GaAs/GaAlAs IR Emitting Diodes in ø 5 mm Package

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1 GaAs/GaAlAs IR Emitting Diodes in ø 5 mm Package Description TSIL64 is a high efficiency infrared emitting diode in GaAlAs on GaAs technology, molded in clear, bluegrey tinted plastic packages. In comparison with the standard GaAs on GaAs technology these emitters achieve about 7 % radiant power improvement at a similar wavelength. The forward voltages at low current and at high pulse current roughly correspond to the low values of the standard technology. Therefore these emitters are ideally suitable as high performance replacements of standard emitters eatures Extra high radiant power and radiant intensity Low forward voltage Suitable for high pulse current operation Standard T 1 (ø 5 mm) package Angle of half intensity ϕ = ± 17 Peak wavelength p = 925 nm High reliability Good spectral matching to Si photodetectors Applications Infrared remote control units with high power requirements ree air transmission systems Infrared source for optical counters and card readers IR source for smoke detectors Absolute Maximum Ratings T amb = 25 C Parameter Test Conditions Symbol Value Unit Reverse Voltage V R 5 V orward Current I ma Peak orward Current t p /T=.5, t p = s I M 2 ma Surge orward Current t p = s I SM 1.5 A Power Dissipation P V 21 mw Junction Temperature T j C Operating Temperature Range T amb C Storage Temperature Range T stg C Soldering Temperature t 5sec, 2 mm from case T sd 26 C Thermal Resistance Junction/Ambient R thja 35 K/W 1 (5)

2 Basic Characteristics T amb = 25 C Parameter Test Conditions Symbol Min Typ Max Unit orward Voltage I = ma, t p = 2 ms V V I = 1 A, t p = s V V Temp. Coefficient of V I = ma TK V 1.3 mv/k Reverse Current V R = 5 V I R A Junction Capacitance V R = V, f = 1 MHz, E = C j 25 p Radiant Intensity I =ma, t p =2ms I e mw/sr I =1.A, t p =s I e 14 2 mw/sr Radiant Power I =ma, t p =2ms e 25 mw Temp. Coefficient of e I = 2 ma TK e.8 %/K Angle of Half Intensity ϕ ±17 deg Peak Wavelength I = ma p 925 nm Spectral Bandwidth I = ma 5 nm Temp. Coefficient of p I = ma TK p.2 nm/k Rise Time I = ma t r 8 ns all Time I = ma t f 8 ns Typical Characteristics (T amb = 25 C unless otherwise specified) P V Power Dissipation ( mw ) R thja I orward Current ( ma ) R thja e igure 1. Power Dissipation vs. Ambient Temperature igure 2. orward Current vs. Ambient Temperature 2 (5)

3 1 1 I orward Current ( A ) I SM = 1 A ( Single Pulse ) t p / T =.1 I Radiant Intensity ( mw/sr ) e t p Pulse Duration ( ms ) I orward Current ( ma ) igure 3. Pulse orward Current vs. Pulse Duration igure 6. Radiant Intensity vs. orward Current 1 4 I orward Current ( ma ) t p = s t p / T =.1 Radiant Power ( mw ) e V orward Voltage ( V ) I orward Current ( ma ) igure 4. orward Current vs. orward Voltage igure 7. Radiant Power vs. orward Current V rel Relative orward Voltage I = 1 ma I e rel ; e rel I = 2 ma e e igure 5. Relative orward Voltage vs. Ambient Temperature igure 8. Rel. Radiant Intensity\Power vs. Ambient Temperature 3 (5)

4 Relative Radiant Power e rel I = ma S rel Relative Sensitivity Wavelength ( nm ) igure 9. Relative Radiant Power vs. Wavelength igure 1. Relative Radiant Intensity vs. Angular Displacement Dimensions in mm (5)

5 Ozone Depleting Substances Policy Statement It is the policy of TEMIC TELEUNKEN microelectronic GmbH to 1. Meet all present and future national and international statutory requirements. 2. Regularly and continuously improve the performance of our products, processes, distribution and operating systems with respect to their impact on the health and safety of our employees and the public, as well as their impact on the environment. It is particular concern to control or eliminate releases of those substances into the atmosphere which are known as ozone depleting substances (ODSs). The Montreal Protocol (1987) and its London Amendments (199) intend to severely restrict the use of ODSs and forbid their use within the next ten years. Various national and international initiatives are pressing for an earlier ban on these substances. TEMIC TELEUNKEN microelectronic GmbH semiconductor division has been able to use its policy of continuous improvements to eliminate the use of ODSs listed in the following documents. 1. Annex A, B and list of transitional substances of the Montreal Protocol and the London Amendments respectively 2. Class I and II ozone depleting substances in the Clean Air Act Amendments of 199 by the Environmental Protection Agency (EPA) in the USA 3. Council Decision 88/54/EEC and 91/69/EEC Annex A, B and C (transitional substances) respectively. TEMIC can certify that our semiconductors are not manufactured with ozone depleting substances and do not contain such substances. We reserve the right to make changes to improve technical design and may do so without further notice. Parameters can vary in different applications. All operating parameters must be validated for each customer application by the customer. Should the buyer use TEMIC products for any unintended or unauthorized application, the buyer shall indemnify TEMIC against all claims, costs, damages, and expenses, arising out of, directly or indirectly, any claim of personal damage, injury or death associated with such unintended or unauthorized use. TEMIC TELEUNKEN microelectronic GmbH, P.O.B. 3535, D-7425 Heilbronn, Germany Telephone: 49 () , ax number: 49 () (5)

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