UNIVERSITY OF CALIFORNIA, BERKELEY College of Engineering Department of Electrical Engineering and Computer Sciences

Size: px
Start display at page:

Download "UNIVERSITY OF CALIFORNIA, BERKELEY College of Engineering Department of Electrical Engineering and Computer Sciences"

Transcription

1 UNIVERSITY OF CALIFORNIA, BERKELEY College of Engineering Department of Electrical Engineering and Computer Sciences Elad Alon Homework #4 Solutions EECS141 PROBLEM 1: Shoot-Through Current In this problem, we will use the simplified transistor model we explored in Problem #4 of Homework #3 along with the parameters found in Table 3.2 of the text to perform a rough characterization of the shoot-through current (also known as short-circuit or crowbar current) of an inverter. Recall that in the simplified transistor model, the transistor s drain current is proportional to (V GS V T *). Note that while your final answers to this problem will be numerical (or plots with numbers on them), you should provide us with all of the equations you used to calculate your results. a) Ignoring output conductance (i.e., λ n = λ p = 0), plot the shoot-through (or shortcircuit) current as V IN is swept from 0 to V DD (=2.5V) of an inverter with W P = 2µm, W N = 1µm, and L =.24µm. The short-circuit current I is simply the smaller of I DP and I DN ; in a transient state, if one transistor has more current than the other, its excess current would flow into the load capacitance and charge/discharge the output. b) Now we are going to see how I vs. V IN changes as we alter the inverter s β ratio. For this problem, as you change β, you should leave the total transistor width constant (i.e., W P + W N = 3µm). All on the same plot, sketch I vs. V IN for β = 1, β = 2, and β = 3. c) If V DD = 2.5V and a 200MHz clock with rise and fall times of 200ps is applied to the input of the inverter, how much power is consumed by the shoot-through current? In comparison, if the total capacitance at the output of the inverter is 25fF, how much power is consumed by switching this capacitance? You can assume that the clock waveform is a purely linear ramp during the transition (i.e., for 0<t<t r, Vin = k r t).

2 Solutions: a) Using Matlab The shoot-through current in the graph above is the bolded portion where we find min(i N,I P ). b) Using Matlab

3 c) P = 2 E f where P is shoot-through power, E is shoot-through energy dissipated on every transition (the factor of 2 comes from the fact that the clock transitions twice every cycle), and f is the frequency of the clock. We calculate the shoot-through energy (which is the same on the rising and falling transitions) as follows: 200 ps E 0 ps i () t V DD dt Since i is a function of V in, we need to write V in as a function of time in order to compute the integral. V in = k r t + V in (0) Boundary conditions: V in (0) = 0, and V in = 2.5V at t = 200ps V in = (0.0125V/pS)t i NMOS (t) = k n W/L * (0.0125t V * tn )V VSATN i PMOS (t) = k p W/L * ( t V * tp )V VSATP Given the shape of the short-circuit current (seen in part a), there are three voltages (and times) of interest in computing this integral: 1) The input voltage and time at which the NMOS turns on (V tn *, t n_on ) 2) The input voltage and time at which the NMOS and PMOS currents are equal (V equal, t equal ) 3) The input voltage and time at which the PMOS turns off (V DD -V tp *, t p_off ) Calculating these times and voltages: t n_on = V tn */k r =.745V / V/ps = 59.6pS k n (W n /L) (V equal -V tn *) V vsatn = k p W p /L (V DD -V equal -V tp *) V vsatp V equal = V t equal = V equal /k r = V / V/ps = pS t p_off = (VDD - V tp *)/k r = 1.6V / V/ps = 128pS For t<t n_on and t>t p_off, the short-circuit current is zero. For t n_on <t<t equal, the current is set by the NMOS device, and for t equal <t<t p_off, the current is set by the PMOS device. So, the integral becomes: E ps 128ps = V DD [ i ( t) dt i ( t) dt] 59.6 ps NMOS ps PMOS Since the shoot-through current has a linear relationship with time, both integrals can be computed by calculating the area of the triangles they represent:

4 ps 1 i t dt ps ps i NMAX ps NMOS ( ) = ( ) ps 1 i t dt ps ps i PMAX ps PMOS ( ) = ( ) ' W i n ( * NMAX = i PMAX = kn Vequal Vtn) V VSATN = µ A L n From these areas we can now compute the shoot-through Energy. E 1 1 = 2 V DD [ ( )* ( )* ] 20 2 ps ps µ A + 2 ps ps µ A fj P = E * f = 4µ W E C 2 L V DD fj CL = = P CL = E CL * f = 31.25µ W ( P / P CL )*100 = 12.8% PROBLEM 2: Transistor Capacitances Throughout this problem, you should assume that the total gate capacitance of a minimum length transistor follows the curve shown on the top of the next page (all of the transistors in this problem are minimum length). However, keep in mind that as the transistor changes regions of operation, the way that the total capacitance is divided between the other terminals (source, drain, and body) changes. Note that all of the transistors in this problem are minimum channel length, and that V DD = 2.5V. All of your answers to this problem should be provided in terms of C ov, C ox, V T, and V DD. a) How much charge does it take to raise the gate of the transistor below from 0V to V DD?

5 b) How much charge is pulled through the gate to lower the drain of the transistor below from V DD to V DD /2? (Hint: using the unified model, what region of operation is the transistor in?) c) How much charge is pulled through the gate down to the source in order to lower the source of the transistor below from V DD to 0V? (Again, you should look for what region of operation the transistor is in where does most of the gate capacitance go to?) Solutions: a) Since we wish to find the charge given a capacitance vs. voltage characteristic, we use the following formula: dq = C dv In order to find the voltage and capacitance levels that contribute to the charge on the gate, we simply look at the function and find the area under the C G vs. V GS curve from a voltage of 0 to V DD. Keeping in mind that W = 1um: Q = (2C OV )(V T ) + (2C OV +C OX )(V DD -V T ) = 2C OV V DD + C OX (V DD -V T ) b) Now we examine the charge on the gate due to the gate-drain capacitance (C GD ). Since the value of C GD is dependent on the region of operation, we must determine what regions of operation are entered as the drain goes from V DD to V DD /2. In this case, min(v GT, V DS, V VSAT ) = V VSAT for all values of interest and we can use our velocity saturated region of operation for calculations. Remember that in velocity saturation the channel charge is not really controlled by the drain

