The Internet of Everything or Sensors Everywhere

Transcription

1 The Internet of Everything or s Everywhere 2015 This document and the information included herein are proprietary of the China Wafer Level CSP Co., Ltd. Disclosure or reproduction by any media, inclusive of electronic means, of any part, is prohibited except with prior and written consent by China Wafer Level CSP Co., Ltd.

2 The Internet Of Things (IoT): - Connect, Talk, Think and Act The Internet of Things (IoT) is a scenario in which objects, animals or people are provided with unique identifiers and the ability to transfer data over a network without requiring human-to-human or human-to-computer interaction.

3 The Way We Access The Internet Has Shifted Dramatically

4 We Started Using It On PCs And Then Moved To Smartphones And Tablets

5 Now The Internet Is Moving Into Everyday Objects And Devices

6 Inside Our Homes

7 Workplaces

8 The Internet Of Things Will Be By Far The World s Largest Device Market The Internet Of Everything We Are Here Source: www. intelligence.businessinsider. com

9 It Will Soon Be Larger Than The PC, Tablet, And Smartphone Markets Combined IoT Device Growth vs. PC, Smartphone and Tablet Growth We Are Here Source: www. intelligence.businessinsider. com

10 It s A Huge Revenue Opportunity For Both New Startups And Legacy Tech Companies Estimated IoT Revenue We Are Here Source: www. intelligence.businessinsider. com

11 What Are The Main Drivers Of IoT Growth By 2020, More Than Half Of Planet Will Be Connected To The Internet We Are Here Source: www. intelligence.businessinsider. com

12 This Is How Our World Connected Today DATA CENTER CLOUD LOCAL BATTERY REMOTE PLUGGED IN APPS MOBILE DEVICES

13 What It Has To Do With Advanced Packaging This Is... But So Is This This is not a simple packaging technology anymore! This is completely new level of Package and System Level Engineering!

14 There Is A Big Shift Ahead In Technology Evolution Foundry Scaling Node Generation 45 nm CMOS Scaling (Moore s Law) 32 nm 28 nm 22 nm <22 nm Improved graphics (HD, 3D gaming) Increased functional density Multi-screen operation Extended battery life High speed connectivity Package Size Cost/Chip Packaging Time Scaling 2.0mm Reducing Form Factor 1.5mm 1.0mm Time Performance metrics are shifting from CMOS scaling to package level integration 0.8mm <0.8mm

15 Large Companies Building Products And Rushing Into The IoT

16 Image and Security s Are The Most Critical Components CMOS image sensors Fingerprint sensors Market Size: 20.0B USD by 2020 Market Size: 15.0B USD by 2020

17 The Price Of s That Make Up The IoT Will Keep Improving Average Cost Forecast We Are Here Source: www. intelligence.businessinsider. com

18 China Wafer Level CSP Co., Ltd. We have shipped over 100 Million biometric and more than 3 Billion image sensors with our IP

19 Over 10 Years Of Leadership In Innovation Our Inventions are found in hundred of millions of today s smartphones and broad range of electronic devices

20 This Is How It s Started Founded in 2005 Pioneered China wafer level Through Silicon Via (TSV) packaging industry Industry first 12 HVM CIS TSV package provider China s largest mobile Fingerprint sensor module manufacturer Established broad technology & IP portfolio Listed on SSE: , Market Cap.: > USD2.0B

21 We Created The Value Added Operational Model SILICON CF & ML TSV or Fan-Out Packaging Probe & Functional Testing Module Assembly Quality Control Functional Testing Packing & Shipment Foundry & IDM Turnkey Solutions: Design, Development, Prototyping and High Volume Manufacturing

22 We Bridge The Infrastructure Gap BGA / CSP $400B+ FOUNDRY ~$10B+ Segment, with 20% CAGR $40.0B+ OSAT 1990s FLIP CHIP RDL Wafer Bumping WL Test 2000s 3D IC Micro Bumping Thin & Reveal Via Last TSV WL ASSY 3D WL Test 2010s

23 Since 2013, Leading Supplier Of 12-Inch CIS TSV CSP TSV structure Vertical Via (75-90º) Micro-Via in Trench TSV Isolation PECVD (SiO2, Si3N4) PECVD (SiO2) or Polymer TSV metallization Aluminum (Al) or Titanium / Copper (Ti/Cu) Aluminum (Al) or Titanium / Copper (Ti/Cu) TSV aspect ratio 1:5 1:3 TSV diameter 40µm 50µm CHINA s LARGEST MID- END INFRASTRUCTURE TSV pitch 100µm 125µm TSV Process Via silicon etch followed by dielectric deposition Trench and micro-via silicon etch followed by dielectric coating

24 Since 2013, Our Fingerprint Technology Used By Tier 1 Companies PROCESS: bond pads 3D rerouting assembly on the substrate Encapsulation and module assembly BENEFITS: Ultra-thin module height Small form factor (X,Y,Z) Low noise level - performance enhancement Scratch resistant surface JEDEC Level 1 moisture sensitivity SAPPHIRE COVER MODULE Processed and shipped up to 12M units per month OVERMOLD MODULE

25 Mobile And Handset Connected Devices Will Help Us Control The IoT IoT Controller Forecast We Are Here Source: www. intelligence.businessinsider. com

26 The Connected TV Is The IoT First Major Consumer Success

27 But, Connected Cars Are Also Going Mainstream Electric Powered by Apps Driver Assist Self Driving Sooner or later every new car will have downloadable applications, either through a tethered smartphone or a built-in data link to local wireless carriers

28 Cars Shipped With Built-In Connectivity By 2020, 100 Million New Cars Will Have Their Own Internet Connections Many Car Makers Are Already Producing Connected Cars Source: www. intelligence.businessinsider. com

29 Cars Need A Lot Of s Break Fluid Level Turbo Boost Water Mass Air Flow Crash/ Impact Occupant Detection Pedal Position Drowsy Driver Detection Steering Rate Rear Vision Barometric Pressure Lidar Parking Radar Variable Reluctance Crank Shaft Position Battery Methanol Fuel Ultrasonic Proximity ABS Wheel Speed Oxygen Curb Feeler Coolant Temperature Light Outage Ambient Temperature Transmission Input Speed Washer Fluid Wheel Speed Vehicle Speed Air-Fuel Ration Acceleration Transmission Temperature Coolant Level Tire Pressure Torque Long Range Radar Transmission Shift Position Manifold Absolute Pressure EGR Valve Position Forward Vision Vehicle Height Rain Rollover Gyro Ambient Light GPS Compass Throttle Position Oil Temperature EGR Pressure Feedback Knock

30 We Are Partnering And Building Automotive Grade Products Image Is The Key / Base In ADAS Predicted Huge Growth In ADAS $165 B CIS Front Side CIS Back Side CIS Front Side CIS Back Side Glass Package Cross Section Glass $18.5 B Image Image Reliability: AEC-Q100 Grade-2 8.1µm 49µm Reliability: AEC-Q100 Grade-2 7.5µm 7.5µm 46µm

31 Robots Are Another Area Set For Expansion Microsoft Is Using Them As Security Guards

32 Aerial Drones Are Increasingly Being Used For Civilian Purposes Businesses Are Slowly Beginning To Test Drones To Make Deliveries Source: www. intelligence.businessinsider. com

33 Brief Summary: Think about the possibilities IoT will impact every aspect of our life Reality of ambient intelligence enabled by sensors will come true There will be more s in our world by far than any other devices combined. Billions upon billions today and trillions tomorrow. s will give us superhuman senses: to see "through" walls, to "hear" sounds many miles away, to "know" things we never could have known before.