uclamp0511t Low Profile μclamp TM 1-Line ESD protection PROTECTION PRODUCTS - MicroClamp TM Description Features Mechanical Characteristics

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- MicroClamp TM Description The μclamp TM series of TVS arrays are designed to protect sensitive electronics from damage or latch-up due to ESD. It is designed to replace multilayer varistors (MLVs) in portable applications such as cell phones, notebook computers, and other portable electronics. It features large cross-sectional area junctions for conducting high transient currents. They offer desirable characteristics for board level protection including fast response time, low operating and clamping voltage, and no device degradation. The μclamp TM 05T is in a 2-pin, RoHS/WEEE compliant, SLP006P2T package. It measures.0 x 0.6 with a nominal height of only 0.4. The leads are spaced at a pitch of 0.65 and are finished with lead-free NiPdAu. Each device will protect one line operating at 5 volts. It gives the designer the flexibility to protect single lines in applications where arrays are not practical. They may be used to meet the ESD iunity requirements of IEC 6000-4-2, Level 4 (±5kV air, ±8kV contact discharge). The combination of small size and high ESD surge capability makes them ideal for use in portable applications such as cellular phones, digital cameras, and MP3 players. Dimensions uclamp05t Low Profile μclamp TM -Line ESD protection Features Transient protection for data lines to IEC 6000-4-2 (ESD) ±5kV (air), ±8kV (contact) IEC 6000-4-4 (EFT) 40A (tp = 5/50ns) Cable Discharge Event (CDE) Ultra-small package (.0 x 0.6 x 0.4) Protects one data or power line Low reverse current: 3nA typical (VR=3.3V) Working voltage: - 5V / +5V Low capacitance: 4pF typical Solid-state silicon-avalanche technology Mechanical Characteristics SLP006P2T package RoHS/WEEE Compliant Nominal Dimensions:.0 x 0.6 x 0.4 Lead Finish: NiPdAu Molding compound flaability rating: UL 94V-0 Marking : Marking code, cathode band Packaging : Tape and Reel Applications Cellular Handsets & Accessories Keypads, Side Keys, USB 2.0, LCD Displays Notebooks & Desktop Computers Portable Instrumentation Digital Cameras Peripherals MP3 Players Schematic & PIN Configuration.0 0.60 2 0.65 0.40 Revision 07//2008 Nominal Dimensions () SLP006P2T (Bottom View)

Absolute Maximum Rating Rating Symbol Value Units ESD per IEC 6000-4-2 ESD per IEC 6000-4-2 (Air) (Contact) V ESD +/- 5 +/- 8 kv Operating Temperature T J -55 to +25 C Storage Temperature T STG 55 to +50 - C Electrical Characteristics (T=25 o C) Parameter Symbol Conditions Minimum Typical Maximum Units Reverse Stand-Off Voltage V WM R in to 2 or 2 to P 5 V Reverse Breakdown Voltage V R B I t = ma Pin to 2 or 2 to 6 8. 2 9. 5 V Reverse Leakage Current I R V RWM = 3.3V, T=25 C Pin to 2 or 2 to Clamping Voltage V C I PP = 2A, tp = 8/20μs Pin to 2 or 2 to 3 50 na 5 V Junction Capacitance C j V R = 0V, f = MHz 4 7 pf 2008 Semtech Corp. 2

Non-Repetitive Peak Pulse Power vs. Pulse Time 0 5.00 Clamping Voltage vs. Peak Pulse Current Peak Pulse Power - P PP (kw) 0. 0.0 0. 0 00 Pulse Duration - tp (us) Clamping Voltage - V C (V) 0.00 5.00 0.00 Waveform Parameters: tr = 8µs td = 20µs 0 0.5.5 2 2.5 3 Peak Pulse Current - I PP (A) Normalized Junction Capacitance vs. Reverse Voltage Typical Insertion Loss (S2).2 f = MHz CH S2 LOG 6 db / REF 0 db : -0.942 db 800 MHz 0 db 5 2: -.35 db 800 MHz C J (V R ) / C J (V R =0) 0.8 0.6 0.4 0.2-6 db -2 db -8 db -24 db -30 db -36 db 2 3 4 3: -6.289 db.8 GHz 4: -0.05 db 2.5 GHz 5: -8.6364 db 2.7 GHz 0 0 2 3 4 5 Reverse Voltage - V R (V) ESD Clamping (Pin to 2 and 2 to ) (8kV Contact per IEC 6000-4-2) -42 db -48 db MHz 0 MHz 00 MHz GHz 3 GHz START. 030 MHz STOP 3000. 000 000 MHz ESD Clamping (Pin to 2 and 2 to ) (-8kV Contact per IEC 6000-4-2) Note: Data is taken with a 0x attenuator Note: Data is taken with a 0x attenuator 2008 Semtech Corp. 3

