The T-lam System

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Britton Ross
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1 The T-lam System

2 T-lam..Where It All Begins.. T-preg The Heart of the T-lam System Three Main Functions Conducts Heat Insulate Electrically Adhesive Bonding Layer

3 The T-lam System T-Preg Thermally Conductive Dielectric/ Prepreg DSL Double Sided Laminate IMPCB s Insulated Metal Printed Circuit Boards

4 IMPCB TM Single Sided Board T-preg Copper Foil Base Metal Material One or Multiple Layers of T-preg Copper weight 1 to 6 ounces Dielectric layers 4,6 or 8 mil Base Metal Copper or Aluminum 10 to 120 mil

5 Two-Layer T-lam PTH & Thermal Vias T-lam DSL T-preg Metal Base Mounting Hole Construction Materials DSL internal copper weight up to 4 oz T-Preg Metal Base

6 Hybrid IMPCB with FR-4 / T-preg FR -4 PTH & Thermal Vias Mounting Hole Metal Base T-preg Construction Materials FR-4-Double-Sided PCB T-Preg Metal Base

7 Multilayer Metal Base PTH & Thermal Vias FR4 PCB Mounting Hole Buried Vias Construction Materials FR4 Copper Foil T-Preg Metal Base

8 Multilayer Metal Base PTH & Thermal Vias T-lam DSL & T-preg Mounting Hole Buried Vias Construction Materials DSL Copper Foil T-Preg Metal Base

9 Double-Sided Metal Core T-preg Metal Core Mounting Hole PTH Construction Materials Copper Foil T-preg Metal-Core

10 Multilayer FR-4/T-preg Hybrid FR-4 Multilayer Board T-preg Buried Via Construction Materials 4 layer FR4 PCB T-preg PTH PTH & Blind Thermal Vias Mounting Hole

11 T-preg Performance Properties Peel Strength, pli Flammability Class PROPERTIES Thermal Conductivity, W / m o C Dielectric Strength, V / mil Dielectric Constant, Dk Glass Fiber Reinforcement UL RTI Operating Temperature, o C Lamination Parameters, psi / o C Relative Price, Fabricated Single Sided PCB(Approximate) T-Preg HTD Yes ~ 7 94V / X T-preg 1KA Yes ~ 6 94V / X

Temperature, o C Lamination Parameters, psi / o C Relative Price, Fabricated Single Sided

12 T-lam What / Why? T-lam: Thermal Laminate, thermally conductive dielectric used to make PCBs (printed circuit boards). T-lam: Thermal Conductivity 3.0 W/m K Conventional PCBs use FR4 (fiberglass) as the dielectric, thermally insulating. Thermal Conductivity (TC) of FR4 ~ 0.25 W/m K T-lam PCB ~ 10 times more heat transfer than FR4

13 T-lam How does it work? Conventional PCB Heat Transfer Conventional FR4 PCB: the heat is dissipated off the surface of the component via thermal interface material or air T-lam is used to dissipate the heat from the base of the component. PCB on a heat sink.

14 High Power LED Lighting General Lighting, Signage, Automotive Requirement Low thermal resistance. Keeping the LED operating below 80 0 C 3watts+ LED or clusters. If light from source is so bright you can not look directly at it, target application. Solution IMPCB 4 mil 1KA (.054 O C-cm/Watt) IMPCB

Keeping the LED operating below 80 0 C 3watts+ LED or clusters.

15 High Power LED Lighting General Lighting, Signage, Automotive LED Lighting: Thermal management a must Use of T-lam in conjunction with a thermal interface material i.e. Grease or PCM

16 High Power LED Lighting General Lighting, Signage, Automotive Advantages of using 1KA04 T-preg Lowest thermal resistance of available materials Keeps the LED cooler increasing efficiency and life 40% better performance than Bergquist MP3 To be used in application using 75VDC or less, 1KA06 is recommended when voltages exceed 75VDC Thermal Resistance per Sq. in. T-preg 1KA06 T-Preg 1KA04 T-Preg HTD RTI MP3

Bergquist MP3 To be used in application using 75VDC or less, 1KA06 is recommended when voltages exceed 75VDC 0.1 0.

17 T-lam Advantages T-Preg HTD04 T-Preg 1KA04 Berquist CML Berqquist MP 3 Denka K-1 0 Thermal Resistance per Sq in. C

18 T-lam Advantages Maximum Operating Temp.oC T-Preg HTD04 T-Preg 1KA04 Berquist CML Berqquist MP 3 Denka K-1

19 T-lam Advantages Thermal Dielectric T-preg dissipates heat keeping components cool which results in increased performance and life One to six ounce copper on external layers. One to four ounce on internal layers Typical thickness of 4-12 mil for T-preg provides outstanding thermal performance with high dielectric strength and low capacitance T-preg only Thermally conductive prepreg (3W/m.K ) in the world. 10 times the heat dissipating capability of FR4 T-lam PCBs. Can eliminate the need for fans, heat sinks and heat spreaders T-lam remains flexible after curing, absorbing the CTE mismatch

One to four ounce on internal layers Typical thickness of 4-12 mil for T-preg provides outstanding thermal performance with high dielectric strength

20 T-lam Advantages T-lam prices are typically equal or less than competitive thermal products. Strategic alliance with Fabricators, allows for quick turn capabilities, competitive pricing and unlimited capacity Versatile stand alone T-Preg. No restriction on the number of layers or variety of materials. Designs are limited only by ones imagination. This make T-preg unique and separates us from our competitor Manufacturing process and design rules similar to conventional PCBs. Routed, punched or scored in single or panel form Boards are processed with standard SMT assembly equipment

No restriction on the number of layers or variety of materials. Designs are limited only by ones imagination.

21 The T-lam System Thank you Have a great day Angelo Hrenczuk

Thermal Management Solutions for Printed Circuit Boards used in Digital and RF Power Electronics and LED assemblies

Thermal Management Solutions for Printed Circuit Boards used in Digital and RF Power Electronics and LED assemblies Sandy Kumar, Ph.D. Director of Technology American Standard Circuits, Inc 3615 Wolf Road