1.Introduction. Introduction. Most of slides come from Semiconductor Manufacturing Technology by Michael Quirk and Julian Serda.

Save this PDF as:
 WORD  PNG  TXT  JPG

Size: px
Start display at page:

Download "1.Introduction. Introduction. Most of slides come from Semiconductor Manufacturing Technology by Michael Quirk and Julian Serda."

Transcription

1 .Introduction If the automobile had followed the same development cycle as the computer, a Rolls- Royce would today cost $00, get one million miles to the gallon and explode once a year Most of slides come from Semiconductor Manufacturing Technology by Michael Quirk and Julian Serda Introduction

2 outline Course Introduction a brief history Design Metrics DIC characteristics Design partitioning/cmos logic Semiconductor processing

3 Semiconductor processing Semiconductor fabrication Layout fundamental Semiconductor testing Semiconductor assembling

4 Different Electrical Tests for IC Production (From Design Stage to Packaged IC) Test Stage of IC Manufacture Wafer- or Chip-Level IC Design Verification Pre-Production Wafer level In-Line Parametric Test Wafer fabrication Wafer level Wafer Sort (Probe) Wafer fabrication Wafer level Burn-In Reliability Final Test Packaged IC Packaged IC Packaged chip level Packaged chip level Test Description Characterize, debug and verify new chip design to insure it meets specifications. Production process verification test performed early in the fabrication cycle (near front-end of line) to monitor process. Product functional test to verify each die meets product specifications. ICs powered up and tested at elevated temperature to stress product to detect early failures (in some cases, reliability testing is also done at the wafer level during in-line parametric testing). Product functionality test using product specifications. 4/57

5 Automated Electrical Tester 5/57

6 Wafer Fab Process Flow with Test Wafer Fabrication (front-end) Wafer start Thin Films Polish Unpatterned wafer Completed wafer Diffusion Photo Etch Test/Sort Implant 6/57

7 Wafer Test In-line Parametric Test (a.k.a. wafer electrical test, WET) In-line test structure In-line test type In-line test data explain In-line test equipment Scribe line with monitor test structures 7/57

8 In-line Parametric Test Systems Probe card interface Wafer positioning Tester instrumentation Computer as host or server/network Instrumentation Electronic interface Computer Probe card Wafer positioning (X, Y, Z, q) q-z stage X-Y stage 8

9 Probe Card for Automatic Tester 9/57

10 Examples of Test Structure Test Structure Discrete transistors Various line widths Box in a box Serpentine structure over oxide steps Resistivity structure Capacitor array structure Contact or via string Fault Measurement Leakage current, breakdown voltage, threshold voltage and effective channel length Critical dimensions Critical dimensions and overlay registration Continuity and bridging Film thickness Insulator materials and oxide integrity Contact resistance and connections 0/57

11 Data Trends The same die location keeps failing a parameter on a wafer. The same parameter is consistently failing on different wafers. There is excessive variation (e.g., > 0%) in measurement data from wafer to wafer. Lot-to-lot failure for the same parameter, indicating a major process problem. /57

12 Wafer Sort Wafer Sort (a.k.a. wafer probe) DC testing Output checking Function testing The Objectives of Wafer Sort Chip functionality: verify the operation of all chip functions to insure only good chips are sent to the next IC manufacturing stage of assembly and packaging. Chip sorting: sort good chips based on their operating speed performance (this is done by testing at several voltages and varying timing conditions). Fab yield response: Provide important fab yield information to assess and improve the performance of the overall fabrication process. Test coverage: Achieve high test coverage of the internal device nodes at the lowest cost. 2/57

13 Wafer Bin Map with Bin Failures Device: Example Lot: Example Wafer: 200 mm Layer: Hardware Bins Yield: 79.54% Good: 70 Total: Good Bad /57

14 Reduced Partial Die on Large Wafer 0.8% partial die 4.5% partial die 200 mm 300 mm 4/57

15 DRAM Probe Yield, After Repair Reduced Time to Product Maturity for DRAM Production R&D 256 Mb Pilot Line Full Production Mb 256 Kb 60 4 Mb 64 Kb Mb 6 Mb Year 5/57

16 Semiconductor processing Semiconductor fabrication Layout fundamental Semiconductor testing Semiconductor assembling

17 Packaging Requirements Electrical: Low parasitics Mechanical: Reliable and robust Thermal: Efficient heat removal Economical: Cheap 7/57

18 Important Functions of IC Packaging Protection from the environment and handling damage. Interconnections for signals into and out of the chip. Physical support of the chip. Heat dissipation. 8/57

19 Traditional Assembly and Packaging Wafer Test and Sort Die Separation Die Attach Wire Bond Plastic Package Final Package and Test 9/57

20 Typical IC Packages Dual in-line package (DIP) Single in-line package (SIP) Thin small outline package (TSOP) Quad flat pack (QFP) Plastic leaded chip carrier (PLCC) Leadless chip carrier (LCC) 20/57

21 Levels of IC Packaging First level packaging: IC packaging Metal leads for mounting onto printed circuit board Leads Pins 2nd level packaging: Printed circuit board assembly Final product assembly: Final assembly of circuit boards into system Surfacemount chips are soldered on top of tinned pads on the PCB. Pins are inserted into holes then soldered on rear of PCB. Edge connector plugs into main system. PCB subassembly Main electronics assembly board 2/57

22 Traditional Assembly Wafer preparation (backgrind) Die separation Die attach Wire bonding 22/57

23 Schematic of the Backgrind Process Downforce Rotating and oscillating spindle Wafer on rotating chuck Table rotates only during indexing of wafers 23/57

