Design-Kits, Libraries & IPs
|
|
|
- Stella Davis
- 10 years ago
- Views:
Transcription
1 Design-Kits, Libraries & IPs
2 Supported CAD tools Design-kits overview Digital, Analog, and RF Libraries IPs Supported CAD tools Design-kits overview ST 65nm Tanner PDK Standard cell Libraries IPs
3 austriamicrosystems 0.35µm CMOS 0.35µm SiGe 0.35µm HV-CMOS 0.18µm CMOS 0.18µm HV-CMOS
4 austriamicrosystems Supported CAD Tools Schematic & Design Entry Electrical Simulation Digital Simulation Logic Synthesis Layout & Verification P&R Cadence Composer (CDS) Spectre (CDS) Hspice Ultrasim NC-Sim, AMS-Designer Verilog BuildGates Virtuoso-XL Diva Assura SOC Encounter Silicon Ensemble Mentor Synopsys DA (MGC) Eldo (MGC) ModelSim Leonardo IC / Calibre IC-Route Design Compiler Hspice VSS / VCS Design Compiler StarRCXT Astro / ICC Tanner SimulationModels S-Edit TSpice TSpice --- L-Edit DRC Pspice (CDS) Saber (Synopsys) ADS (Agilent) Smash (Dolphin) SmartSpice (Silvaco) SPR
5 AMS Design-Kits Current distributions : Cadence (SUN / Linux) Mentor (SUN / Linux) Tanner (MS-Windows) CDB OA - - C35 (0.35µm CMOS) S35 (0.35µm SiGe) H35 (0.35µm HV-CMOS) C18 (0.18µm CMOS) H18 (0.18µm HV-CMOS)
6 AMS Libraries LV Digital standard cells and IO Libraries : CORELIB : General purpose digital library CORELIB_3B : Same as CORELIB with 3 busses (VDD, VSS, GND) IOLIB : IO pads (input, output, bidir). 3.3V and 5V available IOLIBC_3B : Core limited digital IO Libraries Core and IO cells are characterized for 1.8V, 2.2V, 2.7V, 3.3V. HV Digital standard cells and IO Libraries : CORELIB_HV : CORELIB for high voltage. IOLIB_HV : High Voltage digital IO pads library Analog standard cells Libraries : IOLIB_ANA : Analog IO pads library IOLIBC_ANA_3B : Core limited Analog IO pads library IOLIB_ANA_HV : High Voltage Analog IO pads library A_CELLS : Analog Library RF standard IO cells Libraries : SPIRAL : Library with characterized Inductors RF_PADS : RF IO pads library
7 AMS IP Blocks IP blocks available from CMP free of charge to Univ. & Research (0.35µ CMOS) Single & Dual Port RAMS configurations: Single Port RAM Dual Port RAM Diffusion ROM Bits Words SP SP SP SP SP 256 DP SP / DP SP 512 SP SP 600 SP 1024 SP / DP SP / DP 2048 SP SP / DP SP 4098 DP
8 STMicroelectronics HCMOS9 (130nm CMOS) HCMOS9-SOI (130nm CMOS-SOI) BiCMOS9-MW (130nm CMOS) CMOS065 (65nm CMOS) CMOS065-SOI (65nm CMOS-SOI) CMOS040 (40nm CMOS) CMOS028 (28nm CMOS) New 28FDSOI (28nm FD-SOI)
9 STMicroelectronics supported CAD Tools IC Electrical Simulation Verification Parasitics Extraction P&R CDB OA Spectre (CDS) Eldo (MGC) Hspice (SNPS) ADS (Agilent) Calibre (MGC) StarRCXT (SNPS) Calibre (MGC) QRC (CDS) Encounter (CDS) ICC (SNPS) HCMOS9 x x x x x x x x HCMOS9- SOI x x x x x x x - - BiCMOS9- MW x x x x x x x x x CMOS065 x x x x x x x x x x x CMOS065- SOI x x x x x x CMOS040 x x x x x x CMOS028 x x x x x x x CMOS028 x Q x x Q x x Q x x
10 STMicroelectronics Design-Kits Current distributions : Cadence (SUN/ HP / Linux) HCMOS9 9.2 HCMOS9-SOI 10.0 BICMOS9-MW 2.4a Tanner (MS-Windows) CMOS / V3 CMOS065-SOI 4.2 CMOS / 2.3 CMOS FDSOI 2.0a RF option available for HCMOS9 & CMOS065 design kits.
