High Reliability Radiation Hardened Semiconductors
|
|
|
- Nathaniel McDaniel
- 9 years ago
- Views:
Transcription
1 High Reliability Radiation Hardened Semiconductors Rectifiers & Diodes BiPolar Transistors Power MOSFETs HiREL Product Guide
2 Contents Page Introduction 3 MIL-PRF Radiation Test Requirements 4 Ionizing Dose (TID) or Gamma Irradiation Enhanced Low Dose Rate Sensitivity (ELDRS) Neutron Irradiation Single Event Effects (SEE) High Reliability Radiation Hardened d Rectifier er & Diode Products 5 Rectifiers Zeners and Transient Voltage Suppressors pr sors (TVS) Schottky Rectifiers Temperature Compensated Zeners (TCZ High Reliability Radiation Hardened Bipolar Transistors stor 6-7 Product Listing Dose Irradiation Effects on Bipolar Transistors st s High Reliability Radiation Hardened Power MOSFETs 8-9 Product Listing Single Event Capability High Reliability Radiation Hardened Semiconductor Chips 10 Blank Note Pages Tools for Learning About Microsemi s High Reliability ility Products 15 Updates/Inserts Pocket 15 Contents 2
3 Leader in Radiation Hardened Products Microsemi Corporation (MSCC) is the world s leading supplier of High Reliability Discrete Semiconductors. Microsemi was the first diode manufacturer selected by the U.S. military services as a source of supply to qualify product to the highest specified reliability level JANS. Our heritage in supplying space compliant semiconductor products in accordance with MIL-PRF extends over 30 years. Microsemi has expanded its space product offering to include a wide variety of hermetic diodes, transistors, and MOSFETs. Microsemi has been involved in numerous military and commercial space programs involving radiation hardened product specifications with stringent performance requirements. This now includes the largest selection of JANS qualified products in the world; a portfolio that has become predominant in satellite and launch vehicle programs. With recent design trends, the ability to assemble in a variety of packaging styles has become essential. This includes surface mount packaging options for virtually any product, as well as chips for hybrid use. Diodes Power Mosfets Rectifiers Schottkys Transistors Zeners Key Application Specific Products Thermally activated battery bypass switches for satellites Solar cell bypass diodes for bypassing faulty solar cells Zero temperature coefficient radiation hardened compensated zener diodes Custom Products Complete solutions from die selection and screening through module assembly Custom test, environmental and screening capabilities Full range of Dose, ELDRs and Single Event Effects (SEE) characterizations available Overview 3
4 Radiation Services MIL-PRF is the General Performance Specification for Semiconductor Devices. This specification is maintained by the Defense Logistics Agency (DLA) to provide the supplier requirements for manufacturing high reliability semiconductors. MIL-PRF-19500, along with the detailed part requirements found in related slashsheets, and MIL-STD-750 ( Test Methods for Semiconductor Devices published by the United States Department of Defense) combine to fully specify the scope of Radiation test requirements for discrete semiconductor part types. The following is a brief description of the key radiation tests detailed in these documents. Radiation Tests Services Available Microsemi is capable of performing all the methods listed below and offers these test services to our customers. Please contact Microsemi Sales for a review of your unique radiation test requirements. RHA Prefix M D P L R F G H Example: Ionizing Dose Level 3K RADS 10K RADS 30K RADS 50K RADS 100K RADS 300K RADS 500K RADS 1000K RADS JANSR2N2222A (100K RADS) JANSF2N7261 (300K RADS) Ionizing Dose (TID) or Gamma Irradiation Per Mil-Std-750 Method 1019 Dose rate RAD(Si)/s nominal 100RAD(Si)/s Typically 3kRAD(Si) to 1MRAD(Si) or 300Gy(Si) to 10000Gy(Si) Note Gy = Gray where 100RAD = Gray ELDRS (Enhanced Low Dose Rate Sensitivity) Reference Mil-Std-833 Method 1019 Dose rate either 0.01RAD(Si)/s to 0.020RAD(Si)/s Typically 10kRAD(Si) which takes 7 days at 0.020RAD(Si)/s Neutron Irradiation (Fast Neutrons) Per Mil-Std-750 Method 1017 Typically 1E12 n/cm 2 to 1E15n/cm 2 Large 12 x 12 x 12 inch Target Chamber (can test small systems) Radiation Services Single Event Effects (SEE) with Heavy Ions Per Mil-Std-750 Method 1080 Single Event Gate Response (SEGR) Single Event Burnout (SEB) K500 Cyclotron with a wide variety of LETs and Ranges Radiation Services Available Microsemi is capable of performing all of the radiation test methods listed above and offers these test services to our customers. Please contact the Microsemi Sales department for review of your unique radiation test requirements. 7 4