24 Wafer Saw and Sliced Wafer Wafer Stage Blade 24/57

25 Typical Leadframe for Die Attach Leadframe Lead Die Plastic DIP 25/57

26 Epoxy Die Attach Die Epoxy Leadframe 26/57

27 Wires Bonded from Chip Bonding Pads to Leadframe Bond wire Bonding pad Die Moulding compound Leadframe Pin tip 27/57

28 Wirebonding Chip to Leadframe 28/57

29 Traditional Packaging Plastic Packaging Ceramic Packaging TO-Style Metal Package(old) 29/57

30 General package mode Plastic Dual In-Line Package (DIP) for Pin-In-Hole (PIH)970s-980s Single In-Line Package (SIP), decreasing capacity and cost Memory application Thin Small Outline Package (TSOP) Memory and smartcard Single In- Line Memory Module (SIMM) 30/57

31 General package mode Quad Flatpack (QFP) with Gull Wing Surface Mount Leads Plastic Leaded Chip Carrier (PLCC) with J-Leads for Surface Mount Leadless Chip Carrier (LCC) Laminated Refractory Ceramic Process Sequence Ceramic interconnect layers 4-layer laminate 3/57

32 Advanced Packaging Flip chip Ball grid array (BGA) Chip on board (COB) Tape automated bonding (TAB) Multichip modules (MCM) Chip scale packaging (CSP) Wafer-level packaging 32/57

33 Advanced Packaging Flip Chip Package Connecting pin Substrate Via Metal interconnection Silicon chip older bump Chip Epoxy Solder bump on bonding pad Flip chip bump area array Flip Chip Area Array Solder Bumps Versus Wirebond Bonding pad perimeter array Substrate 33/57

34 Ball Grid Array Molded cover Wire Bonding pad Chip Epoxy Substrate Metal via Solder ball Thermal via 34/57

35 Multichip Module (MCM) Individual die MCM substrate 35/57

36 Summary MOS Transistors are stack of gate, oxide, silicon Can be viewed as electrically controlled switches Build logic gates out of switches Draw masks to specify layout of transistors Using different packaging&assembing tech. to start designing schematics and layout for a simple chip! 36/57

Preface xiii Introduction xv 1 Planning for surface mount design General electronic products 3 Dedicated service electronic products 3 High-reliability electronic products 4 Defining the environmental

More information

0.08 to 0.31 mils. IC Metal Interconnect. 6 mils. Bond Wire. Metal Package Lead Frame. 40 mils. PC Board. Metal Trace on PC Board 18507

0.08 to 0.31 mils. IC Metal Interconnect. 6 mils. Bond Wire. Metal Package Lead Frame. 40 mils. PC Board. Metal Trace on PC Board 18507 3 PACKAGING Packaging the IC chip is a necessary step in the manufacturing process because the IC chips are small, fragile, susceptible to environmental damage, and too difficult to handle by the IC users.

More information

COMPONENT ID CERTIFICATION TEST (DVD-64C)

COMPONENT ID CERTIFICATION TEST (DVD-64C) v2.0 This test consists of fifty multiple-choice questions. All questions are from the IPC Component Identification training video (DVD-64C). Each question has only one most correct answer. Circle the

More information

Ball Grid Array (BGA) Technology

Ball Grid Array (BGA) Technology Chapter E: BGA Ball Grid Array (BGA) Technology The information presented in this chapter has been collected from a number of sources describing BGA activities, both nationally at IVF and reported elsewhere

More information

CIRCUITS AND SYSTEMS- Assembly and Printed Circuit Board (PCB) Package Mohammad S. Sharawi ASSEMBLY AND PRINTED CIRCUIT BOARD (PCB) PACKAGE

CIRCUITS AND SYSTEMS- Assembly and Printed Circuit Board (PCB) Package Mohammad S. Sharawi ASSEMBLY AND PRINTED CIRCUIT BOARD (PCB) PACKAGE ASSEMBLY AND PRINTED CIRCUIT BOARD (PCB) PACKAGE Mohammad S. Sharawi Electrical Engineering Department, King Fahd University of Petroleum and Minerals Dhahran, 31261 Saudi Arabia Keywords: Printed Circuit

More information

Wafer Level Testing Challenges for Flip Chip and Wafer Level Packages

Wafer Level Testing Challenges for Flip Chip and Wafer Level Packages Wafer Level Testing Challenges for Flip Chip and Wafer Level Packages by Lim Kok Hwa and Andy Chee STATS ChipPAC Ltd. 5 Yishun Street 23, Singapore 768442 kokhwa.lim@statschippac.com; kenghwee.chee@statschippac.com

More information

Making of a Chip Illustrations

Making of a Chip Illustrations Making of a Chip Illustrations 22nm 3D/Trigate Transistors Version January 2012 1 The illustrations on the following foils are low resolution images that visually support the explanations of the individual

More information

Chapter 1 Introduction to The Semiconductor Industry 2005 VLSI TECH. 1

Chapter 1 Introduction to The Semiconductor Industry 2005 VLSI TECH. 1 Chapter 1 Introduction to The Semiconductor Industry 1 The Semiconductor Industry INFRASTRUCTURE Industry Standards (SIA, SEMI, NIST, etc.) Production Tools Utilities Materials & Chemicals Metrology Tools

More information

INTERNATIONAL ATOMIC ENERGY AGENCY INSTRUMENTATION UNIT SMD (SURFACE MOUNTED DEVICES) REPAIR S. WIERZBINSKI FEBRUARY 1999

INTERNATIONAL ATOMIC ENERGY AGENCY INSTRUMENTATION UNIT SMD (SURFACE MOUNTED DEVICES) REPAIR S. WIERZBINSKI FEBRUARY 1999 (SURFACE MOUNTED DEVICES) REPAIR S. WIERZBINSKI FEBRUARY 1999 (SURFACE MOUNTED DEVICES) REPAIR 1 TABLE OF CONTENTS PAGE 1. INTRODUCTION 3 2. ADVANTAGES 4 3. LIMITATIONS 4 4. DIALECT 5 5. SIZES AND DIMENSIONS

More information

Layout, Fabrication, and Elementary Logic Design

Layout, Fabrication, and Elementary Logic Design Introduction to CMOS VLSI Design Layout, Fabrication, and Elementary Logic Design Adapted from Weste & Harris CMOS VLSI Design Overview Implementing switches with CMOS transistors How to compute logic

More information

What is surface mount?

