NUD4011. Low Current LED Driver

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1 NUD0 Low LED Driver This device is designed to replace discrete solutions for driving LEDs in AC/DC high voltage applications (up to 00 V). An external resistor allows the circuit designer to set the drive current for different LED arrays. This discrete integration technology eliminates individual components by combining them into a single package, which results in a significant reduction of both system cost and board space. The device is a small surface mount package (SO). Features Supplies Constant LED for Varying Input Voltages External Resistor Allows Designer to Set up to 0 ma Offered in Surface Mount Package Technology (SO) PbFree Package is Available PIN CONFIGURATION AND SCHEMATIC Benefits Maintains a Constant Light Output During Battery Drain One Device can be used for Many Different LED Products Reduces Board Space and Component Count Simplifies Circuit and System Designs Typical Applications Portables: For Battery Backup Applications, also Simple NiCAD Battery Charging Industrial: General Lighting Applications and Small Appliances Automotive: Tail Lights, Directional Lights, Backup Light, Dome Light PIN FUNCTION DESCRIPTION Pin Symbol Description Positive input voltage to the device This pin may be used to drive an external transistor as described in the App Note AND9/D. An external resistor between and pins sets different current levels for different application needs SO CASE MARKING DIAGRAM 0 AYWW A = Assembly Location Y = Year WW = Work Week = PbFree Package (Note: Microdot may be in either location) ORDERING INFORMATION For high voltage applications (higher than V), pin is connected to the LEDs array. For low voltage applications (lower than V), pin is connected to ground.,,, The LEDs are connected from these pins to ground Device Package Shipping NUD0DR SO 00 / Tape & Reel NUD0DRG SO (PbFree) 00 / Tape & Reel For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD0/D. Semiconductor Components Industries, LLC, 00 June, 00 Rev. Publication Order Number: NUD0/D

2 NUD0 MAXIMUM RATINGS (T A = C unless otherwise noted) Rating Symbol Value Unit Input Voltage 00 V Output 0 ma (For V drop V) (Note ) Output Voltage V out 9 V Human Body Model (HBM) ESD 00 V Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.. V drop = 0. V V LEDs. THERMAL CHARACTERISTICS Characteristic Symbol Value Unit Operating Ambient Temperature T A 0 to C Maximum Junction Temperature T J 0 C Storage Temperature T STG to 0 C Total Power Dissipation (Note ) Derating above C (Figure ) P D. 9.0 W mw/ C Thermal Resistance, Junction to Ambient (Note ) R JA 0 C/W Thermal Resistance, Junction to Lead (Note ) R JL C/W. Mounted on FR board, in sq pad, oz coverage. ELECTRICAL CHARACTERISTICS (T A = C unless otherwise noted) Characteristic Symbol Min Typ Max Unit Output (Note ) ( = 0 Vdc, =, V LEDs = 90 V) Output (Note ) ( = 00 Vdc, =, V LEDs = 0 V) Bias ( = 0 Vdc, = Open, R shunt = 0 k ) ma..0. ma I Bias..0 ma Voltage Overhead (Note ) V over.0 V. Device s pin connected to the LEDs array (as shown in Figure ).. V over = V LEDs.

3 NUD0 TYPICAL PERFORMANCE CURVES (T A = C unless otherwise noted) , 0 V sense (V) I OUT (ma) Figure. Output (I OUT ) vs. External Resistor ( ) T J, JUNCTION TEMPERATURE ( C) Figure. V sense vs. Junction Temperature.00. P D, POWER DISSIPATION (W) T A, AMBIENT TEMPERATURE ( C) OUTPUT CURRENT, NORMALIZED T J, JUNCTION TEMPERATURE ( C) Figure. Total Power Dissipation (P D ) vs. Ambient Temperature (T A ) Figure. Regulation vs. Junction Temperature

