Unternehmerseminar WS 2009 / 2010
|
|
- Andrew Hawkins
- 7 years ago
- Views:
Transcription
1 Unternehmerseminar WS 2009 / 2010 Fachbereich: Maschinenbau und Mechatronik Autor / Thema / Titel: Key Enabling Technology Business Planning Process: Product Roadmaps 1
2 Table of Contents About AIXTRON General introduction to roadmapping Example silicon equipment roadmaps Summary 2
3 Applications Enabled by AIXTRON s MOCVD Equipment LED - Lightning, Signaling, Outdoor Giant Screens High-k, Ferroelectrics CMOS Transistors, Memories Consumer/ Optoelectronics - CD, DVD, Laserprinter Telecommunication, Data Communication Fiber optics, wireless communication 3
4 What is a product roadmap? Definition A Product Roadmap is a tool to develop new products through a series of logical steps, starting from the process of idea generation and ending at the launch of the product into a market 1 Non-Opportunistic Instead of following short-term customer requests, the Product Roadmap is based on mid- to long-term market requirements, which are common to the majority of targeted customers in a specific segment. Pro-Active Therefore, the Product Roadmap helps to pro-actively build the right products in time for the market, thus reducing the number of product failures Marketing Finally, the Product Roadmap illustrates the planned development, testing, release and availability dates of products and services of a company and can be used as a selling tool in front of (strategic) customers, i.e. roadmap alignment 1 Philip Kotler: Managing Marketing 4
5 Why roadmapping? The main function of roadmapping is to provide a shared view of business in time. The rapid development of new technologies, the change in customer needs has forced to focus new product development. Product development is a inter-disciplinary (sales, marketing, engineering, finance, etc.) and time-consuming process. To minimize risk and cost for development of a new product. 3rd party independent research 1 has shown that 40% of new consumer products, 20% of new industrial products and 18% of new services related products have failed completely as products. 1 David S. Hopkins and Earl L. Baily: "New Product Pressures" 5
6 The Roadmap integrates five views Source: G. Müller, Embedded Systems Institute, NL 6
7 Example AIXTRON s Silicon Equipment Roadmaps: Market Analysis of Megatrends (3) Pentium 4 IC: 100 Mio. transistors! Source: Intel 7
8 Evolution of CMOS technology, Downscaling of dimensions Decade of materials Convergence of technologies L G 90 nm 32 nm L G 65 nm L G < 32 nm Poly Si Si Metal High-k Oxide Metal High-k Oxide SiO 2 Strained Si Si GaAs Oxide Ge Silicon substrate Continuous shrinking of transistor dimensions. Almost no change in materials. MOORE S law driven by lithography improvement. SoI substrate Conventional Si-CMOS reaches physical limits. Moore s law driven by introduction of new materials & shrinking. MORE OF MOORE Engineered substrate Si-CMOS combined with MEMS, compound semiconductors, hetero system integration, etc. MORE THAN MOORE 8
9 Example AIXTRON s Silicon Equipment Roadmaps: Product Top-down definition of market requirement for product (1) TIMING CONCEPT Q3/0Z: Expected production ramp-up of lead customer Q2/0Y: Production tool ready Q3/0X: Start process development on ß-tool Q3/0X Source: ITRS roadmap 2003 Q2/0Y Q3/0Z 9
10 Summary: Main benefits of a Roadmap 10
Advanced VLSI Design CMOS Processing Technology
Isolation of transistors, i.e., their source and drains, from other transistors is needed to reduce electrical interactions between them. For technologies
More informationIntel s Revolutionary 22 nm Transistor Technology
Intel s Revolutionary 22 nm Transistor Technology Mark Bohr Intel Senior Fellow Kaizad Mistry 22 nm Program Manager May, 2011 1 Key Messages Intel is introducing revolutionary Tri-Gate transistors on its
More informationImplementation Of High-k/Metal Gates In High-Volume Manufacturing
White Paper Implementation Of High-k/Metal Gates In High-Volume Manufacturing INTRODUCTION There have been significant breakthroughs in IC technology in the past decade. The upper interconnect layers of
