Only very few MEMS foundries can go all. the way from concept design to marketable. products. In the field of Micro-Electro-

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1 FRAUNHOFER INSTITUTe FoR Photonic Microsystems IPMS MEMS Technologies Dresden MEMS Clean Room The Fraunhofer IPMS offers its customers a m² ( ft²) clean room equipped with state of the art tools. Its infrastructure as well as our three-shift work organization follow latest industry standards. Facilities and processes are certified for the development and fabrication of microsystems according to Class 4 per ISO , or Class 10 per U.S. standard 209E ISO 9001:2008. It allows flexible manufacturing concepts and is configured for the demands of future machine generations. Only very few MEMS foundries can go all the way from concept design to marketable products. In the field of Micro-Electro- (Opto)-Mechanical Systems (MEMS & MOEMS) the Fraunhofer Institute for Photonic Microsysstems provides foundry services for individual steps in the process or for technology modules but at the same time also covers the whole value chain from technology and product development to pilot-fabrication. Our services comprise feasibility studies, simulations of critical parameters and process flows, design, single process development and prototyping to to low/ medium volume production. These include complete electrical and nonelectrical tests and reliability examinations as well as the characterization of microsystems. Beside our know-how in the field of micro scanning mirrors and spatial light modulators we provide broad expertise in manufacturing of standard MEMS such as pressure sensors, photo diodes, ion sensitive field effect transistors and back end for IR thermopiles.

2 Services at a glance At the Fraunhofer IPMS our customers benefit from both extensive R&D and fabrication know-how and our expertise in a great variety of different fields of application. Scanning mirrors and spatial light modulators are examples for successful cooperation with industry partners. Pressure sensors for the automotive industry or photo diodes are manufactured for years in our clean room. Feasibility study and simulation for MEMS products and processes Process development (6, CMOS compatible) ASIC design & layout Complete analog, digital and mixed-signal design & simulation Integration of actuators and sensors MEMS-on-CMOS OLED-on-CMOS Tools: cadence MEMS design & layout In-depth know-how in physical domain simulation Reduced order models Tools: ANSYS, COMSOL, MATLAB, SIMULINK, MATHEMATICA, CADENCE Pilot-fabrication for complete MEMS products Characterization, test & reliability Electrical (analog, mixed signal) Non electrical (mechanical, optical) Physical parameter extraction Customer benefits Comprehensive competencies in surface and bulk micromachining One-stop-shop for your individual requirements along the entire value chain State-of-the-art clean room facility with fabrication capabilities reaching from small batches up to pilot production capacity Intensive support of manufacturing processes and running products by our experienced engineering staff in a three shift work organization System design and integration Foundry services for individual processes or sequences

3 Capabilities Service Details Specific application Deposition, Diffusion, Oxidation PE-CVD Undoped and doped SiO 2 (phosphorous, boron) Undoped and doped a-si:h (phosphorous, boron) Silicon nitride Passivation, membranes LP-CVD Poly-silicon Trench fill, sacrificial layer Silicon oxide, oxinitride Isolator, membranes Silicon nitride, low stress silicon nitride (200 MPa) Dielectrical layer, membranes, masking layer PVD Sputtering Al, AlSiCu, Ti, TiN Interconnections Ta, Ta 2 O 5, HfO 2 Chemical Sensors, dielectrical barriers and layers Al, TiAl, Al-Alloys Mirror, hinges SiO 2, Al 2 Optical coatings, barriers a-si Sacrificial layer Evaporation Al, SiO 2, Al 2 Oxidation Thermal, SiO 2 Etching Dry Etch Metal etch Al / Al alloys Dielectrics & polysilicon etch SiO 2, Si 3 N 4, PolySi, a-si Deep silicon etch (Bosch process) Fine deep trenches with high aspect ratio up to 25:1 (e.g. isolation trenches, free movable Si structures) Deep holes in silicon (e.g. sliced membranes) Release techniques (SiO 2, a-si) Surface micromachining (sticking free release of microstructures) with high selectivity to Al / Al alloys Wet Etch Bonding & Dicing Silicon oxide (NH 4 F-buffered HF) Silicon nitride (phosphoric acid) Aluminum (phosphoric & acetic acid) Anisotropic Si etch (TMAH, KOH) RCA clean Grooves, membranes Anodic and Adhesive Wafer Bonding Wafer Dicing Metrology & Inspection Film Thickness Measurement Scanning Electron Microscope Atomic Force Microscope Ellipsometer X-Ray Diffractometer White Light Interferometer Lithography Glass (Pyrex, Borofloat)-silicon compound Dicing of glass-silicon-compound Pressure Sensors Spin Coating Resists, polyimide, BCB Sacrificial layer, passivation, patterning Spray Coating Lithography in deep structures Nano Imprinting Nikon Stepper Technology iline (365 nm), 1:5 projection technique Double-side Mask Aligner Contact, proximity Front & back side wafer preparation Lift-off Technology Surface and stack planarization CMP Si, SiO 2, polymers

