Chapter 10. Boundary Scan and Core-Based Testing



Similar documents
Testing of Digital System-on- Chip (SoC)

The Boundary Scan Test (BST) technology

TABLE OF CONTENTS. xiii List of Tables. xviii List of Design-for-Test Rules. xix Preface to the First Edition. xxi Preface to the Second Edition

Boundary-Scan Tutorial

Primer. Semiconductor Group

What is a System on a Chip?

Boundary Scan. Boundary Scan.1

A STUDY OF INSTRUMENT REUSE AND RETARGETING IN P1687

Non-Contact Test Access for Surface Mount Technology IEEE

REUSING AND RETARGETING ON-CHIP INSTRUMENT ACCESS PROCEDURES IN IEEE P1687

The Advanced JTAG Bridge. Nathan Yawn 05/12/09

Testing and Programming PCBA s during Design and in Production

Reusing and Retargeting On-Chip Instrument Access Procedures in IEEE P1687

Implementation Details

Section 33. Programming and Diagnostics

Introduction to VLSI Testing

JTAG Applications. Product Life-Cycle Support. Software Debug. Integration & Test. Figure 1. Product Life Cycle Support

G. Squillero, M. Rebaudengo. Test Techniques for Systems-on-a-Chip

Analysis of Hardware and Software Approaches to Embedded In-Circuit Emulation of Microprocessors

Using the Agilent 3070 Tester for In-System Programming in Altera CPLDs

Octal T1/E1/J1 Line Interface Unit

Chapter 2 Logic Gates and Introduction to Computer Architecture

Serial port interface for microcontroller embedded into integrated power meter

In-System Programming Design TM. Guidelines for ispjtag Devices. Introduction. Device-specific Connections. isplsi 1000EA Family.

SPI Flash Programming and Hardware Interfacing Using ispvm System

THE ADVANTAGES OF COMBINING LOW PIN COUNT TEST WITH SCAN COMPRESSION OF VLSI TESTING

Power Reduction Techniques in the SoC Clock Network. Clock Power

Digitale Signalverarbeitung mit FPGA (DSF) Soft Core Prozessor NIOS II Stand Mai Jens Onno Krah

VLSI Design Verification and Testing

MAX II ISP Update with I/O Control & Register Data Retention

Modeling Sequential Elements with Verilog. Prof. Chien-Nan Liu TEL: ext: Sequential Circuit

Design of a High Speed Communications Link Using Field Programmable Gate Arrays

512K x 18, 256K x 36 9Mb SCD/DCD Sync Burst SRAMs

MICROPROCESSOR. Exclusive for IACE Students iacehyd.blogspot.in Ph: /422 Page 1

ARM Ltd 110 Fulbourn Road, Cambridge, CB1 9NJ, UK.

Extended Boundary Scan Test breaching the analog ban. Marcel Swinnen, teamleader test engineering

Rapid System Prototyping with FPGAs

XMC Modules. XMC-6260-CC 10-Gigabit Ethernet Interface Module with Dual XAUI Ports. Description. Key Features & Benefits

EEM870 Embedded System and Experiment Lecture 1: SoC Design Overview

Freescale Semiconductor, Inc. Product Brief Integrated Portable System Processor DragonBall ΤΜ

Design and Verification of Nine port Network Router

Aims and Objectives. E 3.05 Digital System Design. Course Syllabus. Course Syllabus (1) Programmable Logic

MICROPROCESSOR AND MICROCOMPUTER BASICS

Architectures and Platforms

Open Architecture Design for GPS Applications Yves Théroux, BAE Systems Canada

How To Design A Single Chip System Bus (Amba) For A Single Threaded Microprocessor (Mma) (I386) (Mmb) (Microprocessor) (Ai) (Bower) (Dmi) (Dual