More informationDigital Integrated Circuit (IC) Layout and Design
Digital Integrated Circuit (IC) Layout and Design! EE 134 Winter 05 " Lecture Tu & Thurs. 9:40 11am ENGR2 142 " 2 Lab sections M 2:10pm 5pm ENGR2 128 F 11:10am 2pm ENGR2 128 " NO LAB THIS WEEK " FIRST
More informationNanotechnologies for the Integrated Circuits
Nanotechnologies for the Integrated Circuits September 23, 2015 Dr. Bertrand Cambou Professor of Practice NAU, Cybersecurity School of Informatics, Computing, and Cyber-Systems Agenda The Market Silicon
More informationConcevoir et produire des semiconducteurs en Europe: une Utopie? Let s have a look
Concevoir et produire des semiconducteurs en Europe: une Utopie? Let s have a look Gérard MATHERON MIDIS MINATEC 24 avril 2009 1 Advanced Wafer Manufacturing Challenges Advanced Wafer Manufacturing Challenges
More informationAIXTRON Investor Presentation. Fiscal Year 2014 Results (February 24, 2015)
AIXTRON Investor Presentation Fiscal Year 2014 Results (February 24, 2015) DISCLAIMER Forward-Looking Statements 2 This document may contain forward-looking statements regarding the business, results of
More informationHow To Increase Areal Density For A Year
R. Fontana¹, G. Decad¹, S. Hetzler² ¹IBM Systems Technology Group, ²IBM Research Division 20 September 2012 Technology Roadmap Comparisons for TAPE, HDD, and NAND Flash: Implications for Data Storage Applications
More informationCompany Presentation. February 2011. Sustainable Technologies Conference. June 8, 2011
Company Presentation Sustainable Technologies Conference February 2011 June 8, 2011 Disclaimer This presentation contains forward-looking statements relating to the business, financial performance and
More informationASML reports Q3 results as guided and remains on track for record 2015 sales Two new lithography scanners launched
ASML reports Q3 results as guided and remains on track for record 2015 sales Two new lithography scanners launched ASML 2015 Third Quarter Results Veldhoven, the Netherlands Forward looking statements
More informationADVANCED WAFER PROCESSING WITH NEW MATERIALS. ASM International Analyst and Investor Technology Seminar Semicon West July 15, 2015
ADVANCED WAFER PROCESSING WITH NEW MATERIALS ASM International Analyst and Investor Technology Seminar Semicon West July 15, 2015 SAFE HARBOR STATEMENTS Safe Harbor Statement under the U.S. Private Securities
More informationSUSS MICROTEC INVESTOR PRESENTATION. November 2015
SUSS MICROTEC INVESTOR PRESENTATION November 2015 DISCLAIMER This presentation contains forward-looking statements relating to the business, financial performance and earnings of SUSS MicroTec AG and its
More informationIntroduction to VLSI Fabrication Technologies. Emanuele Baravelli
Introduction to VLSI Fabrication Technologies Emanuele Baravelli 27/09/2005 Organization Materials Used in VLSI Fabrication VLSI Fabrication Technologies Overview of Fabrication Methods Device simulation
More informationIntroduction to VLSI Programming. TU/e course 2IN30. Prof.dr.ir. Kees van Berkel Dr. Johan Lukkien [Dr.ir. Ad Peeters, Philips Nat.
Introduction to VLSI Programming TU/e course 2IN30 Prof.dr.ir. Kees van Berkel Dr. Johan Lukkien [Dr.ir. Ad Peeters, Philips Nat.Lab] Introduction to VLSI Programming Goals Create silicon (CMOS) awareness
More informationDEVELOPMENTS & TRENDS IN FEOL MATERIALS FOR ADVANCED SEMICONDUCTOR DEVICES Michael Corbett mcorbett@linx-consulting.com Semicon Taiwan2015
DEVELOPMENTS & TRENDS IN FEOL MATERIALS FOR ADVANCED SEMICONDUCTOR DEVICES Michael Corbett mcorbett@linx-consulting.com Semicon Taiwan2015 LINX BACKGROUND Linx Consulting 1. We help our clients to succeed
More informationsemiconductor software solutions Stefan Birner
Stefan Birner Schmalkaldener Str. 34 D-80807 Munich +49-89 35 89 53 34 Stefan Birner www.nextnano.de stefan.birner@nextnano.de Goal: Business plan & Spin-off Our vision: To establish as the de facto standard
More informationThin Is In, But Not Too Thin!
