HSD High Speed Data interconnection

Transcription

1 HSD High Speed Data interconnection Fast, safe and robust Very high data bit rate up to 5 Gbit/s SSR smart strain relief enables unstressed solder joints Excellent resistance against cross-talk and RF-EMC

2 HSD High Speed Data interconnection This newly developed digital HSD interconnection enables excellent data transmission via LVDS (low voltage differential signaling) by preventing interference both from cross-talk and other external sources. Due to its optimized shielding concept the 100 Ohm impedance matched interconnection works at a superior level. The product s highlight SSR (smart strain relief) offers a uniquely unstressed soldering joint construction, for PCB types. This SSR feature, in combination with the guiding rib gussets on the connector interface, provide outstanding mechanical mating security and robustness. 3 guiding rib gussets Protection of plug pins by guiding rib gussets Product features SSR enables unstressed solder joints for PCB types Tilt safety Very high data bit rate up to 5 Gbit/s Excellent resistance against cross-talk and RF-EMC Mechanical robustness according to automotive requirements THR and THT capable for automated assemblies Mechanical and colour coding prevents mismatching Primary & secondary locking mechanism ensures highest interconnection security 3 guiding slots Protection of jack sockets by guiding slots SSR feature SSR (smart strain relief) feature Applications Infotainment systems HD-entertainment systems Driver assistance systems Telematics applications LVDS camera systems GVIF video transmission IEE 1394, USB, ethernet data links Further 100 Ohm high speed data links Characteristics Data bit rate: up to 5 Gbit/s* Impedance: 100 Ohm Near/far end cross talk: 33 db / 28 db Frequency range: up to 2 GHz Return loss: at 1 GHz 20 db; at 2 GHz 17 db Mating cycles: 25 Lock retention force: 110 N Further details: Please refer to product data sheets * refering to PCB mount plugs Head Office Germany IMS Connector Systems GmbH Obere Hauptstraße 30 PO Box 1141 Tel (+49) Fax (+49) [email protected] Hungary IMS Connector Systems Kft Ipar körút 27 H-9400 Sopron Tel (+36) Fax (+36) [email protected] China IMS Connector Systems Ltd No 35, Huo Ju Road SND Science & Technology Park VCR-Suzhou Tel (+86) Fax (+86) [email protected] Further sales contacts at

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4 page 1 / 6 Design according to: Electrical characteristics: Standard (Norm) Impedance ( MIL-C B) Operating frequency up to colored value means: still under test target value Value Unit / - 10% [Ω] 2 GHz [GHz] Data bit rate 5 Gbit/s [Gbit/s] Return loss 1 GHz 20 db [db] 2 GHz 17 db [db] Picture Insertion loss 0,1 [db] Insulation resistance 1x 10 3 [MΩ] Contact resistance Centre contact 10 [mω] Outer contact 7,5 [mω] Contact current max. (DC) 1,5 [A] DC Operating voltage max. 100 [V] DC Proof voltage min. 250 [V] eff RF Leakage 75 [db] 65 [db] Nearend crosstalk 33 [db] Farend crosstalk 28 [db] Skew ( between signal contacts) 20 [psec] Remarks up to 1 GHz up to 2 GHz angle version Mechanical characteristics: Value Unit Engagement force 30 [N] Separating force 5 [N] Mating cycles Coding efficiency [N] Retention force locked system 110 [N] Remarks

5 page 2 / 6 Material & plating: Outer contact Centre contact Plastic housing Other metal parts Insulator Cap RoHS (2002/95/EC) conform Material Plating Brass Ni 3-6 µm Brass Au min. 0,15 µm PA 10T/X (UL94-HB) Zink alloy Cu + Ni +Tin plated LCP (UL 94-V0) - Zink alloy Cu + Ni Environmental influences: Operating temperature range Thermal shock Temperature and Humidity Vibration (Random) Mechanical Shock High-Temp. Exposure -40 C up to +105 C DIN IEC Test NA USCAR DIN IEC DIN IEC DIN IEC Remarks Solder profile: IEC Group 3&4 Notes: Update History: Rev. Date Alteration Signature a Anpassung der Prüfnormen Toleranz +/-10% hinzu RBg Plating b MF Wave/SMD solderability edit c HSD Interface value MF d Update MK e Update MF f German version added MF g Panel assembling added MF Formblatt-Nr.: Form-TK-012b Rev. 01 Released 17. Aug 07

6 page 3 / 6 Soldering process: Soldering methode: Wavebath solderability Recommended wave soldering profile: Parameter Temperature gradient in preheating Soak time Preheat temperature Temperature gradient time Soldering time Peak temperature Temperature gradient in cooling Reference t soak T 1 t 1 t 2 T peak Specification 2 C/s max. < 30 second < 100 (-5/+5) C 5-6 second 10 second max. 300 C max. 6 C/second max. Temp. / C T peak t 2 T 1 t soak t 1 time / sec.

7 page 4 / 6 Soldering process: Soldering methode: THR solderability Recommended reflow soldering profile: Parameter Reference Specification Max. Temperature (lead free soldering) C Temperature / C time / sec.

8 page 5 / 6 SSR ( Smart Strain Relief) : Panel assembling: The panel shall be mounted from the top side. The funnel shaped lane, secure a better guiding of the panel. The panel inside of the guiding groove is averaged between plastic and dycast housing. The distance 6,60 mm ( pic.1) is the value of the average state. ±0,2 Panel 1 9,1±0,05 5 ±0,05 Panel 2 9,1±0,05 10 ±0,05 6,60 Panel 1 pic. 1: Start position, side view pic 2a: Start position, front view pic. 2b: Start position, front view 6,60 pic. 3: Average funnel position contact point contact point 6,40 6,80 pic. 4: funnel position: pressed endpoint pic. 5: funnel position: pulled endpoint

9 page 6 / 6 SSR ( Smart Strain Relief) : 6,60 pic. 6: average position pic. 7: end position Geometric requirements: X Y Panel stiffness requirements: X: Panel thickness Y: Nipple thickness Deformation Max. 0,1 mm X+Y = 1,10+ 0,03 Center axis 0,1mm Spalt pic. 8: Panel and nipple thickness consideration pic. 9: Panel stiffness consideration at tensiele load. Requirements: -The panel must not be sharp -edged at the contact point. -The panelthickness may vary in the area (X+Y) 1,10mm+0,03, under the presmise, that at a tensile and pressure load of min. 110N on the center axis, do not cause a deformation on the panel bigger than 0,1mm.