RClamp0502BA. Ultra-Low Capacitance TVS for ESD and CDE Protection. PROTECTION PRODUCTS - RailClamp Description. Features. Mechanical Characteristics

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1 - RailClamp Description RailClamp TS diodes are specifically designed to protect sensitive components which are connected to high-speed data and transmission lines from overvoltage caused by ESD (electrostatic discharge), CDE (cable discharge events), and EFT (electrical fast transients). The RClamp 52BA has a typical capacitance of only.6pf (pin to 2). This means it can be used on circuits operating in excess of with minimal signal attenuation. They may be used to meet the ESD iunity requirements of IEC 6-4-2, Level 4 (±5k air, ±8k contact discharge). Each device can be configured to protect bidirectional line or two unidirectional lines. These devices are in a small SC-75 (SOT-52) package and feature a lead-free, matte tin finish. They are compatible with both lead free and SnPb assembly techniques. They are designed for use in applications where board space is at a premium. The combination of small size, low capacitance, and high level of ESD protection makes them a flexible solution for applications such as HDMI, MDDI, antenna circuits, Automatic Test Equipment, USB 2., and Infiniband circuits. RClamp52BA Ultra-Low Capacitance TS for ESD and CDE Protection Features Transient protection for high-speed data lines to IEC (ESD) ±8k (air), ±2k (contact) IEC (EFT) 4A (5/5ns) Protects up to two I/O lines Ultra-Low capacitance (<pf) No insertion loss to >. Low profile (<) Low leakage current and clamping voltage Low operating voltage: 5. Solid-state silicon-avalanche technology Mechanical Characteristics SC-75 (SOT-52) package Lead Finish: Matte Tin Pb-Free, Halogen Free, RoHS/WEEE Compliant Molding compound flaability rating: UL 94- Packaging: Tape and Reel Applications Mobile Display Digital Interface (MDDI) USB 2. Firewire Ports GaAs Photodetector Protection HBT Power Amp Protection Infiniband Transceiver Protection Dimensions Schematic & PIN Configuration.6.5 BSC BSC.75 Revision 4/9/2 Nominal Dimensions () SC-75 L (Top iew)

2 Absolute Maximum Rating Rating Symbol alue Units Peak Peak Pulse Power (tp = 8/2μs) Pulse Current (tp = 8/2μs) P pk 25 Watts 5 A ESD per IEC (Air) ESD per IEC (Contact) ESD 8 2 k Operating Temperature T J -55 to +25 C Storage Temperature T STG 55 to +5 - C Electrical Characteristics (T=25 o C) Parameter Symbol Conditions Minimum Typical Maximum Units Reverse Stand-Off oltage WM R Pin or Pin 2 to Pin and Between Pins and 2 5 Reverse Breakdown oltage B I t = ma Pin or Pin 2 to Pin and Between Pins and 2 R 6 Reverse Leakage Current I R RWM = 5, T=25 C Pin or Pin 2 to Pin and Between Pins and 2 Clamping oltage C = A, tp = 8/2μs Pin to Pin 2 Clamping oltage C = 5A, tp = 8/2μs Pin or Pin 2 to Pin Clamping oltage C = 5A, tp = 8/2μs Pin to Pin 2 Junction Capacitance C R =, f = j Pin to Pin 2 Junction Capacitance C R =, f = j Pin or Pin 2 to Pin μa pf.2 pf 2 Semtech Corp. 2

3 Typical Characteristics Non-Repetitive Peak Pulse Power vs. Pulse Time Power Derating Curve Peak Pulse Power - P PP (kw)... Pulse Duration - tp (μs) % of Rated Power or IPP Ambient Temperature - T A ( o C) 25 Clamping oltage vs. Peak Pulse Current Pin to Pin 2 Clamping oltage vs. Peak Pulse Current Pin or Pin 2 to Pin 2 8 Clamping oltage - C () Waveform Parameters: tr = 8μs td = 2μs Clamping oltage - C () Waveform Parameters: tr = 8μs td = 2μs Peak Pulse Current - (A) Peak Pulse Current - (A) Normalized Capacitance vs. Reverse oltage Pin or Pin 2 to Pin Normalized Capacitance vs. Reverse oltage Pin to Pin f =.2 C J ( R ) / C J ( R =) f = Reverse oltage - R () C J ( R ) / C J ( R =) Reverse oltage - R () 2 Semtech Corp.