7a. System-on-chip design and prototyping platforms

Computer organization

NTE2053 Integrated Circuit 8 Bit MPU Compatible A/D Converter

21555 Non-Transparent PCI-to- PCI Bridge

Introduction to Digital System Design

Agenda. Michele Taliercio, Il circuito Integrato, Novembre 2001

Pre-tested System-on-Chip Design. Accelerates PLD Development

8 Gbps CMOS interface for parallel fiber-optic interconnects

RAPID PROTOTYPING OF DIGITAL SYSTEMS Second Edition

Designing a System-on-Chip (SoC) with an ARM Cortex -M Processor

POCKET SCOPE 2. The idea 2. Design criteria 3

System on Chip Platform Based on OpenCores for Telecommunication Applications

Memory Testing. Memory testing.1

Von der Hardware zur Software in FPGAs mit Embedded Prozessoren. Alexander Hahn Senior Field Application Engineer Lattice Semiconductor

(Refer Slide Time: 00:01:16 min)

Implementing a Digital Answering Machine with a High-Speed 8-Bit Microcontroller

PLL frequency synthesizer

ADS9850 Signal Generator Module

Single Phase Two-Channel Interleaved PFC Operating in CrM Using the MC56F82xxx Family of Digital Signal Controllers

ETEC 2301 Programmable Logic Devices. Chapter 10 Counters. Shawnee State University Department of Industrial and Engineering Technologies

ARM Webinar series. ARM Based SoC. Abey Thomas

Chapter 4 Register Transfer and Microoperations. Section 4.1 Register Transfer Language

RoHS Compliant Copper Small Form Factor Pluggable (SFP) Transceiver for Gigabit Ethernet

The 104 Duke_ACC Machine

RAM & ROM Based Digital Design. ECE 152A Winter 2012

Design Verification & Testing Design for Testability and Scan

Computer Organization & Architecture Lecture #19

MasterBlaster Serial/USB Communications Cable User Guide

Section 33. Programming and Diagnostics

Test Driven Development of Embedded Systems Using Existing Software Test Infrastructure

Chapter 1 Lesson 3 Hardware Elements in the Embedded Systems Chapter-1L03: "Embedded Systems - ", Raj Kamal, Publs.: McGraw-Hill Education

All Programmable Logic. Hans-Joachim Gelke Institute of Embedded Systems. Zürcher Fachhochschule

OpenSPARC T1 Processor

PCI Express: The Evolution to 8.0 GT/s. Navraj Nandra, Director of Marketing Mixed-Signal and Analog IP, Synopsys

CSE2102 Digital Design II - Topics CSE Digital Design II

Switch Fabric Implementation Using Shared Memory

MorphIO: An I/O Reconfiguration Solution for Altera Devices

In-System Programmability

C8051F020 Utilization in an Embedded Digital Design Project Course. Daren R. Wilcox Southern Polytechnic State University Marietta, Georgia

Single Phase Two-Channel Interleaved PFC Operating in CrM

USB-Blaster Download Cable User Guide

Topics of Chapter 5 Sequential Machines. Memory elements. Memory element terminology. Clock terminology

Lesson 7: SYSTEM-ON. SoC) AND USE OF VLSI CIRCUIT DESIGN TECHNOLOGY. Chapter-1L07: "Embedded Systems - ", Raj Kamal, Publs.: McGraw-Hill Education

SKP16C62P Tutorial 1 Software Development Process using HEW. Renesas Technology America Inc.

Designing an efficient Programmable Logic Controller using Programmable System On Chip

Sequential Logic Design Principles.Latches and Flip-Flops

Tools For Debugging JTAG and Power Issues on DaVinci and OMAP devices. Ning Kang & Dr. Madhav Vij Texas Instruments Software Development Organization

Web Site: Forums: forums.parallax.com Sales: Technical:

Debug and Trace for Multicore SoCs How to build an efficient and effective debug and trace system for complex, multicore SoCs

Modeling Registers and Counters

ABB Drives. User s Manual HTL Encoder Interface FEN-31

11. High-Speed Differential Interfaces in Cyclone II Devices

Transcription:

Chapter 10 Boundary Scan and Core-Based Testing VLSI Test Principles and Architectures Ch. 10 - Boundary Scan and Core-Based Testing - P. 1 1

