OPTOELECTRONICS PACKAGING FOR EFFICIENT CHIP-TO-WAVEGUIDE COUPLING

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1 OPTOELECTRONICS PACKAGING FOR EFFICIENT CHIP-TO-WAVEGUIDE COUPLING G. VAN STEENBERGE, E. BOSMAN, J. MISSINNE, B. VAN HOE, K.S. KAUR, S. KALATHIMEKKAD, N. TEIGELL BENEITEZ, A. ELMOGI CONTACT

Vertical light confinement between optoelectronics and

2 OPTOELECTRONICS PACKAGING In-plane coupling approach schemes IBM, ETRI, Georgia Inst. of Technol. Vertical light confinement between optoelectronics and waveguides Fujitsu, Tokai Univ., NTT, Siemens C-LAB GEERT VAN STEENBERGE GHENT UNIVERSITY / IMEC 2

3 OPTOELECTRONICS PACKAGING Vertical proximity coupling Institute of Microelectronics (Singapore), Univ. Oulu. Separate waveguide PCB approach Central Glass Co., Ltd. (Japan), Korea Photonics Technol. Inst., Reflexphotonics GEERT VAN STEENBERGE GHENT UNIVERSITY / IMEC 3

4 OPTOELECTRONICS PACKAGING Embedding of optoelectronics in RCC laminates Inha Univ. (South Korea) Embedding of optoelectronics in flex substrates Ghent Univ. / imec GEERT VAN STEENBERGE GHENT UNIVERSITY / IMEC 4

5 ULTRA-THIN OPTOELECTRONIC CHIP PACKAGE Ultra thin optoelectronic package Thinned commercial (opto)electronic components Embedded in thin & flexible polymer foils Component (bare die) thickness ~20µm Total thickness ~40µm OE component Polymer foil GEERT VAN STEENBERGE GHENT UNIVERSITY / IMEC 5

6 ULTRA-THIN OPTOELECTRONIC CHIP PACKAGE Cu heat sink Via ablation Embedding polymer Top contact metallization OE chip Covering polymer layers Chip leveling Package release Precise process flow depends on substrate, polymer and component GEERT VAN STEENBERGE GHENT UNIVERSITY / IMEC 6

7 INTEGRATION WITH POLYMER OPTICAL WAVEGUIDES Acrylate, epoxy, silsesquioxanes, or silicone based Typical propagation loss below 0.1dB/cm Rigid Additional bending and stretching loss Stretch Flex GEERT VAN STEENBERGE GHENT UNIVERSITY / IMEC 7

8 Z (µm) INTEGRATION WITH POLYMER OPTICAL WAVEGUIDES Sequential build-up approach Typical total optical loss 6dB Mirror loss 0.5 db Lateral scan of the coupling efficiency Y (µm) coupling plug 45 coupling plug Signal in VCSEL array Waveguide array Photodiode array Signal out GEERT VAN STEENBERGE GHENT UNIVERSITY / IMEC 8

9 INTEGRATION WITH POLYMER OPTICAL WAVEGUIDES Modular approach Typical total optical loss 3dB Stretching up to 30% without significant loss VCSEL array Photodiode array 45 coupling plug 45 coupling plug GEERT VAN STEENBERGE GHENT UNIVERSITY / IMEC 9

10 INTEGRATION WITH OPTICAL FIBERS OE component assembly based on adapted flip chip process GEERT VAN STEENBERGE GHENT UNIVERSITY / IMEC 10

11 EU PROJECT PHOSFOS PHOTONIC SKINS FOR OPTICAL SENSING Integration of optoelectronic chips Integration of coupling structures Integration of (multiplexed) fiber sensors GEERT VAN STEENBERGE GHENT UNIVERSITY / IMEC 11

12 EU PROJECT PHOSFOS PHOTONIC SKINS FOR OPTICAL SENSING Tactile sensing Vibrations Strain sensing GEERT VAN STEENBERGE GHENT UNIVERSITY / IMEC 12

13 EU PROJECT FIREFLY MULTILAYER PHOTONIC CIRCUITS Challenges Integration of waveguides and VCSELs Integration of waveguides and glass fibers Integration of photonic crystals and waveguides Multilayer Photonic Circuits made by Nano- Imprinting of Waveguides and Photonic Crystals GEERT VAN STEENBERGE GHENT UNIVERSITY / IMEC 13

14 EU PROJECT FIREFLY VCSEL WAVEGUIDE INTEGRATION Face-up embedding of VCSELS Planarity after chip embedding Single mode polymer waveguide technology GEERT VAN STEENBERGE GHENT UNIVERSITY / IMEC 14

15 EU PROJECT FIREFLY WAVEGUIDE FIBER INTEGRATION Laser direct writing (IBM) End facet (TE Connectivity) Light IN Light OUT Initial testing (TE Connectivity) Laser cleaning GEERT VAN STEENBERGE GHENT UNIVERSITY / IMEC 15

16 EU PROJECT MIRAGE TERABIT CAPACITY AOC Scale line rate to 40G Introduce new degrees of parallelization WDM multi-core multi-level 3D photonic-electronic integration GEERT VAN STEENBERGE GHENT UNIVERSITY / IMEC 16

17 EU PROJECT MIRAGE TERABIT CAPACITY AOC Optoelectronics assembly Accurately defining micro-bumps using Laser Induced Forward Transfer (LIFT) 1 Adhesive bonding / thermocompression GEERT VAN STEENBERGE GHENT UNIVERSITY / IMEC 17

18 2 EU PROJECT MIRAGE TERABIT CAPACITY AOC Optoelectronics assembly Flip chip bonding of the die = chip placement + adhesive curing + thermo-compression bonding Flip chip bonder chuck Substrate + metal tracks + adhesive bumps OE chip (active area facing down) VCSEL test chip (1x4 array) After bonding GEERT VAN STEENBERGE GHENT UNIVERSITY / IMEC 18

testing after bonding 3 LVI curve for bonded test VCSELs

19 EU PROJECT MIRAGE TERABIT CAPACITY AOC Optoelectronics assembly Characterization of bonded VCSEL/PD chips Shear testing after bonding 3 LVI curve for bonded test VCSELs chip encapsulation GEERT VAN STEENBERGE GHENT UNIVERSITY / IMEC 19

20 ACKNOWLEDGEMENT GEERT VAN STEENBERGE GHENT UNIVERSITY / IMEC 20

21 THANK YOU

CENTER FOR MICROSYSTEMS TECHNOLOGY (CMST) IMEC UGENT TECHNOLOGIEPARK (BLDG 914) B-9052 GENT HTTP://WWW.CMST.BE

CENTER FOR MICROSYSTEMS TECHNOLOGY (CMST) IMEC UGENT TECHNOLOGIEPARK (BLDG 914) B-9052 GENT HTTP://WWW.CMST.BE CMST: DESIGN & TECHNOLOGY OF MICROSYSTEMS ORGANIZATIONAL STRUCTURE Faculty of Engineering