Features. Applications ON LOW

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1 N9, N, HCPL-, HCPL-, HCNW9, HCNW- Low Input Current, High Gain Optocouplers Data Sheet Lead (Pb) Free RoHS fully compliant RoHS fully compliant options available; -xxxe denotes a lead-free product Description These high gain series couplers use a Light Emitting Diode and an integrated high gain photodetec tor to provide extremely high current transfer ratio between input and output. Separate pins for the photodiode and output stage result in TTL compatible saturation voltages and high speed operation. Where desired the V CC and terminals may be tied together to achieve conven tional photodarlington operation. A base access terminal allows a gain bandwidth adjustment to be made. The N9, HCPL-, and CNW9 are for use in CMOS, LSTTL or other low power appli ca tions. A 4% minimum current transfer ratio is guaranteed over to C operating range for only.5 ma of LED current. The N, HCPL-, and HCNW are designed for use mainly in TTL applications. Current Transfer Ratio (CTR) is % minimum over to C for an LED current of. ma ( TTL Unit load ). A % minimum CTR enables operation with TTL Load using a. kω pull-up resistor. Functional Diagram NC ANODE CATHODE NC 4 5 V CC V B GND TRUTH TABLE LED ON LOW OFF HIGH Features High current transfer ratio % typical (45 % typical for HCNW9/) Low input current requirements.5 ma TTL compatible output. V L typical Performance guaranteed over temperature C to C Base access allows gain bandwidth adjustment High output current ma Safetyapproval UL recognized 5 V rms for minute and 5 V rms* for minute per UL 5 CSA approved IEC/EN/DIN EN 4-5- approved with V IORM = 44 V peak for HCNW9 and HCNW Available in -Pin DIP or SOIC- footprint or widebody package MIL-PRF-54 hermetic version available (HCPL-5/) Applications Ground isolate most logic families TTL/TTL, CMOS/ TTL, CMOS/CMOS, LSTTL/TTL, CMOS/LSTTL Low input current line receiver High voltage insulation (HCNW9/) EIA RS-C line receiver Telephone ring detector V ac line voltage status indicator low input power dissipation Low power systems ground isolation *5 V rms/ minute rating is for HCNW9/ and Option (N9/) products only. A. µf bypass capacitor connected between pins and 5 is recommended. CAUTION: It is advised that normal static precautions be taken in handling and assembly of this component to prevent damage and/or degradation which may be induced by ESD.

2 Selection for lower input current down to 5 µa is available upon request. The HCPL- and HCPL- are surface mount devices packaged in an industry standard SOIC- footprint. The SOIC- does not require through holes in a PCB. This package occupies approximately one-third the footprint area of the standard dual-in-line package. The lead profile is designed to be compatible with standard surface mount processes. The HCNW9 and HCNW are packaged in a widebody encapsulation that provides creep age and clearance dimensions suitable for safety approval by regulatory agencies worldwide. Selection Guide Widebody -Pin DIP Package Hermetic ( Mil) Small Outline SO- (4 mil) Single and Dual Single Dual Minimum Absolute Dual Single Channel Channel Channel Single Input ON Maxi- Channel Channel Package Package Package Channel Current Minimum mum Packages Package HCPL- HCPL- HCPL- Package (I F ) CTR V CC HCPL- N9 [] HCNW9.5 ma 4% V N [] HCNW. ma % V HCPL-4 [] 4 [] A [] A [] 4 µa % V.5 ma % V 5 [] 5 [] 5 [] 5 [] Note:. Technical data are on separate Avago publications.

