LC03-6. Low Capacitance TVS for High-Speed Data Interfaces. Features. Description. Mechanical Characteristics. Applications

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1 Description The LC0- transient voltage suppressor is designed to protect components which are connected to high speed telecommunication lines from voltage surges caused by lightning, electrostatic discharge (ESD), cable discharge events (CDE), and electrical fast transients (EFT). TVS diodes are ideal for use as board level protection of sensitive semiconductor components. The LC0- combines a TVS diode with a rectifier bridge to provide transient protection in both common and differential mode with a single device. The capacitance of the device is minimized (< 5pF) to ensure correct signal transmission on high speed lines. The LC0- meets the short-haul (intra-building) transient immunity requirements of Bellcore 09 for telecommunications applications. The SO- surface mount package allows flexibility in the design of crowded PC boards. Circuit Diagram LC0- Low Capacitance TVS for High-Speed Data Interfaces Features 000 watts peak pulse power (t p = /0µs) Transient protection for high-speed data lines to Bellcore 09 (Intra-Building) 00A (/0µs) ITU K.0 I PP =40A (5/0µs) IEC (ESD) ±5kV (air), ±kv (contact) IEC (EFT) 40A (5/50ns) IEC (Lightning) 00A (/0µs) Protects two lines in common and differential mode Low capacitance for high-speed interfaces Low clamping and operating voltage Integrated structure saves board space and increases reliability Solid-state silicon avalanche technology Mechanical Characteristics JEDEC SO- package RoHS/WEEE Compliant UL 497B listed Molding compound flammability rating: UL 94V-0 Marking : Part number, date code Packaging : Tube or Tape and Reel per EIA 4 Applications T/E Line Cards T/E and DS Interfaces STS- Interfaces ISDN S/T-Interfaces ISDN U-Interfaces 0/00 Ethernet Schematic & PIN Configuration Pin and 7 Pin,,, and 7 Ground 4 5 Pin 4 and 5 SO- (Top View) Revision 0//00

2 Absolute Maximum Rating Rating Symbol Value Units Peak Pulse Power (t = /0µs) P p k Peak Pulse Current (t = /0µs) I p P p 000 P 00 Watts A Lead Soldering Temperature T L 0 (0 sec. ) C Operating Temperature T J -55 to +5 C Storage Temperature T STG 55 to C Electrical Characteristics LC0- Parameter Symbol Conditions Minimum Typical Maximum Units Reverse Stand-Off Voltage V RWM V Reverse Breakdown Voltage V R B I t = ma. V Reverse Leakage Current I R V RWM = V, T=5 C 5 µ A Clamping Voltage V C I PP = 50A, t = /0µ s p Line-to-Ground Clamping Voltage V C I PP = 00A, t = /0µ s p Line-to-Ground Junction Capacitance C j Between I/O pins and Ground = 0V, f = V R Between I/O pins = 0V, f = V R 5 V 0 V 5 pf pf 00 Semtech Corp.

3 Typical Characteristics Non-Repetitive Peak Pulse Power vs. Pulse Time Power Derating Curve Peak Pulse Power - Ppk (kw) Pulse Duration - t p (µs) % of Rated Power or I PP Ambient Temperature - T A ( o C) Pulse Waveform Clamping Voltage vs. Peak Pulse Current Percent of IPP e -t td = I PP / Waveform Parameters: tr = µs td = 0µs Time (µs) Clamping Voltage - V C (V) Line-To-Line Line-To-Ground Waveform Param eters: tr = µs td = 0µs Peak Pulse Current - I PP (A) Normalized Capacitance vs. Reverse Voltage Forward Voltage vs. Forward Current.4. 5 C J (V R ) / C J (V R =0) f = Forward Voltage - V F (V) 4 Waveform Param eters: tr = µs td = 0µs Reverse Voltage - V R (V) Forward Current - I F (A) 00 Semtech Corp.

