HCC/HCF4027B DUAL-J-K MASTER-SLAVE FLIP-FLOP

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1 DUAL-J-K MASTER-SLAVE FLIP-FLOP. SET-RESET CAPABILITY STATIC FLIP-FLOP OPERATION - RETAINS STATE INDEFINITELY WITH CLOCK LEVEL EITHER HIGH OR LOW MEDIUM SPEED OPERATION - 16MHz (typ. clock toggle rate at 10V) STANDARDIZED SYMMETRICAL OUTPUT CHARACTERISTICS QUIESCENT CURRENT SPECIFIED TO 20V FOR HCC DEVICE INPUT CURRENT OF 100nA AT 18V AND 25 C. FOR HCC DEVICE 100% TESTED FOR QUIESCENT CURRENT MEETS ALL REQUIREMENTS OF JEDEC TEN- TATIVE STANDARD N 0. 13A, STANDARD SPECIFICATIONS FOR DESCRIPTION OF B SERIES CMOS DEVICES. EY (Plastic Package) M1 (Micro Package) F (Ceramic Frit Seal Package) C1 (Plastic Chip Carrier) ORDER CODES : HCC4027BF HCF4027BM1 HCF4027BEY HCF4027BC1 PIN CONNECTIONS DESCRIPTION The HCC4027B (extended temperature range) and HCF4027B (intermediate temperature range) are monolithic integrated circuit, available in 16-lead dual in-line plastic or ceramic package and plastic micro package. The HCC/HCF4027B is a single monolithic chip integrated circuit containing two identical complementary-symmetry J-K master-slave flip-flops. Each flip-flop has provisions for individual J, K, Set, Reset, and Clock input signals, Buffered Q and Q signals are provided as outputs. This input-output arrangement provides for compatible operation with the HCC/HCF4013B dual D-type flip-flop. The HCC/HCF4027B is useful in performing control, register, and toggle functions. Logic levels present at the J and K inputs along with internal self-steering control the state of each flip-flop ; changes in the flipflop state are synchronous with the positive-going transition of the clock pulse. Set and reset functions are independent of the clock and are initiated when a high level signal is present at either the Set or Reset input. June /12

2 FUNCTIONAL DIAGRAM ABSOLUTE MAXIMUM RATINGS Symbol Parameter Value Unit V DD * Supply Voltage : HCC Types HCF Types 0.5 to to + 18 V V V i Input Voltage 0.5 to V DD V I I DC Input Current (any one input) ± 10 ma P tot Total Power Dissipation (per package) Dissipation per Output Transistor for T op = Full Package-temperature Range mw mw T op Operating Temperature : HCC Types HCF Types 55 to to+85 T stg Storage Temperature 65 to C Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for external periods may affect device reliability. * All voltage values are referred to VSS pin voltage. C C RECOMMENDED OPERATING CONDITIONS Symbol Parameter Value Unit V DD Supply Voltage : HCC Types HCF Types 3to18 3to15 V I Input Voltage 0 to V DD V T op Operating Temperature : HCC Types HCF Types 55 to to+85 V V C C 2/12

3 LOGIC DIAGRAM AND TRUTH TABLE ONE OF TWO IDENTICAL J-K FLIP-FLOPS TRUTH TABLE Present State Next State CL Inputs Output Outputs J K S R Q Q Q I X O O O / I O X O O O I / I O O X O O O / O I X I O O I / O I X X O O X \ No Change X X I O X X I O X X O I X X O I X X I I X X I I LOGIC I = HIGH LEVEL LOGIC O = LOW LEVEL - LEVEL CHANGE X - DON T CARE 3/12

