Enhancement Mode phemt
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1 Freescale Semiconductor Technical Data Enhancement Mode phemt Technology (E -phemt) Low Noise Amplifier The MML09212H is a 2--stage low noise amplifier (LNA) with active bias and high isolation for use in cellular infrastructure applications. It is designed for a range of low noise, high linearity applications such as picocell, femtocell, tower mounted amplifiers (TMA) and receiver front--end circuits. It operates from a single voltage supply and is suitable for applications with frequencies from 400 to 1400 MHz such as ISM, GSM, W--CDMA and LTE. Features Low Noise Figure: MHz Frequency: MHz Unconditionally Stable Over Temperature High Reverse Isolation: MHz P1dB: MHz Small--Signal Gain: MHz Third Order Output Intercept Point: MHz Active Bias Control (On--chip) Single 5 V Supply Supply Current: 150 ma 50 Ohm Operation (some external matching required) Cost--effective 12--pin, 3 mm QFN Surface Mount Plastic Package In Tape and Reel. T1 Suffix = 1,000 Units, 12 mm Tape Width, 7--inch Reel. Document Number: MML09212H Rev. 2, 9/ MHz, 37.5 db 22.8dBm,0.52dBNF E-pHEMT LNA QFN 3 3 Table 1. Typical Performance (1) Characteristic Symbol 400 MHz 900 MHz 1400 MHz Unit Noise Figure (2) NF db Input Return Loss (S11) Output Return Loss (S22) Small--Signal Gain (S21) Power 1dB Compression Third Order Input Intercept Point Third Order Output Intercept Point IRL db ORL db G p db P1dB dbm IIP dbm OIP dbm 1.,T A =25 C, 50 ohm system, application circuit tuned for specified frequency. 2. Noise figure value calculated with connector losses removed. Table 3. Thermal Characteristics Thermal Resistance, Junction to Case Case Temperature 83 C, 5 Vdc, 150 ma, no RF applied Table 2. Maximum Ratings Rating Symbol Value Unit Supply Voltage V DD 6 V Supply Current I DD 300 ma RF Input Power P in 20 dbm Storage Temperature Range T stg --65 to +150 C Junction Temperature T J 175 C Characteristic Symbol Value (3) Unit R JC 37 C/W 3. Refer to AN1955, Thermal Measurement Methodology of RF Power Amplifiers. Go to Select Documentation/Application Notes -- AN1955., All rights reserved. 1
2 Table 4. Electrical Characteristics (V DD = 5 Vdc, 900 MHz, T A =25 C, 50 ohm system, in Freescale Application Circuit) Characteristic Symbol Min Typ Max Unit Small--Signal Gain (S21) G p db Input Return Loss (S11) IRL db Output Return Loss (S22) ORL db Power 1dB Compression P1dB 22.8 dbm Third Order Input Intercept Point IIP dbm Third Order Output Intercept Point OIP3 37 dbm Reverse Isolation (S12) S dbm Noise Figure (1) NF 0.52 db Supply Current (2) I DD ma Supply Voltage V DD 5 V Table 5. ESD Protection Characteristics Test Methodology Class Human Body Model (per JESD22--A114) 0 Machine Model (per EIA/JESD22--A115) A Charge Device Model (per JESD22--C101) IV Table 6. Moisture Sensitivity Level Test Methodology Rating Package Peak Temperature Unit Per JESD22--A113, IPC/JEDEC J--STD C 1. Noise figure value calculated with connector losses removed. 2. DC current measured with no RF signal applied. RF Feedback V DD1 RF FB N.C. V DD RF MATCH RF MATCH 1 9 N.C. RF in V DD2 /RF out RF in RF in 2 GND V DD2 /RF out N.C. RF in V BA1 N.C. V BA2 Note: Exposed backside of the package is DC and RF ground. V BA1 V BA2 Figure 1. Functional Block Diagram Figure 2. Pin Connections 2
