4N35/ 4N36/ 4N37/ 4N38

Transcription

1 Optocoupler, Phototransistor Output, With Base Connection Features Isolation Test Voltage 300 V RMS Interfaces with common logic families Input-output coupling capacitance < pf Industry Standard Dual-in line 6-pin package Lead-free component Component in accordance to RoHS 2002/9/EC and WEEE 2002/96/EC Agency Approvals Underwriters Laboratory File #E2744 i79004 A C NC 2 3 e3 6 4 B C E Pb Pb-free DIN EN (VDE0884) DIN EN pending Available with Option Applications AC mains detection Reed relay driving Switch mode power supply feedback Telephone ring detection Logic ground isolation Logic coupling with high frequency noise rejection Description This data sheet presents five families of Vishay Industry Standard Single Channel Phototransistor Couplers.These families include the 4N3/ 4N36/ 4N37/ 4N38 couplers. Each optocoupler consists of gallium arsenide infrared LED and a silicon NPN phototransistor. These couplers are Underwriters Laboratories (UL) listed to comply with a 300 V RMS isolation test voltage. This isolation performance is accomplished through Vishay double molding isolation manufacturing process. Comliance to DIN EN (VDE0884)/ DIN EN pending partial discharge isolation specification is available for these families by ordering option. These isolation processes and the Vishay ISO900 quality program results in the highest isolation performance available for a commecial plastic phototransistor optocoupler. The devices are available in lead formed configuration suitable for surface mounting and are available either on tape and reel, or in standard tube shipping containers. Note: Designing with data sheet is cover in Application Note 4 Order Information Part Remarks 4N3 CTR > 0 %, DIP-6 4N36 CTR > 0 %, DIP-6 4N37 CTR > 0 %, DIP-6 4N38 CTR > 20 %, DIP-6 4N3-X006 CTR > 0 %, DIP mil (option 6) 4N3-X007 CTR > 0 %, SMD-6 (option 7) 4N3-X009 CTR > 0 %, SMD-6 (option 9) 4N36-X007 CTR > 0 %, SMD-6 (option 7) 4N36-X009 CTR > 0 %, SMD-6 (option 9) 4N37-X006 CTR > 0 %, DIP mil (option 6) 4N37-X009 CTR > 0 %, SMD-6 (option 9) For additional information on the available options refer to Option Information. Document Number 8377 Rev.., 27-Jan-0

2 Absolute Maximum Ratings T amb = 2 C, unless otherwise specified Stresses in excess of the absolute Maximum Ratings can cause permanent damage to the device. Functional operation of the device is not implied at these or any other conditions in excess of those given in the operational sections of this document. Exposure to absolute Maximum Rating for extended periods of the time can adversely affect reliability. Input Parameter Test condition Symbol Value Unit Reverse voltage V R 6.0 V Forward current I F 60 ma Surge current µs I FSM 2. A Power dissipation P diss 0 mw Output Parameter Test condition Symbol Value Unit Collector-emitter breakdown V CEO 70 V voltage Emitter-base breakdown V EBO 7.0 V voltage Collector current I C 0 ma (t.0 ms) I C 0 ma Power dissipation P diss 0 mw Coupler Parameter Test condition Symbol Value Unit Isolation test voltage V ISO 300 V RMS Creepage 7.0 mm Clearance 7.0 mm Isolation thickness between 0.4 mm emitter and detector Comparative tracking index per 7 DIN IEC 2/VDE0303,part Isolation resistance V IO = 00 V, T amb = 2 C R IO 2 Ω V IO = 00 V, T amb = 0 C R IO Ω Storage temperature T stg - to + 0 C Operating temperature T amb - to + 0 C Junction temperature T j 0 C Soldering temperature max. s dip soldering: distance to seating plane. mm T sld 260 C 2 Document Number 8377 Rev.., 27-Jan-0

