DISCONTINUED. Product Marking Reel size (inches) Tape width (mm) Quantity per reel DMN4015LK3-13 N4015L ,500
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1 40V N-CHANNEL ENHANCEMENT MODE MOSFET Product Summary V (BR)DSS 40V T A = 25 C = V 20.8A = 4.5V 8.0A Description and Applications This new generation MOSFET has been designed to minimize the onstate resistance () and yet maintain superior switching performance, making it ideal for high efficiency power management applications. Backlighting DC-DC Converters Power management functions Features and Benefits Low on-resistance Fast switching speed Green component and RoHS compliant (Note ) Mechanical Data Case: TO252-3L Case Material: Molded Plastic, Green Molding Compound. UL Flammability Classification Rating 94V-0 (Note ) Moisture Sensitivity: Level per J-STD-020D Terminals Connections: See Diagram Terminals: Matte Tin Finish annealed over Copper leadframe. Solderable per MIL-STD-202, Method 208 Marking Information: See Below Ordering Information: See Below Weight: 0.33 grams (approximate) D D G G D S S TOP VIEW PIN OUT -TOP VIEW Equivalent Circuit Ordering Information (Note ) Product Marking Reel size (inches) Tape width (mm) Quantity per reel -3 N405L 3 6 2,500 Note:. Diodes, Inc. defines Green products as those which are Eu RoHS compliant and contain no halogens or antimony compounds; further information about Diodes Inc. s Green Policy can be found on our website. For packaging details, go to our website. Marking Information YYWW N405L = Manufacturer s Marking N405L = Product Type Marking Code YYWW = Date Code Marking YY = Last two digits of year (ex: 09 = 2009) WW = Week (0-52) of 8
2 Maximum A = 25 C unless otherwise specified Characteristic Symbol Value Unit Drain-Source voltage S 40 V Gate-Source voltage ±20 V (Note 3) 20.8 Continuous Drain current = V T A=70 C (Note 3) 6.6 A (Note 2) 3.5 Pulsed Drain current = V (Note 4) M 72.8 A Continuous Source current (Body diode) (Note 3) I S 3.2 A Pulsed Source current (Body diode) (Note 4) I SM 72.8 A Thermal A = 25 C unless otherwise specified Power dissipation Linear derating factor Characteristic Symbol Value Unit (Note 2) (Note 3) P D.3 W 82.4 mw/ C (Note 5) (Note 2) (Note 3) 2. Thermal Resistance, Junction to Ambient R θja (Note 5) 57.0 C/W 28.6 Thermal Resistance, Junction to Lead (Note 6) R θjl 0.85 Operating and storage temperature range T J, T STG -55 to 50 C Notes: 2. For a device surface mounted on 50mm x 50mm x.6mm FR4 PCB with high coverage of single sided 2oz copper, in still air conditions; the device is measured when operating in a steady-state condition. 3. Same as note 2, except the device is measured at t sec. 4. Same as note 2, except the device is pulsed with D = 0.02 and pulse width 300 µs. The pulse current is limited by the maximum junction temperature. 5. For a device surface mounted on 25mm x 25mm x.6mm FR4 PCB with high coverage of single sided oz copper, in still air conditions; the device is measured when operating in a steady-state condition. 6. Thermal resistance from junction to solder-point (at the end of the drain lead). 2 of 8
3 Thermal Characteristics 0 Limited DC s 0ms ms 0m T amb ms 25mm x 25mm oz FR4 0µs m 0m Drain-Source Voltage (V) Safe Operating Area 0 Limited DC s 0ms ms 0m T amb ms 50mm x 50mm 2oz FR4 0µs m 0. Drain-Source Voltage (V) Safe Operating Area Thermal Resistance ( C/W) T amb 25mm x 25mm oz FR4 D= D=0.2 D=0. D=0.05 Single Pulse 0 0µ m m 0m 0 k Pulse Width (s) Transient Thermal Impedance Thermal Resistance ( C/W) T amb 50mm x 50mm 2oz FR4 D=0.5 D=0.2 D=0. 5 D=0.05 Single Pulse 0 0µ m m 0m 0 k Pulse Width (s) Transient Thermal Impedance Max Power Dissipation (W) 0 Single Pulse T amb 50mm x 50mm 2oz FR4 25mm x 25mm oz FR4 0µ m m 0m 0 k Pulse Width (s) Pulse Power Dissipation Max Power Dissipation (W) mm x 50mm 2oz FR4 25mm x 25mm 2.5 oz FR Temperature ( C) Derating Curve 3 of 8
