RClamp0582BQ. Low Capacitance TVS for Automotive Applications. PROTECTION PRODUCTS - RailClamp Description. Features. Mechanical Characteristics

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- RailClamp Description The RClamp 582BQ transient voltage suppressor is specifically designed to protect sensitive components which are connected to high-speed data and transmission lines from overvoltage caused by ESD (electrostatic discharge), CDE (cable discharge events), and EFT (electrical fast transients). It is rated to Grade 2 of AEC-Q for use in automotive applications. The RClamp 582BQ features high peak pulse current capability (Ipp=5A, tp=8/2us) for use in applications that require high surge immunity testing. It has a maximum capacitance of only.2pf (pin or 2 to pin). They may be used to meet the ESD immunity requirements of IEC 6-4-2 (±k air, ±25k contact discharge). Each device can be configured to protect bidirectional line or two unidirectional lines. These devices are in a small SC-75 (SOT-52) package and feature a lead-free, matte tin finish. They are compatible with both lead free and SnPb assembly techniques. The combination of small size, low capacitance, and high level of surge protection makes them a flexible solution for protection of USB 2., LDS, and video interfaces. RClamp582BQ Low Capacitance TS for Automotive Applications Features Transient protection for high-speed data lines to IEC 6-4-2 (ESD) ±k (air), ±25k (contact) IEC 6-4-4 (EFT) 4A (5/5ns) Qualified to AEC-Q, Grade 2 Protects up to two I/O lines Low capacitance (<.2pF) High surge capability: 5A (tp=8/2us) Low leakage current and clamping voltage Low operating voltage: 5. Solid-state silicon-avalanche technology Mechanical Characteristics SC-75 (SOT-52) package Lead Finish: Matte Tin Pb-Free, Halogen Free, RoHS/WEEE Compliant Molding compound flammability rating: UL 94- Packaging: Tape and Reel Applications USB 2. ideo Lines LDS Lines Dimensions Schematic & PIN Configuration.6.5 BSC.8.6 2. BSC.75 Revision 7/28/ Nominal Dimensions (mm) SC-75 L (Top iew)

RClamp582BQ Absolute Maximum Rating Rating Symbol alue Units Peak Peak Pulse Power (tp = 8/2µs) Pulse Current (tp = 8/2µs) P pk Watts I PP 5 A ESD per IEC 6-4-2 (Air) ESD per IEC 6-4-2 (Contact) ESD 25 k Operating Temperature T J -4 to +5 C Storage Temperature T STG 55 to +5 - C Electrical Characteristics (T=25 o C) Parameter Symbol Conditions Minimum Typical Maximum Units Stand-Off oltage WM R in or Pin 2 to Pin P 5 Breakdown oltage B I t = ma R 6 Leakage Current I R RWM = 5, T=25 C and Between Pins and 2 Leakage Current I R RWM = 5, T=5 C and Between Pins and 2 Clamping oltage C I PP = 5A, tp = 8/2µ s Clamping oltage C I PP = 5A, tp = 8/2µ s Junction Capacitance C R =, f = MHz j Pin to Pin 2 Junction Capacitance C R =, f = MHz j. µ A. µ A 5 2.5. 8 pf.2 pf 2 Semtech Corp. 2

RClamp582BQ Typical Characteristics Non-Repetitive Peak Pulse Power vs. Pulse Time Power Derating Curve Peak Pulse Power - P PP (kw)... Pulse Duration - tp (us) % of Rated Power or IPP 9 8 7 6 5 4 2 25 5 75 25 5 Ambient Temperature - T A ( o C) Clamping oltage vs. Peak Pulse Current Normalized Capacitance vs. oltage Clamping oltage - C () 2 8 6 4 2 8 6 4 Waveform Parameters: 2 tr = 8μs td = 2μs 5 5 2 Peak Pulse Current - I PP (A) ESD Clamping - (8k Contact per IEC 6-4-2) Cj(R)/Cj(R=) 2.8.6.4.2.8.6.4.2 f = MHz 2 4 5 oltage - R () Insertion Loss S2 () CH S2 LOG 6 db / REF db : -.6 db 8 MHz db -6 db -2 db -8 db 2 4 5 2: -.777 db 9 MHz : -.565 db.8 GHz 4: -.565 db 2.5 GHz -24 db - db -6 db -42 db -48 db MHz MHz MHz GHz GHz Note: Data is taken with a x attenuator START. MHz STOP. MHz 2 Semtech Corp.

