IRAM B Series 30A, 600V

Transcription

1 Integrated Power Hybrid IC for High Voltage Motor Applications PD RevC IRAM B Series 30A, 600V with Internal Shunt Resistor Description International Rectifier's IRAM B is a 30A, 600V Integrated Power Hybrid IC with Internal Shunt Resistor for Appliance Motor Drives applications such air conditioning systems and compressor drivers as well as for light industrial application. IR's technology offers an extremely compact, high performance AC motor driver in a single isolated package to simplify design. This advanced HIC is a combination of IR's low V CE(on) Punch-Through IGBT technology and the industry benchmark 3-Phase high voltage, high speed driver in a fully isolated thermally enhanced package. A builtin temperature monitor and over-current and over-temperature protections, along with the short-circuit rated IGBTs and integrated under-voltage lockout function, deliver high level of protection and failsafe operation. Using a new developed single in line package (SiP3) with heat spreader for the power die along with full transfer mold structure minimizes PCB space and resolves isolation problems to heatsink. Features Integrated Gate Drivers Temperature Monitor and Protection Overcurrent shutdown Low V CE(on) Advance Planar Super Rugged Technology Undervoltage lockout for all channels Matched propagation delay for all channels 5V Schmitt-triggered input logic Cross-conduction prevention logic Lower di/dt gate driver for better noise immunity Motor Power up to 3.3kW / 85~253 Vdc Fully Isolated Package, Isolation 2000V RMS min Absolute Maximum Ratings Parameter Description Value Units V CES / V RRM IGBT/Diode Blocking Voltage 600 V + Positive Bus Input Voltage 450 V I T C =25 C Maximum Output Current 30 I T C =100 C RMS Phase Current (Note 1) 15 A I O Pulsed RMS Phase Current (Note 2) 50 PWM Carrier Frequency 20 khz P D Power dissipation per T C =25 C 73 W V ISO Isolation Voltage (1min) 2000 V RMS T J (IGBT & Diode & IC) Maximum Operating Junction Temperature +150 T C Operating Case Temperature Range -20 to +100 C T STG Storage Temperature Range -40 to +125 T Mounting torque Range (M4 screw) 0.7 to 1.17 Nm Note 1: Sinusoidal Modulation at V + =400V, T J =150 C, =6kHz, Modulation Depth=0.8, PF=0.6, See Figure 3. Note 2: t P <100ms; T C =25 C; =6kHz. Limited by I BUS-ITRIP, see Table "Inverter Section Electrical Characteristics" 1

2 Internal Electrical Schematic IRAM B + V (10) V - (12) R S R1 R3 R5 VB1 (1) U, VS1 (2) VB2 (4) V, VS2 (5) VB3 (7) W, VS3 (8) C1 C2 C3 R2 R15 23 VS1 24 HO1 25 VB1 22 VB2 21 HO2 20 VS2 19 VB3 18 HO3 17 VS3 LO1 16 LO2 15 R4 HIN1 (13) HIN2 (14) HIN3 (15) 1 VCC 2 HIN1 3 HIN2 4 HIN3 Driver IC LO3 14 R6 LIN1 (16) 5 LIN1 LIN2 6 LIN3 7 F 8 ITRIP 9 EN 10 RCIN 11 VSS 12 COM 13 LIN2 (17) LIN3 (18) FAULT(19) THERMISTOR R 9 R 8 I SENSE (20) POSISTOR VDD (21) R 11 C7 R 12 C4 R14 R 7 R 13 C 5 C 6 VSS (22) 2

3 Absolute Maximum Ratings (Continued) IRAM B Symbol Parameter Min Max Units Conditions I BDF P BR Peak V S1,2,3 Bootstrap Diode Peak Forward Current Bootstrap Resistor Peak Power (Single Pulse) High side floating supply offset voltage A t P = 10ms, T J = 150 C, T C =100 C W t P =100μs, T C =100 C V B1,2,3-25 V B1,2, V V B1,2,3 High side floating supply voltage V V CC Low Side and logic fixed supply voltage V IN Input voltage LIN, HIN, I Trip V Lower of (V SS +15V) or V CC +0.3V V Inverter Section Electrical J = 25 C Symbol Parameter Min Typ Max Units Conditions V (BR)CES Collector-to-Emitter Breakdown Voltage V V IN =5V, I C =500μA V (BR)CES / T V CE(ON) I CES V FM V BDFM Temperature Coeff. Of Breakdown Voltage Collector-to-Emitter Saturation Voltage Zero Gate Voltage Collector Current Diode Forward Voltage Drop Bootstrap Diode Forward Voltage Drop V/ C V IN=5V, I C =1.0mA (25 C C) I C =15A, V CC =15V V I C =15A, V CC =15V, T J =125 C A V IN =5V, V + =600V V IN =5V, V + =600V, T J =125 C I C =15A V I C =15A, T J =125 C I F =1A V I F =1A, T J =125 C R BR Bootstrap Resistor Value T J =25 C R BR /R BR Bootstrap Resistor Tolerance ±5 % T J =25 C I BUS_TRIP Current Protection Threshold (positive going) A t ON > 175μs 3

