IR2154 SELF-OSCILLATING HALF-BRIDGE DRIVER. Features. Product Summary. Packages. Description. Typical Connection V OFFSET

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1 Features Integrated 600V half-bridge gate driver 15.6V zener clamp on Vcc True micropower start up Tighter initial deadtime control Low temperature coefficient deadtime Shutdown feature (1/6th Vcc) on C T pin Increased undervoltage lockout Hysteresis (1V) Lower power level-shifting circuit Constant, pulse widths at startup Lower di/dt gate driver for better noise immunity High side output in phase with RT Excellent latch immunity on all inputs and outputs ESD protection on all leads Description Preliminary Data Sheet No. PD60063I IR2154 SELF-OSCILLATING HALF-BRIDGE DRIVER Product Summary V OFFSET 600V max. Duty Cycle 50% Tr/Tp 80/40ns V clamp 15.6V Deadtime (typ.) 1.2 µs Packages The IR2154 is an improved version of the popular IR2152 gate driver IC, and incorporates a high voltage half-bridge gate driver with a front end oscillator similar to the industry standard CMOS 555 timer. The IR2154 provides more functionality and is easier to use than previous ICs. A shutdown feature has been designed into the CT pin, so that both gate driver outputs can be disabled using a low voltage control signal. In addition, the gate driver output pulse widths are the same once the rising undervoltage lockout threshold on VCC has been reached, resulting in a more stable profile of frequency vs time at startup. Noise immunity has been improved significantly, both by lowering the peak di/dt of the gate drivers, and by increasing the undervoltage lockout hysteresis to 1V. Finally, special attention has been payed to maximizing the latch immunity of the device, and providing comprehensive ESD protection on all pins. 8 Lead PDIP 8 Lead SOIC Typical Connection VCC VB 600V MAX RT VS CT Shutdown COM

2 Absolute Maximum Ratings Absolute maximum ratings indicate sustained limits beyond which damage to the device may occur. All voltage parameters are absolute voltages referenced to COM, all currents are defined positive into any lead. The thermal resistance and power dissipation ratings are measured under board mounted and still air conditions. Symbol Definition Min. Max. Units V B High side floating supply voltage V S High side floating supply offset voltage V B - 25 V B V High side floating output voltage V S V B V Low side output voltage -0.3 V CC V RT R T pin voltage -0.3 V CC V CT C T pin voltage -0.3 V CC I CC Supply current (note 1) 25 I RT R T pin current -5 5 dv s /dt Allowable offset voltage slew rate V/ns P D Rth JA Maximum power T A +25 C Thermal resistance, junction to ambient (8 Lead DIP) (8 Lead DIP) (8 Lead SOIC) (8 Lead SOIC) W C/W T J Junction temperature T S Storage temperature C T L Lead temperature (soldering, 10 seconds) 300 V ma Recommended Operating Conditions For proper operation the device should be used within the recommended conditions. Symbol Definition Min. Max. Units V Bs High side floating supply voltage V CC V CLAMP V S Steady state high side floating supply offset voltage -3.0 (note 2) 600 V V CC Supply voltage 10 V CLAMP I CC Supply current (note 3) 5 ma T J Junction temperature C Note 1: Note 2: Note 3: This IC contains a zener clamp structure between the chip V CC and COM which has a nominal breakdown voltage of 15.6V. Please note that this supply pin should not be driven by a DC, low impedance power source greater than the V CLAMP specified in the Electrical Characteristics section. Care should be taken to avoid output switching conditions where the V S node flies inductively below ground by more than 5V. Enough current should br supplied to the V CC pin of the IC to keep the internal 15.6V zener diode clamping the voltage at this pin. 2