Thin Is In, But Not Too Thin! K.V. Ravi Crystal Solar, Inc. Abstract The trade-off between thick (~170 microns) silicon-based PV and thin (a few microns) film non-silicon and amorphous silicon PV is addressed
More informationDESIGN, FABRICATION AND ELETRICAL CHARACTERIZATION OF SOI FINFET TRANSISTORS
DESIGN, FABRICATION AND ELETRICAL CHARACTERIZATION OF SOI FINFET TRANSISTORS Prof. Dr. João Antonio Martino Professor Titular Departamento de Engenharia de Sistemas Eletrônicos Escola Politécnica da Universidade
More informationECE 410: VLSI Design Course Introduction
ECE 410: VLSI Design Course Introduction Professor Andrew Mason Michigan State University Spring 2008 ECE 410, Prof. A. Mason Lecture Notes Page i.1 Age of electronics microcontrollers, DSPs, and other
More informationInvestor Presentation Q3 2015
Investor Presentation Q3 2015 Veeco Instruments 1 Investor Presentation Veeco at a Glance > Leading deposition and etch solutions provider; Veeco enables high-tech electronic device manufacturing > Founded
More informationThe Move to the next Silicon Wafer Size
White Paper The Move to the next Silicon Wafer Size The Move to the next Silicon Wafer Size: A White Paper from the European Equipment and Materials 450mm Initiative (EEMI450) Introduction: Industry Dynamics
More informationRecent developments in high bandwidth optical interconnects. Brian Corbett. www.tyndall.ie
Recent developments in high bandwidth optical interconnects Brian Corbett Outline Introduction to photonics for interconnections Polymeric waveguides and the Firefly project Silicon on insulator (SOI)
More informationNanoelektronik: Von der Realität bis zur Utopie
LNQE-Kolloquium Nanoelektronik: Von der Realität bis zur Utopie Heinrich Kurz Institut für Halbleitertechnik, RWTH-Aachen AMICA - Advanced Microelectronic Center Aachen, AMO GmbH I. Einleitung II. Realität
More informationThe MOSFET Transistor
The MOSFET Transistor The basic active component on all silicon chips is the MOSFET Metal Oxide Semiconductor Field Effect Transistor Schematic symbol G Gate S Source D Drain The voltage on the gate controls
More informationNew materials on horizon for advanced logic technology in mobile era
New materials on horizon for advanced logic technology in mobile era source gate Kelin J. Kuhn, TED 2012 drain Franz Kreupl, IFX 2003 Hsinchu March 6, 2013 - Prof. Dr. Franz Kreupl 1 Outline Introduction
More informationEE-612: Nanoscale Transistors (Advanced VLSI Devices) Spring 2005
EE-612: Nanoscale Transistors (Advanced VLSI Devices) Spring 2005 Mark Lundstrom Electrical and Computer Engineering Purdue University, West Lafayette, IN USA 765-494-3515 lundstro@purdue.edu 1 evolution
More informationMARKET ANALYSIS AND KEY TRENDS FROM FD SOI PERSPECTIVE (SEPTEMBER 22, 2014)
MARKET ANALYSIS AND KEY TRENDS FROM FD SOI PERSPECTIVE (SEPTEMBER 22, 2014) INTERNATIONAL BUSINESS STRATEGIES, INC. 632 Industrial Way Los Gatos CA 95030 USA 408 395 9585 408 395 5389 (fax) www.ibs-inc.net
More informationLED and Beyond A Convergent Future Consolidation, Convergence & Collaboration
LED and Beyond A Convergent Future Consolidation, Convergence & Collaboration Paul Hyland President & CEO AIXTRON SE Forward-Looking Statements This document may contain forward-looking statements regarding
More informationFollowing a paper that I wrote in 1965 and a speech that I gave in
C H A P T E R 7 MOORE S LAW AT 40 Gordon E. Moore Following a paper that I wrote in 1965 and a speech that I gave in 1975, the term Moore s law was coined as a name for a type of prediction that I had
More informationIntroduction to CMOS VLSI Design
Introduction to CMOS VLSI esign Slides adapted from: N. Weste,. Harris, CMOS VLSI esign, Addison-Wesley, 3/e, 24 Introduction Integrated Circuits: many transistors on one chip Very Large Scale Integration
More informationIntroduction to Digital System Design
Introduction to Digital System Design Chapter 1 1 Outline 1. Why Digital? 2. Device Technologies 3. System Representation 4. Abstraction 5. Development Tasks 6. Development Flow Chapter 1 2 1. Why Digital
More informationGrad Student Presentation Topics PHGN/CHEN/MLGN 435/535: Interdisciplinary Silicon Processing Laboratory
Grad Student Presentation Topics 1. Baranowski, Lauryn L. AFM nano-oxidation lithography 2. Braid, Jennifer L. Extreme UV lithography 3. Garlick, Jonathan P. 4. Lochner, Robert E. 5. Martinez, Aaron D.