What is surface mount? A way of attaching electronic components to a printed circuit board The solder joint forms the mechanical and electrical connection What is surface mount? Bonding of the solder joint is to the surface

More information

Objective. Testing Principle. Types of Testing. Characterization Test. Verification Testing. VLSI Design Verification and Testing.

Objective. Testing Principle. Types of Testing. Characterization Test. Verification Testing. VLSI Design Verification and Testing. VLSI Design Verification and Testing Objective VLSI Testing Mohammad Tehranipoor Electrical and Computer Engineering University of Connecticut Need to understand Types of tests performed at different stages

More information

Lecture 23 MEMS Packaging. Department of Mechanical Engineering

Lecture 23 MEMS Packaging. Department of Mechanical Engineering Lecture 23 MEMS Packaging MEMS Packaging A simplified process flow for MEMS Packaging MEMS Packaging Key Design and Packaging consideration Wafer or wafer-stack thickness Wafer Dicing concerns Thermal

More information

Designing with High-Density BGA Packages for Altera Devices

Designing with High-Density BGA Packages for Altera Devices 2014.12.15 Designing with High-Density BGA Packages for Altera Devices AN-114 Subscribe As programmable logic devices (PLDs) increase in density and I/O pins, the demand for small packages and diverse

More information

Chip-on-board Technology

Chip-on-board Technology Hybrid Technology The trend in electronics is to continue to integrate more and more functions and numbers of components into a single, smaller assembly. Hybrid circuit technology is a key method of increasing

More information

High Volume Assembly & Test Solutions To Meet The Rapidly Growing MEMS Market. Enabling a Microelectronic World

High Volume Assembly & Test Solutions To Meet The Rapidly Growing MEMS Market. Enabling a Microelectronic World High Volume Assembly & Test Solutions To Meet The Rapidly Growing MEMS Market Enabling a Microelectronic World MEMS & IC Package Comparison MEMS Package Relative Growth MEMS package market is now growing

More information

Dual Integration - Verschmelzung von Wafer und Panel Level Technologien

Dual Integration - Verschmelzung von Wafer und Panel Level Technologien ERÖFFNUNG DES INNOVATIONSZENTRUMS ADAPTSYS Dual Integration - Verschmelzung von Wafer und Panel Level Technologien Dr. Michael Töpper BDT Introduction Introduction Why do we need such large machines to

More information

PCN Structure FY 13/14

PCN Structure FY 13/14 PCN Structure FY 13/14 A PCN FY 13/14 PCN text FY 13/14 QMS FY 12/14 Front End Materials A0101 Process Wafers CZ 150 mm CQT A0102 Process Wafers CZ 200 mm CQT A0103 Process Wafers FZ 150 mm CQT A0104 Process

More information

Flip Chip Package Qualification of RF-IC Packages

Flip Chip Package Qualification of RF-IC Packages Flip Chip Package Qualification of RF-IC Packages Mumtaz Y. Bora Peregrine Semiconductor San Diego, Ca. 92121 mbora@psemi.com Abstract Quad Flat Pack No Leads (QFNs) are thermally enhanced plastic packages

More information

PCB Layout Recommendations for Leaded Packages

PCB Layout Recommendations for Leaded Packages October 2013 Technical Note TN1257 Introduction This document provides general PCB layout guidance for Lattice QFP (Quad Flat Package) and QFN (Quad Flat No Lead) products. Table 1 below lists the common

More information

Adapters - Overview. Quick-Turn Solutions for IC Supply Issues

Adapters - Overview. Quick-Turn Solutions for IC Supply Issues Adapters - Overview BGA to BGA Adapter BGA to PGA BGA to QFP BGA to BGA QFP to BGA SMT to DIP SMT to SMT PGA to PGA BGA to QFP Adapter with VR using FlexFrame Interconnect TSOP Adapter Packaged Die to

More information

Digital VLSI design. Lecture 2: Complementary Metal Oxide Semiconductor (CMOS) Chips

Digital VLSI design. Lecture 2: Complementary Metal Oxide Semiconductor (CMOS) Chips Digital VLSI design Lecture 2: Complementary Metal Oxide Semiconductor (CMOS) Chips What will we learn? How integrated circuits work How to design chips with millions of transistors Ways of managing the

More information

ELECTRONIC COMPONENTS, PACKAGING AND PRODUCTION

ELECTRONIC COMPONENTS, PACKAGING AND PRODUCTION ELECTRONIC COMPONENTS, PACKAGING AND PRODUCTION by Leif Halbo and Per Ohlckers University of Oslo 1995 ISBN 82-992193-2-9 ELECTRONIC COMPONENTS, PACKAGING AND PRODUCTION Copyright: Professor Leif Halbo

More information

Analysis of Factors that Affect Yield in SMT Assembly. 1.0 Introduction

Analysis of Factors that Affect Yield in SMT Assembly. 1.0 Introduction Analysis of Factors that Affect Yield in SMT Assembly Edward Kamen, Alex Goldstein, Orapin Asarangchai, Georgia Institute of Technology Allan Fraser, Kyle Klatka, GenRad, Inc. Joe Belmonte, Speedline/MPM