11 ST 65nm Tanner PDK Full-Custom design environment (Frontend + Backend) All basic devices have been ported from the ST environment to the Tanner Tools. Frontend : - Schematic Capture using S-Edit. - Spice simulation using TSpice. Backend : - Layout Edition using L-Edit. - Parametic layout cells (T-Cells) - Verification using L-Edit/DRC and LVS. New To be done : - Standard-cells (schematics and abstracts) - Qualifying the HiPer Design Suite
12 Standard Cells Libraries from STMicroelectronics CORE cells Libraries : CORE : General purpose core libraries CORX : Complementary core libraries (complex gates) CLOCK : Buffer cells and the same for clock tree synthesis PR : Place and route filler cells and the same. DP : Datapath leaf cells libraries HD : High density core libraries IO cells Libraries : 1.8V, 2.5V, 3.3V IO pads: 80µ, 65µ, 60µ, 50µ 40µ and 30µ IO pads : Digital and Analog Staggered IO pads Flip-Chip pads Level Shifters, and compensation cells On request: LVDS Pads DLL, PLL Memories SPRAM / DPRAM / ROM available on request, free of charge (1-2 weeks delay) on request
13 IP Blocks Available from STMicroelectronics ARM 946EJ-S : HCMOS9 130nm CMOS IP core Simulation models Abstract view for P&R Timing Files for STA and backannotated simulation Available under NDA ARM 926EJ-S : CMOS065 65nm CMOS IP core Simulation models Abstract view for P&R Timing Files for STA and backannotated simulation Available under NDA + Access to all available ARM cores in 65nm.
14 Design-Kit Support at CMP Management and support of the DK distribution and updates. Development, support and maintenance of design-kits. Tutorials on some design flows. Two CMP engineers working partly at ST to solve all kind of support with ST design-kits and memory blocks generation.
STMicroelectronics. Deep Sub-Micron Processes 130nm, 65 nm, 40nm, 28nm CMOS, 28nm FDSOI. SOI Processes 130nm, 65nm. SiGe 130nm
STMicroelectronics Deep Sub-Micron Processes 130nm, 65 nm, 40nm, 28nm CMOS, 28nm FDSOI SOI Processes 130nm, 65nm SiGe 130nm CMP Process Portfolio from ST Moore s Law 130nm CMOS : HCMOS9GP More than Moore
How To Integrate 3D-Ic With A Multi Layer 3D Chip
3D-IC Integration Developments Cooperation for servicing and MPW runs offering Agenda Introduction Process overview Partnership for MPW runs service 3D-IC Design Platform First MPW run Conclusion 3D-IC
Procedure to get a design kit
Design kits Procedure to get a design kit Design kits available at CMP Design kits distribution Procedure to handle DK requests Customer request : http://cmp.imag.fr Design kit request form http://cmp.imag.fr/
3D-IC Integration Developments & Cooperations for servicing
Ecole de microélectronique et microsystèmes 16-19 mai 2011, Fréjus 3D-IC Integration Developments & Cooperations for servicing Kholdoun TORKI [email protected] CMP 46, Avenue Félix Viallet, 38031
University of Texas at Dallas. Department of Electrical Engineering. EEDG 6306 - Application Specific Integrated Circuit Design
University of Texas at Dallas Department of Electrical Engineering EEDG 6306 - Application Specific Integrated Circuit Design Synopsys Tools Tutorial By Zhaori Bi Minghua Li Fall 2014 Table of Contents
Quality. Stages. Alun D. Jones
Quality - by Design Quality Design Review Stages Alun D. Jones Design Review Stages Design Review 0 (DR0) Pre-order & quotation stage Design Review 1 (DR1) Initial kick-off and preliminary specification
1. Submission Rules. 2. Verification tools. 3. Frequent errors
Design Submission 1. Submission Rules 2. Verification tools 3. Frequent errors Design submission rules 1. Send the submission form in the same time as the circuit database 2. The GDSII file must have a.gds
Digital IC Design Flow
Collège Militaire Royal du Canada (Cadence University Alliance Program Member) Department of Electrical and Computer Engineering Départment de Génie Electrique et Informatique RMC Microelectronics Lab
IL2225 Physical Design
IL2225 Physical Design Nasim Farahini [email protected] Outline Physical Implementation Styles ASIC physical design Flow Floor and Power planning Placement Clock Tree Synthesis Routing Timing Analysis Verification
System-on. on-chip Design Flow. Prof. Jouni Tomberg Tampere University of Technology Institute of Digital and Computer Systems. jouni.tomberg@tut.