4 Inverter Section Switching T J = 25 C Symbol Parameter Min Typ Max Units Conditions E ON Turn-On Switching Loss E OFF Turn-Off Switching Loss E TOT Total Switching Loss μj E REC Diode Reverse Recovery energy t RR Diode Reverse Recovery time ns E ON Turn-On Switching Loss E OFF Turn-off Switching Loss E TOT Total Switching Loss μj E REC Diode Reverse Recovery energy t RR Diode Reverse Recovery time ns I C =15A, V + =400V V CC =15V, L=2mH Energy losses include "tail" and diode reverse recovery See CT1 I C =15A, V + =400V V CC =15V, L=2mH, T J =125 C Energy losses include "tail" and diode reverse recovery See CT1 Q G Turn-On IGBT Gate Charge nc I C =20A, V + =400V, V GE =15V T J =150 C, I C =60A, V P =600V RBSOA Reverse Bias Safe Operating Area FULL SQUARE V + = 480V V CC =+15V to 0V See CT3 SCSOA Short Circuit Safe Operating Area μs T J =150 C, V P =600V, V + = 500V, V CC =+15V to 0V See CT2 Recommended Operating Conditions Driver Function The Input/Output logic timing diagram is shown in Figure 1. For proper operation the device should be used within the recommended conditions. All voltages are absolute referenced to COM. The V S offset is tested with all supplies biased at 15V differential Symbol Definition Min Typ Max Units V B1,2,3 High side floating supply voltage V S +12 V S +15 V S +20 V S1,2,3 High side floating supply offset voltage Note V CC Low side and logic fixed supply voltage V T/ITRIP T/I TRIP input voltage V SS --- V SS +5 V V V IN Logic input voltage LIN, HIN V SS --- V SS +5 V HIN High side PWM pulse width μs Deadtime External dead time between HIN and LIN μs Note 3: For more details, see IR21363 data sheet Note 4: Logic operational for V s from COM-5V to COM+600V. Logic state held for V s from COM-5V to COM-V BS. (please refer to DT97-3 for more details) 4

5 Static Electrical Characteristics Driver Function IRAM B V BIAS (V CC, V BS1,2,3 )=15V, unless otherwise specified. The V IN and I IN parameters are referenced to COM/I TRIP and are applicable to all six channels. (Note 3) Symbol Definition Min Typ Max Units V IH Logic "0" input voltage V V IL Logic "1" input voltage V V CCUV+, V BSUV+ V CC and V BS supply undervoltage positive going threshold V V CCUV-, V BSUV- V CC and V BS supply undervoltage negative going threshold V V CCUVH, V BSUVH V CC and V BS supply undervoltage lock-out hysteresis V V IN,Clamp Input Clamp Voltage (HIN, LIN, T/I TRIP ) I IN =10μA V I QBS Quiescent V BS supply current V IN =0V μa I QCC Quiescent V CC supply current V IN =0V ma I LK Offset Supply Leakage Current μa I IN+ Input bias current V IN =5V μa I IN- Input bias current V IN =0V μa I TRIP+ I TRIP bias current V ITRIP =5V μa I TRIP- I TRIP bias current V ITRIP =0V μa V(I TRIP ) I TRIP threshold Voltage mv V(I TRIP,HYS) I TRIP Input Hysteresis mv Dynamic Electrical Characteristics Driver only timing unless otherwise specified.) Symbol Parameter Min Typ Max Units Conditions T ON Input to Output propagation turnon delay time (see fig.11) ns T OFF Input to Output propagation turnoff delay time (see fig. 11) ns V CC =V BS = 15V, I C =15A, V + =400V T FLIN Input Filter time (HIN, LIN) ns V IN =0 & V IN =5V T BLT-Trip I TRIP Blancking Time ns V IN =0 & V IN =5V D T Dead Time (V BS =V DD =15V) ns V BS =V CC =15V M T T ITrip T FLT-CLR Matching Propagation Delay Time (On & Off) I Trip to six switch to turn-off propagation delay (see fig. 2) Post I Trip to six switch to turn-off clear time (see fig. 2) ns V CC = V BS = 15V, external dead time> 400ns μs V CC =V BS = 15V, I C =15A, V + =400V T C = 25 C ms T C = 100 C 5