More information

Leistungselektronik in der Leiterplatte

Leistungselektronik in der Leiterplatte Leistungselektronik in der Leiterplatte Andreas Ostmann Fraunhofer IZM Gustav-Meyer-Allee 25, 13355 Berlin, Germany email: 10. AT&S Technologieforum 9. - 10. Oktober 2013, Graz Inhalt Einleitung Einbettung

More information

DirectFET TM - A Proprietary New Source Mounted Power Package for Board Mounted Power

DirectFET TM - A Proprietary New Source Mounted Power Package for Board Mounted Power TM - A Proprietary New Source Mounted Power Package for Board Mounted Power by Andrew Sawle, Martin Standing, Tim Sammon & Arthur Woodworth nternational Rectifier, Oxted, Surrey. England Abstract This

More information

Failure Analysis (FA) Introduction

Failure Analysis (FA) Introduction Failure Analysis (FA) Introduction (III - Reliability ) Tung-Bao Lu 1 of 23 Reliability Stress Stress Reliability Geberal Condition Temperature Humidity Electrical Others Precondition Baking/L3/Reflowing

More information

Attachment A Whitepaper on Semiconductor Die and Packaging

Attachment A Whitepaper on Semiconductor Die and Packaging Introduction to SIA and Semiconductors Attachment A Whitepaper on Semiconductor Die and Packaging The Semiconductor Industry Association (SIA), represents U.S. leadership in semiconductor manufacturing

More information

AN900 APPLICATION NOTE

AN900 APPLICATION NOTE AN900 APPLICATION NOTE INTRODUCTION TO SEMICONDUCTOR TECHNOLOGY INTRODUCTION by Microcontroller Division Applications An integrated circuit is a small but sophisticated device implementing several electronic

More information

5W X-Band GaN Power Amplifier Using a Commercially Available Discrete Plastic Packaged SMT Transistor

5W X-Band GaN Power Amplifier Using a Commercially Available Discrete Plastic Packaged SMT Transistor Sheet Code RFi0612 White Paper 5W X-Band GaN Power Amplifier Using a Commercially Available Discrete Plastic Packaged SMT Transistor This paper describes the design of a single stage 5W X-Band GaN Power

More information

MMIC Design and Technology. Fabrication of MMIC

MMIC Design and Technology. Fabrication of MMIC MMIC Design and Technology Fabrication of MMIC Instructor Dr. Ali Medi Substrate Process Choice Mobility & Peak Velocity: Frequency Response Band-Gap Energy: Breakdown Voltage (Power-Handling) Resistivity:

More information

VLSI Design Verification and Testing

VLSI Design Verification and Testing VLSI Design Verification and Testing Instructor Chintan Patel (Contact using email: cpatel2@cs.umbc.edu). Text Michael L. Bushnell and Vishwani D. Agrawal, Essentials of Electronic Testing, for Digital,

More information

TEST SOLUTIONS CONTACTING - SEMICONDUCTOR

TEST SOLUTIONS CONTACTING - SEMICONDUCTOR ENGINEERED TO CONNECT CONTACTING - SEMICONDUCTOR TEST SOLUTIONS SPECIFICATIONS AND DRAWINGS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE - DIMENSIONS IN MILLIMETER CONTACTING - SEMICONDUCTOR 3 SEries

More information

POWER FORUM, BOLOGNA 20-09-2012

POWER FORUM, BOLOGNA 20-09-2012 POWER FORUM, BOLOGNA 20-09-2012 Convertitori DC/DC ad alta densità di potenza e bassa impedenza termica. Massimo GAVIOLI. Senior Field Application Engineer. Intersil SIMPLY SMARTER Challenges when Designing

More information

Lecture 22: Integrated circuit fabrication

Lecture 22: Integrated circuit fabrication Lecture 22: Integrated circuit fabrication Contents 1 Introduction 1 2 Layering 4 3 Patterning 7 4 Doping 8 4.1 Thermal diffusion......................... 10 4.2 Ion implantation.........................

More information

Mounting Instructions for SP4 Power Modules

Mounting Instructions for SP4 Power Modules Mounting Instructions for SP4 Power Modules Pierre-Laurent Doumergue R&D Engineer Microsemi Power Module Products 26 rue de Campilleau 33 520 Bruges, France Introduction: This application note gives the

More information

MATERIAL IDENTIFICATION IN ELECTRONICS

MATERIAL IDENTIFICATION IN ELECTRONICS MATERIAL IDENTIFICATION IN ELECTRONICS Wesley Van Meensel 1, Geert Willems 1, Maarten Cauwe 2 1 Center for Electronics Design & Manufacturing, imec IClink, imec, Kapeldreef 75, 3001 Leuven, Belgium 2 Centre

More information

Temporary Bond Material and Process: Survey Drivers and Reference Flow

Temporary Bond Material and Process: Survey Drivers and Reference Flow Accelerating the next technology revolution Temporary Bond Material and Process: Survey Drivers and Reference Flow SEMICON WEST Temporary Bonding Workshop July 11th, 2011 Sitaram Arkalgud / MJ Yim Copyright

More information

MA4AGSW8-2. SP8T AlGaAs PIN Diode Switch Rev. V2 CHIP LAYOUT FEATURES DESCRIPTION. Absolute Maximum Ratings T AMB = +25 C (Unless Otherwise Noted) 1

MA4AGSW8-2. SP8T AlGaAs PIN Diode Switch Rev. V2 CHIP LAYOUT FEATURES DESCRIPTION. Absolute Maximum Ratings T AMB = +25 C (Unless Otherwise Noted) 1 FEATURES Specified Performance : 50 MHz to 40 GHz Operational Performance: 50 MHz to 50 GHz 2.0 db Typical Insertion Loss at 40 GHz 30 db Typical Isolation at 40 GHz thru 3 Diodes 22 db Typical Isolation