4 Piezo resistors Silicon frame Silicon diaphragm Pyrex glass with drill hole Bond surface Manufacturing Technologies Fraunhofer IPMS develops for its customers micro-electromechanical systems (MEMS) and micro-optoelectromechanical systems (MOEMS), products and technologies. In these growing fields of technology we use our existing technological capabilities for bulk MEMS, surface MEMS and the monolithic integration of CMOS and MEMS/MOEMS. Our work is performed in a state-of-the-art MEMS clean room, capable of handling 150 mm wafers. Bulk Micromachining With bulk micromachining we create threedimensional structures out of the single crystalline silicon substrate (the bulk) of the wafer. These structures are trenches, bars, membranes etc., moveable and electrically isolated. The wafer front side is processed with CMOS compatible processes, the backside of the wafer will be processed and structured as well. The position of the backside structures have to be aligned to the front side in order to release the bulk structures. Our front side key process is DSE (deep silicon etch) - the so-called Bosch process. On the backside we master the wet KOH or TMAH etch as well as the DSE process. As a result cavities are generated on the backside and the structures on the Surface Micromachining In surface micromachining we generate structures on the surface of the wafer. This allows the monolithic integration of a CMOS device (which we process first) and after that an actor or sensor is fabricated on top of the CMOS layer. Moveable parts are created by depositing the sensor/actuator material on top of a sacrificial layer, which is later to be removed (sacrificial etch) in order to release the actor/ sensor structures. With the implementation of inorganic sacrificial layers (amorphous silicon or SiO 2 ) we are going towards standardization of MEMS technologies in this field. Therefore compatibility is increased and more complex structures are possible. front side are released.