6 Thermal and Mechanical Characteristics Symbol Parameter Min Typ Max Units Conditions R th(j-c) Thermal resistance, per IGBT Flat, greased surface. Heatsink R th(j-c) Thermal resistance, per Diode C/W compound thermal conductivity R th(c-s) Thermal resistance, C-S W/mK C D Creepage Distance mm See outline Drawings Internal Current Sensing Resistor - Shunt Characteristics Symbol Parameter Min Typ Max Units Conditions R Shunt Resistance m T C = 25 C T Coeff Temperature Coefficient ppm/ C P Shunt Power Dissipation W -40 C < T C < 100 C T Range Temperature Range C Internal NTC - Thermistor Characteristics Parameter Definition Min Typ Max Units Conditions R 25 Resistance k T C = 25 C R 125 Resistance k T C = 125 C B B-constant (25-50 C) k [B(1/T2-1/T1)] R 2 = R 1 e Temperature Range C Typ. Dissipation constant mw/ C T C = 25 C Input-Output Logic Level Table V + Hin1,2,3 (13,14,15) Lin1,2,3 (16,17,18) IC Driver Ho Lo U,V,W (2,5,8) HIN1,2,3 LIN1,2,3 U,V,W V X 1 X X X I TRIP 6

7 Figure 1. Input/Output Timing Diagram HIN1,2,3 LIN1,2,3 50% 50% I TRIP U,V,W 50% 50% T ITRIP T FLT-CLR Figure 2. I TRIP Timing Waveform Note 7: The shaded area indicates that both high-side and low-side switches are off and therefore the halfbridge output voltage would be determined by the direction of current flow in the load. 7

8 Module Pin-Out Description Pin Name Description 1 V B1 High Side Floating Supply Voltage 1 2 U, V S1 Output 1 - High Side Floating Supply Offset Voltage 3 NA none 4 V B2 High Side Floating Supply voltage 2 5 V,V S2 Output 2 - High Side Floating Supply Offset Voltage 6 NA none 7 V B3 High Side Floating Supply voltage 3 8 W,V S3 Output 3 - High Side Floating Supply Offset Voltage 9 NA none 10 V + Positive Bus Input Voltage 11 NA none 12 V- Negative Bus Input Voltage 13 H IN1 Logic Input High Side Gate Driver - Phase 1 14 H IN2 Logic Input High Side Gate Driver - Phase 2 15 H IN3 Logic Input High Side Gate Driver - Phase 3 16 L IN1 Logic Input Low Side Gate Driver - Phase 1 17 L IN2 Logic Input Low Side Gate Driver - Phase 2 18 L IN3 Logic Input Low Side Gate Driver - Phase 3 19 Fault/T MON Temperature Monitor and Fault Function 20 I Sense Current Monitor 21 V CC +15V Main Supply 22 V SS Negative Main Supply 8

9 Typical Application Connection IRAM B V + CONTROLLER DC BUS CAPACITORS +5V Fault & Temp Monitor IMonitor 3-Phase AC MOTOR 12kohm BOOT-STRAP CAPACITORS U V W +5V V + V - HIN1 HIN2 HIN3 LIN1 LIN2 LIN3 FLT/TMON ITRIP Vcc (15 V) VSS VB1 VB2 VB IRAM B Date Code Lot # +15V 0.1m 10m 1. Electrolytic bus capacitors should be mounted as close to the module bus terminals as possible to reduce ringing and EMI problems. Additional high frequency ceramic capacitor mounted close to the module pins will further improve performance. 2. In order to provide good decoupling between VCC-VSS and VB1,2,3-VS1,2,3 terminals, the capacitors shown connected between these terminals should be located very close to the module pins. Additional high frequency capacitors, typically 0.1μF, are strongly recommended. 3. Value of the boot-strap capacitors depends upon the switching frequency. Their selection should be made based on IR design tip DN 98-2a, application note AN-1044 or Figure 9. Bootstrap capacitor value must be selected to limit the power dissipation of the internal resistor in series with the VCC. (see maximum ratings Table on page 3). 4. After approx. 8ms the FAULT is reset. (see Dynamic Characteristics Table on page 5). 5. PWM generator must be disabled within Fault duration to guarantee shutdown of the system, overcurrent condition must be cleared before resuming operation. 6. Fault/T MON Monitor pin must be pulled-up to +5V. 9

