2.5 A Output Current IGBT and MOSFET Driver

Transcription

1 VO. A Output Current IGBT and MOSFET Driver 9 DESCRIPTION NC A C NC _ The VO consists of a LED optically coupled to an integrated circuit with a power output stage. This optocoupler is ideally suited for driving power IGBTs and MOSFETs used in motor control inverter applications. The high operating voltage range of the output stage provides the drive voltages required by gate controlled devices. The voltage and current supplied by this optocoupler makes it ideally suited for directly driving IGBTs with ratings up to V/ A. For IGBTs with higher ratings, the VO can be used to drive a discrete power stage which drives the IGBT gate. Shield V D E V CC V EE FEATURES. A minimum peak output current kv/μs minimum common mode rejection (CMR) at V CM = V I CC =. ma maximum supply current Under voltage lock-out (UVLO) with hysteresis Wide operating V CC range: V to V. μs maximum pulse width distortion Industrial temperature range: - C to C. V maximum low level output voltage (L ) Reinforced insulation rated per DIN EN -- Material categorization: For definitions of compliance please see APPLICATIONS Isolated IGBT/MOSFET gate driver AC and brushless DC motor drives Induction stove top Industrial inverters Switch mode power supplies (SMPS) Uninterruptible power supplies (UPS) AGENCY APPROVALS UL - file no. E system code H, double protection cul - file no. E, equivalent to CSA bulletin A DIN EN -- (VDE ) and reinforced insulation rating available with option ORDERING INFORMATION x - X # # T DIP- PART NUMBER PACKAGE OPTION TAPE AND REEL. mm Option Option 9 >. mm >. mm PACKAGE UL, cul UL, cul, VDE DIP-, tubes VO VO-X SMD-, option, tape and reel VO-XT - SMD-, option 9, tape and reel - VO-X9T Rev.., 9-Oct- Document Number: ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT

2 VO TRUTH TABLE LED V CC - V EE POSITIVE GOING (TURN ON) V CC - V EE NEGATIVE GOING (TURN OFF) Off V to V V to V Low On V to V V to 9. V Low On V to. V 9. V to V Transition On. V to V V to V High V ABSOLUTE MAXIMUM RATINGS (T amb = C, unless otherwise specified) PARAMETER TEST CONDITION SYMBOL VALUE UNIT INPUT Input forward current I F ma Peak transient input current < μs pulse width, pps I F(TRAN) A Reverse input voltage V R V Output power dissipation P diss mw OUTPUT High peak output current () I OH(PEAK). A Low peak output current () I OL(PEAK). A Supply voltage (V CC - V EE ) to V Output voltage (PEAK) to V CC V Output power dissipation P diss mw OPTOCOUPLER Isolation test voltage (between emitter and detector) t = s V ISO V RMS Storage temperature range T S - to C Ambient operating temperature range T A - to C Total power dissipation P tot 9 mw Lead solder temperature () For s,. mm below seating plane C Notes Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. Functional operation of the device is not implied at these or any other conditions in excess of those given in the operational sections of this document. Exposure to absolute maximum ratings for extended periods of the time can adversely affect reliability. () Maximum pulse width = μs, maximum duty cycle =. %. This value is intended to allow for component tolerances for designs with I O peak minimum =. A. See applications section for additional details on limiting I OH peak. () Refer to reflow profile for soldering conditions for surface mounted devices (SMD). Refer to wave profile for soldering conditions for through hole devices (DIP). RECOMMENDED OPERATING CONDITION PARAMETER SYMBOL MIN. MAX. UNIT Power supply voltage V CC - V EE V Input LED current (on) I F ma Input voltage (off) V F(OFF) -. V Operating temperature T amb - C Rev.., 9-Oct- Document Number: ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT

