Dry Film Photoresist & Material Solutions for 3D/TSV

Transcription

1 Dry Film Photoresist & Material Solutions for 3D/TSV

2 Agenda Digital Consumer Market Trends Components and Devices 3D Integration Approaches Examples of TSV Applications Image Sensor and Memory Via Last Surface and Back Via Process Schemes Dry Film Photoresist Solution for TSV Dry Film Permanent Photoresist Solution for Bonding A Material Solution for 3D Integration

3 Digital Consumer Products Outlook (next 2-3years ) Products Trend Outlook (Growth) Cell Phone >10% GPS & Home appliance (Net working & security) FPD P.C Digital Camera DVD/Video cam >10% Flat Flat Down Down Expected continued growth for Cell phone and GPS markets

4 What kind of components are used in a 3G cell phone? Key components Chassis Battery Memory card Main board FPC for LCD FPC for hinge Key devices Processor NAND Flash LCD and drivers CMOS/CCD DSP Passive devices Board Assy. SiP / SOC Source : Vodafone HP Key technologies for reliable interconnect/assembly - High heat resistance, Fine pitch, Thin and light, Good adhesion - Thermal management, Less CTE mismatching, Good mechanical properties

5 What kind of device will drive packaging technology? Processor LCD and drivers CMOS/CCD DSP NAND Flash memory SOC (System on Chip) Concerns - Longer TAT - Complicated process and testing SiP,3D (System on PKG) Advantages - Quick TAT Turnaround Time - Simple process and testing - KGD Known Good Die Functional Module integrated passive and active devices (All in one)

6 Convergence of Packaging Technology - Approaches IC Packaging WLP / MCP / 3D SiP Underfill, EMC, Metallization Dry & Wet plating, molding EAD / Module Functional Module Embedded passive and active devices (All in one) PWB Integrated passive Integrated active Prepreg (composite), FR-4 Lamination (Heat/press)

7 3D Integration approaches On Chip 3D Integration Advantage : High density/small Disadvantage : Low yield, complicated process & testing Issues : Required high temp cycle for build up structure Wafer stacking 3D Integration (WOW) Advantage : High productivity Difficulties : - Thinned wafer handling - Wafer/wafer bonding - Through die connection - Must be use high yield subs Stacked PKG /Chip on Chip 3D Integration Advantage : - Can be used with KGD - Quick TAT (Lead time) Issues : -Thermal dissipation - Reliability: depend on number of solder joints

8 An Example of 3D-TSV Design (3D-Stacked Memory) Memory Memory Memory Memory Through Si Vias Micro Inter connects Rerouting circuit Underfill Interposer Solder

9 An Example of a TSV Application for Image Sensors Thinner/Smaller PKG for cell/pda or other of mobile products ZyCSP Via Last TSV Image Sensor Glass cover C-MOS or CCD 0.6mm (0.024inch) Fan-out vs. Real Chip size Source : Vodafone HP Conventional CCD Ceramic PKG (hermetic seal) Glass cover C-MOS or CCD ZyCube / OKI announced first TSV Production facility in Japan. (Jan 07)

10 Via last (Surface Via) Process Scheme Wafer Wafer Thinning Chip RIE Laser Ablation Wafer Dicing Backside Bump Non electrolytic plating or Seed Cu sputter Stacking Dies Electrolytic plating

11 Via last (Back via) process scheme Wafer Front Bump Wafer Thinning Chip (Surface down) Backside Bump RIE Laser Ablation Wafer Dicing Stacking Dies Non electrolytic plating or Seed Cu sputter Electrolytic plating

12 Key Issues for Photoresist Application in Via Last Process Via creation 1. Selectivity to DRIE process 2. Thickness uniformity 3. High temperature resistance Via Plating 1. Photoresist application Wafer with vias 2. Chemical compatibility Plating and Stripping Via Protection 1. Photoresist application - Wafer with vias 2. Chemical compatibility Wet etch and Stripping

13 Via Creation, Plating and Protection Dry Film Photoresist Application Lamination Process Courtesy of Microcontrol Electronics The Dry film photoresist process is capable of handling all 3D/TSV imaging steps RIE Plating Rerouting

14 Via Creation RIE DuPont MX5000 Dry Film Photoresist One step application process High selectivity to DRIE process High temperature resistance Thickness uniformity Courtesy of RTI International

15 Via Plating Plating DuPont MX5000 Dry Film Photoresist One step, simple application process Tenting over vias No Residue inside the vias Dry film tenting over existing vias Residue free via ready for plating After Lamination After Developement

16 Via Protection Rerouting DuPont MX5000 Dry Film Photoresist One step, simple application process Tenting over vias No Residue inside the vias Protected un filled via after removal Protected filled via after removal Dog Bone Structure after development Dog Bone Structure after metal etch

17 Via Creation, Plating and Protection Photoresist application Polymer Viscosity vs. Temperature Polymer Flow vs. Temperature, Pressure, and Time Shear Rate vs. Shear Stress At Storage Stress At Lamination Stress Temperature, deg C Shear Stress B A TEMP T1<T2<T3 T1 C E Shear Rate T2 T3 D F By controlling polymer flow during lamination with temperature, pressure and speed, DuPont MX5000 series is capable of applying a uniform layer of photoresist on wafers with TSV

18 Bumping/Cu Pillar Application DuPont WBR2050 series Photoresist: MPF TM WBR50 Surface: Cu Exposure: Suss MA200 Plating Eletrolytes: Nexx Plating Tool (Vertical Plating) RH 8540 Remover DuPont EKC WLP Courtesy of Nexx Systems

19 Potential Issues for Photoresist Application in Glass Bonding for Image Sensors Total thickness and thickness uniformity Patterning before bonding Low temperature bonding Outgassing Bonding strength CTE mismatch

20 DuPont PerMX3000 Dry Film Permanent Photoresist Precise edge No edge bead No EBR required Thickness uniformity less than 1 µm variation

21 DuPont PerMX3000 Dry Film Permanent Photoresist PerMX3020 Si PerMX3020 Si Glass Glass Glass Si Low temperature bonding profile Slow temperature ramp up Short cool down cycle PerMX3000 Bonding Profile

22 Material Solution for 3D/TSV Application Camera Module Via Last C-MOS/CCD Camera module Image Sensor Interposer DSP Wafer Thinning APL/PerMX series Photo sensitive permanent film APL/MX series Dry Film photoresist Zyron Depo. Cleaning gas Dry etching gas Vertrel CF deposition Cleaning agents EKC series Dryfilm/Thick PR Remover & Chemicals HD series Polyimides Photo sensitive RDL s, Adhesives and Stress Buffers APL/WBR series Dryfilm photoresist Kapton Flexible Substrate system Syton Mazin BG polish Wafer polish

23 Material Solution for 3D/TSV Application Memory SiP WOW-TSV Memory / Logic SiP module Memory Memory Zyron Depo. Cleaning gas Dry etching gas Vertrel CF deposition Cleaning agents HD3000/HD7000 series Polyimide Adhesives Memory Memory Interposer Logic Syton Mazin BG polish Wafer polish EKC series Dryfilm/Thick PR Remover & Chemicals HD series Polyimides Photo sensitive RDL s, Adhesives and Stress Buffers APL/WBR series APL/MX series APL/PerMX serie Dryfilm photoresist TM CooLam Thermo conductive/ Thermal resistant Substrate system

24 Thanks for your attention!