MC10SX1190. Fibre Channel Coaxial Cable Driver and Loop Resiliency Circuit
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1 Fibre Channel Coaxial Cable Driver and Loop Resiliency Circuit Description The MC10SX1190 is a differential receiver, differential transmitter specifically designed to drive coaxial cables. It incorporates the output cable drive capability of the MC10EP89 Coaxial Cable Driver with additional circuitry to multiplex the output cable drive source between the cable receiver or the local transmitter inputs. The multiplexer control circuitry is TTL compatible for ease of operation. The MC10SX1190 is useful as a bypass element for Fibre Channel-Arbitrated Loop (FC-AL) or Serial Storage Architecture (SSA) applications, to create loop style interconnects with fault tolerant, active switches at each device node. This device is particularly useful for back panel applications where small size is desirable. The EP89 style drive circuitry produces swings approximately 70% larger than a standard PECL output. When driving a coaxial cable, proper termination is required at both ends of the line to minimize reflections. The 1.4 V output swings allow for proper termination at both ends of the cable, while maintaining the required swing at the receiving end of the cable. Because of the larger output swings, the, outputs are terminated into the thevenin equivalent of 50 to V CC 3.0 V instead of 50 to V CC 2.0 V. Features 2.5 Gb/s Operation 425 ps Propagation Delay 1.4 V Output Swing on the Cable Driving Output Single Positive SUpply Operation Ranges: V CC = 3.0 V to 3.6 V, = 0 V V CC = 4.5 V to 5.5 V, = 0 V 75 k Internal Input Pull Down Resistors ESD Protection: 2000 V Human Body Model, >100 V Machine Model These are Pb Free Devices* V CC V CC DT DT V CC V BB PIN DR/DR / DT/DT / SEL V BB V CC TSSOP 20 DT SUFFIX CASE 948E SEL L H TRUTH TABLE Function MARKING DIAGRAM A = Assembly Location L = Wafer Lot Y = Year W = Work Week = Pb Free Package (Note: Microdot may be in either location) PIN DESCRIPTION FUNCTION ECL Diff. Inputs from Receive Cable ECL Buffered Differential Outputs from Receive Cable ECL Differential Input to Transmit Cable ECL Buffered Differential Output to Transmit Cable TTL Multiplexer Control Signal Reference Voltage Output ECL Positive Supply ECL Negative, 0 Supply DR DT 10SX 1190 ALYW *For additional marking information, refer to Application Note AND8002/D DR DR V CC V CC Figure Lead TSSOP Pinout: (Top View) *For additional information on our Pb Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 8 9 SEL 10 V CC ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 5 of this data sheet. Semiconductor Components Industries, LLC, 2006 January, 2006 Rev. 3 1 Publication Order Number: MC10SX1190/D
2 LOCAL RECEIVE DATA (ECL LEVELS) DR DR FROM INPUT CABLE (ECL LEVELS) V BB LOCAL TRANSMIT DATA (ECL LEVELS) DT DT 1 0 TO OUTPUT CABLE (ENHANCED SWING) SEL (TTL) Figure 2. Logic Diagram Table 1. ABSOLUTE MAXIMUM RATINGS Symbol Parameter Value Unit V CC Power Supply Voltage ( = 0 V) 0 to +6.0 Vdc Power Supply Voltage (V CC = 0 V) 6.0 to 0 Vdc V IN Input Voltage ( = 0 V, V IN not more positive than V CC ) 0 to +6.0 Vdc V IN Input Voltage (V CC = 0 V, V IN not more negative than ) 6.0 to 0 Vdc I OUT Output Current Continuous Surge JA Thermal Resistance (Junction to Ambient) Still Air 500 lfpm ma C/W JC Thermal Resistance (Junction to Case) 30 to 35 C/W T A Operating Temperature Range 40 to +85 C T STG Storage Temperature Range 50 to +150 C Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. 2