Outline Introduction Digital Boundary Scan (1149.1) Boundary Scan for Advanced Networks (1149.6) Embedded Core Test Standard (1500) Comparison between 1149.1 and 1500 VLSI Test Principles and Architectures Ch. 10 - Boundary Scan and Core-Based Testing - P. 2 2

Boundary Scan Original objective: board-level digital testing Now also apply to: MCM and FPGA Analog circuits and high-speed networks Verification, debugging, clock control, power management, chip reconfiguration, etc. History: Mid-1980: JETAG 1988: JTAG 1990: First boundary scan standard 1149.1 VLSI Test Principles and Architectures Ch. 10 - Boundary Scan and Core-Based Testing - P. 3 3

Boundary Scan Family No. 1149.1 1149.2 1149.3 1149.4 1149.5 1149.6 Main target Digital chips and interconnects among chips Extended digital serial interface Direct access testability interface Mixed-signal test bus Standard module test and maintenance (MTM) bus High-speed network interface Status Std. 1149.1-2001 Discontinue Discontinue Std. 1149.4-1999 Std. 1149.5-1995 (not endorsed by IEEE since 2003) Std. 1149.6-2003 VLSI Test Principles and Architectures Ch. 10 - Boundary Scan and Core-Based Testing - P. 4 4

Core-Based SOC Design ADC RAM RAM ROM GLUE LOGIC PLL DAC BUS & INTERCONNECT ASIC 1 IP 1 DSP CPU ASIC 2 IP 2 RAM ROM ASIC DSP ALU ASIC VLSI Test Principles and Architectures Ch. 10 - Boundary Scan and Core-Based Testing - P. 5 5

Digital Boundary Scan 1149.1 Basic concepts Overall test architecture & operations Hardware components Instruction register & instruction set Boundary scan description language On-chip test support Board/system-level control architectures VLSI Test Principles and Architectures Ch. 10 - Boundary Scan and Core-Based Testing - P. 6 6

Basic Idea of Boundary Scan Boundary-scan cell Internal Logic VLSI Test Principles and Architectures Ch. 10 - Boundary Scan and Core-Based Testing - P. 7 7

A Board Containing 4 IC s s with Boundary Scan Boundary-scan cell Boundary-scan chain Serial Data in Internal Logic Internal Logic Serial Data out Internal Logic Internal Logic System interconnect 8 VLSI Test Principles and Architectures Ch. 10 - Boundary Scan and Core-Based Testing - P. 8

1149.1 Boundary-Scan Architecture Boundary-Scan Register (consists of boundary Scan cells) Test Data In (TDI) 1 1 Internal Logic Internal Registers Bypass Register Miscellaneous Register Instruction Register Test Data Out (TDO) Test Mode Select (TMS) Test Clock (TCK) TAP Controller Test Reset (TRST*) (optional) VLSI Test Principles and Architectures Ch. 10 - Boundary Scan and Core-Based Testing - P. 9 1 9

Hardware Components of 1149.1 A test access port (TAP) consisting of : 4 mandatory pins: Test data in (TDI), Test data out (TDO), Test mode select (TMS), Test clock (TCK), and 1 optional pin: Test reset (TRST) A test access port controller (TAPC) An instruction register (IR) Several test data registers A boundary scan register (BSR) consisting of boundary scan cells (BSCs) A bypass register (BR) Some optional registers (Device-ID register, designspecified registers such as scan registers, LFSRs for BIST, etc.) VLSI Test Principles and Architectures Ch. 10 - Boundary Scan and Core-Based Testing - P. 10 10

Basic Operations 1. Instruction sent (serially) through TDI into instruction register. 2. Selected test circuitry configured to respond to the instruction. 3. Test pattern shifted into selected data register and applied to logic to be tested 4. Test response captured into some data register 5. Captured response shifted out; new test pattern shifted in simultaneously 6. Steps 3-5 repeated until all test patterns are applied. VLSI Test Principles and Architectures Ch. 10 - Boundary Scan and Core-Based Testing - P. 11 11