System-on on-chip Design Flow Prof. Jouni Tomberg Tampere University of Technology Institute of Digital and Computer Systems [email protected] 26.03.2003 Jouni Tomberg / TUT 1 SoC - How and with whom?
Designing a System-on-Chip (SoC) with an ARM Cortex -M Processor
Designing a System-on-Chip (SoC) with an ARM Cortex -M Processor A Starter Guide Joseph Yiu November 2014 version 1.02 27 Nov 2014 1 - Background Since the ARM Cortex -M0 Processor was released a few years
INF4420 Introduction
INF4420 Introduction Spring 2012 Jørgen Andreas Michaelsen ([email protected]) Outline Practical information about the course. Context (placing what we will learn in a larger context) Outline of the
EEC 118 Lecture #17: Implementation Strategies, Manufacturability, and Testing
EEC 118 Lecture #17: Implementation Strategies, Manufacturability, and Testing Stanley Hsu 6/5/2012 Slides courtesy of Rajeevan Amirtharajah and Bevan Baas, UC Davis, Zhiyi Yu, Fudan University, and Jeff
CADENCE LAYOUT TUTORIAL
CADENCE LAYOUT TUTORIAL Creating Layout of an inverter from a Schematic: Open the existing Schematic Page 1 From the schematic editor window Tools >Design Synthesis >Layout XL A window for startup Options
MEMS Processes from CMP
MEMS Processes from CMP MUMPS from MEMSCAP Bulk Micromachining 1 / 19 MEMSCAP MUMPS processes PolyMUMPS SOIMUMPS MetalMUMPS 2 / 19 MEMSCAP Standard Processes PolyMUMPs 8 lithography levels, 7 physical
Curriculum for a Master s Degree in ECE with focus on Mixed Signal SOC Design
Curriculum for a Master s Degree in ECE with focus on Mixed Signal SOC Design Department of Electrical and Computer Engineering Overview The VLSI Design program is part of two tracks in the department:
Agenda. Michele Taliercio, Il circuito Integrato, Novembre 2001
Agenda Introduzione Il mercato Dal circuito integrato al System on a Chip (SoC) La progettazione di un SoC La tecnologia Una fabbrica di circuiti integrati 28 How to handle complexity G The engineering
Digital Systems Design! Lecture 1 - Introduction!!
ECE 3401! Digital Systems Design! Lecture 1 - Introduction!! Course Basics Classes: Tu/Th 11-12:15, ITE 127 Instructor Mohammad Tehranipoor Office hours: T 1-2pm, or upon appointments @ ITE 441 Email:
A Mixed-Signal System-on-Chip Audio Decoder Design for Education
A Mixed-Signal System-on-Chip Audio Decoder Design for Education R. Koenig, A. Thomas, M. Kuehnle, J. Becker, E.Crocoll, M. Siegel @itiv.uni-karlsruhe.de @ims.uni-karlsruhe.de
State-of-Art (SoA) System-on-Chip (SoC) Design HPC SoC Workshop
Photos placed in horizontal position with even amount of white space between photos and header State-of-Art (SoA) System-on-Chip (SoC) Design HPC SoC Workshop Michael Holmes Manager, Mixed Signal ASIC/SoC
How To Design A Chip Layout
Spezielle Anwendungen des VLSI Entwurfs Applied VLSI design (IEF170) Course and contest Intermediate meeting 3 Prof. Dirk Timmermann, Claas Cornelius, Hagen Sämrow, Andreas Tockhorn, Philipp Gorski, Martin
ECE410 Design Project Spring 2008 Design and Characterization of a CMOS 8-bit Microprocessor Data Path
ECE410 Design Project Spring 2008 Design and Characterization of a CMOS 8-bit Microprocessor Data Path Project Summary This project involves the schematic and layout design of an 8-bit microprocessor data
StarRC Custom: Next-Generation Modeling and Extraction Solution for Custom IC Designs
White Paper StarRC Custom: Next-Generation Modeling and Extraction Solution for Custom IC Designs May 2010 Krishnakumar Sundaresan Principal Engineer and CAE Manager, Synopsys Inc Executive Summary IC
Example-driven Interconnect Synthesis for Heterogeneous Coarse-Grain Reconfigurable Logic
Example-driven Interconnect Synthesis for Heterogeneous Coarse-Grain Reconfigurable Logic Clifford Wolf, Johann Glaser, Florian Schupfer, Jan Haase, Christoph Grimm Computer Technology /99 Overview Ultra-Low-Power
Complete ASIC & COT Solutions 1986-2008
Complete ASIC & COT Solutions 1986-2008 www.avnet-asic.com Nadav Ben-Ezer Managing Director 1 March 5th, 2008 Core Business ASIC/SoC Design and Implementation RTL Design Sub-system IP Integration RTL to
