FODM3011, FODM3012, FODM3022, FODM3023, FODM3052, FODM Pin Full Pitch Mini-Flat Package Random-Phase Triac Driver Output Optocouplers
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1 April 9 FODM311, FODM31, FODM3, FODM33, FODM35, FODM353 4-Pin Full Pitch Mini-Flat Package Random-Phase Triac Driver Output Optocouplers Features Compact 4-pin surface mount package (.4 mm maximum standoff height) Peak blocking voltage 5V (FODM31X) 4V (FODM3X) 6V (FODM35X) Available in tape and reel quantities of 5. Add NF98 for new construction version with 6 C max. reflow temperature rating UL, C-UL and VDE certifications pending Applications Industrial controls Traffic lights Vending machines Package Dimensions.54±.5.±. 3.6±.3 4.4±. 5.3±.3 Applications (Continued) Solid state relay Lamp ballasts Solenoid/valve controls Static AC power switch Incandescent lamp dimmers Motor control Description The FODM31X, FODM3X, and FODM35X series consists of a GaAs infrared emitting diode driving a silicon bilateral switch housed in a compact 4-pin mini-flat package. The lead pitch is.54mm. They are designed for interfacing between electronic controls and power triacs to control resistive and inductive loads for 115V/4V operations. ANODE 1 CATHODE 4 3 MAIN TERMINAL MAIN TERMINAL.±.5.1±.1.4±.1 Note: All dimensions are in millimeters FODM3XX Rev. 1..6
2 Absolute Maximum Ratings (T A = 5 C unless otherwise specified) Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable above the recommended operating conditions and stressing the parts to these levels is not recommended. In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability. The absolute maximum ratings are stress ratings only. Symbol Parameter Value Units TOTAL PACKAGE EMITTER T STG Storage Temperature -55 to +15 C T OPR Operating Temperature -4 to +1 C I F (avg) Continuous Forward Current 6 ma I F (pk) Peak Forward Current (1µs pulse, 3pps.) 1 A V R Reverse Input Voltage 3 V P D Power Dissipation (No derating required over operating temp. range) 1 mw DETECTOR I T(RMS) On-State RMS Current 7 ma (RMS) V DRM Off-State Output Terminal Voltage FODM311/FODM31 5 V FODM3/FODM33 4 FODM35/FODM353 6 P D Power Dissipation (No derating required over operating temp. range) 3 mw FODM3XX Rev. 1..6
3 Electrical Characteristics (T A = 5 C) Individual Component Characteristics Symbol Parameter Test Conditions Device Min. Typ.* Max. Unit EMITTER V F Input Forward Voltage I F = 1mA All V I R Reverse Leakage Current V R = 3V, T A = 5 C All.1 1 µa DETECTOR I DRM dv/dt Peak Blocking Current Either Direction Critical Rate of Rise of Off-State Voltage Transfer Characteristics Isolation Characteristics *All typicals at T A = 5 C Rated V DRM, I F = (1) All 1 na I F = (Figure 8) () FODM311, FODM31, FODM3, FODM33 FODM35, FODM353 1 V/µs Symbol DC Characteristics Test Conditions Device Min. Typ.* Max. Unit I FT LED Trigger Current Main Terminal Voltage = 3V (3) I H V TM Holding Current, Either Direction Peak On-State Voltage Either Direction FODM311, FODM3, FODM35 FODM31, FODM33, FODM353 Notes: 1. Test voltage must be applied within dv/dt rating.. This is static dv/dt. See Figure 1 for test circuit Commutating dv/dt is function of the load-driving thyristor(s) only. 3. All devices are guaranteed to trigger at an I F value less than or equal to max I FT. Therefore, recommended operating I F lies between max I FT (1mA for FODM311, FODM3, and FODM35, 5mA for FODM31, FODM33, and FODM353) and absolute max I F (6mA). 1, 1 ma All 3 µa I TM = 1mA peak All V Symbol Characteristic Test Conditions Device Min. Typ.* Max. Unit V ISO Steady State Isolation Voltage 1 Minute, R.H. = 4% to 6% All 375 VRMS 5 FODM3XX Rev
4 Typical Performance Curves VF - FORWARD VOLTAGE (V) IH - HOLDING CURRENT (NORMALIZED) Fig. 1 LED Forward Voltage vs. Forward Current T A = -4 C T A = 5 C 1.1 T 1. A = 1 C I F - FORWARD CURRENT (ma) Fig. 3 Holding Current vs. Ambient Temperature 1 NORMALIZED TO T A = 5 C T A - AMBIENT TEMPERATURE ( C) I DRM - LEAKAGE CURRENT (na) I FT - TRIGGER CURRENT (NORMALIZED) Fig. Leakage Current vs. Ambient Temperature VDRM = 6V T A - AMBIENT TEMPERATURE ( C) Fig. 4 Trigger Current vs. Ambient Temperature V TM = 3V NORMALIZED TO T A = 5 C T A - AMBIENT TEMPERATURE ( C) 1 FODM3XX Rev
