Features S 1. TA=25 o C unless otherwise noted. (Note 1b) 0.8
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1 FC54P V P-Channel Logic Level PowerTrench MOSFET February 22 FC54P General escription This V P-Channel MOSFET uses Fairchild s high voltage PowerTrench process. It has been optimized for power management applications. Features A, V. R S(ON) =.5 V GS = V R S(ON) =.5 V GS = 4.5 V Applications C-C converters Load switch Power management Fast switching speed High performance trench technology for extremely low R S(ON) S TM SuperSOT - G Absolute Maximum Ratings TA=25 o C unless otherwise noted Symbol Parameter Ratings Units V SS rain-source Voltage V V GSS Gate-Source Voltage ±2 V I rain Current Continuous (Note a) A P Pulsed 2 Maximum Power issipation (Note a). W (Note b).8 T J, T STG Operating and Storage Junction Temperature Range 55 to +5 C Thermal Characteristics R θja Thermal Resistance, Junction-to-Ambient (Note a) 78 C/W R θjc Thermal Resistance, Junction-to-Case (Note ) C/W Package Marking and Ordering Information evice Marking evice Reel Size Tape width Quantity.54 FC54P 7 8mm units 22 Fairchild Semiconductor Corporation FC54P Rev C (W)
2 Electrical Characteristics T A = 25 C unless otherwise noted Symbol Parameter Test Conditions Min Typ Max Units Off Characteristics BV SS rain Source Breakdown Voltage V GS = V, I = 25 µa V BVSS Breakdown Voltage Temperature I = 25 µa, Referenced to 49 mv/ C T J Coefficient 25 C I SS Zero Gate Voltage rain Current V S = 48 V, V GS = V µa I GSSF Gate Body Leakage, Forward V GS = 2V, V S = V na I GSSR Gate Body Leakage, Reverse V GS = 2 V V S = V na FC54P On Characteristics (Note 2) V GS(th) Gate Threshold Voltage V S = V GS, I = 25 µa. V VGS(th) Gate Threshold Voltage I = 25 µa,referenced to 25 C 4 mv/ C T J Temperature Coefficient R S(on) Static rain Source V GS = V, I = A 82 5 mω On Resistance V GS = 4.5 V, I = 2.7 A 5 5 V GS = V, I = A T J=25 C 9 I (on) On State rain Current V GS = V, V S = 5 V 2 A g FS Forward Transconductance V S = 5 V, I = A 8 S ynamic Characteristics C iss Input Capacitance V S = V, V GS = V, 759 pf C oss Output Capacitance f =. MHz 9 pf Reverse Transfer Capacitance 9 pf C rss Switching Characteristics (Note 2) t d(on) Turn On elay Time V = V, I = A, 7 4 ns t r Turn On Rise Time V GS = V, R GEN = Ω 2 ns t d(off) Turn Off elay Time 9 4 ns Turn Off Fall Time 2 22 ns t f Q g Total Gate Charge V S = V, I =. A, 5 24 nc Q gs Gate Source Charge V GS = V 2.5 nc Gate rain Charge. nc Q gd rain Source iode Characteristics and Maximum Ratings I S Maximum Continuous rain Source iode Forward Current. A V S rain Source iode Forward Voltage V GS = V, I S =. A (Note 2).8.2 V Notes:. R θja is the sum of the junction-to-case and case-to-ambient resistance where the case thermal reference is defined as the solder mounting surface of the drain pins. R θjc is guaranteed by design while R θca is determined by the user's board design. a. 78 C/W when mounted on a in 2 pad of 2oz copper on FR-4 board. b. 5 C/W when mounted on a minimum pad. 2. Pulse Test: Pulse Width µs, uty Cycle 2.% FC54P Rev C (W)
3 Typical Characteristics 5 V GS = -V -4.5V -.V 2-4.V -5.V -.5V 9 -.V -2.5V VS, RAIN-SOURCE VOLTAGE (V) RS(ON), NORMALIZE RAIN-SOURCE ON-RESISTANCE V GS = -.5V -4.V -4.5V -5.V -.V -7.V -8.V -V I, RAIN CURRENT (A) FC54P Figure. On-Region Characteristics. Figure 2. On-Resistance Variation with rain Current and Gate Voltage I = -.A V GS = -V. I = -.5A.2.2 TA = 25 o C.8.. TA = 25 o C TJ, JUNCTION TEMPERATURE ( o C) VGS, GATE TO SOURCE VOLTAGE (V) Figure. On-Resistance Variation with Temperature. Figure 4. On-Resistance Variation with Gate-to-Source Voltage. 5 2 VS = -5V TA = -55 o C 25 o C 25 o C VGS = V T A = 25 o C 9 25 o C. -55 o C VGS, GATE TO SOURCE VOLTAGE (V) VS, BOY IOE FORWAR VOLTAGE (V) Figure 5. Transfer Characteristics. Figure. Body iode Forward Voltage Variation with Source Current and Temperature. FC54P Rev C (W)