More informationSolid State Electronics and Photonics Electrical and Computer Engineering The Ohio State University
Solid State Electronics and Photonics Electrical and Computer Engineering The Ohio State University An Overview for Prospective Students http://www.ece.osu.edu/ssep SSEP Area: Who Are We? First Row Betty
More informationWinbond W971GG6JB-25 1 Gbit DDR2 SDRAM 65 nm CMOS DRAM Process
Winbond W971GG6JB-25 1 Gbit DDR2 SDRAM 65 nm CMOS DRAM Process Process Review For comments, questions, or more information about this report, or for any additional technical needs concerning semiconductor
More informationWhat is this course is about? Design of Digital Circuitsit. Digital Integrated Circuits. What is this course is about?
What is this course is about? Design of Digital Circuitsit Design of digital microelectronic circuits.» CMOS devices and manufacturing technology.» Digital gates. Propagation delay, noise margins, and
More informationPhotomask SBU: 65nm Dry Etch has Arrived! Michael D. Archuletta Dr. Chris Constantine Dr. Dave Johnson
Photomask SBU: 65nm Dry Etch has Arrived! Michael D. Archuletta Dr. Chris Constantine Dr. Dave Johnson What s New in Lithography? Wafer dimensions are still accelerating downward towards ever smaller features
More informationFigure 1. New Wafer Size Ramp Up as a Percentage of World Wide Silicon Area Versus Years Elapsed Since the New Size Was Introduced [1].
White Paper Forecasting the 45mm Ramp Up IC Knowledge LLC, PO Box 2, Georgetown, MA 1833 Tx: (978) 352 761, Fx: (978) 352 387, email: info@icknowledge.com Introduction The introduction and ramp up of 45mm
More informationChapter 1 Introduction to The Semiconductor Industry 2005 VLSI TECH. 1
Chapter 1 Introduction to The Semiconductor Industry 1 The Semiconductor Industry INFRASTRUCTURE Industry Standards (SIA, SEMI, NIST, etc.) Production Tools Utilities Materials & Chemicals Metrology Tools
More informationToday's Presenter. Phillip Wright, Ph.D. IntertechPira Consultant and Chief Analyst and Managing Director at WRT Associates, LLC
Today's Presenter Phillip Wright, Ph.D. IntertechPira Consultant and Chief Analyst and Managing Director at WRT Associates, LLC Dr. Wright is a highly experienced technical executive with an extensive
More informationImplementation of Short Reach (SR) and Very Short Reach (VSR) data links using POET DOES (Digital Opto- electronic Switch)
Implementation of Short Reach (SR) and Very Short Reach (VSR) data links using POET DOES (Digital Opto- electronic Switch) Summary POET s implementation of monolithic opto- electronic devices enables the
More informationWhat is th of your St
What is th of your St 18 Fall 2011 A Middle East Point of View Strategy e color rategy? A new dimension Over the past few decades, most strategists and corporate executives have been using a global classification
More informationTypes of Epitaxy. Homoepitaxy. Heteroepitaxy
Epitaxy Epitaxial Growth Epitaxy means the growth of a single crystal film on top of a crystalline substrate. For most thin film applications (hard and soft coatings, optical coatings, protective coatings)
More informationIMEC S BUSINESS MODEL. M. Van Rossum
IMEC S BUSINESS MODEL M. Van Rossum Arenberg Doctoral School 2014 FACTS & FIGURES Total revenue in 2013 of 330 M R&D staff of >2100 people Collaboration with 600 companies & 208 universities, worldwide
More informationThe 50G Silicon Photonics Link
The 50G Silicon Photonics Link The world s first silicon-based optical data connection with integrated lasers White Paper Intel Labs July 2010 Executive Summary As information technology continues to advance,
More informationMeasuring of optical output and attenuation
Measuring of optical output and attenuation THEORY Measuring of optical output is the fundamental part of measuring in optoelectronics. The importance of an optical power meter can be compared to an ammeter
More informationNATIONAL SUN YAT-SEN UNIVERSITY
