Typical Performance 1. IS-95C ACPR dbm WCDMA ACLR dbm

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1 Device Features OIP3 = MHz Gain = MHz Output P1 db = MHz 50 Ω Cascadable Patented Over Voltage Protection Circuit Lead-free/RoHS-compliant SOT-89 SMT package Product Description BeRex s is a high performance and a high dynamic range amplifier in a low cost surface mount package(sot-89) with a RoHS -compliant, that incorporates reliable heterojunction-bipolar-transistor (HBT) devices fabricated with InGaP GaAs technology. This device is designed for use where high linearity is required and features high OIP3 and P1 with low consumption current (135mA) and requires a few external matching components such as a DC blocking capacitors on the In/Output pin, a bypass capacitor and a RF choke for the out port. All devices are 100% RF/DC tested. Applications Base station Infrastructure/RFID Commercial/Industrial/Military wireless system Application Circuits RF In DC Block RF Choke DC Block Bypass Vcc RF Out *external matching circuit: refer to the page 6 to 12. Typical Performance 1 Parameter Frequency Unit MHz Gain db S db S db OIP dbm P1dB dbm IS-95C ACPR dbm WCDMA ACLR dbm Noise Figure db 1 Device performance _ measured on a BeRex evaluation board at 25 C, 50 Ω system. 2 OIP3 _ measured with two tones at an output of 13 dbm per tone separated by 1 MHz. *ACPR&ACLR CH Power _ measured at 45dBc. Absolute Maximum Ratings Min. Typical Max. Unit Bandwidth MHz I (Vc = 5V) ma V C 5.0 V R TH 50 C/W Parameter Rating Unit Operating Case Temperature -40 to +85 C Storage Temperature -55 to +155 C Junction Temperature +220 C Operating Voltage Supply Current Input RF Power V ma dbm *Operation of this device above any of these parameters may result in permanent damage. 1

2 V-I Characteristics BeRex SOT89 Evaluation Board BeRex Evaluation Board *Voltage protection works at 5~6 V *Dielectric constant _ 4.2 *RF pattern width 52mil *31mil thick FR4 PCB Typical Device Data S-parameters (Vc=5V, Ic=135mA, T=25 C) 2

3 S-Parameter (Vdevice = 5.0V, Icc = 135mA, T = 25 C, calibrated to device leads) Freq S11 S11 S21 S21 S12 S12 S22 S22 [MHz] [Mag] [Ang] [Mag] [Ang] [Mag] [Ang] [Mag] [Ang]

4 WCDMA 6FA dBc WCDMA 6FA dBc 4

5 ACLR 5

6 Application Circuit: 1900 MHz Schematic Diagram BOM Tolerance C1 C2 +5V C3 C1 100pF ±5% C2 1000pF ±5% C3 10uF ±20% L1 C4 22pF ±5% RFin C4 C6 C7 C5 RFout C5 22pF ±5% C6 3pF ±5% C7 0.5pF ±5% L1 100nH ±5% 10 uf Note: 1000 pf 100 pf 1. PCB: 31mil thick FR4. 2. Distance between the center of the shunt cap (C6) and the input pin of _ 3.2mm. 100 nh 3. Distance between the center of the shunt cap (C7) and the output pin of _ 8.3mm. 22 pf 3 pf 0.5 pf 22 pf 6

7 Typical Performance 7

8 Application Circuit: 2140MHz Schematic Diagram BOM Tolerance C1 100pF ±5% C1 C2 +5V C3 C2 1000pF ±5% RFin C4 C6 L1 C7 C5 RFout C3 10uF ±20% C4 24pF ±5% C5 24pF ±5% C6 3pF ±5% C7 0.5pF ±5% L1 33nH ±5% 10 uf 1000 pf 100 pf 33 nh Note: 1. PCB: 31mil thick FR4 2. Distance between the center of the shunt cap (C6) and the input pin of _ 1.5mm. 3. Distance between the center of the shunt cap (C7) and the output pin of _ 6.4mm. 24 pf 3 pf 0.5 pf 24 pf 8

9 Typical Performance 9

10 Application Circuit: 2400MHz Schematic Diagram BOM Tolerance C1 C2 +5V C3 C1 100pF ±5% C2 1000pF ±5% RFin C4 C6 L1 C7 C5 RFout C3 10uF ±15% C4 100pF ±5% C5 100pF ±5% C6 2pF ±5% C7 0.5pF ±5% L1 33nH ±5% 33 nh 1000 pf 100 pf 10 uf Note: 1. PCB: 31mil thick FR4 2. Distance between the center of the shunt cap (C6) and the input pin of _ 0.7mm. 3. Distance between the center of the shunt cap (C7) and the output pin of _ 3.2mm. 100 pf 2 pf 0.5 pf 100 pf 10

11 Typical Performance 11

12 Application Circuit: 3500MHz Schematic Diagram BOM Tolerance C1 C2 +5V C3 C1 100pF ±5% C2 1000pF ±5% C3 10uF ±20% L1 C4 22pF ±5% RFin C4 C6 C7 C8 C5 RFout C5 22pF ±5% C6 0.75pF ±5% C7 0.5pF ±5% C8 0.5pF ±5% L1 33nH ±5% Note: 22pF 0.5pF B B 33nH 10uF 1000 pf 100pF 22pF 1. PCB: 31mil thick FR4 2. Distance between the center of the shunt cap (C6) and the input pin of _ 10mm. 3. Distance between the center of the series cap (C7) and the input pin of _ 4mm. 4. Distance between the center of the shunt cap (C8) and the output pin of _ 3mm. 0.75pF 0.5pF 12

13 Typical Performance 13

14 Package Outline Dimension Suggested PCB Land Pattern and PAD Layout PCB Land Pattern PCB Mounting Ø Note : All dimension are in millimeters PCB lay out _ on BeRex website 14

15 Package Marking Tape & Reel SOT89 Packaging information: Tape Width (mm): 12 Reel Size (inches): 7 YY = Year, WW = Working Week, XX = Wafer No. Device Cavity Pitch (mm): 8 Devices Per Reel: 1000 Lead plating finish 100% Tin Matte finish (All BeRex products undergoes a 1 hour, 150 degree C, Anneal bake to eliminate thin whisker growth concerns.) MSL / ESD Rating ESD Rating: Value: Test: Standard: Class 1B Passes <1000V Human Body Model (HBM) JEDEC Standard JESD22-A114B MSL Rating: Standard: Level 1 at +265 C convection reflow JEDEC Standard J-STD-020 NATO CAGE code: 2 N 9 6 F 15

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