3 Ordering Information N, N9, HCPL- and HCPL- are UL Recognized with 5 Vrms for minute per UL5 and are approved under CSA Component Acceptance Notice #5, File CA 4. Option Part RoHS non RoHS Surface Gull Tape UL 5 Vrms/ IEC/EN/DIN Number Compliant Compliant Package Mount Wing & Reel Minute rating EN 4-5- Quantity -E no option mil DIP- 5 per tube -E # mil DIP- X X 5 per tube -5E #5 mil DIP- X X X per reel N -E # mil DIP- X 5 per tube N9 -E # mil DIP- X X X 5 per tube -5E #5 mil DIP- X X X X per reel -E # mil DIP- X 5 per tube -E # mil DIP- X X X 5 per tube -5E #5 mil DIP- X X X X per reel -E no option SO- per tube HCPL- -5E #5 SO- X X X 5 per reel HCPL- -E # SO- X per tube -5E #5 SO- X X X X 5 per reel HCNW -E no option 4 mil 4 per tube HCNW9 -E # Widebody X X 4 per tube -5E #5 DIP- X X X 5 per reel To order, choose a part number from the part number column and combine with the desired option from the option column to form an order entr y. Schematic V CC Example : N-5E to order product of mil DIP Gull Wing Surface Mount package in Tape and Reel packaging with IEC/EN/DIN EN 4-5- Safety Approval and RoHS compliant. Example : HCPL- to order product of mil DIP package in Tube packaging and non RoHS compliant. ANODE + V F CATHODE I F I CC I O 5 GND Option datasheets are available. Contact your Avago sales representative or authorized distributor for information. Remarks: The notation #XXX is used for existing products, while (new) products launched since July 5, and RoHS compliant will use XXXE. SHIELD I B V B

4 UR Package Outline Drawings -Pin DIP Package (N9/N)** 9.5 ±.5 (. ±.). ±.5 (. ±.) TYPE NUMBER A XXXXZ 5 OPTION CODE* DATE CODE.5 ±.5 (.5 ±.) YYWW 4 UL RECOGNITION.9 (.4) MAX..5 ±. (.4 ±.5). (.) MAX. 4. (.5) MAX. 5 TYP (. +.) -.).9 (.5) MIN..5 (.) MIN.. ±. (.4 ±.) **JEDEC Registered Data..5 (.5) MAX..54 ±.5 (. ±.) DIMENSIONS IN MILLIMETERS AND (INCHES). * MARKING CODE LETTER FOR OPTION NUMBERS "L" = OPTION OPTION NUMBERS AND 5 NOT MARKED. NOTE: FLOATING LEAD PROTRUSION IS.5 mm ( mils) MAX. -Pin DIP Package with Gull Wing Surface Mount Option (N9/N) LAND PATTERN RECOMMENDATION 9.5 ±.5 (. ±.). (.4) 5.5 ±.5 (.5 ±.).9 (.4) 4. (.5). (.).9 (.4) MAX.. (.) MAX..5 ±. (.4 ±.5) 9.5 ±.5 (. ±.). ±.5 (. ±.) (. +.) -.). ±. (.4 ±.).54.5 ±. (.) (.5 ±.5) BSC DIMENSIONS IN MILLIMETERS (INCHES). LEAD COPLANARITY =. mm (.4 INCHES)..5 ±.5 (.5 ±.) NOM. NOTE: FLOATING LEAD PROTRUSION IS.5 mm ( mils) MAX. 4

5 Small Outline SO- Package (HCPL-/HCPL-) LAND PATTERN RECOMMENDATION.9 ±. (.55 ±.5) PIN ONE 5 XXX YWW ±. (. ±.).4 ±. (. ±.). (.5) BSC TYPE NUMBER (LAST DIGITS) DATE CODE.4 (.5).9 (.5).49 (.95) * 5. ±. (. ±.5) 45 X.4 (.).5 ±. (.5 ±.5).54 (.) ~. ±.5 (.9 ±.) * TOTAL PACKAGE LENGTH (INCLUSIVE OF MOLD FLASH) 5. ±.54 (.5 ±.) DIMENSIONS IN MILLIMETERS (INCHES). LEAD COPLANARITY =. mm (.4 INCHES) MAX.. ±. (. ±.4).5 (.) MIN. NOTE: FLOATING LEAD PROTRUSION IS.5 mm ( mils) MAX. -Pin Widebody DIP Package (HCNW9/HCNW). ±.5 (.44 ±.) A HCNWXXXX YYWW 5 TYPE NUMBER DATE CODE. MAX. (.4) 9. ±.5 (.54 ±.) 4.55 (.) MAX. TYP. 5. (.) MAX.. (.4) TYP (. +.) -.). (.).9 (.54).5 (.) MIN..54 (.) TYP.. ±.5 (. ±.).4 (.).5 (.) DIMENSIONS IN MILLIMETERS (INCHES). NOTE: FLOATING LEAD PROTRUSION IS.5 mm ( mils) MAX. 5

