PRODUCT SPECIFICATION

Transcription

1 ipass TM / ipass+ TM 0.8 mm PITCH I/O CONNECTOR SYSTEM EXTERNAL ipass / ipass+ of

2 TABLE OF CONTENTS.0 SCOPE PRODUCT DESCRIPTION PRODUCT NAME AND SERIES NUMBER(S) DIMENSION, MATERIALS, PLATING AND MARKINGS SAFETY AGENCY APPROVALS PIN ASSIGNMENTS ADDITIONAL GENERAL SPECIFICATIONS APPLICABLE DOCUMENTS AND SPECIFICATIONS MOLEX DOCUMENTS INDUSTRY DOCUMENTS QUALIFICATION RATINGS VOLTAGE CURRENT TEMPERATURE DURABILITY PERFORMANCE (MECHANICAL & ENVIRONMENTAL) TEST GROUP TEST GROUP TEST GROUP TEST GROUP TEST GROUP 4 (CONTINUED) TEST GROUP MECHANICAL TEST GROUP MECHANICAL TEST GROUP MECHANICAL TEST GROUP MECHANICAL TEST GROUP MECHANICAL TEST GROUP MECHANICAL TEST GROUP MECHANICAL TEST GROUP MECHANICAL TEST GROUP PERFORMANCE (HIGH SPEED CHARACTERIZATION) SIGNAL INTEGRITY REQUIREMENTS (CONNECTOR ONLY) SIGNAL INTEGRITY REQUIREMENTS (CONNECTOR & CABLE SYSTEM, SAS/SATA) SIGNAL INTEGRITY REQUIREMENTS (CONNECTOR & CABLE SYSTEM, PCIE) SIGNAL INTEGRITY REQUIREMENTS (CONNECTOR & CABLE SYSTEM, X) PACKAGING CONNECTOR AND SHELL PLUG AND CABLE ASSEMBLY GAGES AND FIXTURES OTHER INFORMATION MOLEX CONNECTOR ONLY TEST PROFILE INVERTED SMT APPLICATION PCB REQUIREMENTS... EXTERNAL ipass / ipass+ of

3 .0 SCOPE This Product Specification covers this 0.8 mm centerline (pitch) printed circuit board (PCB) connector series and cable assemblies..0 PRODUCT DESCRIPTION. PRODUCT NAME AND SERIES NUMBER(S) Product Name: ipass Connector Family Connector Series: Guide Frame Series: 74540, 74548, 048, 049 Guide Frame/Connector Series: 7558, 7604, 7605, Plug & Cable Series: 74546, 74547, 74588, 74557, 74558, 048, 040. DIMENSION, MATERIALS, PLATING AND MARKINGS See the appropriate sales drawing for information on dimensions, materials, plating, marking, and footprint patterns..3 SAFETY AGENCY APPROVALS UL file: E979 CSA file: PIN ASSIGNMENTS Pin assignment may vary depending on the cable assembly configuration. Different configurations will have different part numbers within the series. Reference the appropriate cable sales drawing of the specific part number for the correct pin assignment..5 ADDITIONAL GENERAL SPECIFICATIONS Plug PCB: Material is FR4 Overall thickness of mm over pads s are 0.76µm minimum hard gold plated over 3.8µm minimum thick nickel plating Plug: Backshells Zinc Diecast Pull Nylon Latch Stainless Steel Bulk Cable: See specific sales drawing EXTERNAL ipass / ipass+ 3 of