3 VO THERMAL CHARACTERISTICS PARAMETER SYMBOL VALUE UNIT LED power dissipation P diss mw Output power dissipation P diss mw Total power dissipation P tot mw Maximum LED junction temperature T jmax. C Maximum output die junction temperature T jmax. C Thermal resistance, junction emitter to board θ JEB 9 C/W Thermal resistance, junction emitter to case θ JEC 9 C/W Thermal resistance, junction detector to board θ JDB C/W Thermal resistance, junction detector to case θ JDC C/W Thermal resistance, junction emitter to junction detector θ JED C/W Thermal resistance, case to ambient θ CA C/W Note The thermal characteristics table above were measured at C and the thermal model is represented in the thermal network below. Each resistance value given in this model can be used to calculate the temperatures at each node for a given operating condition. The thermal resistance from board to ambient will be dependent on the type of PCB, layout and thickness of copper traces. For a detailed explanation of the thermal model, please reference Vishay s Thermal Characteristics of Optocouplers application note. T JD 999 θ DB θ DC T A T C T B θ DE θ CA θ BA T A Package θ EC θ EB T JE ELECTRICAL CHARACTERISTICS PARAMETER TEST CONDITION SYMBOL MIN. TYP. MAX. UNIT High level output current = (V CC - V) I () OH. A = (V CC - V) I () OH. A Low level output current = (V EE. V) I () OL. A = (V EE V) I () OL. A High level output voltage I O = - ma V () OH V CC - V Low level output voltage I O = ma L.. V High level supply current Output open, I F = ma to ma I CCH. ma Low level supply current Output open, V F = - V to. V I CCL. ma Threshold input current low to high I O = ma, > V I FLH ma Threshold input voltage high to low V FHL. V Input forward voltage I F = ma V F. V Temperature coefficient of forward voltage I F = ma ΔV F /ΔT A -. mv/ C Input reverse breakdown voltage I R = μa BV R V Input capacitance f = MHz, V F = V C IN pf V V UVLO. V UVLO threshold I F = ma V UVLO - 9. V UVLO hysteresis UVLO HYS. V Notes Minimum and maximum values were tested over recommended operating conditions (T A = - C to C, I F(ON) = ma to ma, V F(OFF) = - V to. V, V CC = V to V, V EE = ground) unless otherwise specified. Typical values are characteristics of the device and are the result of engineering evaluations. Typical values are for information only and are not part of the testing requirements. All typical values were measured at T amb = C and with V CC - V EE = V. () Maximum pulse width = μs, maximum duty cycle =. %. () Maximum pulse width = μs, maximum duty cycle =. %. This value is intended to allow for component tolerances for designs with I O peak minimum =. A. () In this test H is measured with a dc load current. When driving capacitive loads H will approach V CC as I OH approaches zero A. Maximum pulse width = ms, maximum duty cycle = %. Rev.., 9-Oct- Document Number: ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT

4 VO TEST CIRCUITS I F = ma to ma. µf I OH V V CC = V to V. µf L ma V CC = V to V 9-9- Fig. - I OH Test Circuit Fig. - L Test Circuit. µf. V I OL V CC = V to V I F. µf V > V CC= V to V 9-9- Fig. - I OL Test Circuit Fig. - I FLH Test Circuit. µf. µf I V = V F = ma CC to ma to V H ma IF = ma > V V CC 9-9 Fig. - H Test Circuit Fig. - UVLO Test Circuit SWITCHING CHARACTERISTICS PARAMETER TEST CONDITION SYMBOL MIN. TYP. MAX. UNIT Propagation delay time to logic low output () R g = Ω, C g = nf, f = khz, duty cycle = %.. μs Propagation delay time to logic high output () R g = Ω, C g = nf, f = khz, duty cycle = %.. μs Pulse width distortion () R g = Ω, C g = nf, f = khz, duty cycle = % PWD. μs Rise time R g = Ω, C g = nf, f = khz, duty cycle = % t r. μs Fall time R g = Ω, C g = nf, f = khz, duty cycle = % t f. μs UVLO turn on delay > V, I F = ma T UVLO-ON. μs UVLO turn off delay < V, I F = ma T UVLO-OFF. μs Notes () This load condition approximates the gate load of a V/ A IGBT. () Pulse width distortion (PWD) is defined as - for any given device. () The difference between and between any two VO parts under the same test condition. Rev.., 9-Oct- Document Number: ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT

5 VO khz % Duty Cycle I = ma to ma F Ω. µf Ω nf V CC = V to V I F OUT t r t f 9 % % % 99- Fig. -,, t r and t f Test Circuit and Waveforms COMMON MODE TRANSIENT IMMUNITY PARAMETER TEST CONDITION SYMBOL MIN. TYP. MAX. UNIT Common mode transient immunity at logic high output ()() T A = C, I F = ma to ma, V CM = V, V CC = V Common mode transient immunity at T A = C, V CM = V, logic low output ()() V CC = V, V F = V CM H kv/μs CM L kv/μs Notes () Pins and need to be connected to LED common. () Common mode transient immunity in the high state is the maximum tolerable dv CM /dt of the common mode pulse, V CM, to assure that the output will remain in the high state (i.e., > V). () Common mode transient immunity in a low state is the maximum tolerable dv CM /dt of the common mode pulse, V CM, to assure that the output will remain in a low state (i.e., < V). V dv V = CM I dt Δt F. μf A R V Δt V CC = V H Switch at A: I F = ma L Switch at B: I F = ma 9- V CM = V Fig. - CMR Test Circuit and Waveforms Rev.., 9-Oct- Document Number: ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT

