- RailClamp Description RailClamp TVS arrays are low capacitance SD protection devices designed to protect high speed data interfaces.. This series has been specifically designed to protect sensitive components which are connected to data and transmission lines from overvoltage caused by SD (electrostatic discharge), CD (Cable Discharge vents), and FT (electrical fast transients). The unique design incorporates surge rated, low capacitance steering diodes and a TVS diode in a single package. During transient conditions, the steering diodes direct the transient to either the positive side of the power supply line or to ground. The internal TVS diode prevents over-voltage on the power line, protecting any downstream components. The low capacitance array configuration allows the user to protect three high-speed data or transmission lines. The low inductance construction minimizes voltage overshoot during high current surges. This device is optimized for SD protection of USB OTG and SIM interfaces. They may be used to meet the SD iunity requirements of IC 6-4-2, Level 4 (±kv air, ±8kV contact discharge). RClamp3F RailClamp TVS Array for USB OTG Interfaces Features Transient protection for high-speed data lines to IC 6-4-2 (SD) ±2kV (air), ±2kV (contact) IC 6-4-4 (FT) 4A (/ns) Array of surge rated diodes with internal TVS Diode Small package saves board space Protects three I/O lines & power line Low capacitance (<3pF) for high-speed interfaces Low clamping voltage Low operating voltage:.v Solid-state silicon-avalanche technology Mechanical Characteristics IAJ SC-7 L package Molding compound flaability rating: UL 94V- Lead Finish: Matte Tin Pb-Free, Halogen Free, RoHS/W Compliant Marking : F3 Packaging : Tape and Reel Applications USB OTG interfaces SIM Ports Video Graphics Cards Personal Digital Assistants (PDAs) Monitors and Flat Panel Displays Portable lectronics Microcontroller Input Protection Schematic Schematic & PIN Configuration 3 4 2 SC-7 L (Top View) Revision 4/2/24
Absolute Maximum Rating Rating Symbol Value Units Peak Pulse Power (tp = 8/2μs) M aximum Peak Pulse Current ( tp = 8/2μs) P pk Watts I pp 6 Amps SD per IC 6-4-2 (Air) SD per IC 6-4-2 (Contact) V SD +/- 2 +/- 2 kv Operating Temperature T J - to +2 C Storage Temperature T STG to + - C lectrical Characteristics (T=2 o C) Parameter Symbol Conditions Minimum Typical Maximum Units Reverse Stand-Off Voltage V WM R in to 2 P V Reverse Breakdown Voltage V R B I t = ma Pin to 2 6 V Reverse Leakage Current I R V RWM = V, T=2 C Pin to 2 Clamping Voltage V C I PP = A, tp = 8/2μs Pin, 3, or 4 to Pin 2 Clamping Voltage V C I PP = 6A, tp = 8/2μs Pin, 3, or 4 to Pin 2 Junction Capacitance C j V R = V, f = MHz Pin, 3, or 4 to Pin 2 Notes )SD gun return path connected to SD ground reference plane. V R = V, f = MHz Between any two I/O pins (, 3, 4) 3 μa V 2 V 3 pf. pf 24 Semtech Corporation 2
Typical Characteristics Non-Repetitive Peak Pulse Power vs. Pulse Time Clamping Voltage vs. Peak Pulse Current (tp=8/2us) Peak Pulse Power - P PP (kw). T A = 2 O C Clamping Voltage - V C (V) 2 2 Waveform Parameters: tr = 8µs td = 2µs Pin, 3, or 4,to pin 2 Pin to pin 2.. Pulse Duration - tp (µs) Junction Capacitance vs. Reverse Voltage (Pin, 3, or 4 to GND - Normalized to V) DR442-2 3 4 6 7 8 Peak Pulse Current - I PP (A) TLP Characteristic (Pin, 3, or 4 to GND) Normalized Capacitance 2.. f = MHz Current (A) 3 2 2 Transmission Line Pulse Test (TLP) Settings: t p = ns, t r =.2ns, I TLP and V TLP averaging window: t = 7ns to t 2 = 9ns 2 3 4 Reverse Voltage - V R (V) 2 2 3 3 4 Voltage (V) SD Clamping (+8kV Contact per IC 6-4-2) (Pin, 3, or 4 to GND) SD Clamping (-8kV Contact per IC 6-4-2) (Pin, 3, or 4 to GND) 2 Measured with Ohm scope input impedance, 2GHz bandwidth. Corrected for Ohm, 4dB attenuator. SD gun return path connected to SD ground plane - Voltage (V) Voltage (V) - - -2-2 Measured with Ohm scope input impedance, 2GHz bandwidth. Corrected for Ohm, 4dB attenuator. SD gun return path connected to SD ground l - -3-2 3 4 6 7 8-2 3 4 6 7 8 Time (ns) Time (ns) 24 Semtech Corporation 3