3 50 OHM APPLICATION : 900 MHz R1 C7 L3 C8 C14 C9 V DD R4 1 9 V DD2 C5 C6 L1 2 8 Z1 L2 Z2 C2 RF OUTPUT RF INPUT C R2 R3 C10 C11 C12 C13 Z1 Z Microstrip Microstrip Figure 3. Test Circuit Schematic Table 7. Test Circuit Component Designations and Values Part Description Part Number Manufacturer C1, C2, C7, C14 56 pf Chip Capacitors GRM1555C1H560JZ01 Murata C3, C4 Components Not Placed C5 180 pf Chip Capacitor GRM1555C1H181JZ01 Murata C6, C9, C10, C F Chip Capacitors GRM155R71E103KA01 Murata C pf Chip Capacitor GRM155R71E101KA01 Murata C11, C pf Chip Capacitors GRM1555C1H101JZ01 Murata L1 12 nh Chip Inductor 0402CS--12NXGL Coilcraft L2 30 nh Chip Inductor 0402CS--30NXGL Coilcraft L3 8.2 nh Chip Inductor 0402CS--8N2XGL Coilcraft R1 82 Chip Resistor RC0402JR RL Yageo R Chip Resistor RC0402FR K1L Yageo R3 910 Chip Resistor RC0402FR RL Yageo R4 0, 1 A Chip Resistor ERJ2GE0R00X Panasonic PCB 0.010, r = 3.48, Multilayer RO4350B Rogers Note: Component numbers C3 and C4 are labeled on board but not placed. 3
4 50 OHM APPLICATION : 900 MHz V DD2 V DD1 C9 Via A Via B RF IN C6 C5 L1 C14 C8 C7 R1 L3 L2 R4 C4* C3* RF OUT C2 C1 Via A R2 R3 Via B C10 C11 C12 C13 QFN 3x3--12D Rev. 1 Note: Component numbers C3* and C4* are labeled on board but not placed. Figure 4. Test Circuit Component Layout Table 7. Test Circuit Component Designations and Values Part Description Part Number Manufacturer C1, C2, C7, C14 56 pf Chip Capacitors GRM1555C1H560JZ01 Murata C3, C4 Components Not Placed C5 180 pf Chip Capacitor GRM1555C1H181JZ01 Murata C6, C9, C10, C F Chip Capacitors GRM155R71E103KA01 Murata C pf Chip Capacitor GRM155R71E101KA01 Murata C11, C pf Chip Capacitors GRM1555C1H101JZ01 Murata L1 12 nh Chip Inductor 0402CS--12NXGL Coilcraft L2 30 nh Chip Inductor 0402CS--30NXGL Coilcraft L3 8.2 nh Chip Inductor 0402CS--8N2XGL Coilcraft R1 82 Chip Resistor RC0402JR RL Yageo R Chip Resistor RC0402FR K1L Yageo R3 910 Chip Resistor RC0402FR RL Yageo R4 0, 1 A Chip Resistor ERJ2GE0R00X Panasonic PCB 0.010, r = 3.48, Multilayer RO4350B Rogers (Test Circuit Component Designations and Values repeated for reference.) 4
5 50 OHM TYPICAL CHARACTERISTICS: 900 MHz S11 (db) C 85 C --40 C S12 (db) C 85 C 25 C Figure 5. S11 versus Frequency versus Temperature Figure 6. S12 versus Frequency versus Temperature C --7 S21 (db) C 25 C S22 (db) C 85 C --40 C Figure 7. S21 versus Frequency versus Temperature Figure 8. S22 versus Frequency versus Temperature 5
6 50 OHM TYPICAL CHARACTERISTICS: 900 MHz NF, NOISE FIGURE (db) C 25 C C G ps, POWER GAIN (db) C --40 C 25 C f = 900 MHz P out, OUTPUT POWER (dbm) 23 Figure 9. Noise Figure versus Frequency versus Temperature Figure 10. Power Gain versus Output Power versus Temperature, CW OIP3, THIRD ORDER OUTPUT INTERCEPT POINT (dbm) C C --40 C 1 MHz Tone Spacing P1dB, 1 db COMPRESSION POINT, CW (dbm) C --40 C 85 C Figure 11. Third Order Output Intercept Point (Two -Tone) versus Frequency versus Temperature Figure 12. P1dB versus Frequency versus Temperature, CW 6