5 High Reliability Radiation Hardened Rectifier & Diode Products Most Microsemi Space-level rectifier and diode products are inherently radiation hardened. This fact has been understood by our major customers for many years. As a result, our heritage of usage in space programs is unsurpassed in the industry. Due to the inherent capability of rectifiers and diodes, MIL-PRF in general does not specify radiation hardness levels for this product family (some exceptions do exist). Microsemi s portfolio of JANS qualified rectifiers and diodes is far too extensive to list in this shortfom catalog. The following provides a broad overview of the radiation hardened performance of our core space level diode families. For specific performance information, please visit our website at or Microsemi Sales. Rectifiers are naturally radiation hard up to 10 6 or 10 7 RAD(Si) and n/cm 2. This depends heavily on breakdown voltage (VBR), lifetime (switching speed), etc. with forward voltage (VF) and reverse leakage current (IR) being the affected parameters. The fast and ultrafast recovery rectifiers (FRR and UFR) will have much less effect from high radiation. Zeners and Transient Voltage Suppressors (TVS) are naturally very radiation hard as they employ majority carrier avalanche breakdown. These easily perform up to 10 7 RAD(Si) and n/cm 2 for products up to 200 volts. Below 100 volts, they exceed 10 8 RAD(Si) and n/cm 2. Schottky Rectifiers also operate on a majority carrier principle with natural radiationhard performance and are comparable to zeners less than 100 volts described above. Typically, reverse leakage current (IR) is affected although not enough to affect performance. Exposure of 10 6 RAD(Si) is considered acceptable as well as n/cm 2 or higher. Temperature Compensated Zeners (TCZ) are manufactured with process to improve stability and this process makes these parts naturally radiation hard. These reference diodes are capable of performance up to 10 6 RAD and n/cm 2. Rectifiers & Diodes 5
6 High Reliability Radiation Hardened Bipolar Transistors Part Number V(BR) IC Max TID MIL-PRF- CEO Rating SMD-0.5 (Surface Mount) NPN Power JANSF2N5152U3 80V 10.0A 300K RAD /544 JANSF2N5154U3 80V 10.0A 300K RAD /544 PNP Power JANSF2N5151U3 80V 10.0A 300K RAD /545 JANSF2N5153U3 80V 10.0A 300K RAD /545 Bipolar TO-18 JANSH2N2221A 50V 0.8A 1 MEG RAD /255 JANSH2N2221AL 50V 0.8A 1 MEG RAD /255 JANSH2N2222A 50V 0.8A 1 MEG RAD /255 JANSH2N2222AL 50V 0.8A 1 MEG RAD /255 JANSF2N2369A 15V 0.1A 300K RAD /317 JANSR2N V 1.0A 100K RAD /391 JANSF2N V 0.1A 300K RAD /317 PNP Silicon Switcher JANSR2N2906A 60V 0.6A 100K RAD /291 JANSR2N2906AL 60V 0.6A 100K RAD /291 JANSR2N2907A 60V 0.6A 100K RAD /291 JANSR2N2907AL 60V 0.6A 100K RAD /291 TO-39 JANSR2N V 0.8A 100K RAD /251 JANSR2N2218A 50V 0.8A 100K RAD /251 JANSR2N V 0.8A 100K RAD /251 JANSR2N2219A 50V 0.8A 100K RAD /251 JANSR2N3019S 80V 1.0A 100K RAD /391 JANSR2N3439L 350V 1.0A 100K RAD /368 JANSR2N3440L 250V 1.0A 100K RAD /368 JANSR2N V 0.3A 100K RAD /366 JANSR2N V 0.3A 100K RAD /366 JANSR2N V 0.3A 100K RAD /366 JANSR2N V 0.3A 100K RAD /366 PNP Silicon Switcher JANSR2N V 1.0A 100K RAD /357 JANSR2N V 1.0A 100K RAD /357 JANSR2N V 1.0A 100K RAD /357 JANSR2N V 1.0A 100K RAD /357 NPN Power JANSF2N V 10.0A 300K RAD /544 JANSF2N V 10.0A 300K RAD /544 PNP Power JANSF2N V 10.0A 300K RAD /545 JANSF2N V 10.0A 300K RAD /545 Part Number V(BR) IC Max TID MIL-PRF- CEO Rating TO-5 JANSR2N2218AL 50V 0.8A 100K RAD /251 JANSR2N2219AL 50V 0.8A 100K RAD /251 JANSR2N V 1.0A 100K RAD /391 JANSR2N V 1.0A 100K RAD /368 JANSR2N V 1.0A 100K RAD /368 JANSR2N3498L 100V 0.3A 100K RAD /366 JANSR2N3499L 100V 0.3A 100K RAD /366 JANSR2N3500L 150V 0.3A 100K RAD /366 JANSR2N3501L 150V 0.3A 100K RAD /366 PNP Silicon Switcher JANSR2N3634L 140V 1.0A 100K RAD /357 JANSR2N3635L 140V 1.0A 100K RAD /357 JANSR2N3636L 175V 1.0A 100K RAD /357 JANSR2N3637L 175V 1.0A 100K RAD /357 NPN Power JANSF2N5152L 80V 10.0A 300K RAD /544 JANSF2N5154L 80V 10.0A 300K RAD /544 PNP Power JANSF2N5151L 80V 10.0A 300K RAD /545 JANSF2N5153L 80V 10.0A 300K RAD /545 TO-59 NPN Power JANSF2N V 10.0A 300K RAD /534 JANSF2N V 10.0A 300K RAD /534 TO-78 PNP DUAL JANSF2N V 0.1A 300K RAD /336 JANSF2N3810L 60V 0.1A 300K RAD /336 JANSF2N V 0.1A 300K RAD /336 JANSF2N3811L 60V 0.1A 300K RAD /336 Products are listed with the highest qualified radiation hardness assurance designation as described on Page 4 of this brochure. 6
7 Part Number V(BR) IC Max TID MIL-PRF- CEO Rating Pin LCC (Surface Mount) JANSH2N2221AUB 50V 0.8A 1 MEG RAD /255 JANSH2N2221AUBC 50V 0.8A 1 MEG RAD /255 JANSH2N2222AUB 50V 0.8A 1 MEG RAD /255 JANSH2N22222AUBC 50V 0.8A 1 MEG RAD /255 JANSF2N2369AUB 15V 0.1A 300K RAD /317 JANSF2N2369AUBC 15V 0.1A 300K RAD /317 JANSR2N3501UB 150V 0.3A 100K RAD /366 JANSR2N3700UB 80V 1.0A 100K RAD /391 PNP Silicon Switcher JANSR2N2906AUB 60V 0.6A 100K RAD /291 JANSR2N2906AUBC 60V 0.6A 100K RAD /291 JANSR2N2907AUB 60V 0.6A 100K RAD /291 JANSR2N2907AUBC 60V 0.6A 100K RAD /291 JANSR2N3634UB 140V 1.0A 100K RAD /357 JANSR2N3635UB 140V 1.0A 100K RAD /357 JANSR2N3636UB 175V 1.0A 100K RAD /357 JANSR2N3637UB 175V 1.0A 100K RAD /357 4 Pin LCC (Surface Mount) JANSH2N2221AUA 50V 0.8A 1 MEG RAD /255 JANSH2N22222AUA 50V 0.8A 1 MEG RAD /255 JANSF2N2369AUA 15V 0.1A 300K RAD /317 JANSR2N3439UA 350V 1.0A 100K RAD /368 JANSR2N3440UA 250V 1.0A 100K RAD /368 PNP Silicon Switcher JANSR2N2906AUA 60V 0.6A 100K RAD /291 JANSR2N2907AUA 60V 0.6A 100K RAD /291 6 Pin LCC (Surface Mount) JANSF2N2369AU 15V 0.1A 300K RAD /317 JANSF2N3810U 60V 0.1A 300K RAD /336 PNP DUAL JANSF2N3811U 60V 0.1A 300K RAD /336 TO-254AA NPN Power JANSF2N V 10.0A 300K RAD /613 TO-46 JANSR2N3057A 80V 1.0A 100K RAD /391 Dose Irradiation Effects on Bipolar Transistors Ionizing radiation damage in semiconductor devices is mainly the result of charges trapped on or near the surfaces of their insulating layers and interfaces. In bipolar devices, a trapped charge at their surface layers produce inversion layers that expand the effective surface area, hence, modifying the surface potential at the Si-SiO 2 interfaces. This means that there will be a reduction in the minority carrier life-time