6 voltage, and thus there is no contribution of C OX to C GD. The answer is thus as follows: Q = C GD (V DD -V DD /2) = C OV *V DD /2 c) Now we examine the charge on the gate as a function of the gate-source capacitance (C GS ). Examining the region of operation we see that we will always be in cutoff since V GS <= 0 < V T. Since in cutoff there is no channel charge there is no C OX contribution to C GS all of Cox is effective connected to the body of the transistor. So, the charge pulled through the gate down to the source is due only to the overlap capacitance: Q = C GS *V DD = C OV *V DD PROBLEM 3: Transistors With 2X Channel Length In this problem, we are going to see how doubling the channel length of a transistor affects various transistor parameters. You should use the unified transistor model from Lecture 5 and the parameters found in Table 3.2 of the text for this problem. For parts a) and b), your final answers should be numerical, but you should show all of the equations you use to arrive at these numbers. For parts c) and d), you should turn in the SPICE deck(s) you used for your simulation(s). a) If the transistor s channel length were doubled, what is the new V VSAT? b) What is the ratio of currents between a 2x Length NMOS and a 1x Length NMOS in the linear, saturated, and velocity saturated regimes? In the velocity saturated regime, what is the ratio of current when V GS = V DD = 2.5V? How about the ratio of currents between a 2x Length PMOS and a 1x Length PMOS? c) Using HSPICE and the capacitance calibration procedure described in the lecture, please find the linear input capacitance per µm that best matches the delay of an inverter with minimum channel length transistors (use W n = 1µm, W p = 2µm for the inverter). The discussion sessions will cover the syntax needed to perform optimizations in HSPICE (to find the best fit capacitance), so be sure to attend if you have not used this HSPICE feature before. d) Still using HSPICE and the same procedure, what is the linear input capacitance per µm that best matches the delay of an inverter made up of transistors with 2x the minimum channel length (but still with W n = 1µm and W p = 2µm)? Solutions: a) Our equation (as an approximation) of V VSAT is as follows:

7 V VSAT = L*E C If we double our channel length we can easily see that our V VSAT will be doubled. V VSAT-NEW /V VSAT-OLD = (2L)*E C /(L*E C ) = 2. Using parameters found in Table 3.2 we see that V VSATP = -2V and V VSATN = 1.26V b) Since there are 3 different current equations depending on region of operation we must see what doubling length will do to each region: Linear: NMOS Ratio: [kw/(2l)*(v GT -V DS /2)V DS ]/[kw/l*(v GT -V DS /2)V DS ] = 0.5 PMOS Ratio: same as NMOS => 0.5 Saturation: Just like the linear region, no other parameters depend on length so we have same results: NMOS Ratio = PMOS Ratio = 0.5 Velocity Saturation: Since V VSAT is affected (2x greater) with the change in channel length, we must look closely at how doubling channel length affects current in the velocity saturation regime. NMOS Ratio= [kw/(2l)*(v GT -(2V VSAT )/2)(2V VSAT ) ]/[kw/l*(v GT - V VSAT /2) V VSAT ] = [V GT V VSAT ]/(V GT -V VSAT /2) = (V GT 0.63)/(V GT ) When V GS = V DD = 2.5V, this ratio is PMOS Ratio= same symbolically as NMOS = [V GT V VSAT ]/(V GT - V VSAT /2) = (V GT 1)/(V GT - 0.5) When V GS = V DD = 2.5V, this ratio is c) and d) Below is the spice deck that allows you to find best-fit linear input capacitance per µm of an inverter. Using this deck, the results are: Best Fit Lin Cap with 1x L = fF/µm Best Fit Lin Cap with 2x L = fF/µm ** Homework #4 Problem 3 ***.LIB '/home/ff/ee141/models/g25.mod' TT.param length=0.24u * Change this parameter to 0.48u for 2x length inverter.param Supply=2.5

8 * Inverter SUBCKT Definition.SUBCKT inv in out vdd gnd M1 out in vdd vdd pmos W=2u L='length' M2 out in gnd gnd nmos W=1u L='length'.ENDS *Voltage Sources VVDD vdd 0 'Supply' VSTEP vstep 0 PULSE ( p 1p 1p 5n 10n) ***Main Deck**** Xstage1 vstep out1 vdd 0 inv M=1 Xstage2 out1 out2 vdd 0 inv M=4 Xstage3 out2 out3 vdd 0 inv M=16 Xstage4 out3 out4 vdd 0 inv M=64 Xcalstage1 vstep capout1 vdd 0 inv M=1 Xcalstage2 capout1 capout2 vdd 0 inv M=4 CL capout2 0 'CperMicron*3*16' **Measure Statements.measure invr + TRIG v(out1) VAL='Supply/2' FALL=1 TARG v(out2) VAL='Supply/2' RISE=1.measure capr + TRIG v(capout1) VAL='Supply/2' FALL=1 TARG v(capout2) VAL='Supply/2' + RISE=1.measure invf + TRIG v(out1) VAL='Supply/2' RISE=1 TARG v(out2) VAL='Supply/2' FALL=1.measure capf + TRIG v(capout1) VAL='Supply/2' RISE=1 TARG v(capout2) VAL='Supply/2' + FALL=1.measure errorr param='invr - capr' goal=0.measure errorf param='invf - capf' goal=0 * Analysis.param CperMicron=optrange(2f, 1f, 3.5f).model optmod opt itropt=30.tran 1p 20n SWEEP OPTIMIZE = optrange RESULTS=errorR,errorF MODEL=optmod.measure CperMic param = 'CperMicron'.end

9

Notes about Small Signal Model. for EE 40 Intro to Microelectronic Circuits

Notes about Small Signal Model. for EE 40 Intro to Microelectronic Circuits Notes about Small Signal Model for EE 40 Intro to Microelectronic Circuits 1. Model the MOSFET Transistor For a MOSFET transistor, there are NMOS and PMOS. The examples shown here would be for NMOS. Figure

More information

Chapter 10 Advanced CMOS Circuits

Chapter 10 Advanced CMOS Circuits Transmission Gates Chapter 10 Advanced CMOS Circuits NMOS Transmission Gate The active pull-up inverter circuit leads one to thinking about alternate uses of NMOS devices. Consider the circuit shown in

More information

Transconductance. (Saturated) MOSFET Small-Signal Model. The small-signal drain current due to v gs is therefore given by

Transconductance. (Saturated) MOSFET Small-Signal Model. The small-signal drain current due to v gs is therefore given by 11 (Saturated) MOSFET Small-Signal Model Transconductance Concept: find an equivalent circuit which interrelates the incremental changes in i D v GS v DS etc. for the MOSFET in saturation The small-signal

More information

MOS Transistors as Switches

MOS Transistors as Switches MOS Transistors as Switches G (gate) nmos transistor: Closed (conducting) when Gate = 1 (V DD ) D (drain) S (source) Oen (non-conducting) when Gate = 0 (ground, 0V) G MOS transistor: Closed (conducting)

More information

Op-Amp Simulation EE/CS 5720/6720. Read Chapter 5 in Johns & Martin before you begin this assignment.