4 Typical Characteristics Insertion Loss S - I/O to I/O Insertion Loss S - I/O to Gnd CH S LOG db / REF 0 db CH S LOG db / REF 0 db : -.0 db 90 : -.0 db 4 0 db 4 : -.4 db db : -7. db db : db. GHz - db 4 : -.0 db. GHz - db - db 4: -.97 db.5 GHz - db - db 4: -.7 db.5 GHz -4 db -4 db -0 db -0 db - db - db -4 db -4 db -4 db 0 00 GHz GHz -4 db 0 00 GHz GHz START. 00 STOP START. 00 STOP Semtech Corp. 4

5 Applications Information Device Connection Options for Protection of Two High-Speed Data Lines The LC0- is designed to protect two high-speed data lines (one differential pair) from transient over-voltages which result from lightning and ESD. The device can be configured to protect in differential (Line-to-Line) and common (Line-to-Ground) mode. Data line inputs/ outputs are connected at pins to, and 4 to 5 as shown. Pins,,, and 7 are connected to ground. These pins should be connected directly to a ground plane on the board for best results. The path length is kept as short as possible to minimize parasitic inductance. In applications where high common mode voltages are present, differential protection is achieved by leaving pins,,, and 7 not connected. Connection for Differential (Line-to-Line) and Common Mode Protection (Line-to-Ground) Connection for Differential Protection (Line-to-Line) T/E Linecard Protection (Intra-Building) A typical T/E linecard protection circuit is shown below. The LC0- is connected between Tip and Ring on the transmit and receive line pairs. It provides protection to metallic and common mode lightning surges per Bellcore 09. This design takes advantage of the isolation of the transformer to suppress common mode surges. To complete the protection circuit, the RClamp04N (or RClamp0504N for 5V supplies) is employed as the IC side protection element. This device helps prevent the transceiver from latching up by providing fine clamping of transients that are coupled through the transformer. For further information, reference Semtech application note AN97-0. T/E and STS- Protection The LC0- can also be used to protect T/E and STS- interfaces. The data lines from the BNC interface are run through the LC0- (i.e. enters at pin and exits at pin ) with the ground connection made at the other side of the device (pins 4 and 5). The center pins (,,, and 7) are not connected. In this configuration, the LC0- adds less than pf of capacitance to each line and provides surge protection to 00A (tp=/0µs). Matte Tin Lead Finish Matte tin has become the industry standard lead-free replacement for SnPb lead finishes. A matte tin finish is composed of 00% tin solder with large grains. Since the solder volume on the leads is small compared to the solder paste volume that is placed on the land pattern of the PCB, the reflow profile will be determined by the requirements of the solder paste. Therefore, these devices are compatible with both lead-free and SnPb assembly techniques. In addition, unlike other lead-free compositions, matte tin does not have any added alloys that can cause degradation of the solder joint. 00 Semtech Corp. 5

6 Typical Applications LC0- RClamp04N LC0- T Line Card Protection (Short-Haul Applications) DS, T, E, or STS T/E and STS- Protection 00 Semtech Corp.

7 Typical Applications (Continued) LC0- LC0- ISDN S-Interface Protection ISDN U-Interface Secondary Protection 00 Semtech Corp. 7

8 Typical Applications (Continued) 0/00 Ethernet Protection High Speed Driver/Receiver Protection 00 Semtech Corp.

9 Applications Information - SPICE Model 0.7 nh D D D D D LC0- Spice Model LC0- Spice Parameters Parameter IS BV VJ RS IBV CJO TT U nit D (TVS) D (LCRD) Amp.0E-0.9E- Volt Volt Ohm Amp E- E- Farad.4e-9.0E- sec.54e- 9.54E- 9 M N --.. EG ev.. 00 Semtech Corp. 9

10 Outline Drawing - SO- X E/ ccc C X N/ TIPS aaa C SEATING PLANE C N A D e D E E e/ B A A A bxn bbb C A-B D GAGE PLANE 0.5 H SIDE VIEW h L (L) DETAIL A h c 0 SEE DETAIL A DIMENSIONS INCHES MILLIMETERS DIM MIN NOM MAX MIN NOM MAX A A A b c D E E e. BSC.050 BSC.00 BSC.7 BSC h L L N 0 0 (.04) - 0 (.04) - aaa bbb ccc NOTES:. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).. DATUMS -A- AND -B- TO BE DETERMINED AT DATUM PLANE -H-. DIMENSIONS "E" AND "D" DO NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. 4. REFERENCE JEDEC STD MS-0, VARIATION AA. Land Pattern - SO- X DIMENSIONS DIM INCHES MILLIMETERS C (.05) (5.0) (C) G Z G..00 P X Y Y.07.0 Z P NOTES:. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY. CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY'S MANUFACTURING GUIDELINES ARE MET.. REFERENCE IPC-SM-7A, RLP NO. 00A. 00 Semtech Corp. 0

11 Ordering Information Part Number Lead Finish Qty per Reel Reel Size LC0-.TB LC0-.TBT SnPb Inch Pb free Inch Contact Information Semtech Corporation Protection Products Division 00 Flynn Rd., Camarillo, CA 90 Phone: (05)49- FAX (05) Semtech Corp.