Description. Symbol Parameter FCD4N60 Unit. Maximum Lead Temperature for Soldering Purpose, 300 C 1/8 from Case for 5 Seconds
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1 FCD4N60 600V N-Channel MOSFET Features J = 150 C Typ. R DS(on) = 1.0Ω Ultra low gate charge (typ. Q g = 12.8nC) Low effective output capacitance (typ. C oss.eff = 32pF) 100% avalanche tested Description October 2006 SuperFET TM SuperFET TM is, Farichild s proprietary, new generation of high voltage MOSFET family that is utilizing an advanced charge balance mechanism for outstanding low on-resistance and lower gate charge performance. This advanced technology has been tailored to minimize conduction loss, provide superior switching performance, and withstand extreme dv/dt rate and higher avalanche energy. Consequently, SuperFET is very suitable for various AC/DC power conversion in switching mode operation for system miniaturization and higher efficiency. D D G S D-PAK FCD Series G S Absolute Maximum Ratings Symbol Parameter FCD4N60 Unit S Drain-Source Voltage 600 V Drain Current - Continuous (T C = 25 C) - Continuous (T C = 100 C) M Drain Current - Pulsed (Note 1) 11.7 A S Gate-Source voltage ± 30 V E AS Single Pulsed Avalanche Energy (Note 2) 128 mj I AR Avalanche Current (Note 1) 3.9 A E AR Repetitive Avalanche Energy (Note 1) 5.0 mj dv/dt Peak Diode Recovery dv/dt (Note 3) 4.5 V/ns P D Power Dissipation (T C = 25 C) - Derate above 25 C T J, T STG Operating and Storage Temperature Range -55 to +150 C T L Maximum Lead Temperature for Soldering Purpose, 300 C 1/8 from Case for 5 Seconds A A W W/ C Thermal Characteristics Symbol Parameter FCD4N60 Unit R θjc Thermal Resistance, Junction-to-Case 2.5 C/W R θja Thermal Resistance, Junction-to-Ambient 83 C/W 2006 Fairchild Semiconductor Corporation 1
2 Package Marking and Ordering Information Device Marking Device Package Reel Size Tape Width Quantity FCD4N60 FCD4N60TM D-PAK 380mm 16mm 2500 FCD4N60 FCD4N60TF D-PAK 380mm 16mm 2000 Electrical Characteristics T C = 25 C unless otherwise noted Symbol Parameter Conditions Min Typ Max Units Off Characteristics BS Drain-Source Breakdown Voltage = 0V, = 250μA, T J = 25 C V ΔBS Breakdown Voltage Temperature / ΔT J Coefficient B Drain-Source Avalanche Breakdown Voltage SS Zero Gate Voltage Drain Current = 600V, = 0V = 480V, T C = 125 C = 0V, = 250μA, T J = 150 C V = 250μA, Referenced to 25 C V/ C = 0V, = 3.9A V I GSSF Gate-Body Leakage Current, Forward = 30V, = 0V na I GSSR Gate-Body Leakage Current, Reverse = -30V, = 0V na On Characteristics (th) Gate Threshold Voltage =, = 250μA V R DS(on) Static Drain-Source On-Resistance = 10V, = 2.0A Ω g FS Forward Transconductance = 40V, = 2.0A (Note 4) S Dynamic Characteristics C iss Input Capacitance = 25V, = 0V, pf C oss Output Capacitance f = 1.0MHz pf C rss Reverse Transfer Capacitance pf C oss Output Capacitance = 480V, = 0V, f = 1.0MHz pf C oss eff. Effective Output Capacitance = 0V to 400V, = 0V pf Switching Characteristics t d(on) Turn-On Delay Time V DD = 300V, = 3.9A ns t r Turn-On Rise Time R G = 25Ω ns t d(off) Turn-Off Delay Time ns (Note 4, 5) t f Turn-Off Fall Time ns Q g Total Gate Charge = 480V, = 3.9A nc Q gs Gate-Source Charge = 10V nc Q gd Gate-Drain Charge (Note 4, 5) nc Drain-Source Diode Characteristics and Maximum Ratings I S Maximum Continuous Drain-Source Diode Forward Current A I SM Maximum Pulsed Drain-Source Diode Forward Current A V SD Drain-Source Diode Forward Voltage = 0V, I S = 3.9A V t rr Reverse Recovery Time = 0V, I S = 3.9A ns Q rr Reverse Recovery Charge di F /dt =100A/μs (Note 4) μc μa μa Notes: 1. Repetitive Rating: Pulse width limited by maximum junction temperature 2. I AS = 1.9A, V DD = 50V, R G = 25Ω, Starting T J = 25 C 3. I SD 3.9A, di/dt 200A/μs, V DD BS, Starting T J = 25 C 4. Pulse Test: Pulse width 300μs, Duty Cycle 2% 5. Essentially Independent of Operating Temperature Typical Characteristics 2