Boundary-Scan Circuitry in A Chip Design-Spec. Reg. Data Register TDO TDI TRST* TMS TCK T A P T A P C Device-ID Reg. Boundary Scan Reg. Bypass Reg. (1-bit) 3 ClockDR, ShiftDR, UpdateDR Reset* ClockIR, ShiftIR, UpdateIR 3 Instruction Register M U X IR decode 0 1 Select M U X 1D TCK EN Enable VLSI Test Principles and Architectures Ch. 10 - Boundary Scan and Core-Based Testing - P. 12 12

Data registers Boundary scan register: consists of boundary scan cells Bypass register: a one-bit register used to pass test signal from a chip when it is not involved in current test operation Device-ID register: for the loading of product information (manufacturer, part number, version number, etc.) Other user-specified data registers (scan chains, LFSR for BIST, etc.) VLSI Test Principles and Architectures Ch. 10 - Boundary Scan and Core-Based Testing - P. 13 13

A Typical Boundary-Scan Cell (BSC) Operation modes Normal: IN OUT (Mode = 0) Shift: TDI... IN OUT... TDO (ShiftDR = 1, ClockDR) Capture: IN R1, OUT driven by IN or R2 (ShiftDR = 0, ClcokDR) Update: R1 OUT (Mode_Control = 1, UpdateDR) VLSI Test Principles and Architectures Ch. 10 - Boundary Scan and Core-Based Testing - P. 14 14

TAP Controller A finite state machine with 16 states Input: TCK, TMS Output: 9 or 10 signals included ClockDR, UpdateDR, ShiftDR, ClockIR, UpdateIR, ShiftIR, Select, Enable, TCK and TRST* (optional). VLSI Test Principles and Architectures Ch. 10 - Boundary Scan and Core-Based Testing - P. 15 15

State Diagram of TAP Controller VLSI Test Principles and Architectures Ch. 10 - Boundary Scan and Core-Based Testing - P. 16 16

Main functions of TAP controller Providing control signals to Reset BS circuitry Load instructions into instruction register Perform test capture operation Perform test update operation Shift test data in and out VLSI Test Principles and Architectures Ch. 10 - Boundary Scan and Core-Based Testing - P. 17 17

States of TAP Controller Test-Logic-Reset: normal mode Run-Test/Idle: wait for internal test such as BIST Select-DR-Scan: initiate a data-scan sequence Capture-DR: load test data in parallel Shift-DR: load test data in series Exit1-DR: finish phase-1 shifting of data Pause-DR: temporarily hold the scan operation (e.g., allow the bus master to reload data) Exit2-DR: finish phase-2 shifting of data Update-DR: parallel load from associated shift registers Note: Controls for IR are similar to those for DR. VLSI Test Principles and Architectures Ch. 10 - Boundary Scan and Core-Based Testing - P. 18 18

Instruction Set BYPASS Bypass data through a chip SAMPLE Sample (capture) test data into BSR PRELOAD Shift-in test data and update BSR EXTEST Test interconnection between chips of board Optional INTEST, RUNBIST, CLAMP, IDCODE, USERCODE, HIGH-Z, etc. VLSI Test Principles and Architectures Ch. 10 - Boundary Scan and Core-Based Testing - P. 19 19

Execution of BYPASS Instruction VLSI Test Principles and Architectures Ch. 10 - Boundary Scan and Core-Based Testing - P. 20 20

Execution of SAMPLE Instruction VLSI Test Principles and Architectures Ch. 10 - Boundary Scan and Core-Based Testing - P. 21 21

Execution of PRELOAD Instruction Input PRELOAD R1 R2 M U X Internal Logic R1 R2 M U X Output TDI TDO VLSI Test Principles and Architectures Ch. 10 - Boundary Scan and Core-Based Testing - P. 22 22

Execution of EXTEST Instruction (1/3) Shift-DR (Chip1) Internal Logic Internal Logic TDI Registers TDO TDI Registers TDO TAP controller TAP controller VLSI Test Principles and Architectures Ch. 10 - Boundary Scan and Core-Based Testing - P. 23 23

Execution of EXTEST Instruction (2/3) Update-DR (Chip1) Capture-DR (Chip2) VLSI Test Principles and Architectures Ch. 10 - Boundary Scan and Core-Based Testing - P. 24 24