6 VO SAFETY AND INSULATION RATINGS PARAMETER TEST CONDITION SYMBOL MIN. TYP. MAX. UNIT Climatic classification (according to IEC part ) // Comparative tracking index CTI 99 Peak transient overvoltage V IOTM V Peak insulation voltage V IORM 9 V Safety rating - power output P SO mm Safety rating - input current I SI mm Safety rating - temperature T SI C Creepage distance Standard DIP- mm Clearance distance Standard DIP- mm Creepage distance mil DIP- mm Clearance distance mil DIP- mm Note As per IEC --,..., this optocoupler is reinforced rated and suitable for safe electrical insulation only within the safety ratings. Compliance with the safety ratings shall be ensured by means of protective circuits. TYPICAL CHARACTERISTICS (T amb = C, unless otherwise specified) H - VCC - High Output Voltage Drop (V) I F = ma I OUT = - ma V CC = V V EE = V Fig. 9 - High Output Voltage Drop vs. Temperature L - Output Low Voltage (V) V F =. V I OUT = ma V CC = V V EE = V Fig. - Output Low Voltage vs. Temperature I OH - High Output Current (A) I F = ma V out = (V CC - ) V V CC = V V EE = V - - Fig. - High Output Current vs. Temperature I OL - Output Low Current (A)... I F = ma V out =. V V CC = V V EE = V. - - Fig. - Output Low Current vs. Temperature Rev.., 9-Oct- Document Number: ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT

7 VO L - Output Low Voltage (V) I F = ma V CC = V V EE = V C - C I OL - Output Low Current (A) C Fig. - Output Low Voltage vs. Output Low Current I CC - Supply Current (ma)..... I F = ma for I CCH I F = ma for I CCL T A = C V EE = V I CCH I CCL. V CC - Supply Voltage (V) Fig. - Supply Current vs. Supply Voltage (H - V CC ) Output High Voltage Drop (V) C - C I F = ma V CC = V V EE = V C -... I OH - Output High Current (A) Fig. - Output High Voltage Drop vs. Output High Current I FLH - Low to High Current Threshold (ma).. V CC = V. V EE = V Output = open Fig. - Low to High Current Threshold vs. Temperature I CC - Supply Current (ma).... I F = ma for I CCH. I F = ma for I CCL V CC = V I CCL V EE = V - - I CCH Fig. - Supply Current vs. Temperature - Output Voltage (V) T A = C I F - Forward LED Current (ma) Fig. - Transfer Characteristics Rev.., 9-Oct- Document Number: ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT

8 VO t p - Propagation Delay (ns) I F = ma, T A = C R g = Ω, C g = nf Duty cycle = % f = khz t p - Propagation Delay (ns) V CC = V, V EE = V I F = ma, T A = C C g = nf Duty cycle = % f = khz V CC - Supply Voltage (V) Fig. 9 - Propagation Delay vs. Supply Voltage R g - Series Load Resistance (Ω) Fig. - Propagation Delay vs. Series Load Resistance t p - Propagation Delay (ns) V CC = V, V EE = V I F = ma R g = Ω, C g = nf Duty cycle = % f = khz t p - Propagation Delay (ns) V CC = V, V EE = V I F = ma, T A = C R g = Ω Duty cycle = % f = khz - - T A - Fig. - Propagation Delay vs. Temperature C g - Series Load Capacitance (nf) Fig. - Propagation Delay vs. Series Load Capacitance t p - Propagation Delay (ns) V CC = V, V EE = V T A = C R g = Ω, C g = nf Duty cycle = % f = khz I F - Forward LED Current (ma) Fig. - Propagation Delay vs. Forward LED Current Rev.., 9-Oct- Document Number: ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT

9 VO PACKAGE DIMENSIONS in millimeters Pin one ID. ±. ISOmethodA 9. ±..9 ±.9 typ..9. typ.. ±..9 ±... ±.. ±.9 to 9. ±.. typ.. ±. Option Option 9 i. typ.. max.. typ.. min.. ±.. ±.. ±. min.. min.. max.. min. min.... R... R.. - min... min... PACKAGE MARKING VO X V YWW H Notes The VDE logo is only marked on option parts. Tape and reel suffix (T) is not part of the package marking. Rev.., 9-Oct- 9 Document Number: ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT

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