6 -Pin Widebody DIP Package with Gull Wing Surface Mount Option (HCNW9/HCNW). ±.5 (.44 ±.) LAND PATTERN RECOMMENDATION 5 9. ±.5 (.54 ±.).5 (.54) 4. (.5).9 (.9).55 (.) MAX.. ±. (.44 ±.). MAX. (.4) 4. (.5) MAX.. ±.5 (. ±.).54 (.) BSC DIMENSIONS IN MILLIMETERS (INCHES)..5 ±.5 (. ±.) LEAD COPLANARITY =. mm (.4 INCHES).. ±.5 (.9 ±.) NOM (. +.) -.) NOTE: FLOATING LEAD PROTRUSION IS.5 mm ( mils) MAX. Solder Reflow Temperature Profile TEMPERATURE ( C) PREHEATING RATE C + C/.5 C/SEC. REFLOW HEATING RATE.5 C ±.5 C/SEC. C 5 C 4 C C + C/.5 C.5 C ±.5 C/SEC. PEAK TEMP. 45 C SEC. SEC. SOLDERING TIME C PEAK TEMP. 4 C PEAK TEMP. C PREHEATING TIME 5 C, 9 + SEC. 5 SEC. ROOM TEMPERATURE TIME (SECONDS) TIGHT TYPICAL LOOSE NOTE: NON-HALIDE FLUX SHOULD BE USED.

7 Recommended Pb-Free IR Profile TEMPERATURE T p T L T smax T smin C 5 - C RAMP-UP C/SEC. MAX. t s PREHEAT to SEC. * +/-5 C t p t L TIME WITHIN 5 C of ACTUAL PEAK TEMPERATURE 5 SEC. RAMP-DOWN C/SEC. MAX. to 5 SEC. NOTES: THE TIME FROM 5 C to PEAK TEMPERATURE = MINUTES MAX. T = C, T smax smin = 5 C NOTE: NON-HALIDE FLUX SHOULD BE USED. * RECOMMENDED PEAK TEMPERATURE FOR WIDEBODY 4mils PACKAGE IS 45 C 5 t 5 C to PEAK TIME Regulatory Information The N9/, HCNW9/, and HCPL-/ have been approved by the following organizations: UL Recognized under UL 5, Component Recognition Program, File E55. CSA Approved under CSA Component Acceptance Notice #5, File CA 4. IEC/EN/DIN EN 4-5- Approved under IEC 4-5-:99 + A: EN 4-5-: + A: DIN EN 4-5- (VDE 4 Teil ):- (HCNW9/ only) Insulation and Safety Related Specifications -Pin DIP Widebody ( Mil) SO- (4 Mil) Parameter Symbol Value Value Value Units Conditions Minimum External L() mm Measured from input terminals Air Gap (External to output terminals, shortest Clearance) distance through air. Minimum External L() mm Measured from input terminals Tracking (External to output terminals, shortest Creepage) distance path along body. Minimum Internal... mm Through insulation distance, Plastic Gap conductor to conductor, usually (Internal Clearance) the direct distance between the photoemitter and photodetector inside the optocoupler cavity. Minimum Internal NA NA 4. mm Measured from input terminals Tracking (Internal to output terminals, along Creepage) internal cavity. Tracking Resistance CTI Volts DIN IEC /VDE Part (Comparative Tracking Index) Isolation Group IIIa IIIa IIIa Material Group (DIN VDE, /9, Table ) Option - surface mount classification is Class A in accordance with CECC.