Op-Amp Simulation EE/CS 5720/6720. Read Chapter 5 in Johns & Martin before you begin this assignment. Op-Amp Simulation EE/CS 5720/6720 Read Chapter 5 in Johns & Martin before you begin this assignment. This assignment will take you through the simulation and basic characterization of a simple operational

More information

Here we introduced (1) basic circuit for logic and (2)recent nano-devices, and presented (3) some practical issues on nano-devices.

Here we introduced (1) basic circuit for logic and (2)recent nano-devices, and presented (3) some practical issues on nano-devices. Outline Here we introduced () basic circuit for logic and (2)recent nano-devices, and presented (3) some practical issues on nano-devices. Circuit Logic Gate A logic gate is an elemantary building block

More information

Integrated Circuits & Systems

Integrated Circuits & Systems Federal University of Santa Catarina Center for Technology Computer Science & Electronics Engineering Integrated Circuits & Systems INE 5442 Lecture 11 MOSFET part 2 guntzel@inf.ufsc.br I D -V DS Characteristics

More information

An Introduction to the EKV Model and a Comparison of EKV to BSIM

An Introduction to the EKV Model and a Comparison of EKV to BSIM An Introduction to the EKV Model and a Comparison of EKV to BSIM Stephen C. Terry 2. 3.2005 Integrated Circuits & Systems Laboratory 1 Overview Characterizing MOSFET operating regions EKV model fundamentals

More information

e.g. τ = 12 ps in 180nm, 40 ps in 0.6 µm Delay has two components where, f = Effort Delay (stage effort)= gh p =Parasitic Delay

e.g. τ = 12 ps in 180nm, 40 ps in 0.6 µm Delay has two components where, f = Effort Delay (stage effort)= gh p =Parasitic Delay Logic Gate Delay Chip designers need to choose: What is the best circuit topology for a function? How many stages of logic produce least delay? How wide transistors should be? Logical Effort Helps make

More information

Module 4 : Propagation Delays in MOS Lecture 22 : Logical Effort Calculation of few Basic Logic Circuits

Module 4 : Propagation Delays in MOS Lecture 22 : Logical Effort Calculation of few Basic Logic Circuits Module 4 : Propagation Delays in MOS Lecture 22 : Logical Effort Calculation of few Basic Logic Circuits Objectives In this lecture you will learn the following Introduction Logical Effort of an Inverter

More information

Lecture 8 MOSFET(I) MOSFET I-V CHARACTERISTICS

Lecture 8 MOSFET(I) MOSFET I-V CHARACTERISTICS Lecture 8 MOSFET(I) MOSFET I-V CHARACTERISTICS Outline 1. MOSFET: cross-section, layout, symbols 2. Qualitative operation 3. I-V characteristics Reading Assignment: Howe and Sodini, Chapter 4, Sections

More information

ECE124 Digital Circuits and Systems Page 1

ECE124 Digital Circuits and Systems Page 1 ECE124 Digital Circuits and Systems Page 1 Chip level timing Have discussed some issues related to timing analysis. Talked briefly about longest combinational path for a combinational circuit. Talked briefly

More information

Bob York. Transistor Basics - MOSFETs

Bob York. Transistor Basics - MOSFETs Bob York Transistor Basics - MOSFETs Transistors, Conceptually So far we have considered two-terminal devices that are described by a current-voltage relationship I=f(V Resistors: Capacitors: Inductors:

More information

Lecture 060 Push-Pull Output Stages (1/11/04) Page 060-1. ECE 6412 - Analog Integrated Circuits and Systems II P.E. Allen - 2002

Lecture 060 Push-Pull Output Stages (1/11/04) Page 060-1. ECE 6412 - Analog Integrated Circuits and Systems II P.E. Allen - 2002 Lecture 060 PushPull Output Stages (1/11/04) Page 0601 LECTURE 060 PUSHPULL OUTPUT STAGES (READING: GHLM 362384, AH 226229) Objective The objective of this presentation is: Show how to design stages that

More information

Lecture 9 MOSFET(II) MOSFET I-V CHARACTERISTICS(contd.)

Lecture 9 MOSFET(II) MOSFET I-V CHARACTERISTICS(contd.) Lecture 9 MOSFET(II) MOSFET I-V CHARACTERISTICS(contd.) Outline 1. The saturation regime 2. Backgate characteristics Reading Assignment: Howe and Sodini, Chapter 4, Section 4.4 Announcements: 1. Quiz#1:

More information

Field-Effect (FET) transistors

Field-Effect (FET) transistors Field-Effect (FET) transistors References: Hayes & Horowitz (pp 142-162 and 244-266), Rizzoni (chapters 8 & 9) In a field-effect transistor (FET), the width of a conducting channel in a semiconductor and,

More information

Step Response of RC Circuits

Step Response of RC Circuits Step Response of RC Circuits 1. OBJECTIVES...2 2. REFERENCE...2 3. CIRCUITS...2 4. COMPONENTS AND SPECIFICATIONS...3 QUANTITY...3 DESCRIPTION...3 COMMENTS...3 5. DISCUSSION...3 5.1 SOURCE RESISTANCE...3

More information

CO2005: Electronics I (FET) Electronics I, Neamen 3th Ed. 1

CO2005: Electronics I (FET) Electronics I, Neamen 3th Ed. 1 CO2005: Electronics I The Field-Effect Transistor (FET) Electronics I, Neamen 3th Ed. 1 MOSFET The metal-oxide-semiconductor field-effect transistor (MOSFET) becomes a practical reality in the 1970s. The

More information

COMMON-SOURCE JFET AMPLIFIER

COMMON-SOURCE JFET AMPLIFIER EXPERIMENT 04 Objectives: Theory: 1. To evaluate the common-source amplifier using the small signal equivalent model. 2. To learn what effects the voltage gain. A self-biased n-channel JFET with an AC