7a. System-on-chip design and prototyping platforms
7a. System-on-chip design and prototyping platforms Labros Bisdounis, Ph.D. Department of Computer and Communication Engineering 1 What is System-on-Chip (SoC)? System-on-chip is an integrated circuit
ESP-CV Custom Design Formal Equivalence Checking Based on Symbolic Simulation
Datasheet -CV Custom Design Formal Equivalence Checking Based on Symbolic Simulation Overview -CV is an equivalence checker for full custom designs. It enables efficient comparison of a reference design
SR. SIGNAL INTEGRITY ENGINEER
SR. SIGNAL INTEGRITY ENGINEER Specialist in electrical simulation of advanced package devices. This job requires an individual with outstanding electrical simulation and performance characterization skills
Serial port interface for microcontroller embedded into integrated power meter
Serial port interface for microcontroller embedded into integrated power meter Mr. Borisav Jovanović, Prof. dr. Predrag Petković, Prof. dr. Milunka Damnjanović, Faculty of Electronic Engineering Nis, Serbia
EEC 119B Spring 2014 Final Project: System-On-Chip Module
EEC 119B Spring 2014 Final Project: System-On-Chip Module Dept. of Electrical and Computer Engineering University of California, Davis Issued: March 14, 2014 Subject to Revision Final Report Due: June
Unlimited Product Licensing Cost-Effectively Eliminate Design Bottlenecks. Dr Ivan Pesic
Unlimited Product Licensing Cost-Effectively Eliminate Design Bottlenecks Dr Ivan Pesic Traditional Licensing Problems Traditional point tool licensing is too expensive and inflexible, offering very low
PowerPlay Power Analysis & Optimization Technology
Quartus II Software Questions & Answers Following are the most frequently asked questions about the new features in Altera s Quartus II design software. PowerPlay Power Analysis & Optimization Technology
The GoldenGate Working Group
The GoldenGate Working Group Facing the Challenges of CAD System Integration Synthesis Place&Route DB1 DB2 Parasitic Extraction 2004 - Synopsys Interoperability Forum Jim Wilmore April 1, 2004 The GoldenGate
Contents. Overview... 5-1 Memory Compilers Selection Guide... 5-2
Memory Compilers 5 Contents Overview... 5-1 Memory Compilers Selection Guide... 5-2 CROM Gen... 5-3 DROM Gen... 5-9 SPSRM Gen... 5-15 SPSRM Gen... 5-22 SPRM Gen... 5-31 DPSRM Gen... 5-38 DPSRM Gen... 5-47
An All-Digital Phase-Locked Loop with High Resolution for Local On-Chip Clock Synthesis
An All-Digital Phase-Locked Loop with High Resolution for Local On-Chip Clock Synthesis Oliver Schrape 1, Frank Winkler 2, Steffen Zeidler 1, Markus Petri 1, Eckhard Grass 1, Ulrich Jagdhold 1 International
Virtuoso Analog Design Environment Family Advanced design simulation for fast and accurate verification
Advanced design simulation for fast and accurate verification The Cadence Virtuoso Analog Design Environment family of products provides a comprehensive array of capabilities for the electrical analysis
on-chip and Embedded Software Perspectives and Needs
Systems-on on-chip and Embedded Software - Perspectives and Needs Miguel Santana Central R&D, STMicroelectronics STMicroelectronics Outline Current trends for SoCs Consequences and challenges Needs: Tackling
Best Practises for LabVIEW FPGA Design Flow. uk.ni.com ireland.ni.com
Best Practises for LabVIEW FPGA Design Flow 1 Agenda Overall Application Design Flow Host, Real-Time and FPGA LabVIEW FPGA Architecture Development FPGA Design Flow Common FPGA Architectures Testing and
Route Power 10 Connect Powerpin 10.1 Route Special Route 10.2 Net(s): VSS VDD
SOCE Lab (2/2): Clock Tree Synthesis and Routing Lab materials are available at ~cvsd/cur/soce/powerplan.tar.gz Please untar the file in the folder SOCE_Lab before lab 1 Open SOC Encounter 1.1 % source
Ingar Fredriksen AVR Applications Manager. Tromsø August 12, 2005
Ingar Fredriksen AVR Applications Manager Tromsø August 12, 2005 Atmel Norway 2005 Atmel Norway 2005 The history of computers Foundation for modern computing 3 An automatic computing machine must have:
CILOMAG & SPIN Projects. CMOS / Magnetic Integration
