8611 Balboa Ave., San Diego, CA (800)

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Thomas Harold Wood
8 years ago
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1 Courtesy of of EADS Astrium 8611 Balboa Ave., San Diego, CA (800)

2 Semiconductor Packaging and Assembly Services (KAI) has been manufacturing ceramic IC packages and modules in San Diego since KAI s features listed below, provide a total package solution to customers. Advanced ceramic package manufacturing HTCC (High Temp. Co-fired Ceramic) LTCC (Low Temp. Co-fired Ceramic) Post-fired BeO, Al 2 O 3 Ceramic package design Electrical design, simulation, & modeling Thermo-mechanical design and analysis Contract assembly services Strong customer support team Manufacturing in Mexico

3 Applications and Markets Telecom Commercial & Government Satellites Medical Imaging & Implantables Assembly Markets: Hi-Rel Commercial Wireless Medical Night Vision Surveillance / Communications AESA Radar Systems

Assembly Markets: Hi-Rel Commercial Wireless Medical

4 Hi-Rel: Customers and Programs KAI supports numerous Hi-Rel programs with a variety of innovative ceramic modules designed for superior performance Electronic Antennas Integrated Antennas Electronic Antennas Liquid- Cooled Avionics Active Array Radar Sensor System Common Integrated Processors Integrated Antennas Detection / Warning System

Integrated Antennas Electronic Antennas Liquid- Cooled Avionics Active Array Radar

5 Manufacturing Experience Transmit & Receive Modules AlN Al 2 O 3 A HTCC LTCC Al 2 O 3 A DuPont 951 Ferro A6M Packages Wide - X X Wide - X Ku Wide - Ku Ka Ku L S Wide - S Wide - X X Ku Ka - Narrow S Wide - X Ku Ka Ka Wide - X Ku Q W

10000 1000 100 10 1 Packages Wide - X X Wide - X Ku Wide - Ku Ka Ku L

6 Benefits of Ceramic Packages Unique characteristics of Multilayer and Post-Fired Ceramic technologies can provide a wide variety of solutions. Excellent Design Flexibility High Density Design rule 3D Structure, Embedded Passives Single to Very High Layer Count Excellent Material Properties Physical & Mechanical Electrical Thermal Logic istribution DC Logic ers SL Transition RF Ground Planes/Vias SL-Connector Transition Braze pad & Cu/Ag brazing Pin No Glass bead is necessary Shroud Metal Parts Brazing Capability Heat Sinks / Seal Rings / Leads Many Material Options Reliable High Temp Brazing

Physical & Mechanical Electrical Thermal Logic istribution DC Logic ers SL Transition RF Ground Planes/Vias SL-Connector Transition Braze pad & Cu/Ag

7 Diverse Materials Available Ceramic Options Ceramic Material Options Dielectric Constant Electrical Thermal Mechanical Dissipation Factor (x10e -4 ) 1 MHZ 2 GHz 1 MHz 2 GHz CTE (ppm/k) (RT 400 C) Thermal Conductivity (W/mK) Flexural Strength (MPa) Young s Modulus of Elasticity (GPa) Conductor Material Alumina (Al2O3) A473* W, Mo A440* W, Mo A W, Mo AO CuW AO Mo AlN AN W GL Ag LTCC GL Ag GL330* / GL331* / / / / / 150 Cu Air Fired LTCC GL Cu GL Cu DuPont 951* (3GHz) Au, Resistors Ferro A6M* Au, Resistors Note: Material characteristics mentioned above are typical values. These values may change upon further improvement or modification of these materials and processes. DuPont 951 and Ferro A6M data listed are provided by the vendors. (*KAI-sourced materials)

1 14 400 310 W, Mo A443 9.6 5 6.9 18 460 310 W, Mo AO600 9.0 8.8 10 21 7.2 15 400 260 CuW AO700 9.4 9.2 6 6 7.2 21 620 315 Mo AlN AN242 8.7 8.6 1 170 4.7 150 400 320 W GL940 18.7 2.5 10.7 3.

8 Multilayer Packages HTCC, LTCC-Au, Ag, Kyocera LTCC-Cu Cu Up to 100 layers or more if required CuAg, AuSn brazing of metal components Frequency Converter Modules: Communication, Broadband Satellite LNA Modules: Low-K dielectric materials, RF interconnect optimization TR Modules: S-band to V-band; custom-designed features for high-performance applications Digital Modules: DAC, ADC, SerDes, DSP, DREX

Modules: Low-K dielectric materials, RF interconnect optimization TR Modules: S-band to V-band;

9 Design & Analysis: Cost Tradeoffs Proper design in HTCC can achieve desired price & performance objectives. HTCC modules are typically less expensive than LTCC modules For Hi-Rel programs, long range cost objectives and technology viability should be considered when choosing a material system LTCC - Au Average $ Per Package In High Volume on a Relative Scale LTCC - Ag LTCC - Cu HTCC

HTCC modules are typically less expensive than LTCC modules For Hi-Rel programs, long range cost

10 Contract Assembly KAI s Assembly Technology Dept. offers Flip Chip, Wire bond and SMD assembly capabilities in San Diego. ATD has a strong customer support team for technical guidance and trouble shooting. Target Business Low to mid volume assembly Prototype and engineering assembly with quick turn Commercial & Hi-Rel Optical sensor, complex module, medical RoHS Compliant Assembly Capabilities Flip Chip Assembly Wire Bond Assembly SMD Assembly BGA Ball Attachment Vacuum Solder Integrated FC Assembly Line

Target Business Low to mid volume assembly Prototype and engineering assembly with quick turn Commercial & Hi-Rel Optical

11 Contract Assembly: Image Sensors & Night Vision Image Sensors: 8-22 MegaPixel HDTV Security Satellite Machine Vision 22M Pixel 8M Pixel Night Vision: Ceramic/Metal Substrate Module Assembly TEC, Getter Attach process Seam seal

Vision 22M Pixel 8M Pixel Night Vision: Ceramic/Metal

12 North American Sales Offices Arizona 1620 South Stapley Drive, Ste. 125 Mesa, AZ Tel: (480) Fax: (480) California 472 Kato Terrace Fremont, CA Tel: (510) Fax: (510) Balboa Avenue San Diego, CA Tel: (858) Fax: (858) Massachusetts 24 Prime Parkway Natick, MA Tel: (508) Fax: (508) New York 1401 Route 52 Suite 103 Fishkill, NY Tel: (845) Fax: (845) New Jersey 2301 Cottontail Lane #300 Somerset, NJ Tel: (732) Fax: (732) Texas 740 E. Campbell Road Suite 520 Richardson, TX Tel: (972) Fax: (972) Caliche Rd Wimberley, TX Office: (512) Cell: (512) Washington / Oregon 5713 East Fourth Plain Boulevard Vancouver, WA Tel: (360) Fax: (360) Balboa Ave., San Diego, CA (800) kaicorp@kyocera.com

576-2600 Fax: (858) 569-9412 Massachusetts 24 Prime Parkway Natick, MA 01760-1520 Tel: (508) 651-8161 Fax: (508) 655-9139 New York 1401 Route 52 Suite 103 Fishkill, NY 12524 Tel: (845) 896-0480 Fax:

PCTF Approach Saves MW/RF Component/Module Costs

March 2007 Issue: Design Features PCTF Approach Saves MW/RF Component/Module Costs by: Nahum Rapoport, President, Remtec, Inc. 100 Morse Street, Norwood MA USA 02062 781-762-9191 sales@remtec.com This