More information

Class 11: Transmission Gates, Latches

Class 11: Transmission Gates, Latches Topics: 1. Intro 2. Transmission Gate Logic Design 3. X-Gate 2-to-1 MUX 4. X-Gate XOR 5. X-Gate 8-to-1 MUX 6. X-Gate Logic Latch 7. Voltage Drop of n-ch X-Gates 8. n-ch Pass Transistors vs. CMOS X-Gates

More information

Lecture 9 - MOSFET (I) MOSFET I-V Characteristics. October 6, 2005

Lecture 9 - MOSFET (I) MOSFET I-V Characteristics. October 6, 2005 6.12 - Microelectronic Devices and Circuits - Fall 25 Lecture 9-1 Lecture 9 - MOSFET (I) MOSFET I-V Characteristics October 6, 25 Contents: 1. MOSFET: cross-section, layout, symbols 2. Qualitative operation

More information

Monte Carlo Simulation of Device Variations and Mismatch in Analog Integrated Circuits

Monte Carlo Simulation of Device Variations and Mismatch in Analog Integrated Circuits Proceedings of The National Conference On Undergraduate Research (NCUR) 2006 The University of North Carolina at Asheville Asheville, North Carolina April 6 8, 2006 Monte Carlo Simulation of Device Variations

More information

LAB 7 MOSFET CHARACTERISTICS AND APPLICATIONS

LAB 7 MOSFET CHARACTERISTICS AND APPLICATIONS LAB 7 MOSFET CHARACTERISTICS AND APPLICATIONS Objective In this experiment you will study the i-v characteristics of an MOS transistor. You will use the MOSFET as a variable resistor and as a switch. BACKGROUND

More information

How To Make A Field Effect Transistor (Field Effect Transistor) From Silicon P Channel (Mos) To P Channel Power (Mos) (M2) (Mm2)

How To Make A Field Effect Transistor (Field Effect Transistor) From Silicon P Channel (Mos) To P Channel Power (Mos) (M2) (Mm2) TPC811 TOSHIBA Field Effect Transistor Silicon P Channel MOS Type (U-MOS III) TPC811 Lithium Ion Battery Applications Notebook PC Applications Portable Equipment Applications Unit: mm Small footprint due

More information

Biasing in MOSFET Amplifiers

Biasing in MOSFET Amplifiers Biasing in MOSFET Amplifiers Biasing: Creating the circuit to establish the desired DC oltages and currents for the operation of the amplifier Four common ways:. Biasing by fixing GS. Biasing by fixing

More information

See Horenstein 4.3 and 4.4

See Horenstein 4.3 and 4.4 EE 462: Laboratory # 4 DC Power Supply Circuits Using Diodes by Drs. A.V. Radun and K.D. Donohue (2/14/07) Department of Electrical and Computer Engineering University of Kentucky Lexington, KY 40506 Updated

More information

Lecture 24. Inductance and Switching Power Supplies (how your solar charger voltage converter works)

Lecture 24. Inductance and Switching Power Supplies (how your solar charger voltage converter works) Lecture 24 Inductance and Switching Power Supplies (how your solar charger voltage converter works) Copyright 2014 by Mark Horowitz 1 Roadmap: How Does This Work? 2 Processor Board 3 More Detailed Roadmap

More information

Lecture 090 Large Signal MOSFET Model (3/24/10) Page 090-1

Lecture 090 Large Signal MOSFET Model (3/24/10) Page 090-1 Lecture 9 Large Signal MOSFET Model (3/24/1) Page 9-1 LECTURE 9 LARGE SIGNAL MOSFET MODEL LECTURE ORGANIZATION Outline Introduction to modeling Operation of the MOS transistor Simple large signal model

More information

Lecture 250 Measurement and Simulation of Op amps (3/28/10) Page 250-1

Lecture 250 Measurement and Simulation of Op amps (3/28/10) Page 250-1 Lecture 5 Measurement and Simulation of Op amps (/8/) Page 5 LECTURE 5 SIMULATION AND MEASUREMENT OF OP AMPS LECTURE ORGANIZATION Outline Introduction Open Loop Gain CMRR and PSRR A general method of measuring

More information

Gate Delay Model. Estimating Delays. Effort Delay. Gate Delay. Computing Logical Effort. Logical Effort

Gate Delay Model. Estimating Delays. Effort Delay. Gate Delay. Computing Logical Effort. Logical Effort Estimating Delays Would be nice to have a back of the envelope method for sizing gates for speed Logical Effort Book by Sutherland, Sproull, Harris Chapter 1 is on our web page Also Chapter 4 in our textbook

More information

Depletion-Mode Power MOSFETs and Applications Abdus Sattar, IXYS Corporation

Depletion-Mode Power MOSFETs and Applications Abdus Sattar, IXYS Corporation epletion-mode Power MOSFETs and Applications Abdus Sattar, XYS Corporation Applications like constant current sources, solid-state relays, telecom switches and high voltage C lines in power systems require

More information

UNIVERSITY OF CALIFORNIA College of Engineering Department of Electrical Engineering and Computer Sciences

UNIVERSITY OF CALIFORNIA College of Engineering Department of Electrical Engineering and Computer Sciences UNIVERSITY OF CALIFORNIA College of Engineering Department of Electrical Engineering and Computer Sciences Jan M. Rabaey Homework #1: Circuit Simulation EECS 141 Due Friday, January 30, 5pm, box in 240

More information

Chapter 19 Operational Amplifiers

Chapter 19 Operational Amplifiers Chapter 19 Operational Amplifiers The operational amplifier, or op-amp, is a basic building block of modern electronics. Op-amps date back to the early days of vacuum tubes, but they only became common

More information

Lecture 9 - MOSFET (I) MOSFET I-V Characteristics. March 6, 2003

Lecture 9 - MOSFET (I) MOSFET I-V Characteristics. March 6, 2003 6.12 - Microelectronic Devices and Circuits - Spring 23 Lecture 9-1 Lecture 9 - MOSFET (I) MOSFET I-V Characteristics March 6, 23 Contents: 1. MOSFET: cross-section, layout, symbols 2. Qualitative operation

More information

Fully Differential CMOS Amplifier

Fully Differential CMOS Amplifier ECE 511 Analog Electronics Term Project Fully Differential CMOS Amplifier Saket Vora 6 December 2006 Dr. Kevin Gard NC State University 1 Introduction In this project, a fully differential CMOS operational

More information

Frequency Response of Filters

Frequency Response of Filters School of Engineering Department of Electrical and Computer Engineering 332:224 Principles of Electrical Engineering II Laboratory Experiment 2 Frequency Response of Filters 1 Introduction Objectives To