3 Table 2. DC CHARACTERISTICS (V CC = 3.3 V, = 0 V) (Note 1) Symbol Characteristic -40 C 25 C 85 C Min Typ Max Min Typ Max Min Typ Max V OH Output Voltage High (,) (Note 2) V V OL Output Voltage Low (,) (Note 2) V V OH Output Voltage High (,) (Note 3) V V OL Output Voltage Low (,) (Note 3) V I CC Quiescent Supply Current (Note 4) ma V IH Input Voltage High mv V IL Input Voltage Low mv V IH Input Voltage High SEL (Note 5) V V IL Input Voltage Low SEL (Note 5) V V BB Output Reference Voltage (Note 1) V NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 1. Input and output parameters will track 1:1 V CC. can vary +0.3 V to 0.3 V. 2. outputs loaded with 50 to V CC 2.0 V 3. outputs loaded with 50 to V CC 3.0 V 4. Outputs open circuited. 5. TTL signal threshold is 1.5 V above. Unit Table 3. DC CHARACTERISTICS (V CC = 5.0 V, = 0 V) (Note 6) Symbol Characteristic -40 C 25 C 85 C Min Typ Max Min Typ Max Min Typ Max V OH Output Voltage High (,) (Note 7) V V OL Output Voltage Low (,) (Note 7) V V OH Output Voltage High (,) (Note 8) V V OL Output Voltage Low (,) (Note 8) V I CC Quiescent Supply Current (Note 9) ma V IH Input Voltage High mv V IL Input Voltage Low mv V IH Input Voltage High SEL (Note 10) V V IL Input Voltage Low SEL (Note 10) V V BB Output Reference Voltage (Note 6) V I IL Input High Current A I IH Input LOW Current A NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 6. Input and output parameters will track 1:1 V CC. can vary +0.5 V to 0.5 V. 7. outputs loaded with 50 to V CC 2.0 V 8. outputs loaded with 50 to V CC 3.0 V 9. Outputs open circuited. 10.TTL signal threshold is 1.5 V above. Unit 3
4 Table 4. AC CHARACTERISTICS (V CC = 3.0 V to 5.5 V, = 0 V) (Note 11) 40 C 25 C to 85 C Symbol Characteristic Min Typ Max Min Typ Max Unit t pd Propagation Delay to Output DR (Diff) (Notes 12 and 13) ps DR (Diff) DT (Diff) t PLH, Propagation Delay SEL, t PHL (1.5 V to 50% Pt) t r, Rise Time (20% to 80%), t f Fall Time (80% to 20%) ps ps t r, Rise Time (20% to 80%), t f Fall Time 80% to 20% ps t skew Within Device Skew (Note 14) ps V PP Input Swing (Differential Configuration) mv V CMR Common Mode Range (Note 15) V f max Maximum Operation Frequency Gb/s NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 11. can vary +0.3 V to 0.3 V 12.The differential propagation delay is defined as the delay from the crossing points of the differential input signals to the crossing point of the differential output signals. 13.The single-ended propagation delay is defined as the delay from the 50% point of the input signal to the 50% point of the output signal. 14.Duty cycle skew is the difference between t PLH and t PHL propagation delay through a device. 15.The CMR range is referenced to the most positive side of the differential input signal. Normal operation is obtained if the HIGH level falls within the specified range and the peak-to-peak voltage lies between V PP Min and 1.0 V. 4
5 SX1190 = Typical value for is 160 to 260, depending on the application. The minimum value of should not be less than 50. V TT1 V TT1 = V CC 3 V SX1190 V TT1 V TT2 V TT2 = V CC 2 V V TT2 = /2 Figure 3. SX1190 Termination Configuration ORDERING INFORMATION Device Package Shipping MC10SX1190DT TSSOP 20* 75 Units / Rail MC10SX1190DTG TSSOP 20* 75 Units / Rail MC10SX1190DTR2 TSSOP 20* 2500 / Tape & Reel MC10SX1190DTR2G TSSOP 20* 2500 / Tape & Reel For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *This package is inherently Pb Free. 5
6 PACKAGE DIMENSIONS 0.15 (0.006) T L 0.15 (0.006) T U 2X L/2 PIN 1 IDENT U S S C (0.004) T SEATING PLANE 20X K REF 0.10 (0.004) M T U S V S A V D G H TSSOP 20 DT SUFFIX PLASTIC PACKAGE CASE 948E 02 ISSUE B B U J J1 N N K K1 ÍÍÍÍ ÍÍÍÍ ÍÍÍÍ SECTION N N F DETAIL E 0.25 (0.010) DETAIL E M W NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE W. MILLIMETERS INCHES DIM MIN MAX MIN MAX A B C D F G 0.65 BSC BSC H J J K K L 6.40 BSC BSC M ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Typical parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including Typicals must be validated for each customer application by customer s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 61312, Phoenix, Arizona USA Phone: or Toll Free USA/Canada Fax: or Toll Free USA/Canada N. American Technical Support: Toll Free USA/Canada Japan: ON Semiconductor, Japan Customer Focus Center Kamimeguro, Meguro ku, Tokyo, Japan Phone: ON Semiconductor Website: Order Literature: For additional information, please contact your local Sales Representative. MC10SX1190/D
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