4 Typical Characteristics Insertion Loss S2 (Pin to Pin 2) Insertion Loss S2 (Pin or Pin 2 to Pin ) CH S2 LOG 6 db / REF db CH S2 LOG 6 db / REF db :.4 db 9 :.46 db 9 2:.787 db.8 2:.2 db.8 :.284 db 2.5 : -.88 db 2.5 db 2 db 2-6 db -6 db -2 db -2 db -8 db -8 db -24 db -24 db - db - db -6 db -6 db START. STOP. ESD Clamping (4k Contact per IEC 6-4-2) START. STOP. ESD Clamping (8k Contact per IEC 6-4-2) Note: Data is taken with a x attenuator Analog Crosstalk Note: Data is taken with a x attenuator CH S2 LOG 2 db / REF db START. STOP. 2 Semtech Corp. 4

5 Applications Information Device Connection Options Figure. Pin Configuration This device is optimized for protection of line operating in excess of. It may also be used to protect two lines operating in excess of 2.. The device is connected as follows: Protection for one line with <pf capacitance can be achieved by connecting one data line to either pin or pin 2 with the other pin connected to ground. Pin is not connected. The connection to ground should be made directly to a ground plane. The path length should also be kept as short as possible to minimize parasitic inductance. Protection of two lines is achieved by connecting data lines at pins & 2. Pin is connected to ground. The connection to ground should be made directly to a ground plane. The path length should also be kept as short as possible to minimize parasitic inductance. Matte Tin Lead Finish Matte tin has become the industry standard lead-free replacement for SnPb lead finishes. A matte tin finish is composed of % tin solder with large grains. Since the solder volume on the leads is small compared to the solder paste volume that is placed on the land pattern of the PCB, the reflow profile will be determined by the requirements of the solder paste. Therefore, these devices are compatible with both lead-free and SnPb assembly techniques. In addition, unlike other lead-free compositions, matte tin does not have any added alloys that can cause degradation of the solder joint. 2 Semtech Corp. 5

6 Outline Drawing -SC-75 (SOT-52) A D e 2 e B E E bxn bbb C A B DIMENSIONS INCHES MILLIMETERS DIM MIN NOM MAX MIN NOM MAX A A A b c D E E e.9 BSC. BSC e.2 BSC.5 BSC L (.9) (.22) N aaa.4. bbb.8.2 A A2 A aaa C SEATING PLANE C H SEE DETAIL A SEATING PLANE C L c SIDE IEW DETAIL A NOTES:. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). 2. DATUMS -A- AND -B- TO BE DETERMINED AT DATUM PLANE -H-. DIMENSIONS "E" AND "D" DO NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. Land Pattern -SC-75 (SOT-52) X Z C G Y Y DIMENSIONS DIM INCHES MILLIMETERS C (.55) (.4) P.9. p.2.5 G.24.6 X.6.4 Y..8 Z p P NOTES:. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY'S MANUFACTURING GUIDELINES ARE MET. 2 Semtech Corp. 6

7 Marking Ordering Information P 5 YW Part Number RClamp52BATCT Lead Finish Qty per Reel Reel Size Pb Free, 7 Inch RailClamp and RClamp are registered marks of Semtech Corporation YW = Date Code Tape and Reel Specification Device Orientation in Tape A B K.85 +/ / /-.5 Tape Width B, (Max) D D (MIN) E F K (MAX) P P P 2 T(MAX) W (.65) ( ). (.9).75±. (.69±.4).5±.5 (.8±.2) 2.4 (.94) 4.±. (.57±.- 4) 4.±. (.57±.- 4) 2.±.5 (.79±.2).4 (.6) 8. (.2±.2) Contact Information Semtech Corporation Protection Products Division 2 Flynn Rd., Camarillo, CA 92 Phone: (85)498-2 FAX (85) Semtech Corp. 7