10 22 Maximum Output Phase RMS Current - A T C = 80ºC T C = 90ºC T C = 100ºC PWM Sw itching Frequency - khz Figure 3. Maximum Sinusoidal Phase Current vs. PWM Switching Frequency Sinusoidal Modulation, V + =400V, T J =150 C, Modulation Depth=0.8, PF= Maximum Output Phase RMS Current - A = 6kHz = 9kHz = 12kHz Modulation Frequency - Hz Figure 4. Maximum Sinusoidal Phase Current vs. Modulation Frequency Sinusoidal Modulation, V + =400V, T J =100 C, Modulation Depth=0.8, PF=

11 Total Power Loss- W I OUT = 18A 50 I OUT = 15A I OUT = 12A PWM Sw itching Frequency - khz Figure 5. Total Power Losses vs. PWM Switching Frequency Sinusoidal Modulation, V + =400V, T J =150 C, Modulation Depth=0.8, PF= Total Power Loss - W = 12kHz = 9kHz = 6kHz Output Phase Current - A RMS Figure 6. Total Power Losses vs. Output Phase Current Sinusoidal Modulation, V + =400V, T J =150 C, Modulation Depth=0.8, PF=

12 160 Max Allowable Case Temperature - ºC = 6kHz = 9kHz = 12kHz Output Phase Current - A RMS Figure 7. Maximum Allowable Case Temperature vs. Output RMS Current per Phase Sinusoidal Modulation, V + =400V, T J =150 C, Modulation Depth=0.8, PF= IGBT Junction Temperature - C Internal Thermistor Temperature Equivalent Read Out - C Figure 8. Estimated Maximum MOSFET Junction Temperature vs. Thermistor Temperature Sinusoidal Modulation, V+=400V, Iphase=15Arms, fsw=6khz, fmod=50hz, MI=0.8, PF=

13 Thermistor Pin Read-Out Voltage - V TTHERM RTHERM TTHERM RTHERM TTHERM RTHERM C C C Min Avg. Max IRAM B VTherm Thermistor Temperature - C Figure 9. Thermistor Readout vs. Temperature (12Kohm pull-up resistor, 5V) and Normal Thermistor Resistance values vs. Temperature Table. +5V REXT RTherm Recommended Bootstrap Capacitor - F F 10 F 6.8 F 4.7 F PWM Frequency - khz Figure 10. Recommended Bootstrap Capacitor Value vs. Switching Frequency 13

14 Figure 11. Switching Parameter Definitions Figure 11a. Input to Output propagation turn-on delay time. Figure 11b. Input to Output propagation turn-off delay time. Figure 11c. Diode Reverse Recovery. 14

15 V + Hin1,2,3 Ho IC Driver U,V,W Lin1,2,3 Lo Figure CT1. Switching Loss Circuit V + Hin1,2,3 Ho IN Lin1,2,3 IC Driver Lo U,V,W IO I o Figure CT2. S.C.SOA Circuit V + Hin1,2,3 Ho IN IC Driver U,V,W Lin1,2,3 Lo IO I o Figure CT3. R.B.SOA Circuit 15

16 Package Outline IRAM B Missing Pin : 3,6,9,11 note3 note4 IRAM B note2 P 4KB00 note5 note1: Unit Tolerance is +0.5mm, Unless Otherwise Specified. note2: Mirror Surface Mark indicates Pin1 Identification. note3: Characters Font in this drawing differs from Font shown on Module. note4: Lot Code Marking. Characters Font in this drawing differs from Font shown on Module. note5: P Character denotes Lead Free. Characters Font in this drawing differs from Font shown on Module. Dimensions in mm For mounting instruction see AN

17 Package Outline IRAM B2 Missing Pin : 3,6,9,11 note3 note4 IRAM B note2 P 4DB00 note5 note1: Unit Tolerance is +0.5mm, Unless Otherwise Specified. note2: Mirror Surface Mark indicates Pin1 Identification. note3: Part Number Marking. Characters Font in this drawing differs from Font shown on Module. note4: Lot Code Marking. Characters Font in this drawing differs from Font shown on Module. note5: P Character denotes Lead Free. Characters Font in this drawing differs from Font shown on Module. Dimensions in mm For mounting instruction see AN-1049 Data and Specifications are subject to change without notice IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, USA Tel: (310) TAC Fax: (310) Visit us at for sales contact information