7 50 OHM APPLICATION : 400 MHz R1 C7 L3 C8 C14 C9 V DD R4 1 9 L2 V DD2 C5 C6 L1 2 8 L5 Z1 Z2 C2 RF OUTPUT RF INPUT C1 L R2 R3 C10 C11 C12 C13 Z1 Z Microstrip Microstrip Figure 13. Test Circuit Schematic Table 8. Test Circuit Component Designations and Values Part Description Part Number Manufacturer C1, C2 100 pf Chip Capacitors GRM1555C1H101JZ01 Murata C3, C4 Components Not Placed C5,C7,C8,C11,C pf Chip Capacitors GRM1555C1H391JZ01 Murata C6, C9, C10, C F Chip Capacitors GRM155R71E103KA01 Murata C pf Chip Capacitor GRM155R71E101KA01 Murata L1 20 nh Chip Inductor 0402CS--20NXGL Coilcraft L2, L5 30 nh Chip Inductors 0402CS--30NXGL Coilcraft L3 16 nh Chip Inductor 0402CS--16NNXGL Coilcraft L4 1.2 nh Chip Inductor 0402CS--1N2XJL Coilcraft R1 100 Chip Resistor RC0402JR RL Yageo R Chip Resistor RC0402FR K1L Yageo R3 910 Chip Resistor RC0402FR RL Yageo R4 0, 1 A Chip Resistor ERJ2GE0R00X Panasonic PCB 0.010, r = 3.48, Multilayer RO4350B Rogers Note: Component numbers C3 and C4 are labeled on board but not placed. 7
8 50 OHM APPLICATION : 400 MHz V DD2 V DD1 C9 Via A Via B C14 C8 C7 R1 L3 R4 C4* C3* RF IN C1 C6 C5 L1 L4 Via A R2 L2 R3 Via B L5 C2 RF OUT C10 C11 C12 C13 QFN 3x3--12F Rev. 1 Note: Component numbers C3* and C4* are labeled on board but not placed. Figure 14. Test Circuit Component Layout Table 8. Test Circuit Component Designations and Values Part Description Part Number Manufacturer C1, C2 100 pf Chip Capacitors GRM1555C1H101JZ01 Murata C3, C4 Components Not Placed C5,C7,C8,C11,C pf Chip Capacitors GRM1555C1H391JZ01 Murata C6, C9, C10, C F Chip Capacitors GRM155R71E103KA01 Murata C pf Chip Capacitor GRM155R71E101KA01 Murata L1 20 nh Chip Inductor 0402CS--20NXGL Coilcraft L2, L5 30 nh Chip Inductors 0402CS--30NXGL Coilcraft L3 16 nh Chip Inductor 0402CS--16NNXGL Coilcraft L4 1.2 nh Chip Inductor 0402CS--1N2XJL Coilcraft R1 100 Chip Resistor RC0402JR RL Yageo R Chip Resistor RC0402FR K1L Yageo R3 910 Chip Resistor RC0402FR RL Yageo R4 0, 1 A Chip Resistor ERJ2GE0R00X Panasonic PCB 0.010, r = 3.48, Multilayer RO4350B Rogers (Test Circuit Component Designations and Values repeated for reference.) 8
9 50 OHM TYPICAL CHARACTERISTICS: 400 MHz S11 (db) S12 (db) Figure 15. S11 versus Frequency Figure 16. S12 versus Frequency S21 (db) S22 (db) Figure 17. S21 versus Frequency Figure 18. S22 versus Frequency 9
10 50 OHM TYPICAL CHARACTERISTICS: 400 MHz NF, NOISE FIGURE (db) Figure 19. Noise Figure versus Frequency OIP3, THIRD ORDER OUTPUT INTERCEPT POINT (dbm) Figure 20. Third Order Output Intercept Point (Two -Tone) versus Frequency 10
11 50 OHM APPLICATION : 1400 MHz R1 C7 L3 C8 C14 C9 V DD R4 1 9 V DD2 C5 C6 L1 2 8 Z1 L2 Z2 C2 RF OUTPUT RF INPUT C R2 R3 C10 C11 C12 C13 Z1 Z Microstrip Microstrip Figure 21. Test Circuit Schematic Table 9. Test Circuit Component Designations and Values Part Description Part Number Manufacturer C1 220 pf Chip Capacitor GRM1555C1H221JZ01 Murata C2, C7 56 pf Chip Capacitors GRM1555C1H560JZ01 Murata C3, C4 Components Not Placed C5 180 pf Chip Capacitor GRM1555C1H181JZ01 Murata C6, C9, C10, C F Chip Capacitors GRM155R71E103KA01 Murata C pf Chip Capacitor