4 STATIC ELECTRICAL CHARACTERISTICS (over recommended operating conditions) Test Conditions Value Symbol Parameter V I V O I O V DD T Low * 25 C T High * Unit (V) (V) (µa) (V) Min. Max. Min. Typ. Max. Min. Max. I L Quiescent 0/ Current HCC 0/ Types 0/ / µa 0/ HCF Types 0/ / V OH Output High 0/ 5 < Voltage 0/10 < V 0/15 < V OL Output Low 5/0 < Voltage 10/0 < V 15/0 < V IH Input High 0.5/4.5 < Voltage 1/9 < V 1.5/13.5 < V IL Input Low 4.5/0.5 < Voltage 9/1 < V 13.5/1.5 < I OH Output 0/ Drive HCC 0/ Current Types 0/ / ma 0/ HCF 0/ Types 0/ / I OL Output 0/ Sink HCC 0/ Current Types 0/ ma 0/ HCF Types 0/ / I IH,I IL Input HCC Leakage Types 0/18 18 ± 0.1 ±10 5 ± 0.1 ± 1 Any Input Current HCF Types 0/15 15 ± 0.3 ±10 5 ± 0.3 ± 1 µa C I Input Capacitance Any Input pf *TLow= 55 CforHCC device : 40 C for HCF device. *THigh= C for HCC device : + 85 C for HCF device. The Noise Margin for both 1 and 0 level is : 1V min. with VDD = 5V, 2V min. with VDD = 10V, 2.5 V min. with VDD = 15V. 4/12

5 DYNAMIC ELECTRICAL CHARACTERISTICS (T amb =25 C, C L = 50pF, R L = 200kΩ, typical temperature coefficient for all V DD = 0.3%/ C values, all input rise and fall time = 20ns) Symbol t PLH,t PHL t PLH t PHL Propagation Delay Time Propagation Delay Time Parameter Clock to Q or Q Outputs Set to Q or Reset to Q Test Conditions Value V DD (V) Min. Typ. Max Propagation Set to Q or Reset Delay Time to Q t THL,t TLH Transition Time t W Pulse Width Clock t W Pulse Width Set or Reset t r,t f Clock Input Rise or Fall Time t setup Setup Time Data f max * Input tr, tf = 5ns. Maximum Clock Input Frequency * Toggle Mode Unit ns ns ns ns µs ns MHz 5/12

6 Typical Output Low (sink) Current Characteristics. Minimum Output Low (sink) Current Characteristics. Charac- Typical Output High (source) Current teristics. Minimum Output High (source) Current Characteristics. Typical Propagation Delay Time vs.load Capacitance (CLOCK or SET to Q, CLOCK or RESET to Q). Typical Propagation Delay Time vs. Load Capacitance (SET to Q or RESET to Q). 6/12

7 Typical Maximum Clock Frequency vs. Supply Voltage (Toggle Mode). Typical Dynamic Power Dissipation/ Per Device vs.frequency. TEST CIRCUITS Quiescent Device Current. Input Voltage. Input Leakage Current. 7/12

8 Plastic DIP16 (0.25) MECHANICAL DATA DIM. mm inch MIN. TYP. MAX. MIN. TYP. MAX. a B b b D E e e F I L Z P001C 8/12

9 Ceramic DIP16/1 MECHANICAL DATA DIM. mm inch MIN. TYP. MAX. MIN. TYP. MAX. A B D E e F G H L M N P Q P053D 9/12

10 SO16 (Narrow) MECHANICAL DATA DIM. mm inch MIN. TYP. MAX. MIN. TYP. MAX. A a a b b C c1 45 (typ.) D E e e F G L M S 8 (max.) P013H 10/12

11 PLCC20 MECHANICAL DATA DIM. mm inch MIN. TYP. MAX. MIN. TYP. MAX. A B D d d E e e F G M M P027A 11/12

12 Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsability for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may results from its use. No license is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics. Specificationsmentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. SGS-THOMSON Microelectronicsproducts are not authorized foruse ascritical componentsin life support devices or systems without express written approval of SGS-THOMSON Microelectonics SGS-THOMSON Microelectronics - All Rights Reserved SGS-THOMSON Microelectronics GROUP OF COMPANIES Australia - Brazil - France - Germany - Hong Kong - Italy - Japan - Korea - Malaysia - Malta - Morocco - The Netherlands - Singapore - Spain - Sweden - Switzerland - Taiwan - Thailand - United Kingdom - U.S.A 12/12

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