and hence a corresponding decrease in the DC current gain (hfe) of the DUT. Therefore, bipolar transistors require special calculations to report their post-irradiation performance: (a) Delta (1/hFE): Let hfe1 be the measured hfe at a specific test point (Vce, Ic) prior to irradiation. Let hfe2 be the measured hfe post-irradiation at that same test point. Then: Delta (1/hFE) = (1/hFE) = 1/hFE2 1/hFE1 and is unitless as is hfe. Example: hfe1 = 200 before irradiation and at post-irradiation testing it has decreased to hfe2 = 125.Then: (1/hFE) = 1/125 1/200 = (b) [hfe] calculation is not a directly measured value of hfe, but rather a calculated value used by system analysis engineers. It signifies exactly how well the bipolar transistor will perform in the system after exposure to a radiation fluence. This [hfe] is denoted in square brackets [ ] to delineate it from any measured value of hfe and uses the calculated value of Delta (1/hFE) but adds one additional term. Calculate as follows: Let hfe(min) be the pre-irradiation spec minimum hfe limit at the same test point in the Delta(1/hFE) calculation shown above. Then: [hfe] = inverse { (1/hFE) + 1/hFE)min} Example: hfe(min) = 100 and, in accordance with the above expample, (1/hFE) = Then: [hfe] = inverse { /100 } = inverse { } = 1 / { 0.013} = Note that [hfe] can never exceed hfe (min). (c) When (1/hFE), [hfe] or both are required by the control specification, these calculations will only be required on the irradiation test samples. The test report shall then contain, in spreadsheet fashion, the appropriate pre and post hfe measurements as well as the required calculation results. Unless otherwise specified, all devices shall adhere to the specification maximum hfe limits that were imposed pre-irradiation. Bipolar Products are listed with the highest qualified radiation hardness assurance designation as described on Page 4 of this brochure. 7
8 NEW QUALIFICATION High Reliability Radiation Hardened Power MOSFETs Microsemi has recently qualified its first generation of Radiation Hardened Power MOSFETs. The post irradiation test requirements for MOSFETs are clearly defined in the controlling MIL-PRF slashsheets. Typically, MOSFETs show movement in threshold voltage (Vth) after exposure to Ionizing Dose (TID) Irradiation. Following is a listing of our current MIL-PRF radiation hardened qualified devices. Check our website for the latest product offerings as we continue to expand this product portfolio. TO-205AF (TO-39) Part Number Channel BVDSS VGS RDS(on) MAX TID MIL-PRF- ID MAX PD MAX MIN MAX MAX Rating Spec. V V mω A W (K RAD) JANSR2N7389 P -100 ± /630 JANSF2N7389 P -100 ± /630 JANSR2N7261 N 100 ± /601 JANSF2N7261 N 100 ± /601 JANSR2N7262 N 200 ± /601 JANSF2N7262 N 200 ± /601 TO-257AA JANSR2N7382 P -100 ± /615 JANSF2N7382 P -100 ± /615 JANSR2N7380 N 100 ± /614 JANSF2N7380 N 100 ± /614 JANSR2N7381 N 200 ± /614 JANSF2N7381 N 200 ± / Pin LCC (Surface Mount) JANSR2N7389U P -100 ± /630 JANSF2N7389U P -100 ± /630 JANSR2N7261U N 100 ± /601 JANSF2N7261U N 100 ± /601 JANSR2N7262U N 200 ± /601 JANSF2N7262U N 200 ± /601 Power MOSFETs SMD-1 (TO-267AB Surface Mount) MSR2N7394U** N 60 ± N/A MSF2N7394U** N 60 ± N/A JANSR2N7394U* N 60 ± /603 JANSF2N7394U* N 60 ± /603 JANSR2N7268U N 100 ± /603 JANSF2N7268U N 100 ± /603 JANSR2N7269U N 200 ± /603 JANSF2N7269U N 200 ± /603 TO-254AA MSR2N7394** N 60 ± N/A JANSF2N7394* N 60 ± /603 JANSR2N7268 N 100 ± /603 JANSF2N7268 N 100 ± /603 JANSR2N7269 N 200 ± /603 JANSF2N7269 N 200 ± /603 * DLA qualification in progress ** Microsemi qualified part 48
9 Single Event Capability In addition to TID, Microsemi routinely performs Single Event Effects (SEE) testing using Heavy Ions. Microsemi MOSFETs are sample tested for Single Event Gate Rupture (SEGR) and Single Event Burnout (SEB). The following graphs summarize the SEE results obtained for each of the MOSFET groups. Drain Bias, V V N-channel: 2N7261, 2N7268, 2N Gate Bias, V -25 TAMU Ar LET=8.3 Range =192um Energy=531MeV TAMU Kr LET=27.8 Range =134um Energy=1032MeV TAMU Ag LET=42.2 Range =119um Energy=1289MeV TAMU Au LET=85.4 Range =118um Energy=2247MeV Drain Bias, V V N-channel: 2N7262, 2N7269, 2N Gate Bias, V -25 TAMU Ar LET=8.3 Range =192um Energy=531MeV TAMU Kr LET=27.8 Range =134um Energy=1032MeV TAMU Ag LET=42.2 Range =119um Energy=1289MeV TAMU Au LET=85.4 Range =118um Energy=2247MeV Drain Bias, V V P-channel: 2N7382, 2N Gate Bias, V TAMU Ar LET=8.3 Range =192um Energy=531MeV TAMU Kr LET=27.8 Range =134um Energy=1032MeV TAMU Ag LET=42.2 Range =119um Energy=1289MeV TAMU Au LET=85.4 Range =118um Energy=2247MeV Power MOSFETs 59
10 High Reliability Radiation Hardened Semiconductor Chips Microsemi Corporation is a leader in the sale of semiconductor chips to the high reliability military and space community for hybrid circuit applications. We are continuously adding to our qualified product listings. If you are unable to find the chip you are looking for, please contact our Sales Department for the latest updates. We also regularly sell commercial chip and JANHC/JANKC equivalents to meet customer specific needs. Semiconductor Chips 10
11 Solar Flare NASA Solar Dynamics Observatory High Reliability, Radiation Hardened Semiconductors Microsemi has a team of specialists available to provide application support for you High Reliability requirements. Call for more information or visit our website. America Sales Direct Microsemi Corporation 6 Lake Street Lawrence, MA Ph: Fax: [email protected] Europe / Asia Sales Direct Microsemi Corporation Gort Road Business Park Ennis, County Clare Ireland Ph: [email protected] Microsemi Corporation. Specifications subject to change without notice. 9