5 Equipment Lithography Stepper NSR-2205i 14E2 Nikon Mask Aligner MA 150 BSA SUSS Nano Imprinting Stepper NPS 300 SET Coater / Dev-l-line SK-80BW-AVP DNS Spin Coater (Polyimide, BCB) Gamma 80 Spin Coater SUSS Spray Coater (High topology) Gamma 80 Alta Spray Coater SUSS Spray Coater (High topology) EV101 EVG UV-Stabilizer Fusion 200 PCU Polo Axcelis Deposition PE-CVD / SA-CVD (USG, PSG, BPSG, Silicon nitride, Centura Applied Materials a-si:h) LP-CVD (Poly-Si, SR nitride, TEOS, Oxynitride) E1550 HAT Centroterm ALD atomic layer deposition (Al 2 ) P-300 Picosun PVD Sputtering (Al, TiAl, SiO 2, Al 2, a-si, HfO 2 ) CS400 Von Ardenne PVD Sputtering (Al, AlSiCu, Ti, TiN) Sigma 204 Aviza PVD Sputtering (Ta, Ta 2 O 5, HfO 2 ) Alcatel 610 Alcatel Evaporation (Al, SiO 2 ) PLS 570 Balzers Furnaces Horizontal Furnace Anneal Inotherm Horizontal Furnace Oxide Inotherm Horizontal Furnace POCl 3 Doping Inotherm Horizontal Furnace Reflow Inotherm RTA Heatpuls 8108 Metron Dry Etch Etch (Oxide, Nitride, Poly-Si, Deep Si) Omega fxp Aviza Etch (Al alloys) TCP 9600 LAM Etch (Deep Si) Omega i2l Aviza Resist Strip BobCat 208S Axcelis Resist Strip Plasma System 300 PVA Tepla Resist Strip (on-strip) Type1 Matrix Wet Etch and Cleaning Wet Etch (Silicon oxide, Silicon nitride, Al) Ramgraber Wet Etch (Anisotropic Si: TMAH, KOH) Ramgraber Wet Strip Solvent Spray Tool Semitool Wafer Cleaning Ramgraber Cleaning Processor (High velocity spray, Scrubber) 3300ML SSEC Nanospray, Brush, Bevel Brush SS-80BW-AVR DNS Chemical Mechanical Polishing (CMP) CMP (Silicon oxide, Polyimide, a-si) MIRRA Applied Materials CMP (Silicon oxide, Poly-Si, a-si) ntrepid Strasbaugh Scrubber DSS 200 On Track LAM Vapor Etch for MEMS Release Si Vapor Etch (XeF 2 ) X-SYS-3B:6 Xactix SiO 2 Vapor Etch (HF) MEMS-CET system Primaxx Analysis / Metrology Film Thickness Measurement System NanoSpec 9100 and 8000 X Nanometrics Defect Inspection Compass Pro Applied Materials Defect Classification (optical review) INS3000 Leica Surface Profiler P16+ KLA-Tencor Scanning Electron Microscope JSM-6700F Jeol Atomic Force Microscope Nanoscope D3100 Veeco Ellipsometer VB-400 Woollam X-Ray Diffractometer D5000 Siemens Surfscan Particle Inspection Analyzer Surfscan 4500 / 6220 KLA-Tencor Scanning Near-field Microscope SNOM MV4000 Nanonics FTIR Microspectroscopy System FTIR6700+Continuum ThermoFischer Tunable Diode Laser System TLB6200 NewFocus White-light Interferometer NT8000 Wyko Veeco White-light Interferometer NT1100, NT9800, NT2000 Veeco Analysis / Metrology (cont.) White-light Interferometer NV7300 Zygo Surface Scan µscan Nanofocus Vibrometer MSV 300 Polytec Twymen-Green Interferometer µphase Fisba Packaging Wafer Saw DAD 651 Disco Bonder (Anodic and adhesive bonding) SB6e SUSS Bond Aligner BA6 SUSS Dispenser Schiller Wafer handling & logistics Wafer Marking WMII Innolas Wafer Sorter CTS 2015 SPS Test and Characterization Mixed-Signal Tester M3650, M3670-Falcon SZ Testsysteme Sensor Actuator Test System AP200 SUSS Automatic Inspection System PA200 SUSS Electro-optical Test and Characterization System AP300 SUSS Wafer Prober 6 / 8 EG4900µ EG Systems

6 FRAUNHOFER INSTITUTe FoR Photonic Microsystems IPMS Fraunhofer IPMS Profile The Fraunhofer IPMS with its 300 employees is dedicated to applied research and development at the highest international level in the fields of photonic microsystems, microsystems technologies, nanoelectronic technologies and wireless microsystems. Innovative processes and products which are based upon our various technologies can be found in all large markets such as information and communication technologies, consumer products, automobile technology, semi-conductor technology, measurement and medical technology. Direct commissions from industry contribute 50 percent to the annual research budget of 30 million euros. Regarding micromechanical and photonic microsystems we offer complete solutions: From conception to component right up to complete systems. This includes sample and pilot fabrication in our 1500 m² (15,000 ft²) clean room (ISO class 4) with qualified processes. Additionally, our new business unit Center Nanoelectronic Technologies CNT provides services in the field of nano and micro electronics with functional electronic materials, processes and systems, device and integration, maskless lithography and analytics. Fraunhofer Institute for Photonic Microsystems IPMS Maria-Reiche-Str Dresden Contact Michael Müller +49 (0) michael.mueller@ipms.fraunhofer.de mems-technologies_2014