More information

AN-6005 Synchronous buck MOSFET loss calculations with Excel model

AN-6005 Synchronous buck MOSFET loss calculations with Excel model www.fairchildsemi.com Synchronous buck MOSFET loss calculations with Excel model Jon Klein Power Management Applications Abstract The synchronous buck circuit is in widespread use to provide point of use

More information

THE INVERTER DYNAMICS

THE INVERTER DYNAMICS Dynamic Behavior THE IVERTER DYAMIC Propagation Delay, T p Defines how quickly output is affected by input Measured between 5% transition from input to output t plh defines delay for output going from

More information

CHAPTER 2 POWER AMPLIFIER

CHAPTER 2 POWER AMPLIFIER CHATER 2 OWER AMLFER 2.0 ntroduction The main characteristics of an amplifier are Linearity, efficiency, output power, and signal gain. n general, there is a trade off between these characteristics. For

More information

SIPMOS Small-Signal-Transistor

SIPMOS Small-Signal-Transistor SIPMOS Small-Signal-Transistor Features N-channel Depletion mode dv /dt rated Product Summary V DS V R DS(on),max 3.5 Ω I DSS,min.4 A Available with V GS(th) indicator on reel Pb-free lead plating; RoHS

More information

Pass Gate Logic An alternative to implementing complex logic is to realize it using a logic network of pass transistors (switches).

Pass Gate Logic An alternative to implementing complex logic is to realize it using a logic network of pass transistors (switches). Pass Gate Logic n alternative to implementing complex logic is to realize it using a logic network of pass transistors (switches). Switch Network Regeneration is performed via a buffer. We have already

More information

LM 358 Op Amp. If you have small signals and need a more useful reading we could amplify it using the op amp, this is commonly used in sensors.

LM 358 Op Amp. If you have small signals and need a more useful reading we could amplify it using the op amp, this is commonly used in sensors. LM 358 Op Amp S k i l l L e v e l : I n t e r m e d i a t e OVERVIEW The LM 358 is a duel single supply operational amplifier. As it is a single supply it eliminates the need for a duel power supply, thus

More information

Sequential 4-bit Adder Design Report

Sequential 4-bit Adder Design Report UNIVERSITY OF WATERLOO Faculty of Engineering E&CE 438: Digital Integrated Circuits Sequential 4-bit Adder Design Report Prepared by: Ian Hung (ixxxxxx), 99XXXXXX Annette Lo (axxxxxx), 99XXXXXX Pamela

More information

IRF150 [REF:MIL-PRF-19500/543] 100V, N-CHANNEL. Absolute Maximum Ratings

IRF150 [REF:MIL-PRF-19500/543] 100V, N-CHANNEL. Absolute Maximum Ratings PD - 90337G REPETITIVE AVALANCHE AND dv/dt RATED HEXFET TRANSISTORS THRU-HOLE (TO-204AA/AE) Product Summary Part Number BVDSS RDS(on) ID IRF150 100V 0.055Ω 38A IRF150 JANTX2N6764 JANTXV2N6764 [REF:MIL-PRF-19500/543]

More information

Efficient Interconnect Design with Novel Repeater Insertion for Low Power Applications

Efficient Interconnect Design with Novel Repeater Insertion for Low Power Applications Efficient Interconnect Design with Novel Repeater Insertion for Low Power Applications TRIPTI SHARMA, K. G. SHARMA, B. P. SINGH, NEHA ARORA Electronics & Communication Department MITS Deemed University,

More information

AN105. Introduction: The Nature of VCRs. Resistance Properties of FETs

AN105. Introduction: The Nature of VCRs. Resistance Properties of FETs Introduction: The Nature of s A voltage-controlled resistor () may be defined as a three-terminal variable resistor where the resistance value between two of the terminals is controlled by a voltage potential

More information

Lecture 30: Biasing MOSFET Amplifiers. MOSFET Current Mirrors.

Lecture 30: Biasing MOSFET Amplifiers. MOSFET Current Mirrors. Whites, EE 320 Lecture 30 Page 1 of 8 Lecture 30: Biasing MOSFET Amplifiers. MOSFET Current Mirrors. There are two different environments in which MOSFET amplifiers are found, (1) discrete circuits and

More information

N-channel enhancement mode TrenchMOS transistor

N-channel enhancement mode TrenchMOS transistor FEATURES SYMBOL QUICK REFERENCE DATA Trench technology d V DSS = V Low on-state resistance Fast switching I D = A High thermal cycling performance Low thermal resistance R DS(ON) mω (V GS = V) g s R DS(ON)

More information

Laboratory 4: Feedback and Compensation

Laboratory 4: Feedback and Compensation Laboratory 4: Feedback and Compensation To be performed during Week 9 (Oct. 20-24) and Week 10 (Oct. 27-31) Due Week 11 (Nov. 3-7) 1 Pre-Lab This Pre-Lab should be completed before attending your regular

More information

Systematic Design for a Successive Approximation ADC

Systematic Design for a Successive Approximation ADC Systematic Design for a Successive Approximation ADC Mootaz M. ALLAM M.Sc Cairo University - Egypt Supervisors Prof. Amr Badawi Dr. Mohamed Dessouky 2 Outline Background Principles of Operation System

More information

BJT Ebers-Moll Model and SPICE MOSFET model

BJT Ebers-Moll Model and SPICE MOSFET model Department of Electrical and Electronic Engineering mperial College London EE 2.3: Semiconductor Modelling in SPCE Course homepage: http://www.imperial.ac.uk/people/paul.mitcheson/teaching BJT Ebers-Moll

More information

Small Signal Analysis of a PMOS transistor Consider the following PMOS transistor to be in saturation. Then, 1 2

Small Signal Analysis of a PMOS transistor Consider the following PMOS transistor to be in saturation. Then, 1 2 Small Signal Analysis of a PMOS transistor Consider the following PMOS transistor to be in saturation. Then, 1 I SD = µ pcox( VSG Vtp)^2(1 + VSDλ) 2 From this equation it is evident that I SD is a function

More information

Optimization and Comparison of 4-Stage Inverter, 2-i/p NAND Gate, 2-i/p NOR Gate Driving Standard Load By Using Logical Effort