NPN Darlington Power Silicon Transistor Qualified per MIL-PRF-19500/472
and Available on commercial versions NPN Darlington Power Silicon Transistor Qualified per MIL-PRF-19500/472 DESCRIPTION Qualified Levels: JAN, JANTX, and JANTX This high speed NPN transistor is military
VOIDLESS HERMETICALLY SEALED STANDARD RECOVERY GLASS RECTIFIERS. Qualified to MIL-PRF-19500/420
Available on commercial versions VOIDLESS HERMETICALLY SEALED STANDARD RECOVERY GLASS RECTIFIERS Qualified to MIL-PRF-19500/420 DESCRIPTION This standard recovery rectifier diode series is military qualified
HIGH VOLTAGE TEMPERATURE COMPENSATED ZENER REFERENCE DIODES
Available HIGH VOLTAGE TEMPERATURE COMPENSATED ZENER REFERENCE DIODES DESCRIPTION The 1N4057 through 1N4085A series of temperature compensated reference diodes provides a wide selection of nominal voltages
MHL8701 MHL8705. MHL8701 / MHL8705 SET Free 3 Amp & 5 Amp ULDO Regulators. Levels Available COTS MILITARY SPACE
MHL8701 / SET Free 3 Amp & 5 Amp ULDO Regulators DESCRIPTION The MHL8701 & are space qualified, very low dropout linear regulators designed for military and space flight applications. The MHL8701 is designed
Application Note AN-1068 reva
Application Note AN-1068 reva Considerations for Designs Using Radiation-Hardened Solid State Relays By Alan Tasker Table of Contents Introduction Page Overview...1 The Contact...1 Actuation...1 The IR
IRF150 [REF:MIL-PRF-19500/543] 100V, N-CHANNEL. Absolute Maximum Ratings
PD - 90337G REPETITIVE AVALANCHE AND dv/dt RATED HEXFET TRANSISTORS THRU-HOLE (TO-204AA/AE) Product Summary Part Number BVDSS RDS(on) ID IRF150 100V 0.055Ω 38A IRF150 JANTX2N6764 JANTXV2N6764 [REF:MIL-PRF-19500/543]
Neutron Testing of the ISL70444SEH Quad Operational Amplifier
Test Report 8 Neutron Testing of the ISL7444SEH Quad Operational Amplifier Introduction This report summarizes results of 1MeV equivalent neutron testing of the ISL7444SEH quad operational amplifier (op
C Soldering Temperature, for 10 seconds 300 (1.6mm from case )
l Advanced Process Technology l Ultra Low On-Resistance l Dynamic dv/dt Rating l 75 C Operating Temperature l Fast Switching l Fully Avalanche Rated l Optimized for SMPS Applications Description Advanced
Features. Symbol JEDEC TO-220AB
Data Sheet June 1999 File Number 2253.2 3A, 5V,.4 Ohm, N-Channel Power MOSFET This is an N-Channel enhancement mode silicon gate power field effect transistor designed for applications such as switching
200V, N-CHANNEL. Absolute Maximum Ratings. Features: www.irf.com 1 PD - 90370
PD - 90370 REPETITIVE AVALANCHE AND dv/dt RATED HEXFET TRANSISTORS THRU-HOLE (TO-204AA/AE) IRF240 200V, N-CHANNEL Product Summary Part Number BVDSS RDS(on) ID IRF240 200V 0.18Ω 18A The HEXFET technology
Vdc. Vdc. Adc. W W/ C T J, T stg 65 to + 200 C
2N6284 (NPN); 2N6286, Preferred Device Darlington Complementary Silicon Power Transistors These packages are designed for general purpose amplifier and low frequency switching applications. Features High
N-channel enhancement mode TrenchMOS transistor
FEATURES SYMBOL QUICK REFERENCE DATA Trench technology d V DSS = V Low on-state resistance Fast switching I D = A High thermal cycling performance Low thermal resistance R DS(ON) mω (V GS = V) g s R DS(ON)
V DSS R DS(on) max Qg. 30V 3.2mΩ 36nC
PD - 96232 Applications l Optimized for UPS/Inverter Applications l High Frequency Synchronous Buck Converters for Computer Processor Power l High Frequency Isolated DC-DC Converters with Synchronous Rectification
STANDARD MICROCIRCUIT DRAWING MICROCIRCUIT, LINEAR, ADJUSTABLE ANALOG CONTROLLER, MONOLITHIC SILICON 5962-09233
REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED REV REV REV STATUS REV OF S 1 2 3 4 5 6 7 8 9 10 PMIC N/A MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE
AUTOMOTIVE MOSFET. C Soldering Temperature, for 10 seconds 300 (1.6mm from case )
PD 9399A AUTOMOTIVE MOSFET Typical Applications Electric Power Steering (EPS) Antilock Braking System (ABS) Wiper Control Climate Control Power Door Benefits Advanced Process Technology Ultra Low OnResistance
RoHS Compliant Containing no Lead, no Bromide and no Halogen. IRF9310PbF SO8 Tube/Bulk 95 IRF9310TRPbF SO8 Tape and Reel 4000
PD 97437A IRF93PbF HEXFET Power MOSFET V DS 30 V R DS(on) max (@V GS = V) I D (@T A = 25 C) 4. mω 20 A * SO8 Applications Charge and Discharge Switch for Notebook PC Battery Application Features and Benefits
P-Channel 20 V (D-S) MOSFET
Si30CDS P-Channel 0 V (D-S) MOSFET MOSFET PRODUCT SUMMARY V DS (V) R DS(on) ( ) I D (A) a Q g (Typ.) - 0 0. at V GS = - 4.5 V - 3. 0.4 at V GS = -.5 V -.7 3.3 nc TO-36 (SOT-3) FEATURES Halogen-free According
DC to 30GHz Broadband MMIC Low-Power Amplifier
DC to 30GHz Broadband MMIC Low-Power Amplifier Features Integrated LFX technology: Simplified low-cost assembly Drain bias inductor not required Broadband 45GHz performance: Good gain (10 ± 1.25dB) 14.5dBm
TPN4R712MD TPN4R712MD. 1. Applications. 2. Features. 3. Packaging and Internal Circuit. 2014-12 2015-04-21 Rev.4.0. Silicon P-Channel MOS (U-MOS )
MOSFETs Silicon P-Channel MOS (U-MOS) TPN4R712MD TPN4R712MD 1. Applications Lithium-Ion Secondary Batteries Power Management Switches 2. Features (1) Low drain-source on-resistance: R DS(ON) = 3.8 mω (typ.)