CILOMAG & SPIN Projects Spintronics Platform for Innovative Nanotechnology CMOS / Magnetic Integration Developments and results at CMP Introduction : The MTJ structure CMOS - MTJ Process CMOS process done
ATMEL FPGA 3rd User Group Workshop. 2010, 3rd June Christophe POURRIER
ATMEL FPGA 3rd User Group Workshop 2010, 3rd June Christophe POURRIER Summary Sodern first experience with AT40K Megha-Tropiques Project PHARAO Project ATF280 Evaluation Tests performed on the first development
International Journal of Electronics and Computer Science Engineering 1482
International Journal of Electronics and Computer Science Engineering 1482 Available Online at www.ijecse.org ISSN- 2277-1956 Behavioral Analysis of Different ALU Architectures G.V.V.S.R.Krishna Assistant
Implementation Details
LEON3-FT Processor System Scan-I/F FT FT Add-on Add-on 2 2 kbyte kbyte I- I- Cache Cache Scan Scan Test Test UART UART 0 0 UART UART 1 1 Serial 0 Serial 1 EJTAG LEON_3FT LEON_3FT Core Core 8 Reg. Windows
McPAT: An Integrated Power, Area, and Timing Modeling Framework for Multicore and Manycore Architectures
McPAT: An Integrated Power, Area, and Timing Modeling Framework for Multicore and Manycore Architectures Sheng Li, Junh Ho Ahn, Richard Strong, Jay B. Brockman, Dean M Tullsen, Norman Jouppi MICRO 2009
Altera Error Message Register Unloader IP Core User Guide
2015.06.12 Altera Error Message Register Unloader IP Core User Guide UG-01162 Subscribe The Error Message Register (EMR) Unloader IP core (altera unloader) reads and stores data from the hardened error
Testing Low Power Designs with Power-Aware Test Manage Manufacturing Test Power Issues with DFTMAX and TetraMAX
White Paper Testing Low Power Designs with Power-Aware Test Manage Manufacturing Test Power Issues with DFTMAX and TetraMAX April 2010 Cy Hay Product Manager, Synopsys Introduction The most important trend
Simulation and Design Route Development for ADEPT-SiP
Simulation and Design Route Development for ADEPT-SiP Alaa Abunjaileh, Peng Wong and Ian Hunter The Institute of Microwaves and Photonics School of Electronic and Electrical Engineering The University
Streamlining the creation of high-speed interconnect on digital PCBs
Streamlining the creation of high-speed interconnect on digital PCBs The Cadence integrated high-speed design and analysis environment streamlines creation of high-speed interconnect on digital PCBs. A
CMP is a service organization. prototyping and low volume production. carrousel. >>>>>>>>>> Flash info >>>>>>>>>> Design A Design B Your design
carrousel CMP is a service organization in ICs and MEMS for prototyping and low volume production. Design A Design B Your design Alimentée par CMS Le carrousel est alimenté par la base de données avec
UNIVERSITY OF CALIFORNIA College of Engineering Department of Electrical Engineering and Computer Sciences
UNIVERSITY OF CALIFORNIA College of Engineering Department of Electrical Engineering and Computer Sciences Jan M. Rabaey Homework #1: Circuit Simulation EECS 141 Due Friday, January 30, 5pm, box in 240
Document Contents Introduction Layout Extraction with Parasitic Capacitances Timing Analysis DC Analysis
Cadence Tutorial C: Simulating DC and Timing Characteristics Created for the MSU VLSI program by Professor A. Mason and the AMSaC lab group rev S06 (convert to spectre simulator) Document Contents Introduction
E158 Intro to CMOS VLSI Design. Alarm Clock
E158 Intro to CMOS VLSI Design Alarm Clock Sarah Yi & Samuel (Tae) Lee 4/19/2010 Introduction The Alarm Clock chip includes the basic functions of an alarm clock such as a running clock time and alarm
Static-Noise-Margin Analysis of Conventional 6T SRAM Cell at 45nm Technology
Static-Noise-Margin Analysis of Conventional 6T SRAM Cell at 45nm Technology Nahid Rahman Department of electronics and communication FET-MITS (Deemed university), Lakshmangarh, India B. P. Singh Department
EE411: Introduction to VLSI Design Course Syllabus
: Introduction to Course Syllabus Dr. Mohammad H. Awedh Spring 2008 Course Overview This is an introductory course which covers basic theories and techniques of digital VLSI design in CMOS technology.