NATIONAL SUN YAT-SEN UNIVERSITY Department of Electrical Engineering (Master s Degree, Doctoral Program Course, International Master's Program in Electric Power Engineering) Course Structure Course Structures
More informationFiber Optics: Engineering from Global to Nanometer Dimensions
Fiber Optics: Engineering from Global to Nanometer Dimensions Prof. Craig Armiento Fall 2003 1 Optical Fiber Communications What is it? Transmission of information using light over an optical fiber Why
More informationIntel Q3GM ES 32 nm CPU (from Core i5 660)
Intel Q3GM ES Structural Analysis For comments, questions, or more information about this report, or for any additional technical needs concerning semiconductor and electronics technology, please call
More informationSilicon photonics: low cost and high performance. L. Pavesi 18-11-10
Silicon photonics: a new technology platform to enable low cost and high performance photonics Outline Silicon Photonics State of the art Silicon Photonics for lab-on-a-chip NanoSilicon photonics Conclusion
More informationMicron MT9D111 2 Megapixel CMOS Image Sensor Functional Analysis
March 17, 2006 Micron MT9D111 2 Megapixel CMOS Image Sensor Functional Analysis For comments, questions, or more information about this report, or for any additional technical needs concerning semiconductor
More informationState-of-Art (SoA) System-on-Chip (SoC) Design HPC SoC Workshop
Photos placed in horizontal position with even amount of white space between photos and header State-of-Art (SoA) System-on-Chip (SoC) Design HPC SoC Workshop Michael Holmes Manager, Mixed Signal ASIC/SoC
More informationpush your PERFORMANCE
push your PERFORMANCE Group Management Report for the Six Months Ended June 30, 2004 REVIEW BUSINESS REVIEW AND OUTLOOK Market Environment Cautious market optimism in the compound semiconductor manufacturing
More informationEfficient Big Data Analytics Computing: A Research Challenge
Efficient Big Data Analytics Computing: A Research Challenge Wilfred Pinfold Director, Extreme Scale Programs 1 Agenda Intel Big Data Context Overview Key Research Areas Challenges Partnerships 2 Meeting
More informationNanoscale Resolution Options for Optical Localization Techniques. C. Boit TU Berlin Chair of Semiconductor Devices
berlin Nanoscale Resolution Options for Optical Localization Techniques C. Boit TU Berlin Chair of Semiconductor Devices EUFANET Workshop on Optical Localization Techniques Toulouse, Jan 26, 2009 Jan 26,
More informationHow MOCVD. Works Deposition Technology for Beginners
How MOCVD Works Deposition Technology for Beginners Contents MOCVD for Beginners...3 MOCVD A Definition...4 Planetary Reactor Technology...5 Close Coupled Showerhead Technology...6 AIXTRON MOCVD Production
More informationPhotonic components for signal routing in optical networks on chip
15 th International Conference on Transparent Optical Networks Cartagena, Spain, June 23-27, 213 Photonic components for signal routing in optical networks on chip Vincenzo Petruzzelli, Giovanna Calò Dipartimento
More informationAn Introduction to High-Frequency Circuits and Signal Integrity
An Introduction to High-Frequency Circuits and Signal Integrity 1 Outline The electromagnetic spectrum Review of market and technology trends Semiconductors industry Computers industry Communication industry
More informationHigh tech spare parts management
High tech spare parts management André van Goch Logistics Manager ASML Center of Excellence / Slide 1 20071112 ASML spare parts management Version 1 André van Goch Contents ASML business Supply chain model
More informationCS257 Introduction to Nanocomputing
CS257 Introduction to Nanocomputing Overview of Crossbar-Based Computing John E Savage Overview Intro to NW growth methods Chemical vapor deposition and fluidic assembly Nano imprinting Nano stamping Four
More informationL innovazione tecnologica dell industria italiana verso la visione europea del prossimo futuro
