TOSHIBA CCD Image Sensor CCD (charge coupled device) TCD2955D

Transcription

1 Preliminary TOSHIBA CCD Image Sensor CCD (charge coupled device) TCD2955D The TCD2955D is a high sensitive and low dark current 4240 elements 6 line CCD color image sensor which includes CCD drive circuit and clamp circuit. The sensor is designed for scanner. The device contains a row of 4240 elements 6 line staggered photodiodes which provide a 28 lines/mm (3200DPI) across a A4 size paper. The device is operated by 5 V pulse, and 2 V power supply. Features Number of image sensing elements: 4240 elements 6 line Weight: 5.5 g (typ.) Image sensing element size: 3 µm by 4 µm on 3 µm centers Photo sensing region: High sensitive and low dark current PN photodiode Distance between photodiode array: 72 µm (24 lines), Red line-green line, Green line-blue line 9 µm (3 lines), Odd line-even-line Clock: 2 phase (5 V) Power supply: 2 V power supply voltage Internal circuit: Clamp circuit Package: 22 pin CERDIP package Color filter: Red, green, blue Overflow drain for antiblooming Pin Connections (top view) OS3 22 OS2 SS 2 2 OS Maximum Ratings (Note) Characteristics Symbol Rating Unit φa OD SW φ2a3 Clock pulse voltage Shift pulse voltage Reset pulse voltage V φ V SH V 0.3~8.0 V NC NC 6 7 R G B 7 6 NC SS Clamp pulse voltage V φ2a2 8 5 φ2a Switch pulse voltage V SW Power supply voltage V OD 0.3~5 V Operating temperature T opr 0~60 C Storage temperature T stg 25~85 C φa2 SH3 SS φa SH SH2 Note : All voltage are with respect to SS terminals (ground).

2 Circuit Diagram OD SW φ2a3 SS φ2a φa CCD ANALOG SHIFT REGISTER SHIFT GATE 3 SH OS 2 CLAMP D4 D6 D8 D3 D5 D7 D60 D62 S S3 D59 D6 D63 S2 S4 PHOTO DIODE (B) (odd line) PHOTO DIODE (B) (even line) S28477 S28479 S28476 S28478 D64 D66 S28480 D65 74 D76 73 D75 SHIFT GATE 2 CCD ANALOG SHIFT REGISTER 2 CCD ANALOG SHIFT REGISTER 3 SHIFT GATE 3 2 SH2 OS2 22 CLAMP D4 D6 D8 D3 D5 D7 D60 D62 S S3 S5 D59 D6 D63 S2 S4 PHOTO DIODE (G) (odd line) PHOTO DIODE (G) (even line) S28477 S28479 S28476 S28478 D64 D66 S28480 D65 74 D76 73 D75 SHIFT GATE 4 CCD ANALOG SHIFT REGISTER 4 CCD ANALOG SHIFT REGISTER 5 SHIFT GATE 5 0 SH3 OS3 CLAMP D4 D6 D8 D3 D5 D7 D60 D62 S S3 S5 D59 D6 D63 S2 S4 PHOTO DIODE (R) (odd line) PHOTO DIODE (R) (even line) S28477 S28479 S28476 S28478 D64 D66 S28480 D65 74 D76 73 D75 SHIFT GATE 6 CCD ANALOG SHIFT REGISTER 6 2 DS SS φ2a2 φa2 SS 2

3 Pin Names Pin No. Symbol Name Pin No. Symbol Name OS3 Signal output 3 (red) 22 OS2 Signal output 2 (green) 2 SS Ground 2 OS Signal output (blue) 3 Reset gate 20 OD Power 4 Clamp gate 9 SW Switch gate 5 φ A3 Clock 3 (phase ) 8 φ 2A3 Clock 3 (phase 2) 6 NC Non connection 7 NC Non connection 7 NC Non connection 6 SS Ground 8 φ 2A2 Clock 2 (phase 2) 5 φ 2A Clock (phase 2) 9 φ A2 Clock 2 (phase ) 4 φ A Clock (phase 2) 0 SH3 Shift gate 3 3 SH Shift gate SS Ground 2 SH2 Shift gate 2 Optical/Electrical Characteristics (Ta = 25 C, V OD = 2 V, V φ = V SH =V = V = 5 V (pulse), f φ = MHz, f = 2 MHz, t INT = 5 ms, LIGHT SOURCE = A LIGHT SOURCE + CM500S FILTER (t = mm), LOAD RESISTANCE = 00 kω) Characteristics Symbol Min Typ. Max Unit Note Red R (R) Sensitivity Green R (G) V/lx s (Note 2) Blue R (B) Photo response non uniformity PRNU () 5 20 % (Note 3) PRNU (3) 3 2 mv (Note 4) Register imbalance RI 3 % (Note 5) Saturation Output Voltage V SAT V (Note 6) Saturation Exposure SE lx s (Note 7) Dark signal Voltage V DRK mv (Note 8) Dark Signal Non Uniformity DSNU mv (Note 8) DC Power Dissipation P D mw Total Transfer Efficiency TTE % Output Impedance Z O kω DC Compensation Output Voltage V OS V (Note 9) Random Noise N Dσ 0.8 mv (Note 0) Reset Noise V N V (Note 9) Masking Noise V MS V (Note 9) 3