CHAPTER 10 Fundamentals of the Metal Oxide Semiconductor Field Effect Transistor
CHAPTER 10 Fundamentals of the Metal Oxide Semiconductor Field Effect Transistor Study the characteristics of energy bands as a function of applied voltage in the metal oxide semiconductor structure known
How To Make A Field Effect Transistor (Field Effect Transistor) From Silicon P Channel (Mos) To P Channel Power (Mos) (M2) (Mm2)
TPC811 TOSHIBA Field Effect Transistor Silicon P Channel MOS Type (U-MOS III) TPC811 Lithium Ion Battery Applications Notebook PC Applications Portable Equipment Applications Unit: mm Small footprint due
IRF6201PbF. HEXFET Power MOSFET V DS 20 V. R DS(on) max. 2.75 mω. Q g (typical) 130 nc 27 A. Absolute Maximum Ratings
PD - 97500A IRF620PbF V DS 20 V HEXFET Power MOSFET R DS(on) max (@ = 4.5V) 2.45 mω 6 R DS(on) max (@ = 2.5V) 2.75 mω 6 6 Q g (typical) 30 nc * SO-8 I D (@T A = 25 C) 27 A Applications OR-ing or hot-swap
IRLR8729PbF IRLU8729PbF
Applications l High Frequency Synchronous Buck Converters for Computer Processor Power l High Frequency Isolated DC-DC Converters with Synchronous Rectification for Telecom and Industrial Use Benefits
NTMS4920NR2G. Power MOSFET 30 V, 17 A, N Channel, SO 8 Features
NTMS9N Power MOSFET 3 V, 7 A, N Channel, SO Features Low R DS(on) to Minimize Conduction Losses Low Capacitance to Minimize Driver Losses Optimized Gate Charge to Minimize Switching Losses These Devices
MRF175GU MRF175GV The RF MOSFET Line 200/150W, 500MHz, 28V
Designed for broadband commercial and military applications using push pull circuits at frequencies to 500 MHz. The high power, high gain and broadband performance of these devices makes possible solid
Power MOSFET FEATURES. IRL540PbF SiHL540-E3 IRL540 SiHL540
Power MOSFET PRODUCT SUMMARY (V) 100 R DS(on) (Ω) = 5.0 V 0.077 Q g (Max.) (nc) 64 Q gs (nc) 9.4 Q gd (nc) 27 Configuration Single TO220AB G DS ORDERING INFORMATION Package Lead (Pb)free SnPb G D S NChannel
28 Volt Input - 40 Watt
Features Powers 28 volt dc-dc converters during power dropout Input voltage 12 to 40 volts Operating temperature -55 to +125 C Reduces hold-up capacitance by 80% Inhibit function Synchronization function
Power MOSFET FEATURES. IRFZ44PbF SiHFZ44-E3 IRFZ44 SiHFZ44 T C = 25 C
Power MOSFET PRODUCT SUMMARY (V) 60 R DS(on) (Ω) V GS = 10 V 0.028 Q g (Max.) (nc) 67 Q gs (nc) 18 Q gd (nc) 25 Configuration Single FEATURES Dynamic dv/dt Rating 175 C Operating Temperature Fast Switching
BUZ11. 30A, 50V, 0.040 Ohm, N-Channel Power MOSFET. Features. [ /Title (BUZ1 1) /Subject. (30A, 50V, 0.040 Ohm, N- Channel. Ordering Information
Data Sheet June 1999 File Number 2253.2 [ /Title (BUZ1 1) /Subject (3A, 5V,.4 Ohm, N- Channel Power MOS- FET) /Autho r () /Keywords (Intersil Corporation, N- Channel Power MOS- FET, TO- 22AB ) /Creator
Application Note AN-940
Application Note AN-940 How P-Channel MOSFETs Can Simplify Your Circuit Table of Contents Page 1. Basic Characteristics of P-Channel HEXFET Power MOSFETs...1 2. Grounded Loads...1 3. Totem Pole Switching
Application Note AN-1070
Application Note AN-1070 Class D Audio Amplifier Performance Relationship to MOSFET Parameters By Jorge Cerezo, International Rectifier Table of Contents Page Abstract... 2 Introduction... 2 Key MOSFET
STPS20L15DPbF SCHOTTKY RECTIFIER. Case Styles. I F(AV) = 20Amp V R = 15V. Bulletin PD-20873 rev. A 02/07. Major Ratings and Characteristics
STPS20L5DPbF SCHOTTKY RECTIFIER 20 Amps I F(AV) = 20Amp V R = 5V Major Ratings and Characteristics Characteristics Values Units I F(AV) Rectangular 20 A waveform V RRM 5 V I FSM @ tp = 5 μs sine 700 A
2N6056. NPN Darlington Silicon Power Transistor DARLINGTON 8 AMPERE SILICON POWER TRANSISTOR 80 VOLTS, 100 WATTS
NPN Darlington Silicon Power Transistor The NPN Darlington silicon power transistor is designed for general purpose amplifier and low frequency switching applications. High DC Current Gain h FE = 3000
STPS40L15CW. 2 x 20 Amps SCHOTTKY RECTIFIER. Case Styles. I F(AV) = 40Amp V R = 15V. Bulletin PD-20622 rev. B 10/06. Description/ Features
Bulletin PD-20622 rev. B 0/06 STPS40L5CW SCHOTTKY RECTIFIER 2 x 20 Amps I F(AV) = 40Amp V R = 5V Major Ratings and Characteristics Characteristics Values Units I F(AV) Rectangular 40 A waveform V RRM 5
N-Channel 60-V (D-S), 175 C MOSFET
N-Channel 6-V (D-S), 75 C MOSFET SUP/SUB7N6-4 V (BR)DSS (V) r DS(on) ( ) (A) 6.4 7 a TO-22AB D TO-263 DRAIN connected to TAB G G D S Top View SUP7N6-4 G D S Top View SUB7N6-4 S N-Channel MOSFET Parameter
Power MOSFET. IRF510PbF SiHF510-E3 IRF510 SiHF510. PARAMETER SYMBOL LIMIT UNIT Drain-Source Voltage V DS 100 V Gate-Source Voltage V GS ± 20
Power MOSFET PRODUCT SUMMARY (V) 100 R DS(on) () = 0.54 Q g max. (nc) 8.3 Q gs (nc) 2.3 Q gd (nc) 3.8 Configuration Single D TO220AB G FEATURES Dynamic dv/dt rating Available Repetitive avalanche rated
Power MOSFET FEATURES. IRF610PbF SiHF610-E3 IRF610 SiHF610. PARAMETER SYMBOL LIMIT UNIT Drain-Source Voltage V DS 200 V Gate-Source Voltage V GS ± 20
Power MOSFET PRODUCT SUMMARY (V) 00 R DS(on) ( ) = 1.5 Q g (Max.) (nc) 8. Q gs (nc) 1.8 Q gd (nc) 4.5 Configuration Single FEATURES Dynamic dv/dt Rating Repetitive Avalanche Rated Fast Switching Ease of
CA723, CA723C. Voltage Regulators Adjustable from 2V to 37V at Output Currents Up to 150mA without External Pass Transistors. Features.