L innovazione tecnologica dell industria italiana verso la visione europea del prossimo futuro Mercoledì 2 Aprile 2014 Antonio D Errico, Francesco Testa, Roberto Sabella, Ericsson Silicon Photonics Opportunities
More informationWhat is optical lithography? The optical system Production process Future and limits of optical lithography References. Optical lithography
Optical lithography Robin Nagel TUM 12. Januar 2009 Robin Nagel (TUM) Optical lithography 12. Januar 2009 1 / 22 1 What is optical lithography? 1 The optical system 1 Production process 1 Future and limits
More informationGates & Boolean Algebra. Boolean Operators. Combinational Logic. Introduction
Introduction Gates & Boolean lgebra Boolean algebra: named after mathematician George Boole (85 864). 2-valued algebra. digital circuit can have one of 2 values. Signal between and volt =, between 4 and
More informationEurotraining survey on Microsytems training requirements
Eurotraining survey on Microsytems training requirements Hervé Fanet CEA LETI Annette Locher FSRM Chantal Tardif CEA INSTN Abstract One objective of the Eurotraining MST project is to identify training
More informationEquipment Despatches by applications, 2004 Revenues by regions, 2004
A N N U A L R E P O R T At a Glance Revenues (mil. Euro) Consolidated Earnings (mil. Euro) 237.8* 157.9 152.1* 140.0 34.2* 84.7 90.4* 10.4 18.5 15.1* 7.1 '99 '00 '01 '02 '03 '04 '99 '00 '01 '02 '03 '04
More informationINSTITUTE OF AERONAUTICAL ENGINEERING Dundigal, Hyderabad - 500 043
INSTITUTE OF AERONAUTICAL ENGINEERING Dundigal, Hyderabad - 500 043 ELECTRONICS AND COMMUNICATION ENGINEERING Course Title VLSI DESIGN Course Code 57035 Regulation R09 COURSE DESCRIPTION Course Structure
More informationRiding silicon trends into our future
Riding silicon trends into our future VLSI Design and Embedded Systems Conference, Bangalore, Jan 05 2015 Sunit Rikhi Vice President, Technology & Manufacturing Group General Manager, Intel Custom Foundry
More informationFirst 40 Giga-bits per second Silicon Laser Modulator. Dr. Mario Paniccia Intel Fellow Director, Photonics Technology Lab
First 40 Giga-bits per second Silicon Laser Modulator Dr. Mario Paniccia Intel Fellow Director, Photonics Technology Lab 1 Agenda What We Are Announcing Silicon Photonics Re-cap Tera-Scale Computing Why
More informationh e l p s y o u C O N T R O L
contamination analysis for compound semiconductors ANALYTICAL SERVICES B u r i e d d e f e c t s, E v a n s A n a l y t i c a l g r o u p h e l p s y o u C O N T R O L C O N T A M I N A T I O N Contamination
More informationSUSS MICROTEC INVESTOR PRESENTATION. September 2014
SUSS MICROTEC INVESTOR PRESENTATION September 2014 DISCLAIMER This presentation contains forward-looking statements relating to the business, financial performance and earnings of SUSS MicroTec AG and
More informationSolar Photovoltaic (PV) Cells
Solar Photovoltaic (PV) Cells A supplement topic to: Mi ti l S Micro-optical Sensors - A MEMS for electric power generation Science of Silicon PV Cells Scientific base for solar PV electric power generation
More informationOur Embedded Dream of the Invisible Future
Our Embedded Dream of the Invisible Future Since the invention of semiconductor chips, the evolution of mankind s culture, society and lifestyle has accelerated at a pace never before experienced. Information
More informationGROUP INTERIM REPORT FOR THE SIX MONTHS ENDED JUNE 30, 2006
GROUP INTERIM REPORT FOR THE SIX MONTHS ENDED JUNE 30, 2006 TABLE OF CONTENTS Table of Contents 1. Forward-Looking Statements............................................... 2 2. Business and Operating
More informationSilicon-On-Glass MEMS. Design. Handbook
Silicon-On-Glass MEMS Design Handbook A Process Module for a Multi-User Service Program A Michigan Nanofabrication Facility process at the University of Michigan March 2007 TABLE OF CONTENTS Chapter 1...