4 Electrical A = 25 C unless otherwise specified Characteristic Symbol Min Typ Max Unit Test Condition OFF CHARACTERISTICS Drain-Source Breakdown Voltage BS 40 V = 250µA, = 0V Zero Gate Voltage Drain Current SS 0.5 µa = 40V, = 0V Gate-Source Leakage I GSS ±0 na = ±20V, = 0V ON CHARACTERISTICS Gate Threshold Voltage (th) V = 250µA, = Static Drain-Source On-Resistance (Note 7) R DS (ON) 5 = V, = 4A m 20 = 4.5V, = A Forward Transconductance (Notes 7 & 8) g fs 35.3 S = 5V, = 2A Diode Forward Voltage (Note 7) V SD V I S= 4A, = 0V Reverse recovery time (Note 8) t rr 4 ns Reverse recovery charge (Note 8) Q rr 872 nc I S= 4A, di/dt= 0A/µs DYNAMIC CHARACTERISTICS (Note 8) Input Capacitance C iss 2072 pf = 20V, = 0V Output Capacitance C oss 338 pf f= MHz Reverse Transfer Capacitance C rss 93 pf Total Gate Charge Q g 2 nc = 4.5V Total Gate Charge Q g 42 nc = 20V Gate-Source Charge Q gs 7.3 nc = V = 4A Gate-Drain Charge Q gd.7 nc Turn-On Delay Time (Note 9) t D(on) 7.8 ns Turn-On Rise Time (Note 9) t r 8.5 ns V DD= 20V, = V Turn-Off Delay Time (Note 9) t D(off) 37.3 ns = 4A, R G 6.0Ω Turn-Off Fall Time (Note 9) t f 4.9 ns Notes: 7. Measured under pulsed conditions. Pulse width 300µs; duty cycle 2% 8. For design aid only, not subject to production testing. 9. Switching characteristics are independent of operating junction temperatures. 4 of 8
5 Typical Characteristics V 4V T = 25 C 3.5V 3V 2.5V 0. Drain-Source Voltage (V) Output Characteristics V T = 50 C 3.5V 3V 2.5V 2V 0. Drain-Source Voltage (V) Output Characteristics.5V E-3 = V T = 50 C T = 25 C Gate-Source Voltage (V) Typical Transfer Characteristics Normalised and (th) = V = 4A 0.8 (th) V 0.6 GS = = 250uA Tj Junction Temperature ( C) Normalised Curves v Temperature Drain-Source On-Resistance (Ω) 0. T = 25 C 2.5V 3V 3.5V On-Resistance v Drain Current 4V V I SD Reverse T = 50 C 0. T = 25 C 0.0 Vgs = 0V E V SD Source-Drain Voltage (V) Source-Drain Diode Forward Voltage 5 of 8
6 Typical Characteristics - continued C Capacitance (pf) C ISS C OSS C RSS 0 0. = 0V f = MHz - Drain - Source Voltage (V) Capacitance v Drain-Source Voltage Gate-Source Voltage (V) = 20V = 4A Q - Charge (nc) Gate-Source Voltage v Gate Charge Test Circuits Q G Current regulator 2V 50k Same as D.U.T V G Q GS Q GD I G D.U.T Charge Basic gate charge waveform Gate charge test circuit 90% R D % R G V DD t d(on) t r t t r d(off) t (on) t (on) Switching time waveforms Switching time test circuit 6 of 8
7 Package Outline Dimensions DIM Inches Millimeters DIM Inches Millimeters Min Max Min Max Min Max Min Max A e BSC 2.29 BSC A H b L b L 0.8 REF 2.74 REF b L BSC BSC c L c L D L D E E of 8
8 Suggested Pad Layout IMPORTANT NOTICE DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION). and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. does not assume any liability arising out of the application or use of this document or any product described herein; neither does convey any license under its patent or trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume all risks of such use and will agree to hold and all the companies whose products are represented on website, harmless against all damages. does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel. Should Customers purchase or use products for any unintended or unauthorized application, Customers shall indemnify and hold and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized application. Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings noted herein may also be covered by one or more United States, international or foreign trademarks. LIFE SUPPORT products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of. As used herein: A. Life support devices or systems are devices or systems which:. are intended to implant into the body, or 2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in significant injury to the user. B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness. Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related information or support that may be provided by. Further, Customers must fully indemnify and its representatives against any damages arising out of the use of products in such safety-critical, life support devices or systems. Copyright 2009, 8 of 8
T A = 25 C (Notes 3 & 5) Product Marking Reel size (inches) Tape width (mm) Quantity per reel DMC4040SSD-13 C4040SD 13 12 2,500
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