CA73, CA73C Data Sheet April 1999 File Number 788. Voltage Regulators Adjustable from V to 37V at Output Currents Up to 1mA without External Pass Transistors The CA73 and CA73C are silicon monolithic integrated
Power MOSFET FEATURES. IRF740PbF SiHF740-E3 IRF740 SiHF740. PARAMETER SYMBOL LIMIT UNIT Drain-Source Voltage V DS 400 V Gate-Source Voltage V GS ± 20
Power MOSFET PRODUCT SUMMARY (V) 400 R DS(on) (Ω) = 0.55 Q g (Max.) (nc) 63 Q gs (nc) 9.0 Q gd (nc) 3 Configuration Single FEATURES Dynamic dv/dt Rating Repetitive Avalanche Rated Fast Switching Ease of
UNISONIC TECHNOLOGIES CO., LTD 50N06 Power MOSFET
UNISONIC TECHNOLOGIES CO., LTD 50N06 50 Amps, 60 Volts N-CHANNEL POWER MOSFET DESCRIPTION TO-263 TO-25 The UTC 50N06 is three-terminal silicon device with current conduction capability of about 50A, fast
Diode Circuits. Operating in the Reverse Breakdown region. (Zener Diode)
Diode Circuits Operating in the Reverse Breakdown region. (Zener Diode) In may applications, operation in the reverse breakdown region is highly desirable. The reverse breakdown voltage is relatively insensitive
DATA SHEET. PBSS5540Z 40 V low V CEsat PNP transistor DISCRETE SEMICONDUCTORS. Product data sheet Supersedes data of 2001 Jan 26. 2001 Sep 21.
DISCRETE SEMICONDUCTORS DATA SHEET fpage M3D87 PBSS554Z 4 V low V CEsat PNP transistor Supersedes data of 21 Jan 26 21 Sep 21 FEATURES Low collector-emitter saturation voltage High current capability Improved
IRF5305PbF. HEXFET Power MOSFET V DSS = -55V. R DS(on) = 0.06Ω I D = -31A
dvanced Process Technology Dynamic dv/dt Rating 75 C Operating Temperature Fast Switching PChannel Fully valanche Rated LeadFree Description Fifth Generation HEXFETs from International Rectifier utilize
PERFORMANCE SPECIFICATION SHEET
The documentation and process conversion measures necessary to comply with this document shall be completed by 13 February 2014. INCH-POUND MIL-PRF-19500/538G 13 December 2013 SUPERSEDING MIL-PRF-19500/538F
RFG70N06, RFP70N06, RF1S70N06, RF1S70N06SM
A M A A December 995 SEMICONDUCTOR RFG7N6, RFP7N6, RFS7N6, RFS7N6SM 7A, 6V, Avalanche Rated, N-Channel Enhancement-Mode Power MOSFETs Features 7A, 6V r DS(on) =.4Ω Temperature Compensated PSPICE Model
IRFP460LC PD - 9.1232. HEXFET Power MOSFET V DSS = 500V. R DS(on) = 0.27Ω I D = 20A
HEXFET Power MOSFET PD - 9.232 IRFP460LC Ultra Low Gate Charge Reduced Gate Drive Requirement Enhanced 30V V gs Rating Reduced C iss, C oss, C rss Isolated Central Mounting Hole Dynamic dv/dt Rated Repetitive
Features. P-Channel Enhancement Mode MOSFET
P-Channel Enhancement Mode MOSFET Features Pin Description -4V/-25, R DS(ON) = 4mΩ (typ.) @ V GS = -V R DS(ON) = 55mΩ (typ.) @ V GS = -5V Super High Dense Cell Design G D S Reliable and Rugged Lead Free
Bi-directional FlipFET TM MOSFETs for Cell Phone Battery Protection Circuits
Bi-directional FlipFET TM MOSFETs for Cell Phone Battery Protection Circuits As presented at PCIM 2001 Authors: *Mark Pavier, *Hazel Schofield, *Tim Sammon, **Aram Arzumanyan, **Ritu Sodhi, **Dan Kinzer
P-Channel 20-V (D-S) MOSFET
Si33DS P-Channel -V (D-S) MOSFET PRODUCT SUMMARY V DS (V) R DS(on) (Ω) I D (A).39 at V GS = -.5 V -.7 -.5 at V GS = -.5 V -..68 at V GS = -.8 V - 3.5 FEATURES Halogen-free According to IEC 69-- Available
High Efficiency Battery Charger using Power Components [1]
application note TPB:101 High Efficiency Battery Charger using Power Components [1] Marco Panizza Senior Applications Engineer July 2006 Contents Page Introduction 1 A Unique Converter 1 Control Scheme
400KHz 60V 4A Switching Current Boost / Buck-Boost / Inverting DC/DC Converter
Features Wide 5V to 32V Input Voltage Range Positive or Negative Output Voltage Programming with a Single Feedback Pin Current Mode Control Provides Excellent Transient Response 1.25V reference adjustable
HFA15TB60 HFA15TB60-1
HEXFRED TM Features Ultrafast Recovery Ultrasoft Recovery Very Low I RRM Very Low Q rr Specified at Operating Conditions Benefits Reduced RFI and EMI Reduced Power Loss in Diode and Switching Transistor
SDC15. TVS Diode Array for ESD Protection of 12V Data and Power Lines. PROTECTION PRODUCTS Description. Features. Mechanical Characteristics
Description The SDC15 transient voltage suppressor (TVS) is designed to protect components which are connected to data and transmission lines from voltage surges caused by electrostatic discharge (ESD),
V DS 100 V R DS(ON) typ. @ 10V 72.5 m: Q g typ. 15 nc Q sw typ. 8.3 nc R G(int) typ. 2.2 Ω T J max 175 C
PD 9698A DIGITAL AUDIO MOSFET IRFB422PbF Features Key parameters optimized for ClassD audio amplifier applications Low R DSON for improved efficiency Low Q G and Q SW for better THD and improved efficiency
AUTOMOTIVE GRADE. Orderable Part Number AUIRF7805Q SO-8 Tape and Reel 4000 AUIRF7805QTR
UTOMOTIVE GRE UIRF7805Q Features dvanced Planar Technology Low On-Resistance Logic Level N Channel MOSFET Surface Mount vailable in Tape & Reel 150 C Operating Temperature Lead-Free, RoHS Compliant utomotive
1.5A Very L.D.O Voltage Regulator LM29150/29151/29152
FEATURES High Current Capability 1.5A Low Dropout Voltage 350mV Low Ground Current Accurate 1% Guaranteed Initial Tolerance Extremely Fast Transient Response Reverse-Battery and "Load Dump" Protection
Testing Guideline for Single Event Gate Rupture (SEGR) of Power MOSFETs
National Aeronautics and Space Administration Testing Guideline for Single Event Gate Rupture (SEGR) of Power MOSFETs Leif Scheick Jet Propulsion Laboratory Pasadena, California Jet Propulsion Laboratory