More informationPROVE, the next generation registration metrology tool, status report
PROVE, the next generation registration metrology tool, status report Dirk Beyer a, Patricia Gabella b, Greg Hughes b, Gerd Klose c, Norbert Rosenkranz a a Carl Zeiss SMS GmbH (Germany) Carl-Zeiss-Promenade
More informationFigure 1 Wafer with Notch
Glass Wafer 2 SCHOTT is an international technology group with more than 125 years of experience in the areas of specialty glasses, materials and advanced technologies. With our high-quality products and
More informationDigital Systems and Microelectronics Emphasis Area
Digital Systems and Microelectronics Emphasis Area Professor Classes Research Interests Dr. Sherif Abdelwahed Dr. J. W. Bruce Computer Architecture Model-based computing Embedded Systems VLSI Autonomic
More informationMaterial Requirements For 3D IC and Packaging Presented by: W. R. Bottoms
Material Requirements For 3D IC and Packaging Presented by: W. R. Bottoms Frontiers of Characterization and Metrology for Nanoelectronics Hilton Dresden April 14-16, 2015 Industry Needs Are Changing Moore
More informationSUSS MICROTEC INVESTOR PRESENTATION. May 2014
SUSS MICROTEC INVESTOR PRESENTATION May 2014 DISCLAIMER This presentation contains forward-looking statements relating to the business, financial performance and earnings of SUSS MicroTec AG and its subsidiaries
More informationeve ge our experience Quantum leverage our experience to benefit your business human resource consulting 2011 quantumhrconsulting. All Rights Reserved
Lev eve ge leverage our experience to benefit your business ra experience our 2011 quantumhrconsulting. All Rights Reserved Quantum human resource consulting introduction As the world shrinks into a global
More informationThe Semiconductor Industry: Out in Front, but Lagging Behind Tom Mariano Published September, 2014
As seen in The Semiconductor Industry: Out in Front, but Lagging Behind Tom Mariano Published September, 2014 Capital equipment suppliers must provide advanced analytical systems that leverage data generated
More informationPicosun World Forum, Espoo 9.6.2009. 35 years of ALD. Tuomo Suntola, Picosun Oy. Tuomo Suntola, Picosun Oy
35 years of ALD Conventional methods for compound film deposition Heat treatment Final crystallization Nucleation Vacuum evaporation Sputtering CVD Buildup of thin film in source controlled deposition
More informationThe Internet of Things... Hype or not?
The Internet of Things... Hype or not? Filip De Maeyer Philip Leenders 2013 global revenues of USD 5.8 billion Client-centric, services-focused business 73% of Global Fortune 100 and 59% of Global Fortune
More informationFabrication and Manufacturing (Basics) Batch processes
Fabrication and Manufacturing (Basics) Batch processes Fabrication time independent of design complexity Standard process Customization by masks Each mask defines geometry on one layer Lower-level masks
More informationIEEE CORPORATE INNOVATION AWARD RECIPIENTS
2016 INTEL CORPORATION Hillsboro, Oregon, USA 2015 - SISK CORPORATION Milpitas, California, USA 2014 - DEFENSE ADVANCED RESEARCH PROJECTS (DARPA) Arlington, Virginia, USA 2013 - APPLIED MATERIALS, INC.