Optimization and Comparison of 4-Stage Inverter, 2-i/p NAND Gate, 2-i/p NOR Gate Driving Standard Load By Using Logical Effort Optimization and Comparison of -Stage, -i/p NND Gate, -i/p NOR Gate Driving Standard Load By Using Logical Effort Satyajit nand *, and P.K.Ghosh ** * Mody Institute of Technology & Science/ECE, Lakshmangarh,

More information

Transmission Gate Characteristics

Transmission Gate Characteristics Transmission Gate Characteristics enb in outp (6/2) (6/2) outn 1G out en Figure 1. Transmission Gate Circuit for Simulation. The transmissionn gate is on when en=5v and enb=0v, assuming the bulk of PMOS

More information

OptiMOS 3 Power-Transistor

OptiMOS 3 Power-Transistor Type IPD6N3L G OptiMOS 3 Power-Transistor Features Fast switching MOSFET for SMPS Optimized technology for DC/DC converters Qualified according to JEDEC 1) for target applications Product Summary V DS

More information

Features. Symbol JEDEC TO-220AB

Features. Symbol JEDEC TO-220AB Data Sheet June 1999 File Number 2253.2 3A, 5V,.4 Ohm, N-Channel Power MOSFET This is an N-Channel enhancement mode silicon gate power field effect transistor designed for applications such as switching

More information

CoolMOS TM Power Transistor

CoolMOS TM Power Transistor CoolMOS TM Power Transistor Features New revolutionary high voltage technology Intrinsic fast-recovery body diode Extremely low reverse recovery charge Ultra low gate charge Extreme dv /dt rated Product

More information

MMBF4391LT1G, SMMBF4391LT1G, MMBF4392LT1G, MMBF4393LT1G. JFET Switching Transistors. N Channel

MMBF4391LT1G, SMMBF4391LT1G, MMBF4392LT1G, MMBF4393LT1G. JFET Switching Transistors. N Channel LT1G, SLT1G, LT1G, LT1G JFET Switching Transistors NChannel Features S Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AECQ1 Qualified and PPAP Capable

More information

OptiMOS TM Power-Transistor

OptiMOS TM Power-Transistor Type BSC28N6NS OptiMOS TM Power-Transistor Features Optimized for high performance SMPS, e.g. sync. rec. % avalanche tested Superior thermal resistance N-channel Qualified according to JEDEC ) for target

More information

OptiMOS Power-Transistor Product Summary

OptiMOS Power-Transistor Product Summary OptiMOS Power-Transistor Product Summary V DS 55 V R DS(on),max 4) 35 mω Features Dual N-channel Logic Level - Enhancement mode AEC Q11 qualified I D 2 A PG-TDSON-8-4 MSL1 up to 26 C peak reflow 175 C

More information

The 2N3393 Bipolar Junction Transistor

The 2N3393 Bipolar Junction Transistor The 2N3393 Bipolar Junction Transistor Common-Emitter Amplifier Aaron Prust Abstract The bipolar junction transistor (BJT) is a non-linear electronic device which can be used for amplification and switching.

More information

The MOS Transistor in Weak Inversion

The MOS Transistor in Weak Inversion MOFE Operation in eak and Moderate nversion he MO ransistor in eak nversion n this section we will lore the behavior of the MO transistor in the subthreshold regime where the channel is weakly inverted.

More information

SPICE MOSFET Declaration

SPICE MOSFET Declaration SPICE MOSFET Declaration The MOSFET is a 4-terminal device that is specified in the netlist as: Mname ND NG NS NB ModName The optional para are: L= value W= value AD=value AS=value PD=value

More information

N-Channel 60-V (D-S), 175 C MOSFET

N-Channel 60-V (D-S), 175 C MOSFET N-Channel 6-V (D-S), 75 C MOSFET SUP/SUB7N6-4 V (BR)DSS (V) r DS(on) ( ) (A) 6.4 7 a TO-22AB D TO-263 DRAIN connected to TAB G G D S Top View SUP7N6-4 G D S Top View SUB7N6-4 S N-Channel MOSFET Parameter

More information

Lab #9: AC Steady State Analysis

Lab #9: AC Steady State Analysis Theory & Introduction Lab #9: AC Steady State Analysis Goals for Lab #9 The main goal for lab 9 is to make the students familar with AC steady state analysis, db scale and the NI ELVIS frequency analyzer.

More information

Fig. 1 :Block diagram symbol of the operational amplifier. Characteristics ideal op-amp real op-amp

Fig. 1 :Block diagram symbol of the operational amplifier. Characteristics ideal op-amp real op-amp Experiment: General Description An operational amplifier (op-amp) is defined to be a high gain differential amplifier. When using the op-amp with other mainly passive elements, op-amp circuits with various

More information

Layout of Multiple Cells

Layout of Multiple Cells Layout of Multiple Cells Beyond the primitive tier primitives add instances of primitives add additional transistors if necessary add substrate/well contacts (plugs) add additional polygons where needed

More information

Lecture 23 - Frequency Response of Amplifiers (I) Common-Source Amplifier. December 1, 2005

Lecture 23 - Frequency Response of Amplifiers (I) Common-Source Amplifier. December 1, 2005 6.012 Microelectronic Devices and Circuits Fall 2005 Lecture 231 Lecture 23 Frequency Response of Amplifiers (I) CommonSource Amplifier December 1, 2005 Contents: 1. Introduction 2. Intrinsic frequency

More information

Features. Description. Table 1. Device summary. Order code Marking Package Packing. STP110N8F6 110N8F6 TO-220 Tube

Features. Description. Table 1. Device summary. Order code Marking Package Packing. STP110N8F6 110N8F6 TO-220 Tube N-channel 80 V, 0.0056 Ω typ.,110 A, STripFET F6 Power MOSFET in a TO-220 package Features Datasheet - production data Order code V DS R DS(on)max I D P TOT TAB STP110N8F6 80 V 0.0065 Ω 110 A 200 W TO-220

More information

TSM020N03PQ56 30V N-Channel MOSFET

TSM020N03PQ56 30V N-Channel MOSFET PDFN56 Pin Definition: 1. Source 8. Drain 2. Source 7. Drain 3. Source 6. Drain 4. Gate 5. Drain Key Parameter Performance Parameter Value Unit V DS 30 V R DS(on) (max) V GS = 10V 2 V GS = 4.5V 3 mω Q

More information

SECTION 2 Transmission Line Theory

SECTION 2 Transmission Line Theory SEMICONDUCTOR DESIGN GUIDE Transmission Line Theory SECTION 2 Transmission Line Theory Introduction The ECLinPS family has pushed the world of ECL into the realm of picoseconds. When output transitions