GRM155R71E101KA01 Murata C11, C pf Chip Capacitors GRM1555C1H101JZ01 Murata C14 68 pf Chip Capacitor GRM1555C1H680JZ01 Murata L1 6.8 nh Chip Inductor 0402CS--6N8XGL Coilcraft L2 23 nh Chip Inductor 0402CS--23NXGL Coilcraft L3 4.3 nh Chip Inductor 0402CS--4N3XGL Coilcraft R1 100 Chip Resistor RC0402JR RL Yageo R Chip Resistor RC0402FR K1L Yageo R3 910 Chip Resistor RC0402FR RL Yageo R4 0, 1 A Chip Resistor ERJ2GE0R00X Panasonic PCB 0.010, r = 3.48, Multilayer RO4350B Rogers Note: Component numbers C3 and C4 are labeled on board but not placed. 11
12 50 OHM APPLICATION : 1400 MHz V DD2 V DD1 C9 Via A Via B RF IN C6 C5 L1 C14 C8 C7 R1 L3 L2 R4 C4* C3* RF OUT C2 C1 Via A R2 R3 Via B C10 C11 C12 C13 QFN 3x3--12D Rev. 1 Note: Component numbers C3* and C4* are labeled on board but not placed. Figure 22. Test Circuit Component Layout Table 9. Test Circuit Component Designations and Values Part Description Part Number Manufacturer C1 220 pf Chip Capacitor GRM1555C1H221JZ01 Murata C2, C7 56 pf Chip Capacitors GRM1555C1H560JZ01 Murata C3, C4 Components Not Placed C5 180 pf Chip Capacitor GRM1555C1H181JZ01 Murata C6, C9, C10, C F Chip Capacitors GRM155R71E103KA01 Murata C pf Chip Capacitor GRM155R71E101KA01 Murata C11, C pf Chip Capacitors GRM1555C1H101JZ01 Murata C14 68 pf Chip Capacitor GRM1555C1H680JZ01 Murata L1 6.8 nh Chip Inductor 0402CS--6N8XGL Coilcraft L2 23 nh Chip Inductor 0402CS--23NXGL Coilcraft L3 4.3 nh Chip Inductor 0402CS--4N3XGL Coilcraft R1 100 Chip Resistor RC0402JR RL Yageo R Chip Resistor RC0402FR K1L Yageo R3 910 Chip Resistor RC0402FR RL Yageo R4 0, 1 A Chip Resistor ERJ2GE0R00X Panasonic PCB 0.010, r = 3.48, Multilayer RO4350B Rogers (Test Circuit Component Designations and Values repeated for reference.) 12
13 50 OHM TYPICAL CHARACTERISTICS: 1400 MHz S11 (db) S12 (db) Figure 23. S11 versus Frequency Figure 24. S12 versus Frequency S21 (db) S22 (db) Figure 25. S21 versus Frequency Figure 26. S22 versus Frequency 13
14 50 OHM TYPICAL CHARACTERISTICS: 1400 MHz NF, NOISE FIGURE (db) OIP3, THIRD ORDER OUTPUT INTERCEPT POINT (dbm) Figure 27. Noise Figure versus Frequency Figure 28. Third Order Output Intercept Point (Two -Tone) versus Frequency
15 solder pad with thermal via structure. All dimensions in mm. Figure 29. PCB Pad Layout for QFN 3 3 MA01 YWZ Figure 30. Product Marking 15
16 PACKAGE DIMENSIONS 16
17 17
18 18
19 APPENDIX: APPLICATION S WITH TWO -SUPPLY VOLTAGE 50 OHM APPLICATION : 900 MHz R1 C7 L3 C8 C14 C9 V DD V DD2 C5 C6 L1 2 8 Z1 L2 C15 C16 C17 Z2 C2 RF OUTPUT RF INPUT C R2 R3 C10 C11 C12 C13 Z1 Z Microstrip Microstrip Figure A -1. Test Circuit Schematic Table A -1. Test Circuit Component Designations and Values Part Description Part Number Manufacturer C1, C2, C7, C14, C16 56 pf Chip Capacitors GRM1555C1H560JZ01 Murata C3, C4 Components Not Placed C5 180 pf Chip Capacitor GRM1555C1H181JZ01 Murata C6, C9, C10, C13, C F Chip Capacitors GRM155R71E103KA01 Murata C8, C pf Chip Capacitors GRM155R71E101KA01 Murata C11, C pf Chip Capacitors GRM1555C1H101JZ01 Murata L1 12 nh Chip Inductor 0402CS--12NXGL Coilcraft L2 30 nh Chip Inductor 0402CS--30NXGL Coilcraft L3 8.2 nh Chip Inductor 0402CS--8N2XGL Coilcraft R1 82 Chip Resistor RC0402JR RL Yageo R Chip Resistor RC0402FR K1L Yageo R3 910 Chip Resistor RC0402FR RL Yageo PCB 0.010, r = 3.48, Multilayer RO4350B Rogers Note: Component numbers C3 and C4 are labeled on board but not placed. 19