4 Note 2: Sensitivity is defined for each color of signal outputs average when the photosensitive surface is applied with the light of uniform illumination and uniform color temperature. Note 3: PRNU () is defined for each color on a single chip by the expressions below when the photosensitive surface is applied with the light of uniform illumination and uniform color temperature. PRNU () = x x 00 (%) Where x is average of total signal output and X is the maximum deviation from x. The amount of incident light is shown below. Red = /2 SE Green = /2 SE Blue = /4 SE Note 4: PRNU (3) is defined as maximum voltage with next pixels, where measured at 5% of SE (typ.). Note 5: Register imbalance is defined as follows xn x (n + ) RI = n = x 00 (%) Note 6: VSAT is defined as minimum saturation output of all effective pixels. Note 7: Definition of SE SE = V SAT R G (lx s) Note 8: VDRK is defined as average dark signal voltage of all effective pixels. DSNU is defined as different voltage between VDRK and VMDK when VMDK is maximum dark signal voltage. V DRK V MDK DSNU Note 9: DC signal output voltage is defined as follows. Reset noise voltage is defined as follows. Masking noise voltage is defined as follows. OS V N V MS V OS SS 4

5 Note 0: Random noise is defined as the standard deviation (sigma) of the output level difference between two adjacent effective pixels under no illumination (i.e. dark conditions) calculated by the following procedure. video output video output Output waveform (effective pixels under dark condition) 200 ns 200 ns V pixel (n) pixel (n + ) () Two adjacent pixels (pixel n and n + ) in one reading are fixed as measurement points. (2) Each of the output level at video output periods averaged over 200 ns period to get V (n) and V (n + ). (3) V (n + ) is subtracted from V (n) to get V. V = V (n) V (n + ) (4) The standard deviation of V is calculated after procedure (2) and (3) are repeated 30 times (30 readings) V = Vi σ = ( V V) 30 i= 30 i i= (5) Procedure (2), (3) and (4) are repeated 0 times to get sigma value. (6) 0 sigma values are averaged. 0 σ = σ 0 j j= (7) σ value calculated using the above procedure is observed 2 times larger than that measured relative to the ground level. So we specify random noise as follows. ND σ = σ 2 5

6 Operating Condition Characteristics Symbol Min Typ. Max Unit Note Clock pulse voltage H level V φa V L level Shift pulse voltage H level V SH V L level Reset pulse voltage H level L level V V Clamp pulse voltage H level V V L level Switch pulse voltage H level V SW V L level Power supply voltage V OD V Clock Characteristics (Ta = 25 C) Characteristics Symbol Min Typ. Max Unit Clock pulse frequency f φa MHz Reset pulse frequency f MHz Clamp pulse frequency f MHz Clock capacitance (Note ) C φa 430 pf Shift gate capacitance C SH 50 pf Reset gate capacitance C 0 pf Clamp gate capacitance C 0 pf Switch gate capacitance C SW 0 pf Note : VOD = 2 V Mode Select SW H L Mode 3200dpi mode 600dpi mode 6

7 Timing Chart (3200dpi mode) SH φ A φ 2A SW ( H ) OS D0 D D2 D3 D4 D0 D D2 D3 D4 D5 D6 D58 D59 D60 D6 D62 D63 S S2 S3 S28479 S28480 D64 D65 D66 D67 D68 D74 D75 D76 D77 DUMMY OUTPUTS (3 elements) LIGHT SHIELD OUTPUTS (47 elements) (4 elements) DUMMY OUTPUTS (8 elements) TEST OUTPUTS (2 elements) (3 elements) DUMMY OUTPUT ( element) DUMMY OUTPUTS (64 elements) SIGNAL OUTPUTS (28480 elements) DUMMY OUTPUTS (4 elements) LINE READOUT PERIOD (28558 elements) 7