More information

Integrated Circuit Packaging and Thermal Design

Integrated Circuit Packaging and Thermal Design Lezioni di Tecnologie e Materiali per l Elettronica Integrated Circuit Packaging and Thermal Design Danilo Manstretta microlab.unipv.it danilo.manstretta@unipv.it Introduction to IC Technologies Packaging

More information

Interconnecting the next generation of electronics

Interconnecting the next generation of electronics Ormet Circuits Inc. Interconnecting the next generation of electronics Overview Ormet Circuits provides conductive pastes that enable electrical interconnection and thermal management in electronic substrates,

More information

DVD-111C Advanced Hand Soldering Techniques

DVD-111C Advanced Hand Soldering Techniques DVD-111C Advanced Hand Soldering Techniques Below is a copy of the narration for DVD-111C. The contents for this script were developed by a review group of industry experts and were based on the best available

More information

Thermal Load Boards Improve Product Development Process

Thermal Load Boards Improve Product Development Process Thermal Load Boards Improve Product Development Process Bernie Siegal Thermal Engineering Associates, Inc. 2915 Copper Road Santa Clara, CA 95051 USA P: 650-961-5900 F: 650-227-3814 E: bsiegal@thermengr.com

More information

PCB Board Design. PCB boards. What is a PCB board

PCB Board Design. PCB boards. What is a PCB board PCB Board Design Babak Kia Adjunct Professor Boston University College of Engineering Email: bkia -at- bu.edu ENG SC757 - Advanced Microprocessor Design PCB boards What is a PCB board Printed Circuit Boards

More information

FLASHSOLDERING - A NEW PROCESS FOR REFLOW SOLDERING INSULATED MAGNET WIRE TO ELECTRONIC CONTACTS

FLASHSOLDERING - A NEW PROCESS FOR REFLOW SOLDERING INSULATED MAGNET WIRE TO ELECTRONIC CONTACTS FLASHSOLDERING - A NEW PROCESS FOR REFLOW SOLDERING INSULATED MAGNET WIRE TO ELECTRONIC CONTACTS David W. Steinmeier microjoining Solutions & Mike Becker Teka Interconnection Systems Abstract: Flashing

More information

Intel 266MHz 32-Bit Pentium II (Klamath) Processor

Intel 266MHz 32-Bit Pentium II (Klamath) Processor Construction Analysis Intel 266MHz 32-Bit Pentium II (Klamath) Processor Report Number: SCA 9706-542 Global Semiconductor Industry the Serving Since 1964 15022 N. 75th Street Scottsdale, AZ 85260-2476

More information

Winbond W2E512/W27E257 EEPROM

Winbond W2E512/W27E257 EEPROM Construction Analysis Winbond W2E512/W27E257 EEPROM Report Number: SCA 9703-533 Global Semiconductor Industry the Serving Since 1964 15022 N. 75th Street Scottsdale, AZ 85260-2476 Phone: 602-998-9780 Fax:

More information

AN PCB layout guidelines for NXP MCUs in BGA packages. Document information. Keywords

AN PCB layout guidelines for NXP MCUs in BGA packages. Document information. Keywords Rev. 2 15 April 2011 Application note Document information Info Keywords Abstract Content LPC175x, LPC176x, LPC177x, LPC178x, LPC181x, LPC182x, LPC183x, LPC185x, LPC431x, LPC432x, LPC433x, LPC435x, LPC2220,

More information

DVD-8C Print Reading For Electronics Assembly

DVD-8C Print Reading For Electronics Assembly DVD-8C Print Reading For Electronics Assembly Below is a copy of the narration for DVD-8C. The contents for this script were developed by a review group of industry experts and were based on the best available

More information

Suggested PCB Land Pattern Designs for Leaded and Leadless Packages, and Surface Mount Guidelines for Leadless Packages

Suggested PCB Land Pattern Designs for Leaded and Leadless Packages, and Surface Mount Guidelines for Leadless Packages APPLICATION NOTE Suggested PCB Land Pattern Designs for Leaded and Leadless Packages, and Surface Mount Guidelines for Leadless Packages Introduction This Application Note provides sample PCB land pattern

More information

January 1999, ver. 3 Application Note 80. 1 Burn-in sockets are zero-insertion-force (ZIF) sockets that do not deform a device s leads.

January 1999, ver. 3 Application Note 80. 1 Burn-in sockets are zero-insertion-force (ZIF) sockets that do not deform a device s leads. Selecting Sockets for Altera Devices January 1999, ver. 3 Application Note 80 Introduction Surface-mount assembly places unique demands on the development and manufacturing process by requiring different

More information

Enpirion Application Note General Enpirion Product QFN Package Soldering Guideline

Enpirion Application Note General Enpirion Product QFN Package Soldering Guideline Enpirion Application Note General Enpirion Product QFN Package Soldering Guideline 1.0 - Introduction Altera ENPIRION power converter packages are designed with a plastic leadframe package technology that

More information

GUIDELINES FOR PRINTED CIRCUIT BOARD ASSEMBLY (PCBA) OF UTAC GROUP S GRID ARRAY PACKAGE (GQFN) AND ITS BOARD LEVEL RELIABILITY

GUIDELINES FOR PRINTED CIRCUIT BOARD ASSEMBLY (PCBA) OF UTAC GROUP S GRID ARRAY PACKAGE (GQFN) AND ITS BOARD LEVEL RELIABILITY GUIDELINES FOR PRINTED CIRCUIT BOARD ASSEMBLY (PCBA) OF UTAC GROUP S GRID ARRAY PACKAGE (GQFN) AND ITS BOARD LEVEL RELIABILITY Kyaw Ko Lwin*, Daniel Ting Lee Teh, Carolyn Epino Tubillo, Jun Dimaano, Ang