3 Typical Performance Characteristics Figure 1. On-Region Characteristics Top : 15.0 V 10.0 V 8.0V 7.5 V 7.0 V 6.5 V 6.0 V Bottom : 5.5 V , Drain-Source Voltage [V] μs Pulse Test 2. T C = 25 o C Figure 2. Transfer Characteristics o C 150 o C -55 o C * Note 1. = 40V μs Pulse Test , Gate-Source Voltage [V] Figure 3. On-Resistance Variation vs. Drain Current and Gate Voltage Figure 4. Body Diode Forward Voltage Variation vs. Source Current and Temperatue R DS(ON) [Ω],Drain-Source On-Resistance = 10V * Note : T J = 25 o C = 20V R, Reverse Drain Current [A] o C 25 o C 1. = 0V μs Pulse Test V SD, Source-Drain Voltage [V] Figure 5. Capacitance Characteristics Figure 6. Gate Charge Characteristics Capacitance [pf] C oss C iss C rss C iss = C gs + C gd (C ds = shorted) C oss = C ds + C gd C rss = C gd, Drain-Source Voltage [V] 1. = 0 V 2. f = 1 MHz, Gate-Source Voltage [V] = 120V = 300V = 480V Q G, Total Gate Charge [nc] * Note : = 3.9A 3
4 Typical Performance Characteristics (Continued) Figure 7. Breakdown Voltage Variation Figure 8. On-Resistance Variation vs. Temperature vs. Temperature BS, (Normalized) Drain-Source Breakdown Voltage *Notes : 1. = 0 V 2. = 250μA T J, Junction Temperature [ ο C] R DS(ON), (Normalized) Drain-Source On-Resistance *Notes : 1. = 10 V 2. = 2.0 A T J, Junction Temperature [ o C] Figure 9. Maximum Safe Operating Area Figure 10. Maximum Drain Current vs. Case Temperature Operation in This Area is Limited by R DS(on) us T C = 25 o C 2. T J = 150 o C 3. Single Pulse 10 ms DC 1 ms 100 us , Drain-Source Voltage [V] T C, Case Temperature [ o C] Figure Transient Thermal Response Curve Z θjc (t), Thermal Response D= single pulse 1. Z θ JC (t) = 2.5 o C/W Max. 2. Duty Factor, D=t 1 /t 2 3. T JM - T C = P DM * Z θjc (t) P DM t 1 t t 1, Square W ave Pulse Duration [sec] 4
5 Gate Charge Test Circuit & Waveform Resistive Switching Test Circuit & Waveforms Unclamped Inductive Switching Test Circuit & Waveforms 5
6 Peak Diode Recovery dv/dt Test Circuit & Waveforms 6
7 Mechanical Dimensions D-PAK Dimensions in Millimeters 7
8 TRADEMARKS The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks. ACEx ActiveArray Bottomless Build it Now CoolFET CROSSVOLT DOME EcoSPARK E 2 CMOS EnSigna FACT FAST FASTr FPS FRFET FACT Quiet Series GlobalOptoisolator GTO HiSeC I 2 C i-lo ImpliedDisconnect IntelliMAX ISOPLANAR LittleFET MICROCOUPLER MicroFET MicroPak MICROWIRE MSX MSXPro Across the board. Around the world. The Power Franchise Programmable Active Droop OCX OCXPro OPTOLOGIC OPTOPLANAR PACMAN POP Power247 PowerEdge PowerSaver PowerTrench QFET QS QT Optoelectronics Quiet Series RapidConfigure RapidConnect µserdes ScalarPump SILENT SWITCHER SMART START SPM Stealth SuperFET SuperSOT -3 SuperSOT -6 SuperSOT -8 SyncFET TCM TinyBoost TinyBuck TinyPWM TinyPower TinyLogic TINYOPTO TruTranslation UHC UniFET UltraFET VCX Wire DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN, WHICH COVERS THESE PRODUCTS. LIFE SUPPORT POLICY FAIRCHILD S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, or (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. 2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Product Status Definition Advance Information Formative or In This datasheet contains the design specifications for Design product development. Specifications may change in any manner without notice. Preliminary First Production This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. No Identification Needed Full Production This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. Obsolete Not In Production This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only. Rev. I20 8
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