5 Typical Performance Curves (Continued) IFT - LED TRIGGER CURRENT (NORMALIZED) Fig. 5 LED Current Required to Trigger vs. LED Pulse Width T A = T5 C A NORMALIZED TO PWIN >> 1µs PW IN - LED TRIGGER PULSE WIDTH ( C) I TM - ON-STATE CURRENT (ma) T A = 5 C V DRM - OFF-STATE OUTPUT TERMINAL VOLTAGE (NORMALIZED) Fig. 7 On-State Characteristics V TM - ON-STATE VOLTAGE (V) Fig. 6 Off-State Output Terminal Voltage vs. Ambient Temperature NORMALIZED TO T A = 5 C T A - AMBIENT TEMPERATURE ( C) FODM3XX Rev
6 Typical Application Information 6V (FODM35) (FODM353) 4V (FODM3) (FODM33) 5V (FODM311) (FODM31) Vdc PULSE INPUT APPLIED VOLTAGE WAVEFORM VOLTS MERCURY WETTED RELAY τ RC R TEST C TEST 378 V (FODM35, FODM353) 5 V (FOMD3, FODM33) 158 V (FODM311, FODM31) Figure 9. Resistive Load D.U.T. R = 1 kω X1 SCOPE PROBE NOTE: This optoisolator should not be used to drive a load directly. It is intended to be a trigger device only. V CC R in 1 V CC R in 1 FODM311 FODM31 FODM3 FODM33 FODM35 FODM353 FODM311 FODM31 FODM3 FODM33 FODM35 FODM µf Vmax = 6 V (FODM35, FODM353) = 4 V (FODM3, FODM33) = 5 V (FODM311, FODM31).63 Vmax dv/dt = τ RC Figure 8. Static dv/dt Test Circuit R L C1.4k 1. The mercury wetted relay provides a high speed repeated pulse to the D.U.T.. 1x scope probes are used, to allow high speeds and voltages. 3. The worst-case condition for static dv/dt is established by triggering the D.U.T. with a normal LED input current, then removing the current. The variable R TEST allows the dv/dt to be gradually increased until the D.U.T. continues to trigger in response to the applied voltage pulse, even after the LED current has been removed. The dv/dt is then decreased until the D.U.T. stops triggering. τ RC is measured at this point and recorded. 1 V 6 Hz Z L 1 V 6 Hz = 378 τ RC (FODM353) (FODM35) = 5 τ (FODM33) RC (FODM3) = 158 τ (FODM311) RC (FODM31) Figure 1. Inductive Load with Sensitive Gate Triac (I GT 15 ma) FODM3XX Rev
7 Typical Application Information (Continued) V CC R in 1 FODM3 FODM33 FODM35 FODM µf In this circuit the hot side of the line is switched and the load connected to the cold or ground side Figure 11. Typical Application Circuit 39.1 µf LOAD 4 VAC HOT GROUND The 39Ω resistor and.1µf capacitor are for snubbing of the triac, and the 47Ω resistor and.5µf capacitor are for snubbing the coupler. These components may or may not be necessary depending upon the particular and load used. FODM3XX Rev
8 Ordering Information Option V_NF98 R_NF98 RV_NF98 Note: To specify the new construction version with 6 C max reflow peak temperature rating: Add "NF98" to the end of the part number. The non NF98 version is rated for 3 C peak reflow temperature. Marking Information 3 Definitions V 4 X Description VDE Approved Tape and Reel (5 units) Tape and Reel (5 units) and VDE Approved 311 YY 5 1 Fairchild logo Device number 3 VDE mark (Note: Only appears on parts ordered with VDE option See order entry table) 4 One digit year code 5 Two digit work week ranging from 1 to 53 6 Assembly package code R 1 6 FODM3XX Rev
9 Tape Specifications K t W d Tape Width 1 Tape Thickness Sprocket Hole Pitch Sprocket Hole Dia. Sprocket Hole Location Pocket Location Pocket Pitch Pocket Dimension Pocket Hole Dia. Cover Tape Width Cover Tape Thickness Max. Component Rotation or Tilt Devices Per Reel Reel Diameter P.54 Pitch Description Symbol Dimensions W t P E F P A B D K D 1 W 1 A P P B P 8.±. D 1.±.4.35±. 4.±. 1.55±. 1.75±. 5.5±..±. 4.75±. 7.3±..3±. 1.55±. 9. d.65±. max 5 33 mm (13") D 1 F E W FODM3XX Rev
10 Footprint Drawing for PCB Layout Note: All dimensions are in mm. 1. FODM3XX Rev
11 Reflow Profile Temperature ( C) TP TL Tsmax Tsmin Max. Ramp-up Rate = 3 C/S Max. Ramp-down Rate = 6 C/S Preheat Area Profile Freature Time 5 C to Peak Time (seconds) Pb-Free Assembly Profile Temperature Min. (Tsmin) 15 C Temperature Max. (Tsmax) C Time (t S ) from (Tsmin to Tsmax) 6 1 seconds Ramp-up Rate (t L to t P ) 3 C/second max. Liquidous Temperature (T L ) 17 C Time (t L ) Maintained Above (T L ) 6 15 seconds Peak Body Package Temperature 6 C + C / 5 C Time (t P ) within 5 C of 6 C 3 seconds Ramp-down Rate (T P to T L ) 6 C/second max. Time 5 C to Peak Temperature 8 minutes max. ts tl tp FODM3XX Rev