Execution of EXTEST Instruction (3/3) Shift-DR (Chip2) Internal Logic Internal Logic TDI Registers TDO TDI Registers TDO TAP controller TAP controller VLSI Test Principles and Architectures Ch. 10 - Boundary Scan and Core-Based Testing - P. 25 25

Execution of INTEST Instruction (1/4) Shift-DR VLSI Test Principles and Architectures Ch. 10 - Boundary Scan and Core-Based Testing - P. 26 26

Execution of INTEST Instruction (2/4) Update-DR VLSI Test Principles and Architectures Ch. 10 - Boundary Scan and Core-Based Testing - P. 27 27

Execution of INTEST Instruction (3/4) Capture-DR Internal Logic TDI Registers TAP controller TDO VLSI Test Principles and Architectures Ch. 10 - Boundary Scan and Core-Based Testing - P. 28 28

Execution of INTEST Instruction (4/4) Shift-DR Internal Logic TDI Registers TAP controller TDO VLSI Test Principles and Architectures Ch. 10 - Boundary Scan and Core-Based Testing - P. 29 29

Boundary Scan Description Language (BSDL) Now a part of IEEE 1149.1-2001 Purposes: Provide standard description language for BS devices. Simplify design work for BS automated synthesis is possible. Promote consistency throughout ASIC designers, device manufacturers, foundries, test developers and ATE manufacturers. Make it easy to incorporation BS into software tools for test generation, analysis and failure diagnosis. Reduce possibility of human error when employing boundary scan in a design. VLSI Test Principles and Architectures Ch. 10 - Boundary Scan and Core-Based Testing - P. 30 30

Features of BSDL Describes the testability features of BS devices that are compatible with 1149.1. S subset of VHDL. System-logic and the 1149.1 elements that are absolutely mandatory need not be specified. Examples: BYPASS register, TAP controller, etc. Commercial tools to synthesize BSDL exist. VLSI Test Principles and Architectures Ch. 10 - Boundary Scan and Core-Based Testing - P. 31 31

Scan and BIST Support with Boundary Scan VLSI Test Principles and Architectures Ch. 10 - Boundary Scan and Core-Based Testing - P. 32 32

Bus Master for Chips with Boundary Scan (1/5) Ring architecture with shared TMS Application chips TDI TCK TMS TDO #1 Bus master TDI TDO TMS TCK TDI TCK TMS TDO #2 VLSI Test Principles and Architectures Ch. 10 - Boundary Scan and Core-Based Testing - P. 33 TDI TCK TMS TDO #N 33

Bus Master for Chips with Boundary Scan (2/5) Ring architecture with separate TMS Application chips Bus master TDI TDO TMS1 TMS2 TMSN TCK TDI TCK TMS TDO TDI TCK TMS TDO #1 #2 TDI TCK TMS TDO VLSI Test Principles and Architectures Ch. 10 - Boundary Scan and Core-Based Testing - P. 34 #N 34

Bus Master for Chips with Boundary Scan (3/5) Star architecture VLSI Test Principles and Architectures Ch. 10 - Boundary Scan and Core-Based Testing - P. 35 35

Bus Master for Chips with Boundary Scan (4/5) Multi-drop architecture Multi-Drop Device Multi-Drop Device Multi-Drop Device Bus master TDI TMS TCK TDO Test Bus VLSI Test Principles and Architectures Ch. 10 - Boundary Scan and Core-Based Testing - P. 36 36

Bus Master for Chips with Boundary Scan (5/5) Hierarchical architecture VLSI Test Principles and Architectures Ch. 10 - Boundary Scan and Core-Based Testing - P. 37 37

Boundary scan for advanced networks 1149.6 Rationale Analog test receiver Digital driver logic Digital receiver logic Test access port for 1149.6 VLSI Test Principles and Architectures Ch. 10 - Boundary Scan and Core-Based Testing - P. 38 38