IBIS for SSO Analysis
IBIS for SSO Analysis Asian IBIS Summit, November 15, 2010 (Presented previously at Asian IBIS Summits, Nov. 9 & 12, 2010) Haisan Wang Joshua Luo Jack Lin Zhangmin Zhong Contents Traditional I/O SSO Analysis
ECE 410: VLSI Design Course Introduction
ECE 410: VLSI Design Course Introduction Professor Andrew Mason Michigan State University Spring 2008 ECE 410, Prof. A. Mason Lecture Notes Page i.1 Age of electronics microcontrollers, DSPs, and other
Digitale Signalverarbeitung mit FPGA (DSF) Soft Core Prozessor NIOS II Stand Mai 2007. Jens Onno Krah
(DSF) Soft Core Prozessor NIOS II Stand Mai 2007 Jens Onno Krah Cologne University of Applied Sciences www.fh-koeln.de [email protected] NIOS II 1 1 What is Nios II? Altera s Second Generation
Introduction to Digital System Design
Introduction to Digital System Design Chapter 1 1 Outline 1. Why Digital? 2. Device Technologies 3. System Representation 4. Abstraction 5. Development Tasks 6. Development Flow Chapter 1 2 1. Why Digital
EEM870 Embedded System and Experiment Lecture 1: SoC Design Overview
EEM870 Embedded System and Experiment Lecture 1: SoC Design Overview Wen-Yen Lin, Ph.D. Department of Electrical Engineering Chang Gung University Email: [email protected] Feb. 2013 Course Overview
An Advanced Behavioral Buffer Model With Over-Clocking Solution. Yingxin Sun, Joy Li, Joshua Luo IBIS Summit Santa Clara, CA Jan.
An Advanced Behavioral Buffer Model With Over-Clocking Solution Yingxin Sun, Joy Li, Joshua Luo IBIS Summit Santa Clara, CA Jan. 31, 2014 Agenda 1. SPICE Model and Behavioral Buffer Model 2. Over-Clocking
Chapter 13: Verification
Chapter 13: Verification Prof. Ming-Bo Lin Department of Electronic Engineering National Taiwan University of Science and Technology Digital System Designs and Practices Using Verilog HDL and FPGAs @ 2008-2010,
Power Reduction Techniques in the SoC Clock Network. Clock Power
Power Reduction Techniques in the SoC Network Low Power Design for SoCs ASIC Tutorial SoC.1 Power Why clock power is important/large» Generally the signal with the highest frequency» Typically drives a
Status of CBM-XYTER Development
Status of CBM-XYTER Development Latest Results of the CSA/ADC Test-Chip Tim Armbruster [email protected] Heidelberg University Schaltungstechnik Schaltungstechnik und und 14th CBM CM
System on Chip Design. Michael Nydegger
Short Questions, 26. February 2015 What is meant by the term n-well process? What does this mean for the n-type MOSFETs in your design? What is the meaning of the threshold voltage (practically)? What
Sequential 4-bit Adder Design Report
UNIVERSITY OF WATERLOO Faculty of Engineering E&CE 438: Digital Integrated Circuits Sequential 4-bit Adder Design Report Prepared by: Ian Hung (ixxxxxx), 99XXXXXX Annette Lo (axxxxxx), 99XXXXXX Pamela
Advanced VLSI Design CMOS Processing Technology
Isolation of transistors, i.e., their source and drains, from other transistors is needed to reduce electrical interactions between them. For technologies
Impact of Signal Integrity on System-On-Chip Design Methodologies
EDP 2004 Impact of Signal Integrity on System-On-Chip Methodologies Juan-Antonio Carballo [email protected] VSIA IMP co-chair Raminderpal Singh IBM Systems and Technology [email protected] VSIA IMP
Quartus II Software and Device Support Release Notes Version 15.0
2015.05.04 Quartus II Software and Device Support Release Notes Version 15.0 RN-01080-15.0.0 Subscribe This document provides late-breaking information about the Altera Quartus II software release version
SDN and Streamlining the Plumbing. Nick McKeown Stanford University
SDN and Streamlining the Plumbing Nick McKeown Stanford University What is SDN? (when we clear away all the hype) A network in which the control plane is physically separate from the forwarding plane.