8 Timing Chart (600dpi mode) SH φ A φ 2A SW ( L ) D D3 D9 D D3 D5 D57 D59 D6 D63 S2 S4 S28478 S28480 D65 D67 D69 D7 D73 D75 D77 OS DUMMY OUTPUTS (6 elements) LIGHT SHIELD OUTPUTS (24 elements) DUMMY OUTPUTS (4 elements) TEST OUTPUT ( element) DUMMY OUTPUT ( element) (2 elements) ( element) DUMMY OUTPUTS (32 elements) SIGNAL OUTPUTS (4240 elements) DUMMY OUTPUTS (7 elements) LINE READOUT PERIOD (4279 elements) 8

9 Timing Requirements t2 t3 t4 SH t t5 φ φ φ 2 GND 3.5 V (max).5 V (min) 3.5 V (max).5 V (min) t9 t20 SW ( L H ) SW ( H L ) 3200dpi mode φ φ2 t6 t7 t t9 t6 t5 t8 t0 t2 t4 t7 t3 t8 OS 9

10 600dpi mode φ φ2 t6 t7 t8 t0 t t9 t6 t5 t2 t4 t3 t8 OS Timing Requirements Characteristics Symbol Min Pulse timing of SH and φ Typ. (Note2) Max t t Unit ns SH pulse rise time, fall time t2, t ns SH pulse width t ns φ, φ2 pulse rise time, fall time t6, t ns pulse rise time, fall time t8, t ns pulse width t ns Pulse timing of φ, φ2 and t 0 70 ns pulse rise time, fall time t2, t ns pulse width t ns Pulse timing of φ, φ2 and t ns Pulse timing of and t ns Video data delay time (Note 3) t7, t8 5 ns Pulse timing of SH and t ns Pulse timing of SH and SW t ns Note 2: Typ. is the case of fφ =.0 MHz. Note 3: Load resistance is 00 kω. 0

11 Typical Spectral Response Spectral response.0 Ta = 25 C Red 0.8 Relative response Blue Green Wave length λ (nm)

12 Typical Drive Circuit +5 V 0. µf/25 V 2 V φa 0. µf/25 V 0 µf/25 V φa2 φa3 φ2a φ2a2 φ2a3 IC OS2 OS OD SW φ2a3 NC OS3 SS φa3 TCD2955D NC SS φ2a φa SH φ2a2 φa2 SH3 SH NC SS +2 V +5 V 0. µf/25 V R R R 0. µf/25 V R R R 0 µf/25 V TR OS TR2 OS2 TR3 OS3 R2 R2 R2 SW SH SH2 SH3 IC2 IC, 2: TC74AC04P TR, 2, 3: 2SC85-Y R: 50 Ω R2: 500 Ω 2

13 Caution. Window Glass The dust and stain on the glass window of the package degrade optical performance of CCD sensor. Keep the glass window clean by saturating a cotton swab in alcohol and lightly wiping the surface, and allow the glass to dry, by blowing with filtered dry N2. Care should be taken to avoid mechanical or thermal shock because the glass window is easily to damage. 2. Electrostatic Breakdown Store in shorting clip or in conductive foam to avoid electrostatic breakdown. CCD Image Sensor is protected against static electricity, but interior puncture mode device due to static electricity is sometimes detected. In handing the device, it is necessary to execute the following static electricity preventive measures, in order to prevent the trouble rate increase of the manufacturing system due to static electricity. a. Prevent the generation of static electricity due to friction by making the work with bare hands or by putting on cotton gloves and non-charging working clothes. b. Discharge the static electricity by providing earth plate or earth wire on the floor, door or stand of the work room. c. Ground the tools such as soldering iron, radio cutting pliers of or pincer. It is not necessarily required to execute all precaution items for static electricity. It is all right to mitigate the precautions by confirming that the trouble rate within the prescribed range. 3. Incident Light CCD sensor is sensitive to infrared light. Note that infrared light component degrades resolution and PRNU of CCD sensor. 4. Lead Frame Forming Since this package is not strong against mechanical stress, you should not reform the lead frame. We recommend to use a IC-inserter when you assemble to PCB. 5. Soldering Soldering by the solder flow method cannot be guaranteed because this method may have deleterious effects on prevention of window glass soiling and heat resistance. Using a soldering iron, complete soldering within ten seconds for lead temperatures of up to 260 C, or within three seconds for lead temperatures of up to 350 C. 3

14 Package Dimensions Weight: 5.5 g (typ.) 4

15 RESTRICTIONS ON PRODUCT USE EBA TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the Handling Guide for Semiconductor Devices, or TOSHIBA Semiconductor Reliability Handbook etc.. The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury ( Unintended Usage ). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this document shall be made at the customer s own risk. The products described in this document are subject to the foreign exchange and foreign trade laws. The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA CORPORATION for any infringements of intellectual property or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any intellectual property or other rights of TOSHIBA CORPORATION or others. The information contained herein is subject to change without notice. 5