Rationale Advanced signaling techniques are required for multiple-mega-per-second I/O. Differential or AC-coupling networks Coupling capacitor in AC-coupled networks blocks DC signals. DC-level applied during EXTEST may decay to undefined logic level. VLSI Test Principles and Architectures Ch. 10 - Boundary Scan and Core-Based Testing - P. 39 39

Capturing AC-Coupled Coupled Signal with 1149.1 C U C U TX Update-DR V T RX TX V H V L RX V H V L Capture-DR VLSI Test Principles and Architectures Ch. 10 - Boundary Scan and Core-Based Testing - P. 40 40

1149.1 Configuration for Differential Signaling C U C U TX RX VLSI Test Principles and Architectures Ch. 10 - Boundary Scan and Core-Based Testing - P. 41 41

Analog Test Receiver Response to AC and DC-Coupled Coupled Signals VLSI Test Principles and Architectures Ch. 10 - Boundary Scan and Core-Based Testing - P. 42 42

Digital Driver Logic Mission 0 Shift in ShiftDR 1 C U ClockDR Shift out UpdateDR Train/Pulse 0 1 AC Mode 1149.1 Bypass 1149.1 Extest Extest_Pulse 0 1 Mode Mode Data AC Test Signal Insertion, per driver AC Mode Train/Pulse 0 X X 1 0 X 1 1 0 RTI State TCK D Q AC Test Signal (distributed to all AC drivers) Extest_Train 1 1 1 AC Test Signal Generator (near TAP Controller) VLSI Test Principles and Architectures Ch. 10 - Boundary Scan and Core-Based Testing - P. 43 43

Digital Receiver Logic Optional, Required for Observe-and-Control Capabilty on Single-Ended Inputs Only 0 Boundary Register Cell Shift In 1 0 ShiftDR Capture FF Shift Out Update FF 1 EXTEST: TCK TAP State Init_Memory Clock_DR Capture-DR Shift_DR Test Receiver Pad EXTEST_PULSE or EXTEST_TRAIN Selected R F AC DC C F V T V Hyst V Hyst ClockDR UpdateDR D Set Hyst Mem Clear Init_Memory (common to all test receivers) EXTEST_PULSE, EXTEST_TRAIN: Latch Q Init_Memory NOTE: The generated clock (Init_Memory) shown is suitable for rising edge-sensitive behavior only. VLSI Test Principles and Architectures Ch. 10 - Boundary Scan and Core-Based Testing - P. 44 TCK TAP State TMS May be located near TAP controller Q Q SET Q CLR D LG Exit*-DR Update_DR Capture-DR EXTEST EXTEST_TRAIN EXTEST_PULSE TMS Exit1-DR Exit2-DR TCK 44

Example of Modification on 1149.1 TAP Driver Behavior During EXTEST_PULSE Pulse Width TCK (TAP State) Test-Logic Reset Update-xR Run-Test/Idle Select-DR Capture-DR AC Test Signal Update Point Capture Point AC Pin Driver Data Inverted Data Data VLSI Test Principles and Architectures Ch. 10 - Boundary Scan and Core-Based Testing - P. 45 45

Embedded Core Test Standard - 1500 SOC test problems Overall architecture Wrapper components and functions Instruction set Core test language Core test supporting and system test configurations Hierarchical test control and plug & play VLSI Test Principles and Architectures Ch. 10 - Boundary Scan and Core-Based Testing - P. 46 46

SOC Test Problems/Requirements (1/2) Mixing technologies: logic, processor, memory, analog Need various DFT/BIST/other techniques Deeply embedded cores Need Test Access Mechanism Hierarchical core reuse Need hierarchical test management Different core providers and SOC test developers Need standard for test integration IP protection/test reuse Need core test standard/documentation VLSI Test Principles and Architectures Ch. 10 - Boundary Scan and Core-Based Testing - P. 47 47

SOC Test Problems/Requirements (2/2) Higher-performance core pins than SOC pins Need on-chip, at-speed testing External ATE inefficiency Need on-chip ATE Long test application time Need parallel testing or test scheduling Test power must be considered Need lower power design or test scheduling Testable design automation Need new testable design tools and flow VLSI Test Principles and Architectures Ch. 10 - Boundary Scan and Core-Based Testing - P. 48 48

