HCC4060B HCF4060B 14-STAGE RIPPLE CARRY BINARY COUNTER/DIVIDER AND OSCILLATOR

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1 HCC4060B HCF4060B 14-STAGE RIPPLE CARRY BINARY COUNTER/DIIDER AND OSCILLATOR MEDIUM-SPEED OPERATION COMMON RESET FULLY STATIC OPERATION BUFFERED INPUTS AND OUTPUTS QUIESCENT CURRENT SPECIFIED TO 20 FOR HCC DEICE 5, 10 AND 15 PARAMETRIC RATINGS INPUT CURRENT OF 100nA AT 18 AND 25 o C. FOR HCC DEICE 1005 TESTED FOR QUIESCENT CURRENT MEETS ALL REQUIREMENTS OF JEDEC TEN- TATIE STANDARD N. 13A, STANDARD SPECIFICATIONS FOR DESCRIPTION OF B SERIES CMOS DEICES EY (Plastic Package) F (Ceramic Package) M1 (Micro Package) C1 (Chip Carrier) ORDER CODES : HCC4060BF HCF4060BM1 HCF4060BEY HCF4060BC1 PIN CONNECTIONS DESCRIPTION The HCC4060B (extended temperature range) and HCF4060B (intermediate temperature range) are monolithic integrated circuit, available in 16-lead dual in line plastic or ceramic package and plastic micropackage. The HCC/HCF4060B consist of an oscillator section and 14 ripple carry binary counter stages. The oscillator configuration allows design of either RC or crystal oscillator circuits. A RESET input is provided which reset the counter to the all 0 s state and disables oscillator. A high level on the RESET line accmplishes the reset function. All counter stages are master slave flip-flops. The state of the counter is advanced one step in binary order on the negative transition of φ1 (and φ0). All inputs and outputs are fully buffered. Schmitt trigger action on the clock lin permits unlimited clock rise and fall time. September /13

2 FUNCTIONAL DIAGRAM ABSOLUTE MAXIMUM RATING Symbol Parameter alue Unit DD * Supply oltage: HCC Types HCF Types -0.5 to to +18 i Input oltage -0.5 to DD I I DC Input Current (any one input) ± 10 ma Ptot Total Power Dissipation (per package) Dissipation per Output Transistor for Top = Full Package Temperature Range mw mw Top Operating Temperature: HCC Types -55 to +125 HCF Types -40 to +85 o C C Tstg Storage Temperature -65 to +150 o C Stressesabove those listedunder Absolute Maximum Ratings may cause permanent damage to thedevice. This isa stress ratingonly and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for external periods may affect device reliability. * All voltage values are referred to SS pin voltage. RECOMMENDED OPERATING CONDITIONS Symbol Parameter alue Unit DD Supply oltage: HCC Types HCF Types 3to18 3to15 I Input oltage 0 to DD T op Operating Temperature: HCC Types HCF Types -55 to to +85 o C o C 2/13

3 LOGIC DIAGRAM 3/13

4 STATIC ELECTRICAL CHARACTERISTICS (over recommended operating conditions) Symbol IL OH OL IH IL I OH IOL Parameter Quiescent Current Output High oltage Output Low oltage Input High oltage Input Low oltage Output Drive Current Output Sink Current HCC Types HCF Types HCC Types HCF Types HCC Types HCF Types I () Test Conditios O () IO (µa) DD () alue TLOW * 25 o C THIGH * Min. Max. Min. Typ. Max. Min. Max. 0/ / / / / / / /5 < /10 < /15 < /0 < /0 < /0 < /4.5 < /9 < /13.5 < /0.5 < /1 < /1.5 < / / / / / / / / / / / / / / IIH, IIL Input Leakage 0/18 18 ±0.1 ±10-5 ±0.1 ±1 µa Any Input Current 0/15 15 ±0.3 ±10-5 ±0.3 ±1 µa CI Input Capacitance Any Input pf *TLOW =-55 o CforHCC device: -40 o C for HCF device. *THIGH =+125 o CforHCC device: +85 o C for HCF device. The Noise Margin for both 1 and 0 level is: 1 min. with DD = 5, 2 min. with DD = 10, 2.5 min. withdd =15 Unit µa ma ma 4/13

5 DYNAMIC ELECTRICAL CHARACTERISTICS (Tamb =25 o C, CL =50pF,RL= 200 KΩ, typical temperature coefficent for all DD values is 03 %/ o C, all input rise and fall times= 20 ns) Symbol Parameter Test Conditions alue DD () Min. Typ. Max. Unit tplh Propagation Delay Time tphl (φ to Q4 out) ns t PLH Propagation Delay Time t PHL (Qn to Q n+1 ) ns t TLH Transition Time t THL ns tw Input Pulse Width f = 100KHz ns t r,t f Input Pulse Rise and Fall Time Unlimited µs f max Maximum Clock Input Frequency MHz RESET OPERATION tphl Propagation Delay Time ns tw Reset Pulse Width ns RC OPERATION ariation of Frequency (Unit-to-Unit) C X = 200pF R S = 560KΩ R X =50KΩ KHz ariation of Frequency With oltage Change CX = 200pF 5to10 2 (Same Unit) R S = 560KΩ R X =50KΩ 10 to 15 1 RX CX =10µF 5 20 CX =50µF CX =10µF CX RX = 500 KΩ R X = 300 KΩ R X = 300 KΩ Maximum Oscillator Frequency * R X =5KΩ C X = 15pF * RC oscillator applications are not recommended at supply voltages below 7 for R X = 50KΩ MΩ mf pf 5/13

6 Typical Output Low (sink) Current Characteristics Minimum Output Low (sink) Current Characteristics Typical Output High (source) Current Characteristics Minimum Output High (source) Current Characteristics 6/13

7 DETAIL OF TYPICAL FILP-FLOP STAGE TYPICAL RC OSILLATOR CIRCUIT TYPICAL CRYSTAL OSCILLATOR CIR- CUIT 7/13

8 TEST CIRCUITS Quiescent Device Current. Noise Immunity. Input Leakage Current. 8/13

9 Plastic DIP16 (0.25) MECHANICAL DATA DIM. mm inch MIN. TYP. MAX. MIN. TYP. MAX. a B b b D E e e F I L Z P001C 9/13

10 Ceramic DIP16/1 MECHANICAL DATA DIM. mm inch MIN. TYP. MAX. MIN. TYP. MAX. A B D E e F G H L M N P Q P053D 10/13

11 SO16 (Narrow) MECHANICAL DATA DIM. mm inch MIN. TYP. MAX. MIN. TYP. MAX. A a a b b C c1 45 (typ.) D E e e F G L M S 8 (max.) P013H 11/13

12 PLCC20 MECHANICAL DATA DIM. mm inch MIN. TYP. MAX. MIN. TYP. MAX. A B D d d E e e F G M M P027A 12/13

13 Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsability for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may results from its use. No license is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics. Specificationsmentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. SGS-THOMSON Microelectronicsproducts are not authorized foruse ascritical componentsin life support devices or systems without express written approval of SGS-THOMSON Microelectonics SGS-THOMSON Microelectronics - All Rights Reserved SGS-THOMSON Microelectronics GROUP OF COMPANIES Australia - Brazil - France - Germany - Hong Kong - Italy - Japan - Korea - Malaysia - Malta - Morocco - The Netherlands - Singapore - Spain - Sweden - Switzerland - Taiwan - Thailand - United Kingdom - U.S.A 13/13