C Soldering Temperature, for 10 seconds 300 (1.6mm from case )
dvanced Process Technology Dynamic dv/dt Rating 75 C Operating Temperature Fast Switching Fully valanche Rated Lead-Free Description Fifth Generation HEXFETs from International Rectifier utilize advanced
Peak Atlas DCA. Semiconductor Component Analyser Model DCA55. User Guide
GB55-7 Peak Atlas DCA Semiconductor Component Analyser Model DCA55 User Guide Peak Electronic Design Limited 2000/2007 In the interests of development, information in this guide is subject to change without
LM139/LM239/LM339/LM2901/LM3302 Low Power Low Offset Voltage Quad Comparators
Low Power Low Offset Voltage Quad Comparators General Description The LM139 series consists of four independent precision voltage comparators with an offset voltage specification as low as 2 mv max for
Bob York. Transistor Basics - MOSFETs
Bob York Transistor Basics - MOSFETs Transistors, Conceptually So far we have considered two-terminal devices that are described by a current-voltage relationship I=f(V Resistors: Capacitors: Inductors:
Features Benefits Description TO-247AC (Modified) Absolute Maximum Ratings Parameter Max Units
Bulletin PD -.338 rev. B /4 HEXFRED TM HFA5PB6 Ultrafast, Soft Recovery Diode Features Ultrafast Recovery Ultrasoft Recovery Very Low I RRM Very Low Q rr Specified at Operating Conditions Benefits Reduced
V DSS I D. W/ C V GS Gate-to-Source Voltage ±30 E AS (Thermally limited) mj T J Operating Junction and -55 to + 175
PD 973B IRFB432PbF Applications l Motion Control Applications l High Efficiency Synchronous Rectification in SMPS l Uninterruptible Power Supply l Hard Switched and High Frequency Circuits Benefits l Low
Power MOSFET. IRF9520PbF SiHF9520-E3 IRF9520 SiHF9520. PARAMETER SYMBOL LIMIT UNIT Drain-Source Voltage V DS - 100 V Gate-Source Voltage V GS ± 20
Power MOSFET PRODUCT SUMMARY (V) 100 R DS(on) ( ) = 10 V 0.60 Q g (Max.) (nc) 18 Q gs (nc) 3.0 Q gd (nc) 9.0 Configuration Single TO220AB G DS ORDERING INFORMATION Package Lead (Pb)free SnPb G S D PChannel
2N4921G, 2N4922G, 2N4923G. Medium-Power Plastic NPN Silicon Transistors 1.0 AMPERE GENERAL PURPOSE POWER TRANSISTORS 40 80 VOLTS, 30 WATTS
,, Medium-Power Plastic NPN Silicon Transistors These highperformance plastic devices are designed for driver circuits, switching, and amplifier applications. Features Low Saturation Voltage Excellent
Radiation effects on space electronics. Jan Kenneth Bekkeng, University of Oslo - Department of Physics
Radiation effects on space electronics Jan Kenneth Bekkeng, University of Oslo - Department of Physics Background The presence of radiation in space causes effects in electronic devices. The effects range
Power MOSFET FEATURES. IRF520PbF SiHF520-E3 IRF520 SiHF520. PARAMETER SYMBOL LIMIT UNIT Drain-Source Voltage V DS 100 V Gate-Source Voltage V GS ± 20
Power MOSFET PRODUCT SUMMARY (V) 100 R DS(on) ( ) = 0.7 Q g (Max.) (nc) 16 Q gs (nc) 4.4 Q gd (nc) 7.7 Configuration Single TO0AB G DS ORDERING INFORMATION Package Lead (Pb)free SnPb G D S NChannel MOSFET
A I DM. W/ C V GS Gate-to-Source Voltage ± 20. Thermal Resistance Symbol Parameter Typ. Max. Units
V DS 2 V V GS Max ± 2 V R DSon) max @V GS = V) 24 m * PD - 9787A HEXFET Power MOSFET R DSon) max @V GS = 4.V) 4 m 6 Micro3 TM SOT-23) Applications) Load System Switch Features and Benefits Features Benefits
IRLR8743PbF IRLU8743PbF HEXFET Power MOSFET
Applications l High Frequency Synchronous Buck Converters for Computer Processor Power l High Frequency Isolated DC-DC Converters with Synchronous Rectification for Telecom and Industrial Use l Lead-Free
Application Note AN-983
Application Note AN-983 IGBT Characteristics Table of Contents 1. How the IGBT complements the power MOSFET... 2 Page 2. Silicon structure and equivalent circuit... 2 3. Conduction characteristics... 4
Power MOSFET FEATURES. IRF740PbF SiHF740-E3 IRF740 SiHF740. PARAMETER SYMBOL LIMIT UNIT Drain-Source Voltage V DS 400 V Gate-Source Voltage V GS ± 20
Power MOSFET PRODUCT SUMMARY (V) 400 R DS(on) (Ω) = 0.55 Q g (Max.) (nc) 63 Q gs (nc) 9.0 Q gd (nc) 3 Configuration Single FEATURES Dynamic dv/dt Rating Repetitive Avalanche Rated Fast Switching Ease of
Power MOSFET FEATURES. IRF9640PbF SiHF9640-E3 IRF9640 SiHF9640
Power MOSFET PRODUCT SUMMARY V DS (V) 200 R DS(on) (Ω) = 10 V 0.50 Q g (Max.) (nc) 44 Q gs (nc) 7.1 Q gd (nc) 27 Configuration Single TO220AB G DS ORDERING INFORMATION Package Lead (Pb)free SnPb G S D
MOSFET N-channel enhancement switching transistor IMPORTANT NOTICE. http://www.philips.semiconductors.com use http://www.nxp.com
Rev. 3 21 November 27 Product data sheet Dear customer, IMPORTANT NOTICE As from October 1st, 26 Philips Semiconductors has a new trade name - NXP Semiconductors, which will be used in future data sheets
Application Note AN-1067
Application Note AN-1067 Design Considerations When Using Radiation- Hardened Small Signal Logic Level MOSFETs Table of Contents Page Introduction...1 Acronyms...1 Maximum Rating and Electrical Characteristics...2
SG1731/SG2731/SG3731. Description. Features. High Reliability Features. Block Diagram DC MOTOR PULSE WIDTH MODULATOR
DC MOTOR PULSE WIDTH MODULATOR SG1731/SG2731/SG3731 Description The SG1731 is a pulse width modulator circuit designed specifically for DC motor control. It provides a bi-directional pulse train output
P-Channel 60 V (D-S) MOSFET
TP6K P-Channel 6 V (D-S) MOSFET G S PRODUCT SUMMARY V DS (V) R DS(on) ( ) V GS(th) (V) I D (ma) - 6 6 at V GS = - V - to - - 85 TO-6 (SOT-) Top View D Marking Code: 6Kwll 6K = Part Number Code for TP6K