3 Electrical Characteristics T amb = 2 C, unless otherwise specified Minimum and maximum values are testing requirements. Typical values are characteristics of the device and are the result of engineering evaluation. Typical values are for information only and are not part of the testing requirements. Input Parameter Test condition Symbol Min Typ. Max Unit Forward voltage ) I F = ma V F.3. V I F = ma, T amb = - C V F V Reverse current ) V R = 6.0 V I R 0. µa Capacitance V R = 0, f =.0 MHz C O 2 pf ) Indicates JEDEC registered value Output Parameter Test condition Part Symbol Min Typ. Max Unit Collector-emitter breakdown I C =.0 ma 4N3 BV CEO 30 V voltage ) 4N36 BV CEO 30 V 4N37 BV CEO 30 V 4N38 BV CEO 80 V Emitter-collector breakdown voltage ) I E = 0 µa BV ECO 7.0 V Collector-base breakdown I C = 0 µa, I B =.0 µa 4N3 BV CBO 70 V voltage ) 4N36 BV CBO 70 V 4N37 BV CBO 70 V 4N38 BV CBO 80 V Collector-emitter leakage current ) V CE = V, I F = 0 4N3 I CEO.0 0 na 4N36 I CEO.0 0 na V CE = V, I F =0 4N37 I CEO.0 0 na V CE = 60 V, I F = 0 4N38 I CEO 0 na V CE = 30 V, I F = 0, T amb = 4N3 I CEO 00 µa 0 C 4N36 I CEO 00 µa 4N37 I CEO 00 µa V CE = 60 V, I F = 0, T amb = 0 C 4N38 I CEO 6.0 µa Collector-emitter capacitance V CE = 0 C CE 6.0 pf ) Indicates JEDEC registered value Coupler Parameter Test condition Symbol Min Typ. Max Unit Resistance, input to output ) V IO = 00 V R IO Ω Capacitance (input-output) f =.0 MHz C IO pf ) Indicates JEDEC registered value Document Number 8377 Rev.., 27-Jan-0 3

4 Transfer Ratio Parameter Test condition Part Symbol Min Typ. Max Unit DC Transfer Ratio ) V CE = V, I F = ma 4N3 CTR DC 0 % 4N36 CTR DC 0 % 4N37 CTR DC 0 % V CE = V, I F = 20 ma 4N38 CTR DC 20 % V CE = V, I F = ma, T A = - to + 0 C 4N3 CTR DC 40 0 % ) Indicates JEDEC registered value 4N36 CTR DC 40 0 % 4N37 CTR DC 40 0 % 4N38 CTR DC 30 % Switching Characteristics Parameter Test condition Symbol Min Typ. Max Unit Switching time ) I C = 2 ma, R L = 0 Ω, V CC = V t on, t off µs ) Indicates JEDEC registered value Typical Characteristics (Tamb = 2 C unless otherwise specified) V F - Forward Voltage - V T A = C T A =2 C T A =8 C I F - Forward - ma 0 NCTR - Normlized CTR..0 Vce= V, I F= ma, T A=2 C CTRce(sat) Vce=0.4 V T A=2 C NCTR(SAT) NCTR 0 0 i4n2_0 i4n2_02 Figure. Forward Voltage vs. Forward Figure 2. Normalized Non-Saturated and Saturated CTR vs. LED 4 Document Number 8377 Rev.., 27-Jan-0

5 NCTR - Normalized CTR..0. Vce= V, I F= ma, T A=2 C CTRce(sat) Vce=0.4 V T A=0 C NCTR NCTR(SAT) 0 Ice - Collector - ma C 2 C 8 C C 60 i4n2_03 i4n2_06 Figure 3. Normalized Non-saturated and Saturated CTR vs. LED Figure 6. Collector-Emitter vs. Temperature and LED NCTR - Normalized CTR..0. Vce= V, I F= ma, T A=2 C CTRce(sat) Vce=0.4 V T A=70 C NCTR NCTR(SAT) 0 Iceo - Collector-Emitter - na V ce =V Typical T A - Ambient Temperature - C 0 i4n2_04 i4n2_07 Figure 4. Normalized Non-saturated and saturated CTR vs. LED Figure 7. Collector-Emitter Leakage vs.temp. NCTR - Normalized CTR..0. Vce= V, I F= ma, T A=2 C CTRce(sat) Vce = 0.4 V T A=8 C NCTR(SAT) NCTR 0 NCTRcb - Normalized CTRcb..0 Vcb=9.3 V, I F= ma, T A=2 C 2 C 0 C 70 C. 0 i4n2_0 i4n2_08 Figure. Normalized Non-saturated and saturated CTR vs. LED Figure 8. Normalized CTRcb vs. LED and Temp. Document Number 8377 Rev.., 27-Jan-0