4 NUD0 APPLICATION INFORMATION Design Guide for DC Applications. Define LED s current: a. I LED = 0 ma. Calculate Resistor Value for : a. = V sense (see Figure ) / I LED b. = 0.(T J = C) / 0.00 =. Define : a. Per example in Figure, = 0 Vdc. Define V I LED per LED supplier s data sheet: per example in Figure, a. V LED =.0 V (0 LEDs in series) b. V LEDs = 90 V. Calculate Vdrop across the NUD00 device: a. V drop = V sense V LEDs b. V drop = 0 V 0. V 90 V c. V drop = 9. V. Calculate Power Dissipation on the NUD00 device s driver: a. P D_driver = V drop * b. P D_driver = 9. V 0.00 A c. P D_driver = 0.9 W. Establish Power Dissipation on the NUD00 device s control circuit per below formula: a. P D_control = (. V LEDs ) / 0,000 b. P D_control = 0.00 W. Calculate Total Power Dissipation on the device: a. P D_total = P D_driver P D_control b. P D_total = 0.9 W 0.00 W = 0.99 W 9. If P D_total >. W (or derated value per Figure ), then select the most appropriate recourse and repeat steps : a. Reduce b. Reconfigure LED array to reduce V drop c. Reduce by increasing d. Use external resistors or parallel device s configuration 0. Calculate the junction temperature using the thermal information on Page and refer to Figure to check the output current drop due to the calculated junction temperature. If desired, compensate it by adjusting the value of. 0 V NUD0 Figure. 0 V Application (Series LED s Array) L ED L ED L ED0

5 NUD0 APPLICATION INFORMATION (continued) Design Guide for AC Applications. Define LED s current: a. I LED = 0 ma. Define : a. Per example in Figure, = 0 Vac. Define V I LED per LED supplier s data sheet: a. Per example in Figure, V LED =.0 V (0 LEDs in series) V LEDs = 90 V. Calculate Resistor Value for : The calculation of the for AC applications is totally different than for DC. This is because current conduction only occurs during the time that the ac cycles amplitude is higher than V LEDs. Therefore calculation is now dependent on the peak current value and the conduction time. a. Calculate for V LEDs = 90 V: V = V peak Sin 90 V = (0 ) Sin =.0 b. Calculate conduction time for =.0. For a sinuousoidal waveform Vpeak happens at = 90. This translates to. ms in time for a 0 Hz frequency, therefore.0 is. ms and finally: Conduction time = (. ms. ms) =. ms c. Calculate the I peak needed for I (avg) = 0 ma Since a full bridge rectifier is being used (per Figure ), the frequency of the voltage signal applied to the NUD0 device is now 0 Hz. To simplify the calculation, it is assumed that the 0 Hz waveform is square shaped so that the following formula can be used: I (avg) = I peak duty cycle; If. ms is 00% duty cycle, then. ms is.%, then: I peak = I (avg) / duty cycle I peak = 0 ma / 0. = ma d. Calculate = 0. V / I peak =.. Calculate V drop across the NUD0 device: a. V drop = V sense V LEDs b. V drop = 0 V 0. V 90 V c. V drop = 9. V Full Bridge Rectifier 0 Vac 0 Hz NUD0 Figure. 0 Vac Application (Series LED s array) L ED L ED L ED0. Calculate Power Dissipation on the NUD0 device s driver: a. P D_driver = V drop * I (avg) b. P D_driver = 9. V 0.00 A c. P D_driver = 0.9 W. Establish Power Dissipation on the NUD0device s control circuit per below formula: a. P D_control = (. V LEDs ) / 0,000 b. P D_control = 0.00 W. Calculate Total Power Dissipation on the device: a. P D_total = P D_driver P D_control b. P D_total = 0.9 W 0.00 W = 0.99 W 9. If P D_total >. W (or derated value per Figure ), then select the most appropriate recourse and repeat steps : a. Reduce b. Reconfigure LED array to reduce V drop c. Reduce by increasing d. Use external resistors or parallel device s configuration 0. Calculate the junction temperature using the thermal information on Page and refer to Figure to check the output current drop due to the calculated junction temperature. If desired, compensate it by adjusting the value of.

