Optocoupler, Phototransistor Output, AC Input

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1 Optocoupler, Phototransistor Output, AC Input DESCRIPTION The SFH62A (DIP) and SFH626 (SMD) feature a high current transfer ratio, low coupling capacitance and high isolation voltage. These couplers have a GaAs infrared diode emitter, which is optically coupled to a silicon planar phototransistor detector, and is incorporated in a plastic DIP-4 or SMD package. The coupling devices are designed for signal transmission between two electrically separated circuits. The couplers are end-stackable with 2.54 mm lead spacing. Creepage and clearance distances of > 8 mm are achieved with option 6. This version complies with IEC 695 (DIN VDE 85) for reinforced insulation to an operation voltage of 4 V RMS or DC. A/C C/A C E FEATURES Good CTR linearity depending on forward current Isolation test voltage, 53 V RMS High collector emitter voltage, V CEO = 7 V Low saturation voltage Fast switching times Low CTR degradation Temperature stable Low coupling capacitance End-stackable,.1" (2.54 mm) spacing High common-mode interference immunity Material categorization: for definitions of compliance please see AGENCY APPROVALS The safety application model number covering all products in this datasheet is SFH62A and SHF626. This model number should be used when consulting safety agency documents. UL1577, file no. E52744 system code H, double protection CSA BSI EN 695, EN 665 DIN EN (VDE 884-5), available with option 1 CQC GB , GB ORDERING INFORMATION S F H 6 2 x - # X # # T DIP-# Option 6 PART NUMBER CTR BIN PACKAGE OPTION TAPE AND REEL 7.62 mm Option mm Option 9 AGENCY CERTIFIED/PACKAGE SFH62A CTR (%) ± 1 ma SFH626 UL, cul, BSI 4 to to 2 1 to 32 4 to to 2 1 to 32 DIP-4 SFH62A-1 SFH62A-2 SFH62A DIP-4, 4 mil, option 6 SFH62A-1X6 SFH62A-2X6 SFH62A-3X SMD-4, option 7 - SFH62A-2X7T (1) SMD-4, option SFH626-1T (1) SFH626-2T (1) SFH626-3T (1) VDE, UL, CUL, BSI 4 to to 2 1 to 32 4 to to 2 1 to 32 DIP-4 SFH62A-1X1 SFH62A-2X1 SFH62A-3X DIP-4, 4 mil, option 6 - SFH62A-2X16 SFH62A-3X SMD-4, option 7 - SFH62A-2X17T SMD-4, option SFH626-2X1T (1) SFH626-3X1T (1) Notes Additional options may be possible, please contact sales office. (1) Also available in tubes; do not add T to end. Rev. 2.3, 31-Aug-15 1 Document Number: >.7 mm >.1 mm

2 ABSOLUTE MAXIMUM RATINGS (T amb = 25 C, unless otherwise specified) PARAMETER TEST CONDITION SYMBOL VALUE UNIT INPUT DC forward current I F ± 6 ma Surge forward current t p 1 μs I FSM ± 2.5 A Power dissipation P diss 1 mw OUTPUT Collector emitter voltage V CEO 7 V Emitter collector voltage V ECO 7 V I C 5 ma Collector current t p 1 μs I C 1 ma Power dissipation P diss 15 mw COUPLER Total power dissipation P tot 25 mw Storage temperature range T stg -55 to +15 C Ambient temperature range T amb -55 to +1 C Junction temperature T j 1 C Soldering temperature (1) max. 1 s, dip soldering distance to seating plane 1.5 mm T sld 26 C Notes Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. Functional operation of the device is not implied at these or any other conditions in excess of those given in the operational sections of this document. Exposure to absolute maximum ratings for extended periods of the time can adversely affect reliability. (1) Refer to reflow profile for soldering conditions for surface mounted devices (SMD). Refer to wave profile for soldering conditions for through hole devices (DIP). ELECTRICAL CHARACTERISTICS (T amb = 25 C, unless otherwise specified) PARAMETER TEST CONDITION PART SYMBOL MIN. TYP. MAX. UNIT INPUT Forward voltage I F = ± 6 ma V F V Capacitance V R = V, f = 1 MHz C O 5 pf Thermal resistance R thja 75 K/W OUTPUT Collector emitter capacitance V CE = 5 V, f = 1 MHz C CE 6.8 pf Thermal resistance R thja 5 C/W COUPLER Collector emitter saturation voltage I F = ± 1 ma, I C = 2.5 ma V CEsat.25.4 V Coupling capacitance C C.2 pf Collector emitter leakage current V CE = 1 V SFH62A-1 I CEO 2 5 na SFH626-1 I CEO 2 5 na SFH62A-2 I CEO 2 5 na SFH626-2 I CEO 2 5 na SFH62A-3 I CEO 5 1 na SFH626-3 I CEO 5 1 na Note Minimum and maximum values are testing requirements. Typical values are characteristics of the device and are the result of engineering evaluation. Typical values are for information only and are not part of the testing requirements. Still air, coupler soldered to PCB or base. Rev. 2.3, 31-Aug-15 2 Document Number: 83675