4 Typical Characteristics -VGS, GATE-SOURCE VOLTAGE (V) I = -.A VS = -V 8-2V -V Qg, GATE CHARGE (nc) CRSS C OSS C ISS f = MHz VGS = V VS, RAIN TO SOURCE VOLTAGE (V) FC54P Figure 7. Gate Charge Characteristics. Figure 8. Capacitance Characteristics. 4 -I, RAIN CURRENT (A). RS(ON) LIMIT V GS = -V RθJA = 5 o C/W C µs ms ms s s 2 RθJA = 5 C/W T A = 25 C TA = 25 o C.. -VS, RAIN-SOURCE VOLTAGE (V). t, TIME (sec) Figure 9. Maximum Safe Operating Area. Figure. Single Pulse Maximum Power issipation. = RθJA(t) = r(t) + RθJA RθJA = 5 C/W P(pk) t t 2. T J - T A = P * RθJA(t) uty Cycle, = t / t t, TIME (sec) Figure. Transient Thermal Response Curve. Thermal characterization performed using the conditions described in Note b. Transient themal response will change depending on the circuit board design. FC54P Rev C (W)
5 TRAEMARKS The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks. ACEx Bottomless CoolFET CROSSVOLT ensetrench OME EcoSPARK E 2 CMOS TM EnSigna TM FACT FACT Quiet Series STAR*POWER is used under license ISCLAIMER FAIRCHIL SEMICONUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PROUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR ESIGN. FAIRCHIL OES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PROUCT OR CIRCUIT ESCRIBE HEREIN; NEITHER OES IT CONVEY ANY LICENSE UNER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. LIFE SUPPORT POLICY FAIRCHIL S PROUCTS ARE NOT AUTHORIZE FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT EVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHIL SEMICONUCTOR CORPORATION. As used herein:. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, or (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. PROUCT STATUS EFINITIONS efinition of Terms FAST FASTr FRFET GlobalOptoisolator GTO HiSeC ISOPLANAR LittleFET MicroFET MicroPak MICROWIRE OPTOLOGIC OPTOPLANAR PACMAN POP Power247 PowerTrench QFET QS QT Optoelectronics Quiet Series SILENT SWITCHER SMART START STAR*POWER Stealth SuperSOT - SuperSOT - SuperSOT -8 SyncFET TinyLogic TruTranslation UHC UltraFET 2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. atasheet Identification Product Status efinition VCX Advance Information Preliminary No Identification Needed Formative or In esign First Production Full Production This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. Obsolete Not In Production This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only. Rev. H4
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IRFP24 Data heet January 22 2A, 2V,.8 Ohm, N-Channel Power MOFET This N-Channel enhancement mode silicon gate power field effect transistor is an advanced power MOFET designed, tested, and guaranteed to
A I DM. -55 to + 175 T STG. Storage Temperature Range C Soldering Temperature, for 10 seconds 300 (1.6mm from case) Mounting torque, 6-32 or M3 screw
IGITL UIO MOSFET P 9673 IRFB565PbF Features Key Parameters Optimized for Class udio mplifier pplications Low R SON for Improved Efficiency Low Q G and Q SW for Better TH and Improved Efficiency Low Q RR
Power MOSFET FEATURES. IRF740PbF SiHF740-E3 IRF740 SiHF740. PARAMETER SYMBOL LIMIT UNIT Drain-Source Voltage V DS 400 V Gate-Source Voltage V GS ± 20
Power MOSFET PRODUCT SUMMARY (V) 400 R DS(on) (Ω) = 0.55 Q g (Max.) (nc) 63 Q gs (nc) 9.0 Q gd (nc) 3 Configuration Single FEATURES Dynamic dv/dt Rating Repetitive Avalanche Rated Fast Switching Ease of
Power MOSFET FEATURES. IRL540PbF SiHL540-E3 IRL540 SiHL540
Power MOSFET PRODUCT SUMMARY (V) 100 R DS(on) (Ω) = 5.0 V 0.077 Q g (Max.) (nc) 64 Q gs (nc) 9.4 Q gd (nc) 27 Configuration Single TO220AB G DS ORDERING INFORMATION Package Lead (Pb)free SnPb G D S NChannel