4 3.0 APPLICABLE DOCUMENTS AND SPECIFICATIONS 3. MOLEX DOCUMENTS SD AS PK PS SMES-5 ipass Right Angle Connector Application Specification Packaging Specification Cosmetic Specification Solderability 3. INDUSTRY DOCUMENTS EIA 364 Series EIA Electrical Connector Test Procedures Including Environmental Classifications with Test Procedures Environmental Test Methodology for Assessing the Performance of Connectors and Sockets Used in Business Office Applications 4.0 QUALIFICATION 5.0 RATINGS Laboratory condition and sample selection are in accordance with EIA VOLTAGE 48 Volts AC (RMS)/DC Max. 5. CURRENT 0.75 Amps Max. 5.3 TEMPERATURE Operating: Non-operating: -40ºC to +80ºC -55 C to +80 C 5.4 DURABILITY 0.76 µm Au 50 cycles, 0 year Life (4 day FMG) EXTERNAL ipass / ipass+ 4 of

5 6.0 PERFORMANCE (MECHANICAL & ENVIRONMENTAL) 6. TEST GROUP 3 4 Durability (precondition) Temperature Life 5 Reseating 6 EIA ; perform plug & unplug cycles: 50 times. EIA-364-7, method A, Test Condition 3 at 05 ± C for 0 hours Manually unplug & plug the connector, 3 cycles baseline No evidence of physical Conditioning Exposure No evidence of physical No physical data EXTERNAL ipass / ipass+ 5 of

6 6. TEST GROUP Durability (precondition) 3 Thermal Shock Cyclic Temperature & Humidity 7 Reseating 8 EIA ; perform plug & unplug cycles: 50 times. EIA-364-3, Method A, test condition I, duration A4, ½ extreme EIA Connectors should be cycled (4) times between 5º ± 3ºC at 80% RH and 65 º± 3 ºC at 50% RH). Ramp times should be 0.5 hour and dwell should be.0 hour. Manually unplug & plug the connector, 3 cycles baseline No evidence of physical Conditioning Exposure Conditioning Exposure No evidence of physical No physical data No physical data EXTERNAL ipass / ipass+ 6 of

7 6.3 TEST GROUP 3 baseline Durability (precondition) EIA ; perform plug & unplug cycles: 50 times. No evidence of physical 3 Temperature Life (precondition) EIA-364-7, method A, Test Condition 3 at 05 ± C for 7 hours Conditioning Exposur 4 5 Mechanical Vibration EIA test condition VII test condition letter D 5 minutes in each of 3 mutually perpendicular directions. Both mating halves rigidly fixed to not contribute to relative motion of one contact against another. Discontinuity < µsec No evidence of physical 6 Mechanical Shock EIA test condition letter A 3 shocks in each axis (8) Both mating halves rigidly fixed to not contribute to relative motion of one contact against another. Discontinuity < µsec No evidence of physical 7 EXTERNAL ipass / ipass+ 7 of

8 6.4 TEST GROUP 4 baseline Durability (precondition) EIA ; perform plug & unplug cycles: 50 times. No evidence of physical 3 Temperature Life (precondition) EIA-364-7, method A, Test Condition 3 at 05 ± C for 7 hours Conditioning Exposure No physical data 4 5 Mixed Flowing Gas EIA class IIA, Option A & B test condition VII for 4 days See Note Conditioning Exposure 6 Note:. Expose ½ of the specimens unmated for /3 of the test duration. Mate the specimen to the same one used during preconditioning temperature life. Expose for the duration of the test.. Characterize porosity & plating thickness before test sequence. EXTERNAL ipass / ipass+ 8 of

9 TEST GROUP 4 (CONTINUED) 7 Thermal Disturbance Cycle connectors 0 times between 5º ± 3ºC at 80% RH and 85 º± 3 ºC at 50% RH. Ramps should be a minimum of C per minute and dwell times should insure that the contacts reach the temperature extremes for a minimum of 5 minutes. Conditioning Exposure No physical data 8 9 Reseating Manually unplug & plug the connector, 3 cycles No evidence of physical 0 EXTERNAL ipass / ipass+ 9 of

