Document Number: MPXV7002 Data Sheet: Technical Data Rev 3, 01/2015
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1 Freescale Semiconductor Document Number: Data Sheet: Technical Data Rev 3, 01/2015 Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated The series piezoresistive transducers are state-of-the-art monolithic silicon pressure sensors designed for a wide range of applications, but particularly those employing a microcontroller or microprocessor with A/D inputs. This transducer combines advanced micromachining techniques, thinfilm metallization, and bipolar processing to provide an accurate, high level analog output signal that is proportional to the applied pressure. Features 2.5% Typical Error over +10 C to +60 C with Auto Zero 6.25% Maximum Error over +10 C to +60 C without Auto Zero Ideally Suited for Microprocessor or Microcontroller-Based Systems Thermoplastic (PPS) Surface Mount Package Temperature Compensated over +10 to +60 C Patented Silicon Shear Stress Strain Gauge Available in Differential and Gauge Configurations -2 to +2 kpa (-0.3 to +0.3 psi) 0.5 to 4.5 V Output GP CASE 1369 GC6U/C6T1 CASE 482A Small Outline Package DP CASE 1351 Top view N/C 5 4 V OUT N/C 6 3 GND N/C 7 2 V S N/C 8 1 N/C Pinout (Style 2, case number 98ASA99255D) ORDERING INFORMATION Package Case # of Ports Pressure Type Device Device Name Options No. None Single Dual Gauge Differential Absolute Marking Small Outline Package ( Series) GC6U Rails 482A G GC6T1 Tape & Reel 482A G GP Trays 1369 G DP Trays 1351 DP 2005, 2009, 2015 Freescale Semiconductor, Inc. All rights reserved.
2 1 Operating Characteristics Table 1. Operating Characteristics (V S = 5.0 Vdc, T A = 25 C unless otherwise noted. Decoupling circuit shown in Figure 3 required to meet specification.) Characteristic Symbol Min Typ Max Unit Pressure Range (1) Supply Voltage (2) P OP kpa V S Vdc Supply Current I o 10 madc Pressure Offset V S = 5.0 Volts Full Scale Output V S = 5.0 Volts Full Scale Span V S = 5.0 Volts Accuracy (6) (10 to 60 C) (10 to 60 C) (10 to 60 C) (10 to 60 C) V off Vdc V FSO Vdc V FSS V Vdc 2.5 (7) 6.25 %V FSS Sensitivity V/P V/kPa Response Time (8) t R ms Output Source Current at Full Scale Output I O madc Warm-Up Time (9) 20 - ms kpa (kilopascal) equals psi. 2.Device is ratiometric within this specified excitation range. 3.Offset (V off ) is defined as the output voltage at the minimum rated pressure. 4.Full Scale Output (V FSO ) is defined as the output voltage at the maximum or full rated pressure. 5.Full Scale Span (V FSS ) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 6.Accuracy (error budget) consists of the following: Linearity: Temperature Hysteresis: Pressure Hysteresis: TcSpan: TcOffset: Variation from Nominal: Output deviation from a straight line relationship with pressure over the specified pressure range. Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or maximum rated pressure, at 25 C. Output deviation over the temperature range of 10 to 60 C, relative to 25 C. Output deviation with minimum rated pressure applied, over the temperature range of 10 to 60 C, relative to 25 C. The variation from nominal values, for Offset or Full Scale Span, as a percent of V FSS, at 25 C. 7.Auto Zero at Factory Installation: Due to the sensitivity of the Series, external mechanical stresses and mounting position can affect the zero pressure output reading. Auto zero is defined as storing the zero pressure output reading and subtracting this from the device's output during normal operations. Reference AN1636 for specific information. The specified accuracy assumes a maximum temperature change of ± 5 C between auto zero and measurement. 8.Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 9.Warm-up Time is defined as the time required for the product to meet the specified output voltage after the Pressure has been stabilized. 2 Freescale Semiconductor, Inc.