數 位 積 體 電 路 Digital Integrated Circuits
IEE5049 - Spring 2012 數 位 積 體 電 路 Digital Integrated Circuits Course Overview Professor Wei Hwang 黃 威 教 授 Department of Electronics Engineering National Chiao Tung University [email protected] Wei
DIGITAL DESIGN FLOW OPTIONS
DIGITAL DESIGN FLOW OPTIONS A Thesis Presented in Partial Fulfillment of the Requirements for the Degree Master of Science in the Graduate School of The Ohio State University By Sagar Vidya Reddy, B.E.
UTBB-FDSOI 28nm : RF Ultra Low Power technology for IoT
UTBB-FDSOI 28nm : RF Ultra Low Power technology for IoT International Forum on FDSOI IC Design B. Martineau www.cea.fr Cliquez pour modifier le style du Outline titre Introduction UTBB-FDSOI 28nm for RF
Asynchronous IC Interconnect Network Design and Implementation Using a Standard ASIC Flow
Asynchronous IC Interconnect Network Design and Implementation Using a Standard ASIC Flow Bradley R. Quinton Dept. of Electrical and Computer Engineering University of British Columbia [email protected]
Low Power AMD Athlon 64 and AMD Opteron Processors
Low Power AMD Athlon 64 and AMD Opteron Processors Hot Chips 2004 Presenter: Marius Evers Block Diagram of AMD Athlon 64 and AMD Opteron Based on AMD s 8 th generation architecture AMD Athlon 64 and AMD
3. On the top menu bar, click on File > New > Project as shown in Fig. 2 below: Figure 2 Window for Orcad Capture CIS
Department of Electrical Engineering University of North Texas Denton, TX. 76207 EENG 2920 Quickstart PSpice Tutorial Tutorial Prepared by Oluwayomi Adamo 1. To run the PSpice program, click on Start >
Understanding DO-254 Compliance for the Verification of Airborne Digital Hardware
White Paper Understanding DO-254 Compliance for the of Airborne Digital Hardware October 2009 Authors Dr. Paul Marriott XtremeEDA Corporation Anthony D. Stone Synopsys, Inc Abstract This whitepaper is
ECE 5745 Complex Digital ASIC Design Course Overview
ECE 5745 Complex Digital ASIC Design Course Overview Christopher Batten School of Electrical and Computer Engineering Cornell University http://www.csl.cornell.edu/courses/ece5745 Application Algorithm
High-Level Synthesis for FPGA Designs
High-Level Synthesis for FPGA Designs BRINGING BRINGING YOU YOU THE THE NEXT NEXT LEVEL LEVEL IN IN EMBEDDED EMBEDDED DEVELOPMENT DEVELOPMENT Frank de Bont Trainer consultant Cereslaan 10b 5384 VT Heesch
RAPID PROTOTYPING OF DIGITAL SYSTEMS Second Edition
RAPID PROTOTYPING OF DIGITAL SYSTEMS Second Edition A Tutorial Approach James O. Hamblen Georgia Institute of Technology Michael D. Furman Georgia Institute of Technology KLUWER ACADEMIC PUBLISHERS Boston
Digital Integrated Circuit (IC) Layout and Design
Digital Integrated Circuit (IC) Layout and Design! EE 134 Winter 05 " Lecture Tu & Thurs. 9:40 11am ENGR2 142 " 2 Lab sections M 2:10pm 5pm ENGR2 128 F 11:10am 2pm ENGR2 128 " NO LAB THIS WEEK " FIRST
Printed Circuit Board Design with HDL Designer
Printed Circuit Board Design with HDL Designer Tom Winkert Teresa LaFourcade NASNGoddard Space Flight Center 301-286-291 7 NASNGoddard Space Flight Center 301-286-0019 tom.winkert8 nasa.gov teresa. 1.