A System Overview of IEEE 1500 Standard VLSI Test Principles and Architectures Ch. 10 - Boundary Scan and Core-Based Testing - P. 49 49

Test Interface of A Core Wrapper Wrapper Parallel Input WPI Wrapper Parallel Control WPC Optional W rapper Parallel Port (W PP) Wrapper Parallel Output WPO Core WSI Wrapper Serial Input Required W rapper Serial Port (WSP) Wrapper WSC Wrapper Serial Control WSO Wrapper Serial Output VLSI Test Principles and Architectures Ch. 10 - Boundary Scan and Core-Based Testing - P. 50 50

Serial Test Circuitry of 1500 for a Core VLSI Test Principles and Architectures Ch. 10 - Boundary Scan and Core-Based Testing - P. 51 51

Wrapper Components Wrapper series port (WSP) Wrapper series input (WSI), Wrapper series output (WSO), Wrapper series control (WSC) Wrapper parallel port (WPP) (optional) Wrapper parallel input (WPI), Wrapper parallel output (WPO), wrapper parallel control (WPC) Wrapper instruction register (WIR) Wrapper bypass regiester (WBY) Wrapper data register (WBR) Consists of wrapper boundary cells (WBC s) Core data register (CDR) (optional) VLSI Test Principles and Architectures Ch. 10 - Boundary Scan and Core-Based Testing - P. 52 52

Wrapper Series Control (WSC) signals WRCK: wrapper clock terminal AUXCKn: Optional auxiliary clocks, where n is the number of the clocks. WRSTN: wrapper reset SelectWIR: determine whether WIR is selected CaptureWR: enable Capture operation ShiftWR: enable Shift operation UpdateWR: enable Update operation TransferDR: enable Transfer operation VLSI Test Principles and Architectures Ch. 10 - Boundary Scan and Core-Based Testing - P. 53 53

Wrapper Instruction Register VLSI Test Principles and Architectures Ch. 10 - Boundary Scan and Core-Based Testing - P. 54 54

Wrapper Boundary Register (WBR) Consists of Wrapper boundary cells (WBC s) WBC Terminals: Cell functional input (CFI), cell functional output (CFO), cell test input (CTI), cell test output (CTO) Functional modes: Normal, inward facing, outward facing, nonhazardous (safe). Operation events: Shift, capture, update, transfer, apply. VLSI Test Principles and Architectures Ch. 10 - Boundary Scan and Core-Based Testing - P. 55 55

Events of WBR (WBC) Shift: data advance one-bit forward on WBR s shift path Capture: data on CFI or CFO are captured and stored in WBC Update: data stored in WBC s shift path storage are loaded into an off-shift-path storage of the WBC Transfer: move data to the storage closest to CTI or one bit closer to CTO Apply: a derivative event inferred from other events to apply data to functional inputs of cores or functional outputs of WBR VLSI Test Principles and Architectures Ch. 10 - Boundary Scan and Core-Based Testing - P. 56 56

Four Symbols Used in Bubble Diagrams for WBC s Storage element Data path Decision point Data paths from a source VLSI Test Principles and Architectures Ch. 10 - Boundary Scan and Core-Based Testing - P. 57 57

Some Typical WBC s Represented by Bubble Diagrams VLSI Test Principles and Architectures Ch. 10 - Boundary Scan and Core-Based Testing - P. 58 58

Example 10.1 - WIR Interface of WBY, WBR WDR(s) ) and CDR(s) SelectWIR {SelectWIR, WRCK, WRSTN, CaptureWR, ShiftWR, UpdateWR} WIR Circuitry Core_Cntrl WDR_Cntrl CDR_Cntrl DR_Select[n:0] WBR_Cntrl WBY_Cntrl WBR CDR k WDR k WIR_WSO DR_Select[n:0] DR_WSO WSO WSI WBY VLSI Test Principles and Architectures Ch. 10 - Boundary Scan and Core-Based Testing - P. 59 59