6 Normalized Photocurrent i4n2_09 I F= ma, T A=2 C 0. Nib, T A= 20 C Nib, T A= 2 C Nib, T A= 0 C Nib, T A= 70 C. 0 tplh - Propagation Delay - µs i4n2_ IF = ma,ta=2 C VCC=.0 V, Vth=. V tphl tplh. 0 RL - Collector Load Resistor - kω tphl - Propagation Delay - µs Figure 9. Normalized Photocurrent vs. I F and Temp. Figure 2. Propagation Delay vs. Collector Load Resistor.2 70 C I F NHFE - Normalized HFE C 20 C Ib=20 µa, Vce= V, T A =2 C V O t D t R t PLH V TH =. V i4n2_ Ib - Base - µa i4n2_3 t PHL t S t F Figure. Normalized Non-saturated HFE vs. Base and Temperature Figure 3. Switching Timing NHFE(sat) - Normalized Saturated HFE C 2 C 20 C 0 C Vce=0.4 V Vce= V, Ib=20 µa TA=2 C 0 00 I F = 0 ma F= KHz, DF=0% V CC =.0V R L V O i4n2_ Ib - Base - µa i4n2_4 Figure. Normalized HFE vs. Base and Temp. Figure 4. Switching Schematic 6 Document Number 8377 Rev.., 27-Jan-0

7 Package Dimensions in Inches (mm) 4N3/ 4N36/ 4N37/ 4N38 For 4N3/36/37/38... see DIL300-6 Package dimension in the Package Section. For products with an option designator (e.g. 4N3-X006 or 4N36-X007)... see DIP-6 Package dimensions in the Package Section. DIL300-6 Package Dimensions 4770 DIP-6 Package Dimensions 3 2 pin one ID.248 (6.30).26 (6.0) 4 6 ISO Method A.039 (.00) Min..33 (8.0).343 (8.70).048 (0.4).022 ().30 (3.30).0 (3.8).300 (7.62) typ. 4 typ..08 (0.4).022 ().03 (0.80) min..03 (0.80).03 (0.90).0 (2.4) typ (.2) typ ( ).4 (2.90).30 (3.0) i78004 Document Number 8377 Rev.., 27-Jan-0 7

8 Option 6 Option 7 Option (.36).39 (9.96).307 (7.8).29 (7.4).04 (0.3).0 (0.2).400 (.6).430 (.92).028 (0.7) MIN..300 (7.62) TYP..3 (8.0) MIN..33 (8.4) MIN..406 (.3) MAX..80 (4.6).60 (4.).0040 (.2).0098 (.249).37 (9.3).39 (.03).300 (7.62) ref..020 (.).040 (.02).3 (8.00) min..02 (.30) typ. max Document Number 8377 Rev.., 27-Jan-0

9 Ozone Depleting Substances Policy Statement 4N3/ 4N36/ 4N37/ 4N38 It is the policy of Vishay Semiconductor GmbH to. Meet all present and future national and international statutory requirements. 2. Regularly and continuously improve the performance of our products, processes, distribution and operatingsystems with respect to their impact on the health and safety of our employees and the public, as well as their impact on the environment. It is particular concern to control or eliminate releases of those substances into the atmosphere which are known as ozone depleting substances (ODSs). The Montreal Protocol (987) and its London Amendments (990) intend to severely restrict the use of ODSs and forbid their use within the next ten years. Various national and international initiatives are pressing for an earlier ban on these substances. Vishay Semiconductor GmbH has been able to use its policy of continuous improvements to eliminate the use of ODSs listed in the following documents.. Annex A, B and list of transitional substances of the Montreal Protocol and the London Amendments respectively 2. Class I and II ozone depleting substances in the Clean Air Act Amendments of 990 by the Environmental Protection Agency (EPA) in the USA 3. Council Decision 88/40/EEC and 9/690/EEC Annex A, B and C (transitional substances) respectively. Vishay Semiconductor GmbH can certify that our semiconductors are not manufactured with ozone depleting substances and do not contain such substances. We reserve the right to make changes to improve technical design and may do so without further notice. Parameters can vary in different applications. All operating parameters must be validated for each customer application by the customer. Should the buyer use products for any unintended or unauthorized application, the buyer shall indemnify against all claims, costs, damages, and expenses, arising out of, directly or indirectly, any claim of personal damage, injury or death associated with such unintended or unauthorized use. Vishay Semiconductor GmbH, P.O.B. 33, D-7402 Heilbronn, Germany Telephone: 49 (0) , Fax number: 49 (0) Document Number 8377 Rev.., 27-Jan-0 9