IRLR8729PbF IRLU8729PbF
Applications l High Frequency Synchronous Buck Converters for Computer Processor Power l High Frequency Isolated DC-DC Converters with Synchronous Rectification for Telecom and Industrial Use Benefits
A I DM. W/ C V GS Gate-to-Source Voltage ± 12. Thermal Resistance Symbol Parameter Typ. Max. Units
V DS 2 V V GS Max ±2 V * PD - 973A HEXFET Power MOSFET R DSon) max @V GS = 4.V) 2. m R DSon) max @V GS = 2.V) 27. m 6 Micro3 TM SOT-23) Applications) Load System Switch Features and Benefits Features Benefits
UNISONIC TECHNOLOGIES CO., LTD 50N06 Power MOSFET
UNISONIC TECHNOLOGIES CO., LTD 50N06 50 Amps, 60 Volts N-CHANNEL POWER MOSFET DESCRIPTION TO-263 TO-25 The UTC 50N06 is three-terminal silicon device with current conduction capability of about 50A, fast
STW20NM50 N-CHANNEL 550V @ Tjmax - 0.20Ω - 20ATO-247 MDmesh MOSFET
N-CHANNEL 550V @ Tjmax - 0.20Ω - 20ATO-247 MDmesh MOSFET TYPE V DSS (@Tjmax) R DS(on) I D STW20NM50 550V < 0.25Ω 20 A TYPICAL R DS (on) = 0.20Ω HIGH dv/dt AND AVALANCHE CAPABILITIES 100% AVALANCHE TESTED
A I DM. W/ C V GS Gate-to-Source Voltage ± 20. Thermal Resistance Symbol Parameter Typ. Max. Units
V DS 2 V V GS Max ± 2 V R DSon) max @V GS = V) 24 m * PD - 9787A HEXFET Power MOSFET R DSon) max @V GS = 4.V) 4 m 6 Micro3 TM SOT-23) Applications) Load System Switch Features and Benefits Features Benefits
N-Channel 60-V (D-S) MOSFET
7/7, VQJ/P, BS7 -Channel 6-V (D-S) MOSFET Part umber V (BR)DSS Min (V) r DS(on) Max ( ) V GS(th) (V) I D (A) 7 5 @ V GS = V.8 to. 7 7.5 @ V GS = V to.5.5 VQJ 6 5.5 @ V GS = V.8 to.5.5 VQP 5.5 @ V GS =
P6KE6V8(C)A - P6KE440(C)A 600 W Transient Voltage Suppressors
P6KE6V8(C)A - P6KE440(C)A 600 W Transient Suppressors Features Glass-Passivated Junction 600 W Peak Pulse Power Capability at 1.0 ms Excellent Clamping Capability Low Incremental Surge Resistance Fast
Automotive P-Channel 60 V (D-S) 175 C MOSFET
Automotive P-Channel 6 V (D-S) 75 C MOSFET SQ36AEES PRODUCT SUMMARY V DS (V) -6 R DS(on) () at V GS = - V 7 R DS(on) () at V GS = -4.5 V.3 I D (A) -.9 Configuration Single D 3 SOT-3 (TO-36) G Top View
SIPMOS Small-Signal-Transistor
SIPMOS Small-Signal-Transistor Features N-channel Depletion mode dv /dt rated Product Summary V DS V R DS(on),max 3.5 Ω I DSS,min.4 A Available with V GS(th) indicator on reel Pb-free lead plating; RoHS
STP60NF06. N-channel 60V - 0.014Ω - 60A TO-220 STripFET II Power MOSFET. General features. Description. Internal schematic diagram.
N-channel 60V - 0.014Ω - 60A TO-220 STripFET II Power MOSFET General features Type V DSS R DS(on) I D STP60NF06 60V
N-Channel 80-V (D-S) MOSFET
Si785P N-Channel 80-V (-S) MOSFET PROUCT SUMMARY V S (V) R S(on) (Ω) I (A) 80 8 7 6 0.065 at V GS = 0 V.5 0.0 at V GS = 6 V 0.9 PowerPAK SO-8 5 S 6.5 mm 5.5 mm Ordering Information: Bottom View S S 3 G
V DS 100 V R DS(ON) typ. @ 10V 72.5 m: Q g typ. 15 nc Q sw typ. 8.3 nc R G(int) typ. 2.2 Ω T J max 175 C
PD 9698A DIGITAL AUDIO MOSFET IRFB422PbF Features Key parameters optimized for ClassD audio amplifier applications Low R DSON for improved efficiency Low Q G and Q SW for better THD and improved efficiency
OptiMOS 3 Power-Transistor
Type IPD36N4L G OptiMOS 3 Power-Transistor Features Fast switching MOSFET for SMPS Optimized technology for DC/DC converters Qualified according to JEDEC ) for target applications Product Summary V DS
RS1A - RS1M Fast Rectifiers
RSA - RSM Fast Rectifiers Features Glass-Passivated Junction For Surface Mounted Applications uilt-in Strain Relief, Ideal for Automated Placement UL Certified: Certificate # E326243 SMA/DO-24AC COLOR
STP60NF06FP. N-channel 60V - 0.014Ω - 30A TO-220FP STripFET II Power MOSFET. General features. Description. Internal schematic diagram.