More informationFreescale Semiconductor i.250 Case Studies: CSI Wireless. Case Study March 2004
Freescale Semiconductor i.250 Case Studies: CSI Wireless Case Study March 2004 CSI Wireless In many parts of the world, conventional landline infrastructure is poor or non-existent. Rather than lay costly
More informationA Point of View on the Future of IC Design, Testing and Manufacturing
A Point of View on the Future of IC Design, Testing and Manufacturing Wojciech Maly ECE Department, Carnegie Mellon University Pittsburgh, Pa. Invited * For at least last 30 years microelectronics has
More informationOUR STRATEGIC PLANNING JOURNEY
OUR STRATEGIC PLANNING JOURNEY The Department of Medicine Strategic Plan Our roadmap for the future It will shape and guide what the Department of Medicine does, why we do it, and our priorities, with
More informationMEMS Processes from CMP
MEMS Processes from CMP MUMPS from MEMSCAP Bulk Micromachining 1 / 19 MEMSCAP MUMPS processes PolyMUMPS SOIMUMPS MetalMUMPS 2 / 19 MEMSCAP Standard Processes PolyMUMPs 8 lithography levels, 7 physical
More informationMICROPROCESSOR AND MICROCOMPUTER BASICS
Introduction MICROPROCESSOR AND MICROCOMPUTER BASICS At present there are many types and sizes of computers available. These computers are designed and constructed based on digital and Integrated Circuit
More informationStatistical Models for Hot Electron Degradation in Nano-Scaled MOSFET Devices
2006, 대한 산업공학회 추계학술대회 Session C3 : Statistical models Statistical Models for Hot Electron Degradation in Nano-Scaled MOSFET Devices Seong-joon Kim, Suk Joo Bae Dept. of Industrial Engineering, Hanyang
More informationEmbedded Computing. Now easier than ever. Embedded Building Blocks * An Intel Initiative
Embedded Computing. Now easier than ever. Embedded Building Blocks * An Intel Initiative Embedded Building Blocks. A unique, new kit for Embedded Computing. Everything Made in Germany Rapid, flexible service
More information3.2.5.2 Degree Requirements
3.2.5.2 Degree Requirements Students in the BEng (Electrical Engineering) programme are required to complete a minimum of 160 MCs with a CAP 2.0 to graduate. In the first stage of the programme, students
More informationPontifícia Universidade Católica de São Paulo
WIRELESS DATA TRANSMISSION Lesson Plan Author: Prof. Orivaldo Gonçalves de Mello (E.E. Pe Simon Switzar) Students from 11th and 12th grades from E.E. Pe Simon Switzar Raphaela Rodrigues Tatiane Aparecida
More informationSUSS MICROTEC INVESTOR PRESENTATION. November 2013
SUSS MICROTEC INVESTOR PRESENTATION November 2013 DISCLAIMER This presentation contains forward-looking statements relating to the business, financial performance and earnings of SUSS MicroTec AG and its
More informationLecture 1. Introduction to Semiconductor Devices. Reading:
Lecture 1 Introduction to Semiconductor Devices Reading: Notes and Anderson 2 Chapters 1.1-1.3, 1.7-1.9 Atoms to Operational Amplifiers The goal of this course is to teach the fundamentals of non-linear
More informationTanner EDA L-edit (Layout Editor)
Tanner EDA L-edit (Layout Editor) Tanner Tools Speeding Concept to Silicon EDA= Electronic Design and Automation NOTE: This tutorial was constructed in L-edit version 1.15 (c. October 2007) http://www.tanner.com/eda/
More informationSilicon Wafer Solar Cells
Silicon Wafer Solar Cells Armin Aberle Solar Energy Research Institute of Singapore (SERIS) National University of Singapore (NUS) April 2009 1 1. PV Some background Photovoltaics (PV): Direct conversion
More informationQuarterly Group Financial Report Q1/2015
Quarterly Group Financial Report /2015 Interim consolidated financial statements for the three months ended March 31, 2015 Key Financials Key Financials (in EUR million) Revenues 40.3 43.9-8% 40.3 58.0-31%
More informationMass production, R&D Failure analysis. Fault site pin-pointing (EM, OBIRCH, FIB, etc. ) Bottleneck Physical science analysis (SEM, TEM, Auger, etc.
Failure Analysis System for Submicron Semiconductor Devices 68 Failure Analysis System for Submicron Semiconductor Devices Munetoshi Fukui Yasuhiro Mitsui, Ph. D. Yasuhiko Nara Fumiko Yano, Ph. D. Takashi
More informationPERSONAL DEVELOPMENT GOALS PLAN For September 2013-June 2014
PERSONAL DEVELOPMENT GOALS PLAN For September 2013-June 2014 RATIONALE: As a student at ITS, we want you to be not only learners in the classroom but also within the context of life in general and ministry
More information