More information

Input and Output Capacitor Selection

Input and Output Capacitor Selection Application Report SLTA055 FEBRUARY 2006 Input and Output Capacitor Selection Jason Arrigo... PMP Plug-In Power ABSTRACT When designing with switching regulators, application requirements determine how

More information

IRF740 N-CHANNEL 400V - 0.46Ω - 10A TO-220 PowerMESH II MOSFET

IRF740 N-CHANNEL 400V - 0.46Ω - 10A TO-220 PowerMESH II MOSFET N-CHANNEL 400V - 0.46Ω - 10A TO-220 PowerMESH II MOSFET TYPE V DSS R DS(on) I D IRF740 400 V < 0.55 Ω 10 A TYPICAL R DS (on) = 0.46Ω EXCEPTIONAL dv/dt CAPABILITY 100% AVALANCHE TESTED LOW GATE CHARGE VERY

More information

Transistor amplifiers: Biasing and Small Signal Model

Transistor amplifiers: Biasing and Small Signal Model Transistor amplifiers: iasing and Small Signal Model Transistor amplifiers utilizing JT or FT are similar in design and analysis. Accordingly we will discuss JT amplifiers thoroughly. Then, similar FT

More information

Basic Electronics Prof. Dr. Chitralekha Mahanta Department of Electronics and Communication Engineering Indian Institute of Technology, Guwahati

Basic Electronics Prof. Dr. Chitralekha Mahanta Department of Electronics and Communication Engineering Indian Institute of Technology, Guwahati Basic Electronics Prof. Dr. Chitralekha Mahanta Department of Electronics and Communication Engineering Indian Institute of Technology, Guwahati Module: 2 Bipolar Junction Transistors Lecture-2 Transistor

More information

LOW POWER DUAL EDGE - TRIGGERED STATIC D FLIP-FLOP

LOW POWER DUAL EDGE - TRIGGERED STATIC D FLIP-FLOP LOW POWER DUAL EDGE - TRIGGERED STATIC D FLIP-FLOP Anurag #1, Gurmohan Singh #2, V. Sulochana #3 # Centre for Development of Advanced Computing, Mohali, India 1 anuragece09@gmail.com 2 gurmohan@cdac.in

More information

University of California, Berkeley Department of Electrical Engineering and Computer Sciences EE 105: Microelectronic Devices and Circuits

University of California, Berkeley Department of Electrical Engineering and Computer Sciences EE 105: Microelectronic Devices and Circuits University of California, Berkeley Department of Electrical Engineering and Computer Sciences EE 105: Microelectronic Devices and Circuits LTSpice LTSpice is a free circuit simulator based on Berkeley

More information

200V, N-CHANNEL. Absolute Maximum Ratings. Features: www.irf.com 1 PD - 90370

200V, N-CHANNEL. Absolute Maximum Ratings. Features: www.irf.com 1 PD - 90370 PD - 90370 REPETITIVE AVALANCHE AND dv/dt RATED HEXFET TRANSISTORS THRU-HOLE (TO-204AA/AE) IRF240 200V, N-CHANNEL Product Summary Part Number BVDSS RDS(on) ID IRF240 200V 0.18Ω 18A The HEXFET technology

More information

Document Contents Introduction Layout Extraction with Parasitic Capacitances Timing Analysis DC Analysis

Document Contents Introduction Layout Extraction with Parasitic Capacitances Timing Analysis DC Analysis Cadence Tutorial C: Simulating DC and Timing Characteristics Created for the MSU VLSI program by Professor A. Mason and the AMSaC lab group rev S06 (convert to spectre simulator) Document Contents Introduction

More information

ETIN25 Analogue IC Design. Laboratory Manual Lab 1

ETIN25 Analogue IC Design. Laboratory Manual Lab 1 Department of Electrical and Information Technology LTH ETIN25 Analogue IC Design Laboratory Manual Lab 1 Jonas Lindstrand Martin Liliebladh Markus Törmänen September 2011 Laboratory 1: Cadence, DC parameters

More information

BIPOLAR JUNCTION TRANSISTORS

BIPOLAR JUNCTION TRANSISTORS CHAPTER 3 BIPOLAR JUNCTION TRANSISTORS A bipolar junction transistor, BJT, is a single piece of silicon with two back-to-back P-N junctions. However, it cannot be made with two independent back-to-back

More information

Design of a Fully Differential Two-Stage CMOS Op-Amp for High Gain, High Bandwidth Applications

Design of a Fully Differential Two-Stage CMOS Op-Amp for High Gain, High Bandwidth Applications Design of a Fully Differential Two-Stage CMOS Op-Amp for High Gain, High Bandwidth Applications Rajkumar S. Parihar Microchip Technology Inc. Rajkumar.parihar@microchip.com Anu Gupta Birla Institute of

More information

CMOS Logic Integrated Circuits

CMOS Logic Integrated Circuits CMOS Logic Integrated Circuits Introduction CMOS Inverter Parameters of CMOS circuits Circuits for protection Output stage for CMOS circuits Buffering circuits Introduction Symetrical and complementary

More information

TSM2N7002K 60V N-Channel MOSFET

TSM2N7002K 60V N-Channel MOSFET SOT-23 SOT-323 Pin Definition: 1. Gate 2. Source 3. Drain PRODUCT SUMMARY V DS (V) R DS(on) (Ω) I D (ma) 5 @ V GS = 10V 100 60 5.5 @ V GS = 5V 100 Features Low On-Resistance ESD Protection High Speed Switching

More information

CMOS Power Consumption and C pd Calculation

CMOS Power Consumption and C pd Calculation CMOS Power Consumption and C pd Calculation SCAA035B June 1997 1 IMPORTANT NOTICE Texas Instruments (TI) reserves the right to make changes to its products or to discontinue any semiconductor product or

More information

Design and Construction of Variable DC Source for Laboratory Using Solar Energy

Design and Construction of Variable DC Source for Laboratory Using Solar Energy International Journal of Electronics and Computer Science Engineering 228 Available Online at www.ijecse.org ISSN- 2277-1956 Design and Construction of Variable DC Source for Laboratory Using Solar Energy

More information

Lecture 39: Intro to Differential Amplifiers. Context

Lecture 39: Intro to Differential Amplifiers. Context Lecture 39: Intro to Differential Amplifiers Prof J. S. Smith Context Next week is the last week of lecture, and we will spend those three lectures reiewing the material of the course, and looking at applications