8 IEC/EN/DIN EN 4-5- Insulation Related Characteristics (HCNW9 and HCNW) Description Symbol Characteristic Units Installation Classification per DIN VDE /.9, Table for rated mains voltage V rms for rated mains voltage V rms Climatic Classification 55// Pollution Degree (DIN VDE /.9) Maximum Working Insulation Voltage V IORM 44 V peak Input to Output Test Voltage, Method b* V PR =.5 x V IORM, % Production Test with t P = sec, V PR 5 V peak Partial Discharge < 5 pc Input to Output Test Voltage, Method a* V PR =.5 x V IORM, Type and Sample Test, V PR V peak t P = sec, Partial Discharge < 5 pc Highest Allowable Overvoltage* (Transient Overvoltage, t ini = sec) V IOTM V peak Safety Limiting Values (Maximum values allowed in the event of a failure, also see Figure, Thermal Derating curve.) Case Temperature T S 5 C Current (Input Current I F, P S = ) I S,INPUT 4 ma Output Power P S,OUTPUT mw Insulation Resistance at T S, V IO = 5 V R S > 9 Ω I-IV I-III *Refer to the front of the optocoupler section of the current catalog, under Product Safety Regulations section, IEC/EN/DIN EN 4-5-, for a detailed description. Note: Isolation characteristics are guaranteed only within the safety maximum ratings which must be ensured by protective circuits in application.

9 Absolute Maximum Ratings* (No Derating Required up to 5 C) Parameter Symbol Min. Max. Units Storage Temperature T S C Operating Temperature** T A -4 5 C Average Forward Input Current I F(AVG) ma Peak Forward Input Current I FPK 4 ma (5% Duty Cycle, ms Pulse Width) Peak Transient Input Current I F(TRAN). A (< µs Pulse Width, pps) Reverse Input Voltage V R 5 V HCNW9/ V Input Power Dissipation P I 5 mw Output Current (Pin ) I O ma Emitter Base Reverse Voltage (Pin 5-) V EB.5 V Supply Voltage and Output Voltage V CC -.5 V (N9, HCPL-, HCNW9) Supply Voltage and Output Voltage V CC -.5 V (N, HCPL-, HCNW) Output Power Dissipation P O mw Total Power Dissipation P T 5 mw Lead Solder Temperature (for Through Hole Devices) Reflow Temperature Profile (for SOIC- and Option #) HCNW9/ C for sec.,. mm below seating plane C for sec., up to seating plane See Package Outline Drawings section *JEDEC Registered Data for N9 and N. ** C to C on JEDEC Registration. Recommended Operating Conditions Parameter Symbol Min. Max. Units Power Supply Voltage V CC 4.5 V Forward Input Current (ON) I F(ON).5. ma Forward Input Voltage (OFF) V F(OFF). V Operating Temperature T A C 9

10 Electrical Specifications C T A C, 4.5 V V CC V,.5 ma I F(ON) ma, V V F(OFF). V, unless otherwise specified. All Typicals at T A = 5 C. See Note. Parameter Sym. Device Min. Typ.** Max. Units Test Conditions Fig. Note Current Transfer CTR N9 4* 5 % I F =.5 ma V CC = 4.5,,, Ratio HCPL- =.4 V 4 HCNW N9 5* I F =. ma HCPL- HCNW9 5 I F = 5. ma 5 I F = ma N * I F =. ma HCPL- HCNW 5 Logic Low Output L N9..4 V I F =.5 ma, V = 4.5 CC Voltage HCPL- I O = ma HCNW9 I F =. ma, I O = ma I F = 5. ma, I O = 5 ma. I F = ma, I O = 4 ma N. I F =. ma, HCPL- I O = 4. ma HCNW Logic High I OH N9.5 µa = V CC = V IF = ma Output Current HCPL- HCNW9 N. 5 = V = V CC HCPL- HCNW Logic Low Supply I CCL N/9.4.5 ma I F =. ma, = Open, Current HCPL-/ V = V CC HCNW9.5 HCNW Logic High I CCH N/9. µa I F = ma, = Open, Supply Current HCPL-/ V = V CC HCNW9 HCNW Input Forward V F N.5.4.* V T A = 5 C I F =. ma 4, Voltage N9 HCPL-.5 HCPL- HCNW T A = 5 C HCNW Input Reverse BVR 5.* V I R = µa, T A = 5 C Breakdown Voltage HCNW9. I R = µa, T A = 5 C HCNW Temperature V F -. mv/ C I F =. ma Coefficient of T A Forward Voltage Input C IN pf f = MHz, V F = V Capacitance HCNW9 9 HCNW *JEDEC Registered Data for N9 and N. **All typical values at T A = 5 C and V CC = 5 V, unless otherwise noted.