10 6.5 TEST GROUP 7 Dielectric Withstanding Voltage 3 Durability 4 5 Dielectric Withstanding Voltage EIA-364-0; apply a voltage of 300 VDC for minute between adjacent terminals and between adjacent terminals and ground. EIA ; perform plug & unplug cycles: 50 times. EIA-364-0; apply a voltage of 300 VDC for minute between adjacent terminals and between adjacent terminals and ground. No disruptive discharge No leakage current in excess of 5mA baseline No evidence of physical No disruptive discharge No leakage current in excess of 5mA Note:. Separate sets of test specimens will be used to access dielectric withstanding voltage and the change in low level contact resistance.. Dielectric withstanding voltage testing will use different contacts than those used for low level contact resistance testing. EXTERNAL ipass / ipass+ 0 of

11 6.6 MECHANICAL TEST GROUP Temperature Rise (via current cycling) Measure the temperature rise at the rated current after 96 hours. (45 minutes ON and 5 minutes OFF). Fixture as required. Temperature Rise: +30 C maximum 0.3 A min. with < 30 C Temperature Rise 6.7 MECHANICAL TEST GROUP Connector Mate Forces (Module only) Mate connector at a rate of 5 mm per min. Mate.5 N / contact pair MAX insertion force N / force Connector Un-mate Forces (Module only) Un-mate connector at a rate of 5 mm per min. Un-mate 0.5 N / contact pair MAX withdrawal force N / contact pair 3 Plug Mate Forces Mate connector at a rate of 5 mm per min. Mate.5 N / contact pair plus 50 N MAX 6 ckt: 6 N 40 N 38 ckt: 6 N 8 N 68 ckt: 98 N 34 N 4 De-Latch Plug (Axial Load) Mate connector and place axial load on latch pull to delatch plug Un-mate 0.5 N / contact pair plus 0 N MAX 6 ckt: 6 N.4 N 38 ckt: 8 N 4 N 68 ckt: 40 N 45 N 5 Latch Pull (Axial Load) Place axial load on plug pull with 6.35 mm diameter pin Mate 5 N MIN (no physical ) EXTERNAL ipass / ipass+ of

12 6.8 MECHANICAL TEST GROUP 3 Terminal Retention Force Axial pullout force on the terminal in the housing at a rate of 5 mm ( in) per min. Normal Force Apply a perpendicular force. 3 Solder Ring Retention to Housing Peg Axial pullout force on the terminal in the housing at a rate of 5 mm ( in) per min. 4.5 N MINIMUM retention force 0.49 N, (50 grams) MINIMUM normal force 5.0 N MINIMUM retention force 6. N MINIMUM 0.49 N, (50 grams) MINIMUM normal force 6.6 N MINIMUM 6.9 MECHANICAL TEST GROUP 4 Latitudinal Load Mate connector and load plug with latitudinal load until open circuit. See section N MIN 90 N (no open circuit) Longitudinal Load Mate connector and load plug with longitudinal load until open circuit. See section N MIN 90 N (no open circuit) 3 Cable Pullout Force (Axial Load) Mate plug to connector and apply an axial pullout force on the wire at a rate of 5 mm per min. 6 ckt 88 N MIN 38 ckt 00 N MIN 6 ckt: 9 N 97 N 4 Cable Pullout Force (Right Angle Load) Mate plug to connector and apply an right angle pullout force on the wire at a rate of 5 mm per min. 75 N MIN 5 N 45 N EXTERNAL ipass / ipass+ of

13 6.0 MECHANICAL TEST GROUP 5 Wire Flex 3 Flex cable 80 for 0 cycles. Test per EIA test cond. I: 4 AWG with X = 40 mm 6 AWG with X = 30 mm 8 AWG with X = 30 mm baseline 0 mω MAX (change ) No physical 0 cycles, no physical 6. MECHANICAL TEST GROUP 6 Solderability Per SMES-5 SMT Process Compatibility (Pb Free) See Section 0.0 for Molex Connector Only Test Profile Solder Coverage 95% minimum Dimensional: Conformance to Sales Drawing Requirements Visual: No Damage No opens No bridges No EXTERNAL ipass / ipass+ 3 of

