to realize innovative electronic products 2 June 13, 2013 Jan Eite Bullema 3D Printing to realize innovative electronic products
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1 Overview of 2 What is? Methods / Materials / Current Products Rapid Prototyping evolves to Additive Manufacturing in Electronics Manufacturing Recent developments in 3D printing at TNO Conclusions / jan_eite.bullema@tno.nl 1
2 Overview of 3 Additive Manufacturing Layer by layer 3D CAD Slice file Part 4 The Third Industrial Revolution Additive Manufacturing / / jan_eite.bullema@tno.nl 2
3 Overview of 5 The Third Industrial Revolution TNO s Print Valley Machine 6 The Third Industrial Revolution Additive Manufacturing / / jan_eite.bullema@tno.nl 3
4 Overview of 7 Additive Manufacturing at the Peak of the Gartner 2012 hype curve 8 Overview of What is? Methods / Materials / Current Products Rapid Prototyping evolves to Additive Manufacturing in Electronics Manufacturing Recent developments in 3D printing at TNO Conclusions / jan_eite.bullema@tno.nl 4
5 Overview of 9 Processes several processes 10 Processes several processes / jan_eite.bullema@tno.nl 5
6 Overview of 11 Materials current pallet of around 200 materials, but growing fast 12 Fused Deposition Modelling (FDM) / jan_eite.bullema@tno.nl 6
7 Overview of 13 Fused Deposition Modelling 14 Laser Sintering - Polymers / jan_eite.bullema@tno.nl 7
8 Overview of 15 Laser Sintering Freedom Of Creation collection Courtesy of FOC 16 Stereo Lithography / jan_eite.bullema@tno.nl 8
9 Overview of 17 Stereo Lithography from Large to Small 18 Material Jetting / jan_eite.bullema@tno.nl 9
10 Overview of 19 Ink-jet Nano-particle & curing (thermal/photonic) Seed & plating Functional polymers Low-viscous materials thin layers, multi-pass needed Feature size > 50 µm Flat substrate Can be very fast (parallel processing) 20 Micro-dispensing Similar to FDM Nano-particle pastes, functional pastes (adhesive, solder-paste) High-viscous materials Thick layers, single pass Feature size > 70 µm Conformal Relatively slow / jan_eite.bullema@tno.nl 10
11 Overview of 21 Aerosol jetting The ink in a tank is atomized by ultrasonic or pneumatic mechanism (1) Resulting aerosol jet is then transferred (2) to the writing nozzle (3) where it is driven (sheath gas) towards the substrate 22 Overview of What is? Methods / Materials / Current Products Rapid Prototyping evolves to Additive Manufacturing in Electronics Manufacturing Recent developments in 3D printing at TNO Conclusions / jan_eite.bullema@tno.nl 11
12 Overview of 23 Rapid Prototyping => Additive Manufacturing hearing Aid Applications 24 Rapid Prototyping => Additive Manufacturing hearing Aid Applications / jan_eite.bullema@tno.nl 12
13 Overview of 25 Rapid Prototyping => Additive Manufacturing in 2 years time change from manual production to digital shell production. 26 Rapid Prototyping => Additive Manufacturing Growth Additive Manufacturing for Direct Parts production to 25% / jan_eite.bullema@tno.nl 13
14 Overview of 27 Rapid Prototyping => Additive Manufacturing Breakdown of the percentage of industrial sectors using AM Source: Wohlers Report Overview of What is? Methods / Materials / Current Products Rapid Prototyping evolves to Additive Manufacturing in Electronics Manufacturing Recent developments in 3D printing at TNO Conclusions / jan_eite.bullema@tno.nl 14
15 Overview of 29 Aerosol Jetting OPTOMEC makes aerosol jetting based printed circuit board Source:Optomec 30 Solder Jetting micro Fab print solder balls on wafer Source: micro Fab / jan_eite.bullema@tno.nl 15
16 Overview of 31 3D-Chip Scale Package microtec prints System in Package with RMPD technology Outline 4 x 5 x 0.8 mm Source: microtec 32 Dispensing Asymtec makes printed wire bond for stacked IC Source: Vertical Circuits Inc. / jan_eite.bullema@tno.nl 16
17 Overview of 33 Plasma Particle Jetting LEONI has developed the FLAMECON technology 34 May 14th, 2013 Arjen Koppens Penrose Program Opportunities in the Electronics Industry printed electronic conductive patterns inside a housing / jan_eite.bullema@tno.nl 17
18 Overview of 35 Printed 3D Packages printed packaging: University El Paso and nscript 36 3D Printed Gaming Die Embedded micro controller and accelerometer identify top surface Source: W.M. Keck Center for 3D Innovation / jan_eite.bullema@tno.nl 18
19 Overview of 37 Overview of What is? Methods / Materials / Current Products Rapid Prototyping evolves to Additive Manufacturing in Electronics Manufacturing Recent developments in 3D printing at TNO Conclusions 38 TNO Printed Packages printing of MEMS pressure nozzles with micro SLA Project together with Melexis / jan_eite.bullema@tno.nl 19
20 Overview of 39 TNO Printed Packages printing of MEMS pressure nozzles with micro SLA After pressure cooker test 40 TNO Printed Packages micro SLA based printed 3D interconnects / jan_eite.bullema@tno.nl 20
21 Overview of 41 TNO Printed Packages printed 3D Packages 42 TNO Printed Packages micro SLA based printed 3D interconnects / jan_eite.bullema@tno.nl 21
22 Overview of 43 TNO Printed Packages printed conductive interconnections based upon SLA and LIFT 44 TNO Printed Packages printed conductive interconnections based upon SLA and LIFT / jan_eite.bullema@tno.nl 22
23 Overview of 45 Overview of What is? Methods / Materials / Current Products Rapid Prototyping evolves to Additive Manufacturing in Electronics Manufacturing Recent developments in 3D printing at TNO Conclusions 46 Conclusion: TNO is setting up a shared research program for 3D printing / jan_eite.bullema@tno.nl 23
24 Overview of Potential Demonstration Project Printed wireless sensor, e.g. printed MYRYANED sensor STEP 1: Printed PCB Demonstrate: challenges in ink-substrate interaction conductive inks challenges in chip connection SMT chips PCB antenna Conductive adhesive µsla resin Silver ink Potential Demonstration Project Printed wireless sensor, e.g. printed MYRYANED sensor STEP 2: Embedded PCB with antenna Demonstrate: embedding of the chips printed antenna Printed antenna Conductive adhesive µsla resin Silver ink / jan_eite.bullema@tno.nl 24
25 Overview of Potential Demonstration Project Printed wireless sensor, e.g. printed MYRYANED sensor STEP 3: 2-level PCB with antenna Demonstrate: multi-layer embedding inter-layer connections Large via, filled with conductive adhesive Potential Demonstration Project Printed wireless sensor, e.g. printed MYRYANED sensor STEP 4: Embedded 2-level PCB with antenna Conductive adhesive / jan_eite.bullema@tno.nl 25
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