20 Appendix: Application Circuits with Two -Supply Voltage (continued) 50 OHM APPLICATION : 900 MHz V DD2 V DD1 C9 C14 Via A Via B C17 C16 RF IN C6 C5 L1 C7 C8 R1 L3 L2 C15 C4* C3* RF OUT C2 C1 Via A R2 R3 Via B C10 C11 C12 C13 QFN 3x3--12D Rev. 1 Note: Component numbers C3* and C4* are labeled on board but not placed. Figure A -2. Test Circuit Component Layout Table A -1. Test Circuit Component Designations and Values Part Description Part Number Manufacturer C1, C2, C7, C14, C16 56 pf Chip Capacitors GRM1555C1H560JZ01 Murata C3, C4 Components Not Placed C5 180 pf Chip Capacitor GRM1555C1H181JZ01 Murata C6, C9, C10, C13, C F Chip Capacitors GRM155R71E103KA01 Murata C8, C pf Chip Capacitors GRM155R71E101KA01 Murata C11, C pf Chip Capacitors GRM1555C1H101JZ01 Murata L1 12 nh Chip Inductor 0402CS--12NXGL Coilcraft L2 30 nh Chip Inductor 0402CS--30NXGL Coilcraft L3 8.2 nh Chip Inductor 0402CS--8N2XGL Coilcraft R1 82 Chip Resistor RC0402JR RL Yageo R Chip Resistor RC0402FR K1L Yageo R3 910 Chip Resistor RC0402FR RL Yageo PCB 0.010, r = 3.48, Multilayer RO4350B Rogers (Test Circuit Component Designations and Values repeated for reference.) 20
21 Appendix: Application Circuits with Two -Supply Voltage (continued) 50 OHM APPLICATION : 400 MHz R1 C7 L3 C8 C14 C9 V DD V DD2 C5 C6 L1 2 8 Z1 L2 C15 C16 C17 Z2 C2 RF OUTPUT RF INPUT C R2 R3 C10 C11 C12 C13 Z1 Z Microstrip Microstrip Figure A -3. Test Circuit Component Layout Table A -2. Test Circuit Component Designations and Values Part Description Part Number Manufacturer C1, C2 100 pf Chip Capacitors GRM1555C1H101JZ01 Murata C3, C4 Components Not Placed C5, C7, C8,C11, C12, C pf Chip Capacitors GRM1555C1H391JZ01 Murata C6, C9, C10, C13, C F Chip Capacitors GRM155R71E103KA01 Murata C14, C pf Chip Capacitors GRM155R71E101KA01 Murata L1 20 nh Chip Inductor 0402CS--20NXGL Coilcraft L2, L5 30 nh Chip Inductors 0402CS--30NXGL Coilcraft L3 16 nh Chip Inductor 0402CS--16NNXGL Coilcraft L4 1.2 nh Chip Inductor 0402CS--1N2XJL Coilcraft R1 100 Chip Resistor RC0402JR RL Yageo R Chip Resistor RC0402FR K1L Yageo R3 910 Chip Resistor RC0402FR RL Yageo PCB 0.010, r = 3.48, Multilayer RO4350B Rogers Note: Component numbers C3 and C4 are labeled on board but not placed. 21
22 Appendix: Application Circuits with Two -Supply Voltage (continued) 50 OHM APPLICATION : 400 MHz V DD2 V DD1 C9 C14 Via A Via B C16 C17 RF IN C6 C5 L1 C7 C8 R1 L3 L2 C15 C4* C3* RF OUT C2 C1 Via A R2 R3 Via B C10 C11 C12 C13 QFN 3x3--12D Rev. 1 Note: Component numbers C3* and C4* are labeled on board but not placed. Figure A -4. Test Circuit Component Layout Table A -2. Test Circuit Component Designations and Values Part Description Part Number Manufacturer C1, C2 100 pf Chip Capacitors GRM1555C1H101JZ01 Murata C3, C4 Components Not Placed C5, C7, C8,C11, C12, C pf Chip Capacitors GRM1555C1H391JZ01 Murata C6, C9, C10, C13, C F Chip Capacitors GRM155R71E103KA01 Murata C14, C