6 NUD0 TYPICAL APPLICATION CIRCUITS Switch NUD0, / W 0 Vdc L ED L ED L ED0 Figure. 0 Vdc Application Circuit for a Series Array of 0 LEDs (.0 V, 0 ma) NUD0 Switch Full Bridge Rectifier 0, / W 0 Vac 0 Hz VARISTOR 00 V L ED L ED L ED0 Figure. 0 Vac Application Circuit for a Series Array of 0 LEDs (.0 V, 0 ma)

7 NUD0 TYPICAL APPLICATION CIRCUITS (continued) Switch NUD0, / W 0 Vdc.0 k R shunt 0 k, / W Q 00 V L ED L ED / ENABLE L ED0 Figure 9. 0 Vdc Application with / Enable Function, 0 LEDs in Series (.0 V, 0 ma) NUD0 Switch Full Bridge Rectifier, / W 0 Vac 0 Hz VARISTOR 00 V 00 V Electrolytic Cap.0 k R shunt 0 k, / W Q 00 V L ED L ED / ENABLE L ED0 Figure 0. 0 Vac Application with / Enable Function, 0 LEDs in Series (.0 V, 0 ma)

8 NUD0 THERMAL INFORMATION NUD0 Power Dissipation The power dissipation of the SO is a function of the pad size. This can vary from the minimum pad size for soldering to a pad size given for maximum power dissipation. Power dissipation for a surface mount device is determined by T J(max), the maximum rated junction temperature of the die, R JA, the thermal resistance from the device junction to ambient, and the operating temperature, T A. Using the values provided on the data sheet for the SO package, P D can be calculated as follows: PD T Jmax TA R JA The values for the equation are found in the maximum ratings table on the data sheet. Substituting these values into the equation for an ambient temperature T A of C, one can calculate the power dissipation of the device which in this case is. W. PD 0 C C 0 C. W The 0 C/W for the SO package assumes the use of a FR copper board with an area of square inches with oz coverage to achieve a power dissipation of. W. There are other alternatives to achieving higher dissipation from the SOIC package. One of them is to increase the copper area to 0 00 reduce the thermal resistance. Figure shows how the thermal resistance changes for different copper areas. Another alternative would be to use a ceramic substrate or an aluminum core board such as Thermal Clad. Using a board material such as Thermal Clad or an aluminum core board, the power dissipation can be even doubled using the same footprint. JA ( C/W) BOARD AREA (in ) Figure. JA versus Board Area S.9 sq. mm 0.0 in sq. S. sq. mm 0. in sq. R( ) (C /W) S 0.0 sq. mm 0. in sq. S. sq. mm 0.9 in sq. S.0 sq. mm.0 in sq. S.0 sq. mm.9 in sq TIME (sec) Figure. Transient Thermal Response

9 NUD0 PACKAGE DIMENSIONS X B Y A S 0. (0.00) M Y SOIC NB CASE 0 ISSUE AH M K NOTES:. DIMENSIONING AND TOLERANCING PER ANSI Y.M, 9.. CONTROLLING DIMENSION: MILLIMETER.. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION.. MAXIMUM MOLD PROTRUSION 0. (0.00) PER SIDE.. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0. (0.00) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION.. 0 THRU 0 ARE OBSOLETE. NEW STANDARD IS 0. Z H G D C 0. (0.00) M Z Y S X S SEATING PLANE 0.0 (0.00) N X M J MILLIMETERS INCHES DIM MIN MAX MIN MAX A B C D G. BSC 0.00 BSC H J K M 0 0 N S SOLDERING FOOTPRINT* SCALE : mm inches *For additional information on our PbFree strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. Thermal Clad is a registered trademark of the Bergquist Company. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Typical parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including Typicals must be validated for each customer application by customer s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box, Denver, Colorado 0 USA Phone: 0 or 000 Toll Free USA/Canada Fax: 0 or 00 Toll Free USA/Canada N. American Technical Support: 009 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: Japan Customer Focus Center Phone: 0 9 ON Semiconductor Website: Order Literature: For additional information, please contact your local Sales Representative NUD0/D

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