EDA Vendor Support. Table 1 Alliance Program EDA Vendors. Actel s Alliance Partners. Company Contact Address
EDA Vendor Support This document describes the EDA environments that supports. This document also covers each of the -supported vendors. Within each vendor s tool set the features will be described that
A NEAR FIELD INJECTION MODEL FOR SUSCEPTIBILITY PREDICTION IN INTEGRATED CIRCUITS
ICONIC 2007 St. Louis, MO, USA June 27-29, 2007 A NEAR FIELD INJECTION MODEL FOR SUSCEPTIBILITY PREDICTION IN INTEGRATED CIRCUITS Ali Alaeldine 12, Alexandre Boyer 3, Richard Perdriau 1, Sonia Ben Dhia
IMPLEMENTATION OF BACKEND SYNTHESIS AND STATIC TIMING ANALYSIS OF PROCESSOR LOCAL BUS(PLB) PERFORMANCE MONITOR
International Journal of Engineering & Science Research IMPLEMENTATION OF BACKEND SYNTHESIS AND STATIC TIMING ANALYSIS OF PROCESSOR LOCAL BUS(PLB) PERFORMANCE MONITOR ABSTRACT Pathik Gandhi* 1, Milan Dalwadi
Training Course of SOC Encounter
Training Course of SOC Encounter REF: CIC Training Manual Cell-Based IC Physical Design and Verification with SOC Encounter, July, 2006 CIC Training Manual Mixed-Signal IC Design Concepts, July, 2007 Speaker:
DEVICE DRIVERS AND TERRUPTS SERVICE MECHANISM Lesson-14: Device types, Physical and Virtual device functions
DEVICE DRIVERS AND TERRUPTS SERVICE MECHANISM Lesson-14: Device types, Physical and Virtual device functions 1 Device Types For each type of device, there is a set of the generic commands. For example,
Space product assurance
ECSS-Q-ST-60-02C Space product assurance ASIC and FPGA development ECSS Secretariat ESA-ESTEC Requirements & Standards Division Noordwijk, The Netherlands Foreword This Standard is one of the series of
SABRE Lite Development Kit
SABRE Lite Development Kit Freescale i.mx 6Quad ARM Cortex A9 processor at 1GHz per core 1GByte of 64-bit wide DDR3 @ 532MHz UART, USB, Ethernet, CAN, SATA, SD, JTAG, I2C Three Display Ports (RGB, LVDS
Wireless Security Camera
Wireless Security Camera Technical Manual 12/14/2001 Table of Contents Page 1.Overview 3 2. Camera Side 4 1.Camera 5 2. Motion Sensor 5 3. PIC 5 4. Transmitter 5 5. Power 6 3. Computer Side 7 1.Receiver
Embed-It! Integrator Online Release E-2011.03 March 2011
USER MANUAL Embed-It! Integrator Online Release E-2011.03 March 2011 (c) 1998-2011 Virage Logic Corporation, All Rights Reserved (copyright notice reflects distribution which may not necessarily be a publication).
Table 1. The relationship between courses and EDA tools (P: PC, M: MAC, U:Unix Workstation, T: Engineering Technology only).
Table 1. The relationship between courses and EDA tools (P: PC, M: MAC, U:Unix Workstation, T: Engineering Technology only). Course Mentor Graphics U Viewlogic PowerView U / WorkView P,U Low Cost Tools
High-Frequency Integrated Circuits
High-Frequency Integrated Circuits SORIN VOINIGESCU University of Toronto CAMBRIDGE UNIVERSITY PRESS CONTENTS Preface, page xiii Introduction l 1.1 High-frequency circuits in wireless, fiber-optic, and