3 2 Maximum Ratings Table 2. Maximum Ratings (1) Rating Symbol Value Unit Maximum Pressure (P1 > P2) P max 75 kpa Storage Temperature T stg 30 to +100 C Operating Temperature T A 10 to 60 C 1.Exposure beyond the specified limits may cause permanent damage or degradation to the device. Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip. V S 2 Sensing Element Thin Film Temperature Compensation and Gain Stage #1 Gain Stage #2 and Ground Reference Shift Circuitry V out 4 GND 3 Pins 1, 5, 6, 7, and 8 are NO CONNECTS for Small Outline Package Device Figure 1. Integrated Pressure Sensor Schematic Freescale Semiconductor, Inc. 3
4 3 On-Chip Temperature Compensation, Calibration and Signal Conditioning The performance over temperature is achieved by integrating the shear-stress strain gauge, temperature compensation, calibration and signal conditioning circuitry onto a single monolithic chip. Figure 2 illustrates the Differential or Gauge configuration in the basic chip carrier (Case 482). A gel die coat isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the sensor diaphragm. The series pressure sensor operating characteristics, and internal reliability and qualification tests are based on use of dry air as the pressure media. Media, other than dry air, may have adverse effects on sensor performance and long-term reliability. Contact the factory for information regarding media compatibility in your application. Figure 3 shows the recommended decoupling circuit for interfacing the integrated sensor to the A/D input of a microprocessor or microcontroller. Proper decoupling of the power supply is recommended. Figure 4 shows the sensor output signal relative to pressure input. Typical, minimum, and maximum output curves are shown for operation over a temperature range of 10 to 60 C using the decoupling circuit shown in Figure 3. The output will saturate outside of the specified pressure range. Fluoro Silicone Gel Die Coat Die Stainless Steel Cap Wire Bond P1 Thermoplastic Case Lead Frame Differential Sensing Element P2 Die Bond Figure 2. Cross-Sectional Diagram SOP (not to scale) +5 V V out OUTPUT V s IPS 1.0 F 0.01 F GND 470 pf Figure 3. Recommended Power Supply Decoupling and Output Filtering (For additional output filtering, please refer to Application Note AN1646.) 4 Freescale Semiconductor, Inc.
5 Output Voltage (V) Transfer Function: V out = V S (0.2 P(kPa)+0.5) ± 6.25% V FSS V S = 5.0 Vdc T A = 10 to 60 C MAX TYPICAL 1.0 MIN Differential Pressure (kpa) Figure 4. Output versus Pressure Differential 4 Pressure (P1)/Vacuum (P2) Side Identification Table Freescale designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing a gel die coat which protects the die from harsh media. The Pressure (P1) side may be identified by using the following table: Part Number Case Type Pressure (P1) Side Identifier GC6U/GC6T1 482A-01 Side with Port Attached GP Side with Port Attached DP Side with Part Marking 5 Minimum Recommended Footprint for Surface Mounted Applications Surface mount board layout is a critical portion of the total design. The footprint for the surface mount packages must be the correct size to ensure proper solder connection interface between the board and the package. With the correct footprint, the packages will self align when subjected to a solder reflow process. It is always recommended to design boards with a solder mask layer to avoid bridging and shorting between solder pads TYP 8X TYP 8X TYP 8X 2.54 inch mm SCALE 2:1 Figure 5. Small Outline Package Footprint Freescale Semiconductor, Inc. 5
6 6 Package Dimensions N -A- -B- J 5 8 -T- S V 4 1 G C D 8 PL 0.25 (0.010) M T B S A S W H NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5 TYPICAL DRAFT. INCHES MILLIMETERS DIM MIN MAX MIN MAX A B C D G BSC 2.54 BSC H J K M N S V W K M PIN 1 IDENTIFIER SEATING PLANE CASE 482A-01 ISSUE A SMALL OUTLINE PACKAGE 6 Freescale Semiconductor, Inc.
7 CASE ISSUE A SMALL OUTLINE PACKAGE Freescale Semiconductor, Inc. 7
8 8 Freescale Semiconductor, Inc.
9 CASE ISSUE B SMALL OUTLINE PACKAGE Freescale Semiconductor, Inc. 9
10 CASE ISSUE B SMALL OUTLINE PACKAGE 10 Freescale Semiconductor, Inc.
11 7 Revision History Table 1. Revision History Revision number Revision date Description of changes 3 01/2015 Updated data sheet format. Added Pinout. Updated package outline for 98ASA99303D. Freescale Semiconductor, Inc. 11
12 How to Reach Us: Home Page: Web Support: Information in this document is provided solely to enable system and software implementers to use Freescale products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits based on the information in this document. Freescale reserves the right to make changes without further notice to any products herein. Freescale makes no warranty, representation, or guarantee regarding the suitability of its products for any particular purpose, nor does Freescale assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. Typical parameters that may be provided in Freescale data sheets and/or specifications can and do vary in different applications, and actual performance may vary over time. All operating parameters, including typicals, must be validated for each customer application by customer s technical experts. Freescale does not convey any license under its patent rights nor the rights of others. Freescale sells products pursuant to standard terms and conditions of sale, which can be found at the following address: Freescale and the Freescale logo are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. All other product or service names are the property of their respective owners Freescale Semiconductor, Inc. All rights reserved. Rev 3 01/2015
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