RClamp582BQ Forward oltage vs. Forward Current (Pin to Pin or Pin 2) Normalized Capacitance vs. Temperature () Forward oltage - F () 2 5 5 T A =25 O C 8/2μs pulse Capacitance Normalized to 25 O C 5 4 2 R = Line to Line 5 5 Forward Current - I F (A) Leakage Current vs. Temperature () - -5 5 5 2 Temperature ( O C) 6 R =5 Pin or 2 to Leakage (na) 4 2-75 -25 25 75 25 75 Temperature ( O C) 2 Semtech Corp. 4

RClamp582BQ Applications Information Device Connection Options Figure. Pin Configuration This device is optimized for protection of two high speed dta lines. The device is connected as follows: Protection of two lines is achieved by connecting data lines at pins & 2. Pin is connected to ground. The connection to ground should be made directly to a ground plane. The path length should also be kept as short as possible to minimize parasitic inductance. Matte Tin Lead Finish Matte tin has become the industry standard lead-free replacement for SnPb lead finishes. A matte tin finish is composed of % tin solder with large grains. Since the solder volume on the leads is small compared to the solder paste volume that is placed on the land pattern of the PCB, the reflow profile will be determined by the requirements of the solder paste. Therefore, these devices are compatible with both lead-free and SnPb assembly techniques. In addition, unlike other lead-free compositions, matte tin does not have any added alloys that can cause degradation of the solder joint. 2 Semtech Corp. 5

RClamp582BQ Outline Drawing -SC-75 (SOT-52) A D e 2 e B E E bxn bbb C A B DIMENSIONS INCHES MILLIMETERS DIM MIN NOM MAX MIN NOM MAX A.2 -.5.6 -.9 A. -.4. -. A2.2...6.75.8 b.5 -.2.5 -. c. -.8. -.2 D.59.6.67.5.6.7 E.57.6.69.45.6.75 E.29...75.8.85 e.9 BSC. BSC e.2 BSC.5 BSC L (.9) (.22) N - 8-8 aaa.4. bbb.8.2 A A2 A aaa C SEATING PLANE C H SEE DETAIL A SEATING PLANE C L c SIDE IEW DETAIL A NOTES:. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). 2. DATUMS -A- AND -B- TO BE DETERMINED AT DATUM PLANE -H-. DIMENSIONS "E" AND "D" DO NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. Land Pattern -SC-75 (SOT-52) X Z C G Y Y DIMENSIONS DIM INCHES MILLIMETERS C (.55) (.4) P.9. p.2.5 G.24.6 X.6.4 Y..8 Z.87 2.2 p P NOTES:. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY'S MANUFACTURING GUIDELINES ARE MET. 2 Semtech Corp. 6

RClamp582BQ Marking Ordering Information Part Number Lead Finish Qty per Reel Reel Size P 8 YW RClamp582BQ.TCT Pb Free, 7 Inch RailClamp and RClamp are registered trademarks of Semtech Corporation YW = Date Code Tape and Reel Specification Device Orientation in Tape A B K.85 +/-.5 mm.85 +/-.5 mm.87 +/-.5 mm Tape Width B, (Max) D D (MIN) E F K (MAX) P P P 2 T(MAX) W 8 mm 4.2 mm (.65).5 +. mm -. mm (.59 +.5 -.). mm (.9).75±. mm (.69±.4).5±.5 mm (.8±.2) 2.4 mm (.94) 4.±. mm (.57±.4) 4.±. mm (.57±.4) 2.±.5mm (.79±.2).4 mm (.6) 8. mm (.2±.2) Contact Information Semtech Corporation Protection Products Division 2 Flynn Rd., Camarillo, CA 92 Phone: (85)498-2 FAX (85)498-84 2 Semtech Corp. 7