pf Chip Capacitors GRM155R71E101KA01 Murata L1 20 nh Chip Inductor 0402CS--20NXGL Coilcraft L2, L5 30 nh Chip Inductors 0402CS--30NXGL Coilcraft L3 16 nh Chip Inductor 0402CS--16NNXGL Coilcraft L4 1.2 nh Chip Inductor 0402CS--1N2XJL Coilcraft R1 100 Chip Resistor RC0402JR RL Yageo R Chip Resistor RC0402FR K1L Yageo R3 910 Chip Resistor RC0402FR RL Yageo PCB 0.010, r = 3.48, Multilayer RO4350B Rogers (Test Circuit Component Designations and Values repeated for reference.) 22
23 Appendix: Application Circuits with Two -Supply Voltage (continued) 50 OHM APPLICATION : 1400 MHz R1 C7 L3 C8 C14 C9 V DD V DD2 C5 C6 L1 2 8 Z1 L2 C15 C16 C17 Z2 C2 RF OUTPUT RF INPUT C R2 R3 C10 C11 C12 C13 Z1 Z Microstrip Microstrip Figure A -5. Test Circuit Component Layout Table A -3. Test Circuit Component Designations and Values Part Description Part Number Manufacturer C1 220 pf Chip Capacitor GRM1555C1H221JZ01 Murata C2, C7 56 pf Chip Capacitors GRM1555C1H560JZ01 Murata C3, C4 Components Not Placed C5 180 pf Chip Capacitor GRM1555C1H181JZ01 Murata C6, C9, C10, C13, C F Chip Capacitors GRM155R71E103KA01 Murata C8, C pf Chip Capacitors GRM155R71E101KA01 Murata C11, C pf Chip Capacitors GRM1555C1H101JZ01 Murata C14, C16 68 pf Chip Capacitors GRM1555C1H680JZ01 Murata L1 6.8 nh Chip Inductor 0402CS--6N8XGL Coilcraft L2 23 nh Chip Inductor 0402CS--23NXGL Coilcraft L3 4.3 nh Chip Inductor 0402CS--4N3XGL Coilcraft R1 100 Chip Resistor RC0402JR RL Yageo R Chip Resistor RC0402FR K1L Yageo R3 910 Chip Resistor RC0402FR RL Yageo PCB 0.010, r = 3.48, Multilayer RO4350B Rogers Note: Component numbers C3 and C4 are labeled on board but not placed. 23
24 Appendix: Application Circuits with Two -Supply Voltage (continued) 50 OHM APPLICATION : 1400 MHz V DD2 V DD1 C9 C14 Via A Via B C17 C16 RF IN C6 C5 L1 C7 C8 R1 L3 L2 C15 C4* C3* RF OUT C2 C1 Via A R2 R3 Via B C10 C11 C12 C13 QFN 3x3--12D Rev Note: Component numbers C3* and C4* are labeled on board but not placed. Figure A -6. Test Circuit Component Layout Table A -3. Test Circuit Component Designations and Values Part Description Part Number Manufacturer C1 220 pf Chip Capacitor GRM1555C1H221JZ01 Murata C2, C7 56 pf Chip Capacitors GRM1555C1H560JZ01 Murata C3, C4 Components Not Placed C5 180 pf Chip Capacitor GRM1555C1H181JZ01 Murata C6, C9, C10, C13, C F Chip Capacitors GRM155R71E103KA01 Murata C8, C pf Chip Capacitors GRM155R71E101KA01 Murata C11, C pf Chip Capacitors GRM1555C1H101JZ01 Murata C14, C16 68 pf Chip Capacitors GRM1555C1H680JZ01 Murata L1 6.8 nh Chip Inductor 0402CS--6N8XGL Coilcraft L2 23 nh Chip Inductor 0402CS--23NXGL Coilcraft L3 4.3 nh Chip Inductor 0402CS--4N3XGL Coilcraft R1 100 Chip Resistor RC0402JR RL Yageo R Chip Resistor RC0402FR K1L Yageo R3 910 Chip Resistor RC0402FR RL Yageo PCB 0.010, r = 3.48, Multilayer RO4350B Rogers (Test Circuit Component Designations and Values repeated for reference.)