N-channel 60V - 0.014Ω - 30A TO-220FP STripFET II Power MOSFET General features Type V DSS R DS(on) I D STP60NF06FP 60V
91 P D @T C = 25 C Power Dissipation 330 P D @T C = 100 C Power Dissipation Linear Derating Factor
PD - 9778 IRFB4229PbF Features l dvanced Process Technology l Key Parameters Optimized for PDP Sustain, Energy Recovery and Pass Switch pplications l Low E PULSE Rating to Reduce Power Dissipation in PDP
STP80NF55-08 STB80NF55-08 STB80NF55-08-1 N-CHANNEL 55V - 0.0065 Ω - 80A D2PAK/I2PAK/TO-220 STripFET II POWER MOSFET
STP80NF55-08 STB80NF55-08 STB80NF55-08-1 N-CHANNEL 55V - 0.0065 Ω - 80A D2PAK/I2PAK/TO-220 STripFET II POWER MOSFET TYPE V DSS R DS(on) I D STB80NF55-08/-1 STP80NF55-08 55 V 55 V
Lower Conduction Losses Low Thermal Resistance to PCB ( 0.5 C/W)
PD -97428 IRFH5020PbF HEXFET Power MOSFET V DS 200 V 55 m: R DS(on) max (@V GS = V) Q g (typical) 36 nc R G (typical).9 : I D (@T c(bottom) = 25 C) 43 A PQFN 5X6 mm Applications Secondary Side Synchronous
IRF5305PbF. HEXFET Power MOSFET V DSS = -55V. R DS(on) = 0.06Ω I D = -31A
dvanced Process Technology Dynamic dv/dt Rating 75 C Operating Temperature Fast Switching PChannel Fully valanche Rated LeadFree Description Fifth Generation HEXFETs from International Rectifier utilize
Rev D, October 1998 1
1 Rev D, October 1998 2 Ω Ω Ω Ω µ Ω Ω 3 = + = + = = + τ 4 Figure 4. Measured FDC6329L Dynamic Waveforms Figure 5. SPICE verification on FDC6329L Dynamic Waveforms Figure 6. SPICE result of FDC6329L V DROP
IRFB3607PbF IRFS3607PbF IRFSL3607PbF
Applications l High Efficiency Synchronous Rectification in SMPS l Uninterruptible Power Supply l High Speed Power Switching l Hard Switched and High Frequency Circuits Benefits l Improved Gate, Avalanche
IRFP460LC PD - 9.1232. HEXFET Power MOSFET V DSS = 500V. R DS(on) = 0.27Ω I D = 20A
HEXFET Power MOSFET PD - 9.232 IRFP460LC Ultra Low Gate Charge Reduced Gate Drive Requirement Enhanced 30V V gs Rating Reduced C iss, C oss, C rss Isolated Central Mounting Hole Dynamic dv/dt Rated Repetitive
V DSS I D. W/ C V GS Gate-to-Source Voltage ±30 E AS (Thermally limited) mj T J Operating Junction and -55 to + 175
PD 973B IRFB432PbF Applications l Motion Control Applications l High Efficiency Synchronous Rectification in SMPS l Uninterruptible Power Supply l Hard Switched and High Frequency Circuits Benefits l Low
W/ C V GS Gate-to-Source Voltage ± 20 dv/dt Peak Diode Recovery e 38. V/ns T J. mj I AR
PD 967 IRFB465PbF Applications l High Efficiency Synchronous Rectification in SMPS l Uninterruptible Power Supply l High Speed Power Switching l Hard Switched and High Frequency Circuits G D S V DSS HEXFET
OptiMOS Power-Transistor Product Summary
OptiMOS Power-Transistor Product Summary V DS 55 V R DS(on),max 4) 35 mω Features Dual N-channel Logic Level - Enhancement mode AEC Q11 qualified I D 2 A PG-TDSON-8-4 MSL1 up to 26 C peak reflow 175 C
STP55NF06L STB55NF06L - STB55NF06L-1
General features STP55NF06L STB55NF06L - STB55NF06L-1 N-channel 60V - 0.014Ω - 55A TO-220/D 2 PAK/I 2 PAK STripFET II Power MOSFET Type V DSS R DS(on) I D STP55NF06L 60V