14 6. MECHANICAL TEST GROUP 7 Longitudinal Load (connector only) Mate connector and load module in peel and shear modes. 68 Ckt Peel: 5 N min Shear: 50 N min 6 Ckt Peel: 7 N min Shear: 35 N min 68 Ckt Peel: 0 N min Shear: 80 N min 6 Ckt Peel: 3 N min Shear: 45 N min Longitudinal Load (connector only) (with solder ring) Mate connector and load module in peel and shear modes. 6 Ckt Peel: 5 N min Shear: 95 N min 6 Ckt Peel: 3 N min Shear: 0 N min 6.3 MECHANICAL TEST GROUP 8 Compliant Pin Insertion into PCB Apply an axial insertion force on the terminal at a rate of 5±6 mm/min. 3 N (5. lbf) max insertion force per pin 5 N max Compliant Pin Retention to PCB Apply an axial extraction force on the terminal at a rate of 5±6 mm/min. 3 N (0.7 lbf) min retention force per pin 3 N min EXTERNAL ipass / ipass+ 4 of

15 7.0 PERFORMANCE (HIGH SPEED CHARACTERIZATION) 7. SIGNAL INTEGRITY REQUIREMENTS (CONNECTOR ONLY) ITEM DESCRIPTION TEST CONDITION REQUIREMENT ACTUAL Return Loss Frequency range 50MHz to 7.5GHz Frequency range 7.5GHz to 5GHz.5dB at 5GHz -0 db Equation Differential Impedance Rise-time of 5ps (0-80%) 00 ± 0 ohms -6 db 9-09 ohms SMT vs Compliant 3 Insertion Loss Frequency range 50 MHz to.5 GHz Equation db 4 Crosstalk NEXT, FEXT for adjacent pairs within a row NEXT, FEXT for adjacent pairs across rows *Measured at 5ps 0-80% risetime % % 0.5 % 0.5 % 5 Isolation Frequency range 50MHz to 5GHz Measure near-end and far-end isolation - Adjacent pairs within a row - Adjacent pairs across rows -30 db N/A 6 Differential Skew (Within Pair) Mate plug to receptacle < ps < ps Note: PCB Interface Option SMT PCB Interface Option Compliant Pin, single port PCB Interface Option 3 Compliant Pin, dual port or stacked ports Equation : -0-5log 0 (f / 7.5GHz) db Equation : -0log 0 (a * f + a * f + a3 * f ) db Where a=.0e-0.5, a=.0e-0, a3=.0e-0 EXTERNAL ipass / ipass+ 5 of

16 7. SIGNAL INTEGRITY REQUIREMENTS (CONNECTOR & CABLE SYSTEM, SAS/SATA) ITEM DESCRIPTION TEST CONDITION REQUIREMENT ACTUAL Differential Impedance Rise time of 55 ps (0 % - 80 %) 00 ± 5 ohms (mated cable) 9-0 ohms Common-mode Impedance Rise time of 55 ps (0 % - 80 %) 3.5 ± 7.5 ohms (cable) 6-37 ohms 3 Differential Mode Return Loss - Measured from 0 MHz < f < 4.5 GHz - Measured from 4.5 GHz < f < 6.5 GHz -8 db -8+6 db per decade -xx db -xx db 4 5 Common Mode Return Loss Differential to Common Mode Conversion Measured from 0 MHz to 6.5 GHz -8 db -xx db - SCD: 0 MHz < f < 9.0 GHz - SCD: 0 MHz < f < 9.0 GHz -6 db -0 db -xx db -xx db 6 Differential Insertion Loss Measured from 0 MHz to 3.0 GHz -.5-( f /50) db -xx db (0 m, 4 AWG) 7 Multi-Lane Isolation - Measured from 0 MHz to 4.5 GHz - (4) near-end aggressor pairs and () victim pair - TotalNEXT ( f ) 0 log 0 4 NEXT( f ) / 0-6 db GHz (0 m, 4 AWG) EXTERNAL ipass / ipass+ 6 of