11 Switching Specifications (AC) Over recommended operating conditions (T A = to C), V CC = 5 V, unless otherwise specified. Parameter Sym. Device Min. Typ.** Max. Units Test Conditions Fig. Note T A =5 C Propagation t PHL N9 5 5* µs I F =.5 ma, 5,,, 4 Delay Time HCPL- Rl = 4. kω, 9, to Logic Low HCNW9 at Output N9. * µs I F = ma, HCPL- Rl = Ω HCNW9 N. * 5 µs I F =. ma, HCPL- Rl =. kω HCNW Propagation t PLH N9 * 9 µs I F =.5 ma, 5,,, 4 Delay Time HCPL- Rl = 4. kω, 9, to Logic High HCNW9 5 at Output N9 * µs I F = ma, HCPL- Rl = Ω HCNW9 N 5* 5 µs I F =. ma, HCPL- Rl =. kω HCNW Common Mode CM H V/µs I F = ma, 5, Transient T A = 5 C Immunity at Rl =. kω Logic High V CM = Output Vp-p Common Mode CM L V/µs I F =. ma, 5, Transient T A = 5 C Immunity at Rl =. kω Logic Low V CM = Output Vp-p *JEDEC Registered Data for N9 and N. **All typical values at T A = 5 C and V CC = 5 V, unless otherwise noted.

12 Package Characteristics Parameter Sym. Min. Typ.** Max. Units Test Conditions Fig. Note Input-Output Momentary V ISO 5 V rms RH < 5%, t = min.,, Withstand Voltage T A = 5 C Option 5, 9 HCNW9 HCNW Resistance (Input-Output) R I-O Ω V I-O = 5 Vdc RH < 45% Capacitance (Input-Output) C I-O. pf f = MHz **All typicals at T A = 5 C, unless otherwise noted. The Input-Output Momentary Withstand Voltage is a dielectric voltage rating that should not be interpreted as an input-output continuous voltage rating. For the continuous voltage rating refer to the IEC/EN/DIN EN 4-5- Insulation Characteristics Table (if applicable), your equipment level safety specification or Avago Application Note 4 entitled Optocoupler Input-Output Endurance Voltage. Notes:. DC CURRENT TRANSFER RATIO (CTR) is defined as the ratio of output collector current, I O, to the forward LED input current, I F, times %.. Pin Open.. Device considered a two-terminal device. Pins,,, and 4 shorted together and Pins 5,,, and shorted together. 4. Use of a resistor between pin 5 and will decrease gain and delay time. Significant reduction in overall gain can occur when using resistor values below 4 kω. For more information, please contact your local Avago Components representative. 5. Common mode transient immunity in a Logic High level is the maximum toler able (positive) dv CM/dt of the common mode pulse, V CM, to assure that the output will remain in a Logic High state (i.e., >. V). Common mode transient immunity in a Logic Low level is the maximum tolerable (negative) dv CM/dt of the common mode pulse, V CM, to assure that the output will remain in a Logic Low state (i.e., <. V).. In applications where dv/dt may exceed 5, V/µs (such as static discharge) a series resistor, R CC, should be included to protect the detector IC from destructively high surge currents. The recommended value is R CC = Ω.. Use of a. µf bypass capacitor connected between pins and 5 adjacent to the device is recommended.. In accordance with UL 5, each optocoupler is proof tested by applying an insulation test voltage 45 V rms for second (leakage detection current limit, I I-O < 5 µa). This test is per formed before the % production test shown in the IEC/EN/DIN EN 4-5- Insulation Related Characteristics Table, if applicable. 9. In accordance with UL 5, each optocoupler is proof tested by applying an insulation test voltage > V rms for second (leakage detection current limit, I I-O < 5 µa). This test is per formed before the % production test for partial discharge (method b) shown in the IEC/EN/DIN EN 4-5- Insulation Related Characteristics Table, if applicable.