More information

Investigation of Components Attachment onto Low Temperature Flex Circuit

Investigation of Components Attachment onto Low Temperature Flex Circuit Investigation of Components Attachment onto Low Temperature Flex Circuit July 2013 Q. Chu, N. Ghalib, H. Ly Agenda Introduction to MIRA Initiative MIRA Manufacturing Platforms Areas of Development Multiphase

More information

Hugh de Lacy - Technical Manager Alun Jones Technical Director Micross Components Ltd., Given at CMSE, Portsmouth 2008

Hugh de Lacy - Technical Manager Alun Jones Technical Director Micross Components Ltd.,  Given at CMSE, Portsmouth 2008 Shrinking Silicon Feature Sizes Consequences for Reliability Hugh de Lacy - Technical Manager Alun Jones Technical Director Micross Components Ltd., www.micross.com Given at CMSE, Portsmouth 2008 1 The

More information

Plastic Package Reliability & Testing

Plastic Package Reliability & Testing Plastic Package Reliability & Testing June 1999, ver. 1 Application Note 113 Introduction Designers expect Altera devices to perform in a variety of environments and conditions. Reliable devices decrease

More information

The Turning of JMP Software into a Semiconductor Analysis Software Product:

The Turning of JMP Software into a Semiconductor Analysis Software Product: The Turning of JMP Software into a Semiconductor Analysis Software Product: The Implementation and Rollout of JMP Software within Freescale Semiconductor Inc. Jim Nelson, Manager IT, Yield Management Systems

More information

A Manufacturing Technology Perspective of: Embedded Die in Substrate and Panel Based Fan-Out Packages

A Manufacturing Technology Perspective of: Embedded Die in Substrate and Panel Based Fan-Out Packages A Manufacturing Technology Perspective of: Embedded Die in Substrate and Panel Based Fan-Out Packages Bernd K Appelt Director WW Business Development April 24, 2012 Table of Content Definitions Wafer Level

More information

11-1. Stick Diagram and Lamda Based Rules

11-1. Stick Diagram and Lamda Based Rules 11-1 Stick Diagram and Lamda Based Rules Mask Layout (Print this presentation in colour if possible, otherwise highlight colours) 11-2 Circuit coloured mask layer layout Coloured stick diagram mask representation

More information

USING MERCURY PROBES TO CHARACTERIZE USJ LAYERS

USING MERCURY PROBES TO CHARACTERIZE USJ LAYERS USING MERCURY PROBES TO CHARACTERIZE USJ LAYERS James T.C. Chen and Wei Liu Four Dimensions, Inc. Hayward, CA 94545 It is well established that uniformity and dosage of drain-source ion implantation on

More information

X. Dealing with Signature Differences

X. Dealing with Signature Differences X. Dealing with Signature Differences One of the most often asked questions that Tracker users ask is "when is a different signature considered a fault?". Simply put, "what makes a bad signature?". To

More information

HOLE PLATING COPPER FOIL ANNULAR RING. Figure 1 A Section Through a Plated Through Hole in a PCB

HOLE PLATING COPPER FOIL ANNULAR RING. Figure 1 A Section Through a Plated Through Hole in a PCB FAQ #5 For Current Source Newsletter #7 Why Not Route Two Traces Between Pins on a 1 mm Pitch BGA? There are applications notes that describe how to save layers in a PCB by routing two traces between pins

More information

QFN Layout Guidelines

QFN Layout Guidelines Yang Boon Quek... Application Report SLOA122 July 2006 QFN Layout Guidelines HPL Audio Power Amplifiers 1 Introduction Board layout and stencil information for most Texas Instruments (TI) Quad Flat No-Lead

More information

SOLDERING, PCB REPAIR & IPC610

SOLDERING, PCB REPAIR & IPC610 SOLDERING, PCB REPAIR & IPC610 COURSE 560: 3 DAYS: Max 8 Candidates This course provides all the skills necessary to work on modern electronic printed circuit boards. It is intended for candidates who

More information

Die Carrier Temporary Reusable Packages. Setting the Standards for Tomorrow

Die Carrier Temporary Reusable Packages. Setting the Standards for Tomorrow Die Carrier Temporary Reusable Packages Setting the Standards for Tomorrow Die Level Burn-in and Test The Need for KGD Historically, semiconductor manufacturers and endusers performed numerous tests on

More information

System in Package Solutions using Fan-Out Wafer Level Packaging Technology

System in Package Solutions using Fan-Out Wafer Level Packaging Technology SEMI Networking Day: Packaging - Key for System Integration System in Package Solutions using Fan-Out Wafer Level Packaging Technology J. Campos; S. Kroehnert; E. O Toole; V. Henriques; V. Chatinho; A.

More information

Recommended method of attaching QFP prototype sockets to a PCB.

Recommended method of attaching QFP prototype sockets to a PCB. Actel provides simple step-by-step assembly flow instructions for attaching QFP and BGA sockets to a PCB. Also included is solder reflow information along with a sample standard reflow temperature profile.

