Device Marking Device Device Package Reel Size Tape width Quantity SSF2300 SOT-23 Ø180mm 8 mm 3000 units. Parameter Symbol Limit Unit
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1 DESCRIPTION The SSF2300 uses advanced trench technology to provide excellent R DS(ON), low gate charge and operation with gate voltages as low as 2.5V. This device is suitable for use as a battery protection or in other switching applications. G D S FEATURES V DS = 20V,I D = 4.5A R DS(ON) < V GS=2.5V R DS(ON) < V GS =4.5V High Power and Current Handling Capability Lead Free Schematic Diagram Marking and Pin Assignment APPLICATIONS Battery Protection Load Switch Power Management SOT-23 Top View PACKAGE MARKING AND ORDERING INFORMATION Device Marking Device Device Package Reel Size Tape width Quantity 2300 SSF2300 SOT-23 Ø180mm 8 mm 3000 units ABSOLUTE MAXIMUM RATINGS (T A =25 C unless otherwise noted) Parameter Symbol Limit Unit Drain-Source Voltage VDS 20 V Gate-Source Voltage VGS ±12 V Drain Current-Continuous@ Current-Pulsed (Note 1) I D (25 C) 4.5 A I D (70 C) 2.8 A I DM 16 A Maximum Power Dissipation P D 1.3 W Operating Junction and Storage Temperature Range T J,T STG -55 To 150 C THERMAL CHARACTERISTICS Thermal Resistance,Junction-to-Ambient (Note 2) R θja 140 C/W 1/6
2 ELECTRICAL CHARACTERISTICS (T A =25 C unless otherwise noted) OFF CHARACTERISTICS Drain-Source On-State Resistance R DS(ON) V GS =2.5V, I D =3.1A mω V GS=4.5V, I D=3.6A mω Forward Transconductance g FS V DS=5V,I D=3.6A 8 S DYNAMIC CHARACTERISTICS (Note4) Input Capacitance C lss 300 PF Output Capacitance C oss V DS =10V,V GS =0V, F=1.0MHz 120 PF Reverse Transfer Capacitance C rss 80 PF SWITCHING CHARACTERISTICS (Note 4) Turn-on Delay Time t d(on) 7 15 ns Turn-on Rise Time t r V DD =10V, R L = 2.8 Ω ns V GS =4.5V,R GEN =6Ω, Turn-Off Delay Time t d(off) I D=3.6A, ns Turn-Off Fall Time t f ns Total Gate Charge Parameter Symbol Condition Min Typ Max Unit Drain-Source Breakdown Voltage BV DSS V GS =0V I D=250μA 20 V Zero Gate Voltage Drain Current I DSS V DS=20V,V GS=0V 1 μa Gate-Body Leakage Current I GSS V GS =±8V,V DS =0V ±100 na ON CHARACTERISTICS (Note 3) Gate Threshold Voltage V GS(th) V DS=VGS,I D=250μA V Q g nc Gate-Source Charge Q gs V DS=10V,I D=3.6A,V GS=4.5V 0.65 nc Gate-Drain Charge Q gd 1.5 nc DRAIN-SOURCE DIODE CHARACTERISTICS Diode Forward Voltage (Note 3) V SD V GS=0V,I S=0.94A V Diode Forward Current (Note 2) I S 0.94 A NOTES: 1. Repetitive Rating: Pulse width limited by maximum junction temperature. 2. Surface Mounted on 1in 2 FR4 Board, t 10 sec. 3. Pulse Test: Pulse Width 300μs, Duty Cycle 2%. 4. Guaranteed by design, not subject to production testing. 2/6
3 TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS t on t off Vdd t d(on) t r t d(off) t f Vgs Rgen Vin G D Rl Vout V OUT 10% 90% INVERTED 90% 10% 90% S V IN 10% 50% 50% PULSE WIDTH Figure 1:Switching Test Circuit Figure 2:Switching Waveforms PD Power(W) T J -Junction Temperature( ) Figure 3 Power Dissipation ID- Drain Current (A) ID- Drain Current (A) Vds Drain-Source Voltage (V) Figure 4 Safe Operation Area Rdson On-Resistance(mΩ) Vds Drain-Source Voltage (V) Figure 5 Output CHARACTERISTICS I D - Drain Current (A) Figure 6 Drain-Source On-Resistance 3/6
4 TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS SSF2300 ID- Drain Current (A) Normalized On-Resistance Vgs Gate-Source Voltage (V) Figure 7 Transfer Characteristics T J -Junction Temperature( ) Figure 8 Drain-Source On-Resistance Vgs Gate-Source Voltage (V) Rdson On-Resistance(mΩ) C Capacitance (pf) Vgs Gate-Source Voltage (V) Figure 9 Rdson vs Vgs Vds Drain-Source Voltage (V) Figure 10 Capacitance vs Vds Is- Reverse Drain Current (A) Qg Gate Charge (nc) Figure 11 Gate Charge Vsd Source-Drain Voltage (V) Figure 12 Source- Drain Diode Forward 4/6
5 TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS Normalized Effective Transient Thermal Impedance Square Wave Pluse Duration(sec) Figure 13 Normalized Maximum Transient Thermal Impedance 5/6
6 SOT-23 PACKAGE INFORMATION Dimensions in Millimeters (UNIT:mm) Dimensions in Millimeters Symbol MIN. MAX. A A A b c D E E e 0.950TYP e L 0.550REF L θ 0 8 NOTES 1. All dimensions are in millimeters. 2.Tolerance ±0.10mm (4 mil) unless otherwise specified. 3. Package body sizes exclude mold flash and gate burrs. Mold flash at the non-lead sides should be less than 5 mils. 4. Dimension L is measured in gauge plane. 5. Controlling dimension is millimeter, converted inch dimensions are not necessarily exact. 6/6 Doc.USSSF2300x3.0
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