Applications Information Device Connection Options These TVS diodes are designed to protect one data, I/O, or power supply line. The device is bidirectional and may be used on lines where the signal polarity can go above and below ground. Circuit Diagram Circuit Board Layout Recoendations for Suppression of ESD. Good circuit board layout is critical for the suppression of ESD induced transients. The following guidelines are recoended: Place the TVS near the input terminals or connectors to restrict transient coupling. Minimize the path length between the TVS and the protected line. Minimize all conductive loops including power and ground loops. The ESD transient return path to ground should be kept as short as possible. Never run critical signals near board edges. Use ground planes whenever possible. 2008 Semtech Corp. 4

Applications Information - Spice Model uclamp05t Spice Model uclamp05t Spice Parameters Parameter IS BV VJ RS IBV CJO TT U nit D (TVS) D2 (TVS) Amp 2.05E-5 2.05E-5 Volt 7 7 Volt 0. 8 0. 8 Ohm 0.83 0.83 Farad 3E-2 3E-2 Amp E-3 E-3 sec 2.54E- 9 2.54E- 9 M -- 0.25 0.25 N --.. EG ev.. 2008 Semtech Corp. 5

Outline Drawing - SLP006P2T A D B aaa C A TOP VIEW A E C SEATING PLANE DIMENSIONS INCHES MILLIMETERS DIM MIN NOM MAX MIN NOM MAX A.05.06.07 0.37 0.40 0.43 A.000.00.002 0.00 0.03 0.05 b.08.020.022 0.45 0.50 0.55 D.035.039.043 0.90.00.0 E.020.024.028 0.50 0.60 0.70 e.026 BSC 0.65 BSC L.008.00.02 0.20 0.25 0.30 R.002.004.006 0.05 0.0 0.5 N 2 2 aaa.003 0.08 bbb.004 0.0 PIN ID bxn bbb C A B R e 2x L BOTTOM VIEW NOTES:. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). Land Pattern - SLP006P2T (C) G Z X Y DIMENSIONS DIM INCHES MILLIMETERS C (.033) (0.85) G X.02.024 0.30 0.60 Y.022 0.55 Z.055.40 NOTES:. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). 2. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY. CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY'S MANUFACTURING GUIDELINES ARE MET. 2008 Semtech Corp. 6

Marking Code Ordering Information PIN ID Part Number uclamp05t.tct Working Voltage Qty per Reel Reel Size 5V 3,000 7 Inch 88 Notes: ) This is a lead-free, RoHS/WEEE compliant product MicroClamp, uclamp and μclamp are marks of Semtech Corporation Notes: )Device is electrically syetrical Tape and Reel Specification Pin Location User Direction of feed Device Orientation in Tape A0 B0 K0 0.69 +/-0.0.9 +/-0.0 0.66 +/-0.0 Tape Width B, (Max) D D E F P P0 P2 T W 8 4.2 (.65).5 + 0. - 0.0 (0.59 +.005 -.000) 0.4 ±0.25 (.03).750±.0 (.069±.004) 3.5±0.05 (.38±.002) 4.0±0.0 (.57±.00-4) 4.0±0. (.57±.00-4) 2.0±0.05 (.079±.002) 0.254±0.02 (.06) 8.0 + 0.3-0. (.32±.02) Contact Information Semtech Corporation Protection Products Division 200 Flynn Rd., Camarillo, CA 9302 Phone: (805)498-2 FAX (805)498-3804 2008 Semtech Corp. 7