More information

CHAPTER 11: Flip Flops

CHAPTER 11: Flip Flops CHAPTER 11: Flip Flops In this chapter, you will be building the part of the circuit that controls the command sequencing. The required circuit must operate the counter and the memory chip. When the teach

More information

N-Channel 40-V (D-S) 175 C MOSFET

N-Channel 40-V (D-S) 175 C MOSFET N-Channel 4-V (D-S) 75 C MOSFET SUP/SUB85N4-4 PRODUCT SUMMARY V (BR)DSS (V) r DS(on) ( ) (A) 4.4 @ V GS = V 85 a TO-22AB D TO-263 G DRAIN connected to TAB G D S Top View Ordering Information SUP85N4-4

More information

IRF6201PbF. HEXFET Power MOSFET V DS 20 V. R DS(on) max. 2.75 mω. Q g (typical) 130 nc 27 A. Absolute Maximum Ratings

IRF6201PbF. HEXFET Power MOSFET V DS 20 V. R DS(on) max. 2.75 mω. Q g (typical) 130 nc 27 A. Absolute Maximum Ratings PD - 97500A IRF620PbF V DS 20 V HEXFET Power MOSFET R DS(on) max (@ = 4.5V) 2.45 mω 6 R DS(on) max (@ = 2.5V) 2.75 mω 6 6 Q g (typical) 30 nc * SO-8 I D (@T A = 25 C) 27 A Applications OR-ing or hot-swap

More information

Final data. Maximum Ratings Parameter Symbol Value Unit

Final data. Maximum Ratings Parameter Symbol Value Unit SPPN8C3 SPN8C3 Cool MOS Power Transistor V DS 8 V Feature R DS(on).45 Ω New revolutionary high voltage technology Ultra low gate charge I D Periodic avalanche rated Extreme dv/dt rated Ultra low effective

More information

STN3NF06L. N-channel 60 V, 0.07 Ω, 4 A, SOT-223 STripFET II Power MOSFET. Features. Application. Description

STN3NF06L. N-channel 60 V, 0.07 Ω, 4 A, SOT-223 STripFET II Power MOSFET. Features. Application. Description N-channel 60 V, 0.07 Ω, 4 A, SOT-223 STripFET II Power MOSFET Features Type V DSS (@Tjmax) Exceptional dv/dt capability Avalanche rugged technology 100% avalanche tested R DS(on) max STN3NF06L 60 V < 0.1

More information

STP6N60FI N - CHANNEL ENHANCEMENT MODE POWER MOS TRANSISTOR

STP6N60FI N - CHANNEL ENHANCEMENT MODE POWER MOS TRANSISTOR N - CHANNEL ENHANCEMENT MODE POWER MOS TRANSISTOR TYPE VDSS RDS(on) ID STP6N60FI 600 V < 1.2 Ω 3.8 A TYPICAL R DS(on) =1Ω AVALANCHE RUGGED TECHNOLOGY 100% AVALANCHE TESTED REPETITIVE AVALANCHE DATA AT

More information

Analog & Digital Electronics Course No: PH-218

Analog & Digital Electronics Course No: PH-218 Analog & Digital Electronics Course No: PH-218 Lec-28: Logic Gates & Family Course Instructor: Dr. A. P. VAJPEYI Department of Physics, Indian Institute of Technology Guwahati, India 1 Digital Logic Gates

More information

McPAT: An Integrated Power, Area, and Timing Modeling Framework for Multicore and Manycore Architectures

McPAT: An Integrated Power, Area, and Timing Modeling Framework for Multicore and Manycore Architectures McPAT: An Integrated Power, Area, and Timing Modeling Framework for Multicore and Manycore Architectures Sheng Li, Junh Ho Ahn, Richard Strong, Jay B. Brockman, Dean M Tullsen, Norman Jouppi MICRO 2009

More information

TPN4R712MD TPN4R712MD. 1. Applications. 2. Features. 3. Packaging and Internal Circuit. 2014-12 2015-04-21 Rev.4.0. Silicon P-Channel MOS (U-MOS )

TPN4R712MD TPN4R712MD. 1. Applications. 2. Features. 3. Packaging and Internal Circuit. 2014-12 2015-04-21 Rev.4.0. Silicon P-Channel MOS (U-MOS ) MOSFETs Silicon P-Channel MOS (U-MOS) TPN4R712MD TPN4R712MD 1. Applications Lithium-Ion Secondary Batteries Power Management Switches 2. Features (1) Low drain-source on-resistance: R DS(ON) = 3.8 mω (typ.)

More information

Lecture 5: Logical Effort

Lecture 5: Logical Effort Introduction to CMOS VLSI Design Lecture 5: Logical Effort David Harris Harvey Mudd College Spring 2004 Outline Introduction Delay in a Logic Gate Multistage Logic Networks Choosing the Best Number of

More information

EXPERIMENT NUMBER 8 CAPACITOR CURRENT-VOLTAGE RELATIONSHIP

EXPERIMENT NUMBER 8 CAPACITOR CURRENT-VOLTAGE RELATIONSHIP 1 EXPERIMENT NUMBER 8 CAPACITOR CURRENT-VOLTAGE RELATIONSHIP Purpose: To demonstrate the relationship between the voltage and current of a capacitor. Theory: A capacitor is a linear circuit element whose

More information

BUZ11. 30A, 50V, 0.040 Ohm, N-Channel Power MOSFET. Features. [ /Title (BUZ1 1) /Subject. (30A, 50V, 0.040 Ohm, N- Channel. Ordering Information

BUZ11. 30A, 50V, 0.040 Ohm, N-Channel Power MOSFET. Features. [ /Title (BUZ1 1) /Subject. (30A, 50V, 0.040 Ohm, N- Channel. Ordering Information Data Sheet June 1999 File Number 2253.2 [ /Title (BUZ1 1) /Subject (3A, 5V,.4 Ohm, N- Channel Power MOS- FET) /Autho r () /Keywords (Intersil Corporation, N- Channel Power MOS- FET, TO- 22AB ) /Creator

More information

IEC 1000-4-2 ESD Immunity and Transient Current Capability for the SP72X Series Protection Arrays

IEC 1000-4-2 ESD Immunity and Transient Current Capability for the SP72X Series Protection Arrays IEC 00-4-2 ESD Immunity and Transient Current Capability for the SP72X Series Protection Arrays Application Note July 1999 AN9612.2 Author: Wayne Austin The SP720, SP721, SP723, and SP724 are protection

More information