13 I O OUTPUT CURRENT ma ma 4.5 ma 4. ma.5 ma. ma.5 ma. ma.5 ma. ma.5 ma V CC = 5 V T A = 5 C.. OUTPUT VOLTAGE V CTR CURRENT TRANSFER RATIO % 4 5 C V CC = 5 V =.4 V.. C 5 C C -4 C I F FORWARD CURRENT ma I O OUTPUT CURRENT ma T A = 5 C. T A = C T. A = 5 C T A = C T A = -4 C... I F INPUT DIODE FORWARD CURRENT ma Figure. N/N9 DC transfer characteristics Figure. Current transfer ratio vs. forward current N/N9 Figure. N/N9 output current vs. input diode forward current I F FORWARD CURRENT ma I F + V F T A = 5 C. T A = C T A = 5 C T A = C T A = -4 C.5. t P PROPAGATION DELAY µs I F =.5 ma R L = 4. kω /f = 5 µs t PLH t PHL t P PROPAGATION DELAY µs I F =. ma R L =. kω /f = 5 µs t PLH t PHL V F FORWARD VOLTAGE V T A TEMPERATURE C T A TEMPERATURE C Figure 4. Input diode forward current vs. forward voltage Figure 5. Propagation delay vs. temperature Figure. Propagation delay vs. temperature t P PROPAGATION DELAY µs 4 I F = ma R L = kω /f = 5 µs t PLH t PHL V F FORWARD VOLTAGE V I F =. ma TIME µs T A = 5 C t f t r I F ADJUSTED FOR L = V T A TEMPERATURE C T A TEMPERATURE C R L LOAD RESISTANCE kω Figure. Propagation delay vs. temperature Figure. Forward voltage vs. temperature Figure 9. Nonsaturated rise and fall times vs. load resistance

14 I CCL LOGIC LOW SUPPLY CURRENT ma....5 V CC = V.4 V CC = 5 V I F FORWARD CURRENT OUTPUT POWER P S, INPUT CURRENT I S WIDEBODY P S (mw) I S (ma) T S CASE TEMPERATURE C 5 Figure. Logic low supply current vs. forward current Figure. Thermal derating curve, dependence of safety limiting value with case temperature per IEC/EN/DIN EN 4-5- I F 5 V PULSE GEN. Z O = 5 Ω t r = 5 ns I F R L +5 V (SATURATED RESPONSE) t PHL.5 V.5 V L t PLH % DUTY CYCLE I/f < µs I F MONITOR 4 5. µf C L = 5 pf* R M (NON-SATURATED RESPONSE) 9% % % 9% 5 V * INCLUDES PROBE AND FIXTURE CAPACITANCE t f tr Figure. Switching test circuit V CM V 9% 9% V % t r t r, t f = ns % tf I F A B R CC (SEE NOTE ) +5 V R L SWITCH AT A: I = ma F 5 V V FF 4 5 SWITCH AT B: I F =. ma L V CM + PULSE GEN. Figure. Test circuit for transient immunity and typical waveforms For product information and a complete list of distributors, please go to our website: Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies Limited in the United States and other countries. Data subject to change. Copyright 5- Avago Technologies Limited. All rights reserved. Obsoletes AV-54EN AV-59EN - January,