17 7.3 SIGNAL INTEGRITY REQUIREMENTS (CONNECTOR & CABLE SYSTEM, PCIE) ITEM DESCRIPTION TEST CONDITION REQUIREMENT ACTUAL Differential Mode Return Loss - Measured from 0 MHz < f <.5 GHz - Measured from.5 GHz < f <.5 GHz - db -+6 db per decade -xx db -xx db Differential Insertion Loss Measured from 0 MHz to 3.0 GHz MHz -7.5 GHz -xx db -xx db 3 Inter-pair skew Rise time of 70 ps (0 % - 80 %).3 ns xx ps 4 Intra-pair skew Rise time of 70 ps (0 % - 80 %) 40 ps xx ps 5 Multi-Lane Isolation - Measured from 0 MHz to.5 GHz - (4) near-end aggressor pairs and () victim pair - TotalNEXT ( f ) 0 log 0 4 NEXT( f ) / db GHz (0 m, 4 AWG) 7.4 SIGNAL INTEGRITY REQUIREMENTS (CONNECTOR & CABLE SYSTEM, X) ITEM DESCRIPTION TEST CONDITION REQUIREMENT ACTUAL Differential Mode Return Loss - Measured from 0 MHz < f <.5 GHz -0 db -xx db Differential Insertion Loss Measured from 0 MHz to 5.0 GHz MHz MHz MHz -. GHz -4.7 GHz -7 GHz -xx 00 MHz -xx 00 MHz -xx 65 MHz -xx GHz -xx GHz -xx GHz EXTERNAL ipass / ipass+ 7 of

18 8.0 PACKAGING 8. CONNECTOR AND SHELL 8.. Product shall be packaged in tape and reel per the packaging specification as called out on the applicable assembly print. 8.. Packaging shall meet the requirements of and be tested per the packaging specification as called out on the applicable assembly print. 8. PLUG AND CABLE ASSEMBLY 8.. Product shall be packaged to protect against during handling, transit and storage. EXTERNAL ipass / ipass+ 8 of

19 9.0 GAGES AND FIXTURES Test setup for latitudinal and longitudinal load testing and shell retention testing. Probe is about 6mm in diameter with a full radius nose. The probe is to be placed 0mm from the front edge of the receptacle and located at the centerline of the plug. Apply load to plug at a rate of 5mm per minute. Test setup for peel and shear testing. Apply load to plug at a rate of 5mm per minute. EXTERNAL ipass / ipass+ 9 of

20 0.0 OTHER INFORMATION 0. MOLEX CONNECTOR ONLY TEST PROFILE SMT Profile Ramp-Up: Preheat Temperature: Time maintained above: Peak Temperature: Time within 5 C of actual Peak Temperature: Ramp-Down: Cycle Duration, 5 C to Peak Temperature: Average Rate of 3 C/second max 50 C min. to 00 C max. for seconds 7 C for seconds 60 C 0-0 seconds Average Rate of 6 C/second max 8 minutes maximum 0. INVERTED SMT APPLICATION Glue must be used on the locating pegs to hold the part while inverted through the reflow process. EXTERNAL ipass / ipass+ 0 of

21 0.3 PCB REQUIREMENTS These requirements are for connector series 7558, 7604, 7605 & only. The compliant pin shall be capable of being inserted one time. The PCB hole shall be capable of retaining the compliant pin for a maximum of three insertions. The removal of the compliant pin from the PCB shall not the PCB hole beyond the point to be able to retain a compliant pin (that has not been inserted into a PCB). The minimum thickness of the PCB for use with the compliant pin is.35 mm. EXTERNAL ipass / ipass+ of