Typical Characteristics Insertion Loss S2 S2 (db) - -2-3 -4 - (Pin, 3, or 4 to GND) -6 Frequency (MHz) S2 (db).2 -.2 -.4 -.6 -.8 - -.2 -.4 -.6 Insertion Loss S2 (Between any two I/O pins -, 3, 4) -.8 Frequency (MHz) 24 Semtech Corporation 4
Applications Information Device Connection Options for Protection of Three High-Speed Data Lines Data Line and Power Supply Protection Using Vcc as reference This device is designed to protect three data lines from transient over-voltages by clamping them to a fixed reference. When the voltage on the protected line exceeds the reference voltage (plus diode V F ) the steering diodes are forward biased, conducting the transient current away from the sensitive circuitry. Data lines are connected at pins, 3, and 4. The negative reference is connected at pin 2. This pin should be connected directly to a ground plane on the board for best results. The path length is kept as short as possible to minimize parasitic inductance. Connect pin directly to the positive supply rail (V CC ). In this configuration the data lines are referenced to the supply voltage. The internal TVS diode prevents over-voltage on the supply rail. Matte Tin Lead Finish Matte tin has become the industry standard lead-free replacement for SnPb lead finishes. A matte tin finish is composed of % tin solder with large grains. Since the solder volume on the leads is small compared to the solder paste volume that is placed on the land pattern of the PCB, the reflow profile will be determined by the requirements of the solder paste. Therefore, these devices are compatible with both lead-free and SnPb assembly techniques. In addition, unlike other lead-free compositions, matte tin does not have any added alloys that can cause degradation of the solder joint. 24 Semtech Corporation
Outline Drawing - SC-7 L /2 ccc C 2X N/2 TIPS A N 2 B D e e D DIMNSIONS INCHS MILLIMTRS DIM MIN NOM MAX MIN NOM MAX A - -.43 - -. A. -.4. -. A2.28.3.39.7.9. b.6 -.2. -.3 c.3 -.9.8 -.22 D.7.79.87.8 2. 2.2.4.49.3..2.3 e.83 BSC.26 BSC 2. BSC.6 BSC e..3 BSC L..4.8.26.36.46 L (.7) (.42) N - 8-8 aaa.4. bbb.4. ccc.2.3 aaa C A2 A SATING PLAN C A bxn bbb C A-B D GAG PLAN H c SID VIW S DTAIL A. DTAIL A L (L) NOTS:. CONTROLLING DIMNSIONS AR IN MILLIMTRS (ANGLS IN DGRS). 2. DATUMS -A- AND -B- TO B DTRMIND AT DATUM PLAN -H- 3. DIMNSIONS "" AND "D" DO NOT INCLUD MOLD FLASH, PROTRUSIONS OR GAT BURRS. 4. RFRNC JDC STD MO-23, VARIATION AA. Land Pattern - SC-7 L C X Y G Z DIM C G P X Y Z DIMNSIONS INCHS MILLIMTRS (.73) (.8).39..26.6.6.4.33.8.6 2.7 P NOTS:. THIS LAND PATTRN IS FOR RFRNC PURPOSS ONLY. CONSULT YOUR MANUFACTURING GROUP TO NSUR YOUR COMPANY'S MANUFACTURING GUIDLINS AR MT. 24 Semtech Corporation 6
Marking Code F3 Ordering Information Part Number RClamp3F.TCT Lead Finis h Qty per Reel Reel Size Matte Tin 3, 7 Inch RailClamp and RClamp are trademarks of Semtech Corporation. Carrier Tape Specification F3 F3 F3 F3 F3 F3 F3 F3 Device Orientation in Tape Tape Width B, (Max) D D (MIN) F K (MAX) P P P 2 T(MAX) W 8 4.2 (.6). +. -. (.9 +. -.). (.39).7±. (.69±.4) 3.±. (.38±.2) 2.4 (.94) 4.±. (.7±.- 4) 4.±. (.7±.- 4) 2.±. (.79±.2).4 (.6) 8.3 (.32±.2) Contact Information Semtech Corporation Protection Products Division 2 Flynn Rd., Camarillo, CA 932 Phone: (8)498-2 FAX (8)498-384 24 Semtech Corporation 7