3 CURRENT TRANSFER RATIO (T amb = 25 C, unless otherwise specified) PARAMETER TEST CONDITION PART SYMBOL MIN. TYP. MAX. UNIT SFH62A-1 CTR % SFH626-1 CTR % V CE = 5 V, I F = ± 1 ma SFH62A-2 CTR 63 2 % SFH626-2 CTR 63 2 % SFH62A-3 CTR 1 32 % I C /I F SFH626-3 CTR 1 32 % SFH62A-1 CTR 13 3 % SFH626-1 CTR 13 3 % V CE = 5 V, I F = ± 1 ma SFH62A-2 CTR % SFH626-2 CTR % SFH62A-3 CTR 34 7 % SFH626-3 CTR 34 7 % I F R L =75 Ω V CC =5 V I C 47 Ω isfh62a_8 Fig. 1 - Switching Times Linear Operation (without Saturation) SWITCHING CHARACTERISTICS (T amb = 25 C, unless otherwise specified) PARAMETER TEST CONDITION SYMBOL MIN. TYP. MAX. UNIT Turn-on time R L = 75 Ω, I F = ± 1 ma, V CC = 5 V t on 3 μs Rise time R L = 75 Ω, I F = ± 1 ma, V CC = 5 V t r 2 μs Turn-off time R L = 75 Ω, I F = ± 1 ma, V CC = 5 V t off 2.3 μs Fall time R L = 75 Ω, I F = ± 1 ma, V CC = 5 V t f 2 μs Cut-off frequency R L = 75 Ω, I F = ± 1 ma, V CC = 5 V t ctr 28 khz SAFETY AND INSULATION RATINGS PARAMETER TEST CONDITION SYMBOL VALUE UNIT Climatic classification According to IEC 68 part 1 55/115/21 Pollution degree According to DIN VDE 19 2 Comparative tracking index Insulation group IIIa CTI 175 Maximum rated withstanding isolation voltage According to UL1577, t = 1 min V ISO 447 V RMS Tested withstanding isolation voltage According to UL1577, t = 1 s V ISO 53 V RMS Maximum transient isolation voltage According to DIN EN V IOTM 8 V peak Maximum repetitive peak isolation voltage According to DIN EN V IORM 89 V peak Isolation resistance T amb = 25 C, V IO = 5 V R IO 1 12 Ω T amb = 1 C, V IO = 5 V R IO 1 11 Ω Output safety power P SO 7 mw Input safety current I SI 4 ma Input safety temperature T S 175 C Creepage distance DIP-4 7 mm Clearance distance DIP-4 7 mm Creepage distance DIP-4, 4 mil, option 6 8 mm Clearance distance DIP-4, 4 mil, option 6 8 mm Creepage distance SMD-4, option 7 and option 9 7 mm Clearance distance SMD-4, option 7 and option 9 7 mm Insulation thickness DTI.4 mm Note As per DIN EN , , this optocoupler is suitable for safe electrical insulation only within the safety ratings. Compliance with the safety ratings shall be ensured by means of protective circuits. Rev. 2.3, 31-Aug-15 3 Document Number: 83675

4 TYPICAL CHARACTERISTICS (T amb = 25 C, unless otherwise specified) I F = 1 ma, V CC = 5 V f = 1 MHz (%) 15 I C I F C (pf) 1 5 C CE isfh62a_1 T A ( C) isfh62a_4 V e (V) Fig. 2 - Current Transfer Ratio (CTR) vs. Temperature Fig. 5 - Transistor Capacitance (Typ.) vs. Collector Emitter Voltage I C (ma) 3 2 I F = 14 ma I F = 12 ma I F = 1 ma I F = 8 ma I F (ma) D =.5.1 D = t p T t p.2 Pulse cycle D = parameter T I F 1 I F = 6 ma I F = 4 ma DC I F = 1 ma I F = 2 ma V isfh62a_2 (V) CE isfh62a_5 t p (s) Fig. 3 - Output Characteristics (Typ.) Collector Current vs. Collector Emitter Voltage Fig. 6 - Permissible Pulse Handling Capability Forward Current vs. Pulse Width V F (V) V F = f (I F ) 25 C 5 C 75 C P tot (mw) Transistor 1. 5 Diode isfh62a_3 I F (ma) isfh62a_6 T A ( C) Fig. 4 - Diode Forward Voltage (Typ.) vs. Forward Current Fig. 7 - Permissible Power Dissipation vs. Ambient Temperature Rev. 2.3, 31-Aug-15 4 Document Number: 83675