More information

Introduction to VLSI Fabrication Technologies. Emanuele Baravelli

Introduction to VLSI Fabrication Technologies. Emanuele Baravelli Introduction to VLSI Fabrication Technologies Emanuele Baravelli 27/09/2005 Organization Materials Used in VLSI Fabrication VLSI Fabrication Technologies Overview of Fabrication Methods Device simulation

More information

Advanced VLSI Design CMOS Processing Technology

Advanced VLSI Design CMOS Processing Technology Isolation of transistors, i.e., their source and drains, from other transistors is needed to reduce electrical interactions between them. For technologies

More information

Excerpt Direct Bonded Copper

Excerpt Direct Bonded Copper xcerpt irect Bonded Copper Presented by ouglas C. Hopkins, Ph.. 312 Bonner Hall University at Buffalo Buffalo, Y 14620-1900 607-729-9949, fax: 607-729-7129 Authors thank Curamik lectronics A member of

More information

400W MONO/STEREO AMPLIFIER

400W MONO/STEREO AMPLIFIER 400W MONO/STEREO AMPLIFIER Universal, robust and compact are the words to describe this amplifier. Total solder points: 264 Difficulty level: beginner 1 2 3 4 5 advanced K4005B ILLUSTRATED ASSEMBLY MANUAL

More information

Module 3 : Fabrication Process and Layout Design Rules Lecture 12 : CMOS Fabrication Technologies

Module 3 : Fabrication Process and Layout Design Rules Lecture 12 : CMOS Fabrication Technologies Module 3 : Fabrication Process and Layout Design Rules Lecture 12 : CMOS Fabrication Technologies Objectives In this course you will learn the following Introduction Twin Well/Tub Technology Silicon on

More information

Electrolytic Deposition of Fine Pitch Sn/Cu Solder Bumps for Flip Chip Packaging

Electrolytic Deposition of Fine Pitch Sn/Cu Solder Bumps for Flip Chip Packaging Electrolytic Deposition of Fine Pitch Sn/Cu Solder Bumps for Flip Chip Packaging Stephen Kenny, Kai Matejat, Sven Lamprecht and Olivier Mann Atotech Germany Erasmusstrasse 20, 10553 Berlin Germany +49

More information

These help quantify the quality of a design from different perspectives: Cost Functionality Robustness Performance Energy consumption

These help quantify the quality of a design from different perspectives: Cost Functionality Robustness Performance Energy consumption Basic Properties of a Digital Design These help quantify the quality of a design from different perspectives: Cost Functionality Robustness Performance Energy consumption Which of these criteria is important

More information

Introduction to CMOS VLSI Design

Introduction to CMOS VLSI Design Introduction to CMOS VLSI esign Slides adapted from: N. Weste,. Harris, CMOS VLSI esign, Addison-Wesley, 3/e, 24 Introduction Integrated Circuits: many transistors on one chip Very Large Scale Integration

More information

Last Time Buy. Deadline for receipt of LAST TIME BUY orders: April 30, 2011

Last Time Buy. Deadline for receipt of LAST TIME BUY orders: April 30, 2011 Last Time Buy This part is in production but has been determined to be LAST TIME BUY. This classification indicates that the product is obsolete and notice has been given. Sale of this device is currently

More information

The Future of Packaging ~ Advanced System Integration

The Future of Packaging ~ Advanced System Integration The Future of Packaging ~ Advanced System Integration Enabling a Microelectronic World R. Huemoeller SVP, Adv. Product / Platform Develop January 2013 Product Segments End Market % Share Summary 2 New

More information

QPL. Advanced Lead Frame Services From Design to Delivery

QPL. Advanced Lead Frame Services From Design to Delivery QPL Advanced Lead Frame Services From Design to Delivery CORPORATE OVERVIEW Founded in 1982, QPL Limited is a global supplier of lead frames for the semiconductor industry. With headquarters in Hong Kong

More information

Package Information Guide

Package Information Guide Package Information Guide Version 5.0 Scope and Applicability This Package Information Guide presents information about Cirrus Logic product package selection and availability. Related Documents Data books

More information

Data converter chips transform data (information) from one format to another, such from analog to digital.

Data converter chips transform data (information) from one format to another, such from analog to digital. Data Converter Chips Key: SpecSearch (searchable catalogs) available in this product category. Data converter chips transform data (information) from one format to another, such from analog to digital.

More information

Samsung emcp. WLI DDP Package. Samsung Multi-Chip Packages can help reduce the time to market for handheld devices BROCHURE

Samsung emcp. WLI DDP Package. Samsung Multi-Chip Packages can help reduce the time to market for handheld devices BROCHURE Samsung emcp Samsung Multi-Chip Packages can help reduce the time to market for handheld devices WLI DDP Package Deliver innovative portable devices more quickly. Offer higher performance for a rapidly

More information

NBB-402. RoHS Compliant & Pb-Free Product. Typical Applications

NBB-402. RoHS Compliant & Pb-Free Product. Typical Applications Typical Applications Narrow and Broadband Commercial and Military Radio Designs Linear and Saturated Amplifiers 0 RoHS Compliant & Pb-Free Product NBB-402 CASCADABLE BROADBAND GaAs MMIC AMPLIFIER DC TO

More information

The MOSFET Transistor

The MOSFET Transistor The MOSFET Transistor The basic active component on all silicon chips is the MOSFET Metal Oxide Semiconductor Field Effect Transistor Schematic symbol G Gate S Source D Drain The voltage on the gate controls

More information

Printed Circuits. Danilo Manstretta. microlab.unipv.it/ danilo.manstretta@unipv.it. AA 2012/2013 Lezioni di Tecnologie e Materiali per l Elettronica

Printed Circuits. Danilo Manstretta. microlab.unipv.it/ danilo.manstretta@unipv.it. AA 2012/2013 Lezioni di Tecnologie e Materiali per l Elettronica Lezioni di Tecnologie e Materiali per l Elettronica Printed Circuits Danilo Manstretta microlab.unipv.it/ danilo.manstretta@unipv.it Printed Circuits Printed Circuits Materials Technological steps Production

More information

Printed Circuit Boards

Printed Circuit Boards Printed Circuit Boards Luciano Ruggiero lruggiero@deis.unibo.it DEIS Università di Bologna Flusso di progetto di un circuito stampato 1 Specifications Before starting any design, you need to work out the

More information

Definition of OhmegaPly

Definition of OhmegaPly Definition of OhmegaPly OhmegaPly is a thin film Electrodeposited On Copper NiP metal alloy (RESISTOR CONDUCTOR MATERIAL) that is laminated to a dielectric material and subtractively processed to produce