25 PRODUCT DOCUMENTATION, SOFTWARE AND TOOLS Refer to the following resources to aid your design process. Application Notes AN1955: Thermal Measurement Methodology of RF Power Amplifiers AN3100: General Purpose Amplifier and MMIC Biasing Software.s2p File Development Tools Printed Circuit Boards For Software and Tools, do a Part Number search at and select the Part Number link. Go to Software & Tools on the part s Product Summary page to download the respective tool. FAILURE ANALYSIS At this time, because of the physical characteristics of the part, failure analysis is limited to electrical signature analysis. In cases where Freescale is contractually obligated to perform failure analysis (FA) services, full FA may be performed by third party vendors with moderate success. For updates contact your local Freescale Sales Office. REVISION HISTORY The following table summarizes revisions to this document. Revision Date Description 0 Oct Initial Release of Data Sheet 1 Apr Table 1, Typical Performance: changed 400 MHz Application Circuit Third Order Output Intercept Point value from 38 dbm to 37 dbm to reflect the true capability of the device, p. 1 Added 900 MHz, 50 Ohm Operation, application circuit figures as follows: -- Figure 5, S11 versus Frequency versus Temperature, p Figure 6, S12 versus Frequency versus Temperature, p Figure 7, S21 versus Frequency versus Temperature, p Figure 8, S22 versus Frequency versus Temperature, p Figure 9, Noise Figure versus Frequency versus Temperature, p Figure 10, Power Gain versus Output Power versus Temperature, CW, p Figure 11, Third Order Output Intercept Point (Two--Tone) versus Frequency versus Temperature, p Figure 12, P1dB versus Frequency versus Temperature, CW, p. 6 Added 400 MHz, 50 Ohm Operation, application circuit figures as follows: -- Figure 15, S11 versus Frequency, p Figure 16, S12 versus Frequency, p Figure 17, S21 versus Frequency, p Figure 18, S22 versus Frequency, p Figure 19, Noise Figure versus Frequency, p Figure 20, Third Order Output Intercept Point (Two--Tone) versus Frequency, p. 10 Added 1400 MHz, 50 Ohm Operation, application circuit figures as follows: -- Figure 23, S11 versus Frequency, p Figure 24, S12 versus Frequency, p Figure 25, S21 versus Frequency, p Figure 26, S22 versus Frequency, p Figure 27, Noise Figure versus Frequency, p Figure 28, Third Order Output Intercept Point (Two--Tone) versus Frequency, p. 14 Added Appendix: Application Circuits with Two--Supply Voltage, pp Sept Table 2, Maximum Ratings: updated Junction Temperature from 150 C to 175 C to reflect recent test results of the device, p. 1 Added Failure Analysis information, p
26 How to Reach Us: Home Page: freescale.com Web Support: freescale.com/support Information in this document is provided solely to enable system and software implementers to use Freescale products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits based on the information in this document. Freescale reserves the right to make changes without further notice to any products herein. Freescale makes no warranty, representation, or guarantee regarding the suitability of its products for any particular purpose, nor does Freescale assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. Typical parameters that may be provided in Freescale data sheets and/or specifications can and do vary in different applications, and actual performance may vary over time. All operating