3 Recommended Component Values Symbol Component Min. Max. Units R T Timing resistor value 10 kω C T C T pin capacitor value 330 pf IR2153 IR2154 RT vs Frequency Frequency (Hz) pf 470pF 1nF 2.2nF CT Values 4.7nF nF RT (ohms) Electrical Characteristics V BIAS (V CC, V BS ) = 12V, C L = 1000 pf, C T = 1 nf and T A = 25 C unless otherwise specified. The V IN, V TH and I IN parameters are referenced to COM. The V O and I O parameters are referenced to COM and are applicable to the respective output leads: or. Low Voltage Supply Characteristics V CCUV+ Rising V CC undervoltage lockout threshold V CCUV- Falling V CC undervoltage lockout threshold V CCUVH V CC undervoltage lockout Hysteresis I QCCUV Micropower startup V CC supply current V CC V µa CCUV- I QCC Quiescent V CC supply current V CLAMP V CC zener clamp voltage V I CC = 5mA 3 V

4 Electrical Characteristics (cont.) Floating Supply Characteristics I QBSUV Micropower startup V BS supply current 0 10 I QBS Quiescent VBS supply current µa V CC V CCUV- V BSMIN Minimum required V BS voltage for proper V V CC =V CCUV V functionality from R T to I LK Offset supply leakage current 50 µa V B = V S = 600V Oscillator I/O Characteristics fosc Oscillator frequency khz R T = 36.9kΩ RT = 7.43kΩ d RT pin duty cycle % fo < 100kHz I CT CT pin current ua I CTUV UV-mode CT pin pulldown current ma V CC = 7V VCT+ Upper CT ramp voltage threshold 8.0 VCT- Lower CT ramp voltage threshold 4.0 V VCTSD CT voltage shutdown threshold V RT+ High-level RT output voltage, VCC - VRT I RT = 100µA I RT = 1mA V RT- Low-level RT output voltage IRT = 100µA I RT = 1mA mv VRTUV UV-mode RT output voltage V CC V CCUV- VRTSD SD-Mode RT output voltage, VCC - VRT I RT = 100µA, V CT = 0V I RT = 1mA, V CT = 0V Gate Driver Output Characteristics V OH High level output voltage, V BIAS -V O I O = OA VOL Low-level output voltage, VO I O = OA mv VOL_UV UV-mode output voltage, VO I O = OA V CC V CCUVtr Output rise time tf Output fall time nsec tsd Shutdown propogation delay 660 td Output deadtime ( or ) µsec 4

5 Functional Block Diagram R T V B R R + - HV LEVEL SHIFT HV LEVEL SHIFT PULSE FILTER R S Q C T R/2 R/ R Q S Q GIC DEAD TIME DEAD TIME PULSE GEN DELAY 15.6V V S V CC UV DETECT COM Lead Definitions Symbol V CC R T C T COM V S V B Description Logic and internal gate drive supply voltage Oscillator timing resistor input Oscillator timing capacitor input IC power and signal ground Low side gate driver output High voltage floating supply return High side gate driver output High side gate driver floating supply Lead Assignments 8 Lead PDIP 8 Lead SOIC IR2154 IR2154S 5

6 8 Lead PDIP Lead SOIC

7 Vccuv+ V CLAMP Vcc 2/3 R T,C T 1/3 R T C T td td Figure 1. Input/Output Timing Diagram Figure 2. Switching Time Waveform Definitions Figure 3. Deadtime Waveform Definitions WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California Tel: (310) IR GREAT BRITAIN: Hurst Green, Oxted, Surrey RH8 9BB, UK Tel: IR CANADA: 15 Lincoln Court, Brampton, Ontario L6T 3Z2 Tel: (905) IR GERMANY: Saalburgstrasse 157, Bad Homburg Tel: IR ITALY: Via Liguria 49, Borgaro, Torino Tel: IR FAR EAST: K&H Bldg., 2F, 30-4 Nishi-Ikebukuro 3-Chome, Toshima-Ku, Tokyo, Japan 171 Tel: IR SOUTHEAST ASIA: 1 Kim Seng Promenade, Great World City West Tower, 13-11, Singapore Tel: IR TAIWAN: 16 Fl. Suite D..207, Sec.2, Tun Haw South Road, Taipei, 10673, Taiwan Tel: Data and specifications subject to change without notice. 3/1/99 7