uclamp0541z Ultra Small μclamp 1-Line ESD Protection

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1 - Z-Pak TM Description μclamp TVS diodes are designed to protect sensitive electronics from damage or latch-up due to ESD. It is designed to replace 2 size multilayer varistors (MLVs) in portable applications such as cell phones, notebook computers, and other portable electronics. It features large cross-sectional area junctions for conducting high transient currents. This device offers desirable characteristics for board level protection including fast response time, low operating and clamping voltage, and no device degradation. μclamp 54Z is in a 2-pin SLP63P2X3 package. It measures.6 x.3 mm with a nominal height of only.25mm. Leads are finished with lead-free NiAu. Each device will protect one line operating at 5 volts. It gives the designer the flexibility to protect single lines in applications where arrays are not practical. The combination of small size and high ESD surge capability makes them ideal for use in portable applications such as cellular phones, digital cameras, and MP3 players. uclamp54z Ultra Small μclamp -Line ESD Protection Features High ESD withstand Voltage: +/-7kV (Contact/Air) per IEC Able to withstand over ESD strikes per IEC Level 4 Ultra-small 2 package age Protects one data or power line Low reverse current: <na typical (VR=5V) Working voltage: +/- 5V Low capacitance: 6.5pF typical Solid-state silicon-avalanche technology Mechanical Characteristics SLP63P2X3 package Pb-Free, Halogen Free, RoHS/WEEE Compliant Nominal Dimensions:.6 x.3 x.25 mm Lead Finish: NiAu Marking : Marking code + dot matrix date code Packaging : Tape and Reel Applications Cellular Handsets & Accessories eypads, Side eys, Audio Ports Portable Instrumentation Digital Lines Tablet PC Nominal Dimensions Schematic BSC /6/25 SLP63P2X3 (Bottom View)

2 Absolute Maximum Rating Rating Symbol Value Units Peak Pulse Power (tp = 8/2μs) M aximum Peak Pulse Current ( tp = 8/2μs) P pk 25 Watts I pp 2 Amps ESD per IEC (Air) SD per IEC (Contact) E V ESD +/- 7 +/- 7 kv Operating Temperature T J -55 to +25 C Storage Temperature T STG 55 to +5 - C Electrical Characteristics (T=25 o C) Parameter Symbol Conditions Minimum Typical Maximum Units Reverse Stand-Off Voltage V WM R in to 2 or 2 to P 5 V Reverse Breakdown Voltage V R B I t = ma Pin to 2 or 2 to V Reverse Leakage Current I R V RWM = 5V, T=25 C Pin to 2 or 2 to Clamping Voltage V C I PP = A, tp = 8/2μs Pin to 2 or 2 to Clamping Voltage V C I PP = 2A, tp = 8/2μs Pin to 2 or 2 to 3 5 na 2 V 5 V, 3 Dynamic Resistance 2 R DYN tlp =.2 / n s.78 Ohms Junction Capacitance C j V R = V, f = MHz pf Notes )ESD gun return path connected to ESD ground reference plane. 2)Transmission Line Pulse Test (TLP) Settings: t p = ns, t r =.2ns, I TLP and V TLP averaging window: t = 7ns to t 2 = 9ns. 3) Dynamic resistance calculated from I TLP = 4A to I TLP = 6A 25 Semtech Corporation 2

3 Typical Characteristics Non-Repetitive Peak Pulse Power vs. Pulse Time Clamping Voltage vs. Peak Pulse Current (tp=8/2us) 5 Peak Pulse Power - P PP (kw).. Clamping Voltage - V C (V) 5 Waveform Parameters: tr = 8μs td = 2μs.. Pulse Duration - tp (µs) Peak Pulse Current - I PP (A) Junction Capacitance vs. Reverse Voltage TLP Characteristic.2 25 f = MHz 2 Transmission Line Pulse Test (TLP) Settings: t p = ns, t r =.2ns, I TLP and V TLP averaging window: t = 7ns to t 2 = 9ns C J (V R ) / C J (V R =) TLP Current (A) Reverse Voltage - V R (V) TLP Voltage (V) ESD Clamping (+8kV Contact per IEC 6-4-2) ESD Clamping (-8kV Contact per IEC 6-4-2) 4 3 Voltage (V) 2 Voltage (V) - -2 Measured with 5 Ohm scope input impedance, 2GHz bandwidth. Corrected for 5 Ohm, 2dB attenuator. ESD gun return path connected to ESD ground plane -3 Measured with 5 Ohm scope input impedance, 2GHz bandwidth. Corrected for 5 Ohm, 2dB attenuator. ESD gun return path connected to ESD ground plane Time (ns) Time (ns) 25 Semtech Corporation 3

4 Typical Characteristics Typical Insertion Loss S2 CH S2 LOG 6 db / REF db : db 8 MHz db 2: db 9 MHz -6 db 2 3 3: db.8 GHz -2 db -8 db 4 5 4: db 2.5 GHz -24 db -3 db -36 db -42 db -48 db MHz MHz MHz GHz 3 GHz START. 3 MHz STOP 3. MHz Applications Information Assembly Guidelines The small size of this device means that some care must be taken during the mounting process to insure reliable solder joint. The table below provides Semtech's recommended assembly guidelines for mounting this device. The figure at the right details Semtech s recommended aperture based on the below recommendations. Note that these are only recommendations and should serve only as a starting point for design since there are many factors that affect the assembly process. The exact manufacturing parameters will require some experimentation to get the desired solder application..272 Stencil Aperture Mounting Pad Package Assembly Solder Parameter Stencil Design Aperture shape Recommendation Laser cut, Electro-polishe d Rectangular with rounded corners Recommended Mounting Pattern S older Stencil Thickness. mm (.4") Solder Paste Type Type 4 size sphere or smaller Solder Reflow Profile Per JEDEC J-STD-2 PCB PCB Solder Pad Design Pad Finish Non-Solder mask defined OSP OR NiAu 25 Semtech Corporation 4

5 Outline Drawing - SLP63P2X3 aaa C A A D TOP VIEW B E A C SEATING PLANE DIMENSIONS DIM MILLIMETERS MIN NOM MAX A A b D E e.355 BSC L N 2 aaa.8 bbb. bbb bxn C A B 2xL e BOTTOM VIEW NOTES:. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). Land Pattern - SLP63P2X3 DIMENSIONS (C) G Z DIM MILLIMETERS C (.425) G.75 X.27 Y.25 Z.675 Y X NOTES:. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). 2. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY. CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY'S MANUFACTURING GUIDELINES ARE MET. 25 Semtech Corporation 5

6 Marking Code Notes: ) Dots represent matrix date code Ordering Information Ordering Number Qty per Reel Carrier Tape Reel Size Comments uclamp54z.tnt, Plastic uclamp54z.tft 5, Paper uclamp54z.tvt 5, Paper 7 Inch 7 Inch 3 Inch Not Recommended for New Designs Notes: ) MicroClamp, uclamp and μclamp are trademarks of Semtech Corporation 25 Semtech Corporation 6

7 Carrier Tape Specification Plastic Tape Bo o Ao Paper Tape Note: All dimensions in mm unless otherwise specified Device Orientation in Tape Date Code Location (Away from Sprocket Holes) 25 Semtech Corporation 7

8 Contact Information Semtech Corporation Protection Products Division 2 Flynn Rd., Camarillo, CA 932 Phone: (85)498-2 FAX (85) Semtech Corporation 8