5 12 P tot = f (T A ) 9 I F (ma) 6 3 isfh62a_ T A ( C) Fig. 8 - Permissible Diode Forward Current vs. Ambient Temperature PACKAGE DIMENSIONS in millimeters DIP-4, Standard.7 min. 5.1 max. 4.7 ± typ. 6.6 ± ± ±.1.5 ± typ..5 min. 3 to ±.5.25 ± Pin one I.D. 1 2 Rev. 2.3, 31-Aug-15 5 Document Number: 83675

6 DIP-4, Option 6.7 min. 5.1 max. 4.7 ± typ typ. 6.6 ± ±.25.1 min ±.1.5 ± typ ± ±.4.25 ±.1 Pin one I.D. 1 2 SMD-4, Option max. 5.1 max typ..7 min. 4.7 ± ± ±.25.5 min..25 ± ± ± typ..5 min. 8. min. Leads coplanarity.1 max R min. Pin one I.D Rev. 2.3, 31-Aug-15 6 Document Number: 83675

7 SMD-4, Option 9.7 min. 5.1 max. 4.7 ± max typ. 6.6 ± R ±.25.2 ±.1.25 ± ± typ..5 min. 8. min. Leads coplanarity.1 max min. Pin one I.D PACKAGE MARKING (example) Notes Only options 1 and 7 are reflected in the package marking. The VDE logo is only marked on option1 parts. Tape and reel suffix (T) is not part of the package marking. SOLDER PROFILES YWW H 68 SFH62A-1 V X1 Temperature ( C) C to 26 C first wave wave ca. 2 K/s 1 C to 13 C 5 s 2 K/s second wave ca. 2 K/s forced cooling Lead temperature full line: typical dotted line: process limits ca. 5 K/s Temperature ( C) C 24 C 217 C max. 12 s max. ramp up 3 C/s max. 26 C 245 C max. 3 s max. 1 s max. ramp down 6 C/s Time (s) Fig. 9 - Wave Soldering Double Wave Profile According to J-STD-2 for DIP-8 Devices Time (s) Fig. 1 - Lead (Pb)-free Reflow Solder Profile According to J-STD-2 for SMD-8 Devices Rev. 2.3, 31-Aug-15 7 Document Number: 83675

8 HANDLING AND STORAGE CONDITIONS ESD level: HBM class 2 Floor life: unlimited Conditions: T amb < 3 C, RH < 85 % Moisture sensitivity level 1, according to J-STD-2 Rev. 2.3, 31-Aug-15 8 Document Number: 83675

9 Legal Disclaimer Notice Vishay Disclaimer ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE. Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, Vishay ), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other disclosure relating to any product. Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or the continuing production of any product. To the maximum extent permitted by applicable law, Vishay disclaims (i) any and all liability arising out of the application or use of any product, (ii) any and all liability, including without limitation special, consequential or incidental damages, and (iii) any and all implied warranties, including warranties of fitness for particular purpose, non-infringement and merchantability. Statements regarding the suitability of products for certain types of applications are based on Vishay s knowledge of typical requirements that are often placed on Vishay products in generic applications. Such statements are not binding statements about the suitability of products for a particular application. It is the customer s responsibility to validate that a particular product with the properties described in the product specification is suitable for use in a particular application. Parameters provided in datasheets and / or specifications may vary in different applications and performance may vary over time. All operating parameters, including typical parameters, must be validated for each customer application by the customer s technical experts. Product specifications do not expand or otherwise modify Vishay s terms and conditions of purchase, including but not limited to the warranty expressed therein. Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining applications or for any other application in which the failure of the Vishay product could result in personal injury or death. Customers using or selling Vishay products not expressly indicated for use in such applications do so at their own risk. Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay. Product names and markings noted herein may be trademarks of their respective owners. Revision: 13-Jun-16 1 Document Number: 91

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