More information

Altoids Tin Headphone Amplifier Lab

Altoids Tin Headphone Amplifier Lab Altoids Tin Headphone Amplifier Lab Michigan State University AEE/IEEE Step 1: Required Parts Table 1 shows a complete listing of the parts required to complete this project. Figure 1 shows a picture of

More information

MA4AGSW8-2. AlGaAs SP8T PIN Diode Switch. Features. MA4AGSW8-2 Layout. Description. Absolute Maximum Ratings 1

MA4AGSW8-2. AlGaAs SP8T PIN Diode Switch. Features. MA4AGSW8-2 Layout. Description. Absolute Maximum Ratings 1 MA4AGSW82 AlGaAs SP8T PIN Diode Switch Features Specified Performance : 50 MHz to 40 GHz Operational performance: 50 MHz to 50 GHz 2.0 Typical Insertion Loss at 40 GHz 30 Typical Isolation at 40 GHz thru

More information

Packaging Challenges for High Speed Analog Devices. Ben Sutton, Matt Romig, Souvik Mukherjee, Sreenivasan Koduri Texas Instruments April 30, 2013

Packaging Challenges for High Speed Analog Devices. Ben Sutton, Matt Romig, Souvik Mukherjee, Sreenivasan Koduri Texas Instruments April 30, 2013 Packaging Challenges for High Speed Analog Devices Ben Sutton, Matt Romig, Souvik Mukherjee, Sreenivasan Koduri Texas Instruments April 30, 2013 1 Agenda What is high speed Analog? What is packaging? Co-design

More information

Automated Contact Resistance Tester CR-2601

Automated Contact Resistance Tester CR-2601 Automated Contact Resistance Tester CR-2601 What s New What s New Summary of Hardware Improvements: The middle Stiffener has been improved and no longer comes in direct contact with the main board thus

More information

Chip-On-Glass (COG) for LCD modules

Chip-On-Glass (COG) for LCD modules Chip-On-Glass (COG) for LCD modules Introduction Abstract: For industrial, automotive, and portable equipment designers, Chip-on-Glass (COG) liquid crystal display (LCD) modules offer many advantages compared

More information

NO CONTENT ON THE ATTACHED DOCUMENT HAS CHANGED OBSOLETE

NO CONTENT ON THE ATTACHED DOCUMENT HAS CHANGED OBSOLETE Analog Devices Welcomes Hittite Microwave Corporation NO CONTENT ON THE ATTACHED DOCUMENT HAS CHANGED www.analog.com www.hittite.com THIS PAGE INTENTIONALLY LEFT BLANK v03.1203 Typical Applications Broadband

More information

PIN IN PASTE APPLICATION NOTE. www.littelfuse.com

PIN IN PASTE APPLICATION NOTE. www.littelfuse.com PIN IN PASTE APPLICATION NOTE 042106 technical expertise and application leadership, we proudly introduce the INTRODUCTION The Pin in Paste method, also called through-hole reflow technology, has become

More information

SURFACE MOUNT NOMENCLATURE AND PACKAGING

SURFACE MOUNT NOMENCLATURE AND PACKAGING SURFACE MOUNT NOMENCLATURE AND PACKAGING Tel 800-776-9888 Email info@topline.tv w w w. t o p l i n e. t v Contents Overview... 3 Flat Chip... 4 MELF Components...10 Tantalum Capacitors.... 12 Transistors

More information

Agenda. Michele Taliercio, Il circuito Integrato, Novembre 2001

Agenda. Michele Taliercio, Il circuito Integrato, Novembre 2001 Agenda Introduzione Il mercato Dal circuito integrato al System on a Chip (SoC) La progettazione di un SoC La tecnologia Una fabbrica di circuiti integrati 28 How to handle complexity G The engineering

More information

Click to edit Master title style Thinking outside of the chip Using co-design to optimize interconnect between IC, Package and PCB.

Click to edit Master title style Thinking outside of the chip Using co-design to optimize interconnect between IC, Package and PCB. Thinking outside of the chip Using co-design to optimize interconnect between IC, Package and PCB John Park Click Current to Over-the-wall edit Master design title process style IC Layout Package design

More information

Good Boards = Results

Good Boards = Results Section 2: Printed Circuit Board Fabrication & Solderability Good Boards = Results Board fabrication is one aspect of the electronics production industry that SMT assembly engineers often know little about.

More information

HARDWARE DESIGN FUNDAMENTALS. George Hadley 2016, Images Property of their Respective Owners.

HARDWARE DESIGN FUNDAMENTALS. George Hadley 2016, Images Property of their Respective Owners. HARDWARE DESIGN FUNDAMENTALS George Hadley 2016, Images Property of their Respective Owners. OUTLINE PCB Design Objective PCB Manufacturing Process Design Automation Tools The Design Process Parts Schematics

More information

Fraunhofer ISIT, Itzehoe 14. Juni 2005. Fraunhofer Institut Siliziumtechnologie (ISIT)

Fraunhofer ISIT, Itzehoe 14. Juni 2005. Fraunhofer Institut Siliziumtechnologie (ISIT) Research and Development centre for Microelectronics and Microsystems Applied Research, Development and Production for Industry ISIT applies an ISO 9001:2000 certified quality management system. Certificate

More information

Specializing in Open Cavity Packages & Complete IC Assembly Services ISO 9001:2008 Certified and ITAR Registered

Specializing in Open Cavity Packages & Complete IC Assembly Services ISO 9001:2008 Certified and ITAR Registered TowerJazz Global Symposium Specializing in Open Cavity Packages & Complete IC Assembly Services and TowerJazz Global Symposium Quik-Pak a division of Delphon Industries 2011 Gold Sponsor and TowerJazz

More information