Example 10.2 - Schematic Diagram of WBC WC_SD2_CIO CTI SHIFT XFER WRCK D1 MODE CFI CAPT CFO D2 CTO IO_FACE WRCK VLSI Test Principles and Architectures Ch. 10 - Boundary Scan and Core-Based Testing - P. 60 60

WS_BYPASS Instruction VLSI Test Principles and Architectures Ch. 10 - Boundary Scan and Core-Based Testing - P. 61 61

WS_EXTEST Instruction VLSI Test Principles and Architectures Ch. 10 - Boundary Scan and Core-Based Testing - P. 62 62

WP_EXTEXT Instruction VLSI Test Principles and Architectures Ch. 10 - Boundary Scan and Core-Based Testing - P. 63 63

WS_SAFE Instruction Disabled Safe States W B R FI FO Core FO FI W B R Safe States WSI Bypass WIR WSO WSC VLSI Test Principles and Architectures Ch. 10 - Boundary Scan and Core-Based Testing - P. 64 64

WS_PRELOAD Instruction VLSI Test Principles and Architectures Ch. 10 - Boundary Scan and Core-Based Testing - P. 65 65

WP_PRELOAD Instruction VLSI Test Principles and Architectures Ch. 10 - Boundary Scan and Core-Based Testing - P. 66 66

WS_CLAMP Instruction VLSI Test Principles and Architectures Ch. 10 - Boundary Scan and Core-Based Testing - P. 67 67

WS_INTEST Instruction VLSI Test Principles and Architectures Ch. 10 - Boundary Scan and Core-Based Testing - P. 68 68

WS_INTEST_SCAN Instruction VLSI Test Principles and Architectures Ch. 10 - Boundary Scan and Core-Based Testing - P. 69 69

General Parallel TAM Structure VLSI Test Principles and Architectures Ch. 10 - Boundary Scan and Core-Based Testing - P. 70 70

Multiplexed TAM Architectures VLSI Test Principles and Architectures Ch. 10 - Boundary Scan and Core-Based Testing - P. 71 71

Daisy chained TAM Architecture VLSI Test Principles and Architectures Ch. 10 - Boundary Scan and Core-Based Testing - P. 72 72

Direct Access TAM Architectures VLSI Test Principles and Architectures Ch. 10 - Boundary Scan and Core-Based Testing - P. 73 73

Local Controller TAM Architectures VLSI Test Principles and Architectures Ch. 10 - Boundary Scan and Core-Based Testing - P. 74 74

Core Access Switch (CAS) Architecture VLSI Test Principles and Architectures Ch. 10 - Boundary Scan and Core-Based Testing - P. 75 75

Different Functional Modes of CAS VLSI Test Principles and Architectures Ch. 10 - Boundary Scan and Core-Based Testing - P. 76 76

Various Types of Test Supporting Using CAS Structure VLSI Test Principles and Architectures Ch. 10 - Boundary Scan and Core-Based Testing - P. 77 77

A Hierarchical Test Architecture Supporting Plug & Play Feature VLSI Test Principles and Architectures Ch. 10 - Boundary Scan and Core-Based Testing - P. 78 78

Detailed I/O and CTC of The Hierarchical Test Architecture VLSI Test Principles and Architectures Ch. 10 - Boundary Scan and Core-Based Testing - P. 79 79

A Hierarchical Test Architecture with I/Os Compatible to 1149.1 VLSI Test Principles and Architectures Ch. 10 - Boundary Scan and Core-Based Testing - P. 80 80

Comparison between 1149.1 and 1500 Purpose Parallel Mode Extra Data/Control I/Os FSM Transfer Mode Latency between operations Mandatory Instructions 1149.1 Board-level No Mandatory: TDI, TDO, TMS, TCK Optional: TRST Yes No Yes EXTEST, BYPASS, SAMPLE, PRELOAD 1500 Core-based VLSI Test Principles and Architectures Ch. 10 - Boundary Scan and Core-Based Testing - P. 81 Yes Mandatory: WSI, WSO, 6 WSC Optional: TransferDR, WPP, AUXCKn(s) No Yes No WS_EXTEST, WS_BYPASS, one Wx_INTEST, WS_PRELOAD (cond. required) 81