A I DM. W/ C V GS Gate-to-Source Voltage ± 12. Thermal Resistance Symbol Parameter Typ. Max. Units
V DS 2 V V GS Max ±2 V * PD - 973A HEXFET Power MOSFET R DSon) max @V GS = 4.V) 2. m R DSon) max @V GS = 2.V) 27. m 6 Micro3 TM SOT-23) Applications) Load System Switch Features and Benefits Features Benefits
Power MOSFET FEATURES. IRF540PbF SiHF540-E3 IRF540 SiHF540. PARAMETER SYMBOL LIMIT UNIT Drain-Source Voltage V DS 100 V Gate-Source Voltage V GS ± 20
Power MOSFET PRODUCT SUMMARY (V) 100 R DS(on) ( ) = 0.077 Q g (Max.) (nc) 72 Q gs (nc) 11 Q gd (nc) 32 Configuration Single TO220AB G DS ORDERING INFORMATION Package Lead (Pb)free SnPb G D S NChannel MOSFET
OptiMOS 3 Power-Transistor
Type IPD6N3L G OptiMOS 3 Power-Transistor Features Fast switching MOSFET for SMPS Optimized technology for DC/DC converters Qualified according to JEDEC 1) for target applications Product Summary V DS
OptiMOS Power-Transistor Product Summary
OptiMOS Power-Transistor Product Summary V DS 55 V R DS(on),max 4) 35 mω Features Dual N-channel Logic Level - Enhancement mode AEC Q11 qualified I D 2 A PG-TDSON-8-4 MSL1 up to 26 C peak reflow 175 C
Cost. 13p each. 1.50 each
G-QRP Club components This is a service for G-QRP Club members only 6 pole crystal filter SSB 9MHz 2.2kHz 500 Ohm in/out 12 Polyvaricon capacitors 2 gang - 8 to 140pF & 6 to 60pF (tags marked A & O respectively)
CONTENTS. Preface. 1.1.2. Energy bands of a crystal (intuitive approach)
CONTENTS Preface. Energy Band Theory.. Electron in a crystal... Two examples of electron behavior... Free electron...2. The particle-in-a-box approach..2. Energy bands of a crystal (intuitive approach)..3.
MJD112 (NPN), MJD117 (PNP) Complementary Darlington Power Transistors. DPAK For Surface Mount Applications
MJD (NPN), MJD7 (PNP) Complementary Darlington Power Transistors For Surface Mount Applications Designed for general purpose power and switching such as output or driver stages in applications such as
New High Current MOSFET Module Offers 177 µω R DS(on)
ew High Current Offers 177 µω R D(on) By William C. Kephart, Eric R. Motto Application Engineering owerex Incorporated Abstract This paper describes a new family of high current modules optimized for industrial
N-Channel 100 V (D-S) MOSFET
Si4DS N-Channel V (D-S) MOSFET MOSFET PRODUCT SUMMARY V DS (V) R DS(on) ( ) I D (A) a Q g (Typ.).4 at V GS = V..67 at V GS = 6 V..9 nc.78 at V GS = 4.5 V.7 FEATURES TrenchFET Power MOSFET % R g Tested
Solar Cell Bypass Diodes in Silicon Crystalline Photovoltaic Panels
VISHAY GENERAL SEMICONDUCTOR www.vishay.com Rectifiers IMPORTANT CHARACTERISTICS OF BYPASS DIODES FOR PHOTOVOLTAIC SOLAR CELLS 1. Forward Voltage Drop (V F ) at Bypass The basic function of bypass diodes
Characteristics of blocking voltage for power 4H-SiC BJTs with mesa edge termination
Vol. 31, No. 7 Journal of Semiconductors July 2010 Characteristics of blocking voltage for power 4H-SiC BJTs with mesa edge termination Zhang Qian( 张 倩 ), Zhang Yuming( 张 玉 明 ), and Zhang Yimen( 张 义 门
MADP-000504-10720T. Non Magnetic MELF PIN Diode
MADP-54-172T Features High Power Handling Low Loss / Low Distortion Leadless Low Inductance MELF Package Non-Magnetic Surface Mountable RoHS Compliant MSL 1 Package Style 172 Dot Denotes Cathode Description
AMPLIFIERS BJT BJT TRANSISTOR. Types of BJT BJT. devices that increase the voltage, current, or power level
AMPLFERS Prepared by Engr. JP Timola Reference: Electronic Devices by Floyd devices that increase the voltage, current, or power level have at least three terminals with one controlling the flow between
Diodes and Transistors
Diodes What do we use diodes for? Diodes and Transistors protect circuits by limiting the voltage (clipping and clamping) turn AC into DC (voltage rectifier) voltage multipliers (e.g. double input voltage)
10MQ100N SCHOTTKY RECTIFIER. I F(AV) = 2.1Amp V R = 100V. Bulletin PD-20520 rev. M 07/04. Major Ratings and Characteristics. Description/ Features
0MQ00N SCHOTTKY RECTIFIER 2. Amp I F(AV) = 2.Amp V R = 00V Major Ratings and Characteristics Characteristics 0MQ00N Units I F DC 2. A V RRM 00 V I FSM @ tp = 5 µs sine 20 A V F @.5Apk, T =25 C 0.68 V J
1N59xxBRNG Series. 3 W DO-41 Surmetic 30 Zener Voltage Regulators
W DO-4 Surmetic 0 Zener Voltage Regulators This is a N9xxBRNG series with limits and excellent operating characteristics that reflect the superior capabilities of silicon oxide passivated junctions. All
IRGP4068DPbF IRGP4068D-EPbF
INSULATED GATE BIPOLAR TRANSISTOR WITH ULTRA-LOW VF DIODE FOR INDUCTION HEATING AND SOFT SWITCHING APPLICATIONS Features Low V CE (ON) Trench IGBT Technology Low Switching Losses Maximum Junction temperature
BC327, BC327-16, BC327-25, BC327-40. Amplifier Transistors. PNP Silicon. These are Pb Free Devices* http://onsemi.com. Features MAXIMUM RATINGS
BC327, BC327-16, BC327-25, BC327-4 Amplifier Transistors PNP Silicon Features These are PbFree Devices* MAXIMUM RATINGS Rating Symbol Value Unit CollectorEmitter Voltage V CEO 45 Vdc CollectorEmitter Voltage
TOSHIBA Insulated Gate Bipolar Transistor Silicon N Channel IGBT GT60J323
GT6J2 TOSHIBA Insulated Gate Bipolar Transistor Silicon N Channel IGBT GT6J2 Current Resonance Inverter Switching Application Unit: mm Enhancement mode type High speed : t f =.6 μs (typ.) (I C = 6A) Low
GLOLAB Two Wire Stepper Motor Positioner
Introduction A simple and inexpensive way to remotely rotate a display or object is with a positioner that uses a stepper motor to rotate it. The motor is driven by a circuit mounted near the motor and