parameters, including typicals, must be validated for each customer application by customer s technical experts. Freescale does not convey any license under its patent rights nor the rights of others. Freescale sells products pursuant to standard terms and conditions of sale, which can be found at the following address: freescale.com/salestermsandconditions. Freescale and the Freescale logo are trademarks of, Reg. U.S. Pat. & Tm. Off. All other product or service names are the property of their respective owners. E Document Number: MML09212H 26 Rev. 2, 9/2014
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Ultra Linear Low Noise Monolithic Amplifier 50Ω The Big Deal 0.05 to 4 GHz Ultra High IP3 Broadband High Dynamic Range without external Matching Components May be used as a replacement for RFMD SPF-5189Z
Product Description. Ordering Information. GaAs HBT GaAs MESFET InGaP HBT
Basestation Applications Cellular and PCS Systems CDMA, W-CDMA Systems GSM/EDGE Systems Final PA for Low-Power Applications RF3223Low Noise, Linear Amplifier High Linearity/Driver Amplifier RF3223 LOW
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NOT RECOMMENDED FOR NEW DESIGN
Technical Data RF Power Field Effect Transistor N- Channel Enhancement- Mode Lateral MOSFET Designed for broadband commercial and industrial applications with frequencies up to 00 MHz. The high gain and
Broadband covering primary wireless communications bands: Cellular, PCS, LTE, WiMAX
High Gain, High IP3 Monolithic Amplifier 50Ω 0.01 to 6 GHz The Big Deal High Gain Broadband High Dynamic Range without external Matching Components May be used as a replacement to RFMD SBB5089Z a,b SOT-89
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Typical Performance 1. IS-95C ACPR 21.0 - - - dbm WCDMA ACLR - 19.5 18.5 - dbm
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Technical Data RF Power Field Effect Transistor N-Channel Enhancement-Mode Lateral MOSFET Designed for broadband commercial and industrial applications with frequencies up to 1000 MHz. The high gain and
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TQP0103 15 W, DC to 4 GHz, GaN Power Transistor
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General Purpose Transistors NPN Silicon Features PbFree Packages are Available* MAXIMUM RATINGS Rating Symbol Value Unit Collector Emitter Voltage V CEO 4 Vdc Collector Base Voltage V CBO 6 Vdc Emitter
P D 215 1.25 Operating Junction Temperature T J 200 C Storage Temperature Range T stg 65 to +150 C
SEMICONDUCTOR TECHNICAL DATA Order this document by /D The RF Line The is designed for output stages in band IV and V TV transmitter amplifiers. It incorporates high value emitter ballast resistors, gold
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DATA SHEET SE2425U : 2.4 GHz Bluetooth Power Amplifier IC. Applications. Product Description. Features. Ordering Information
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SKY13370-374LF: 0.5 to 6.0 GHz SPDT Switch, 50 Ω Terminated
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Vdc. Vdc. Adc. W W/ C T J, T stg 65 to + 200 C
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