12 TRADEMARKS The following includes registered and unregistered trademarks and service marks, owned by Fairchild Semiconductor and/or its global subsidiaries,and is not intended to be an exhaustive list of all such trademarks. Auto-SPM Build it Now CorePLUS CorePOWER CROSSVOLT CTL Current Transfer Logic EcoSPARK EfficentMax EZSWITCH * * Fairchild Fairchild Semiconductor FACT Quiet Series FACT FAST FastvCore FETBench FlashWriter * FPS F-PFS FRFET Global Power Resource SM Green FPS Green FPS e-series Gmax GTO IntelliMAX ISOPLANAR MegaBuck MICROCOUPLER MicroFET MicroPak MillerDrive MotionMax Motion-SPM OPTOLOGIC OPTOPLANAR PDP SPM Power-SPM PowerTrench PowerXS Programmable Active Droop QFET QS Quiet Series RapidConfigure * Trademarks of System General Corporation, used under license by Fairchild Semiconductor. Saving our world, 1mW/W/kW at a time SmartMax SMART START SPM STEALTH SuperFET SuperSOT -3 SuperSOT -6 SuperSOT -8 SupreMOS SyncFET Sync-Lock * The Power Franchise TinyBoost TinyBuck TinyLogic TINYOPTO TinyPower TinyPWM TinyWire TriFault Detect TRUECURRENT * µserdes UHC Ultra FRFET UniFET VCX VisualMax XS DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN, WHICH COVERSTHESE PRODUCTS. LIFE SUPPORT POLICY FAIRCHILD S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user. ANTI-COUNTERFEITING POLICY. A critical component in any component of a life support, device, or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. Fairchild Semiconductor Corporation's Anti-Counterfeiting Policy. Fairchild's Anti-Counterfeiting Policy is also stated on our external website, under Sales Support. Counterfeiting of semiconductor parts is a growing problem in the industry. All manufacturers of semiconductor products are experiencing counterfeiting of their parts. Customers who inadvertently purchase counterfeit parts experience many problems such as loss of brand reputation, substandard performance, failed applications, and increased cost of production and manufacturing delays. Fairchild is taking strong measures to protect ourselves and our customers from the proliferation of counterfeit parts. Fairchild strongly encourages customers to purchase Fairchild parts either directly from Fairchild or from Authorized Fairchild Distributors who are listed by country on our web page cited above. Products customers buy either from Fairchild directly or from Authorized Fairchild Distributors are genuine parts, have full traceability, meet Fairchild's quality standards for handling and storage and provide access to Fairchild's full range of up-to-date technical andproduct information. Fairchild and our Authorized Distributors will stand behind all warranties and will appropriately address any warranty issues that may arise. Fairchild will not provide any warranty coverage or other assistance for parts bought from Unauthorized Sources. Fairchild is committed to combat this global problem and encourage our customers to do their part in stopping this practice by buying direct or from authorized distributors. PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Product Status Definition Advance Information Preliminary No Identification Needed Obsolete Formative / In Design First Production Full Production Not In Production Datasheet contains the design specifications for product development. Specifications may change in any manner without notice. Datasheet contains preliminary data; supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve design. Datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve the design. Datasheet contains specifications on a product that is discontinued by Fairchild Semiconductor. The datasheet is for reference information only. FODM3XX Rev Rev. I4
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