LCDA12C-1 and LCDA15C-1

Transcription

1 Descrition The LCDxxC1 is a low caacitance transient voltage suressor (TS) diode array. It is designed to rotect sensitive CMOS ICs from the damaging effects of ESD and lightning. Each device will rotect one line in common (linetoground) mode or one line air in metallic (toline) mode. They are low caacitance (< 15F) making them suitable for use on highseed telecom and datacom interfaces without signal degradation. The configuration of the LCDxxC1 has been otimized for easy layout on high density boards. The small SOT143 ackage minimizes required board sace. These devices will handle u to ms for an 8/µs lightning imulse. The low inductance construction minimizes voltage overshoot during high current surges. The LCDxxC1 may be used to rotect DSL interfaces, multirotocol serial transceivers, ortable electronics, and wireless systems. Low Caacitance TS Diode rray PRELIMINRY Features Transient rotection to highseed data lines IEC (ESD) ±15k (air), ±8k (contact) IEC (EFT) 40 (5/50ns) IEC (Lightning) 0.5k, 12 (8/µs) Configuration otimized for easy board layout Protects one line air Low caacitance (<15F) for highseed interfaces Low claming voltage Low leakage current Oerating voltage: 12 and 15 Solidstate siliconavalanche technology Mechanical Characteristics JEDEC SOT143 ackage Molding comound flammability rating: UL 940 Marking : Marking code Packaging : Tae and Reel er EI 481 RoHS/WEEE Comliant lications DSL Interfaces RS232, RS422,.90 Interfaces MultiProtocol Serial Transceivers HighSeed Data s Portable Electronics WN/LN Equiment Wireless Systems Circuit Diagram Schematic & PIN Configuration Pin 1 and 4 Pin 2 and 3 SOT143 (To iew) Revision 01/15/03 1

2 bsolute Maximum Rating Rating Symbol alue Units Peak Pulse Power (t = 8/µs) P k 00 5 Watts Lead Soldering Temerature T L 260 ( sec. ) C Oerating Temerature T J 55 to +125 C Storage Temerature T STG 55 to +150 C Electrical Characteristics LCD12C1 Parameter Symbol Conditions Minimum Tyical Maximum Units StandOff oltage WM R 2 1 Breakdown oltage B I t = 1m R Leakage Current I R RWM = 12, T=25 C 5 µ Claming oltage C = 5, t = 8/µ s 19 Claming oltage C =, t = 8/µ s Peak Pulse Current P t = 8/µ s I P Junction Caacitance C j Between I/O ins and Ground = 0, f = 1MHz R 8 15 F LCD15C1 Parameter Symbol Conditions Minimum Tyical Maximum Units StandOff oltage WM R 5 1 Breakdown oltage B I t = 1m R Leakage Current I R RWM = 15, T=25 C 5 µ Claming oltage C = 1, t = 8/µ s 24 Claming oltage C = 15, t = 8/µ s 33 Peak Pulse Current P t = 8/µ s 15 I P Junction Caacitance C j Between I/O ins and Ground = 0, f = 1MHz R 8 15 F 05 Semtech Cor. 2

3 Tyical Characteristics NonReetitive Peak Pulse Power vs. Pulse Time Power Derating Curve PRELIMINRY Peak Pulse Power Pk (kw) Pulse Duration t (µs) % of Rated Power or IPP mbient Temerature T ( o C) Pulse Waveform Claming oltage vs. Peak Pulse Current Percent of IPP e t td = / Time (µs) Claming oltage C () LCD15C1 LCD12C1 Waveform Parameters: tr = 8µs td = µs Peak Pulse Current () Caacitance vs. oltage 9 Caacitance Cj (F) f=1mhz oltage R () 05 Semtech Cor. 3

4 lications Information Device Connection for Metallic Protection of High Seed Data s The LCDxxC1 is designed to rotect highseed data lines from transient overvoltages which result from lightning and ESD. The device is designed to rotect one line in common mode (toground) or one line air in metallic (to) mode. For metallic mode rotection, the inut of line 1 is connected at in 1 and the outut is connected at in 4. Likewise, the inut of line 2 is connected at in 2 and the outut is connected at in 3. For common mode rotection, ground either ins 1 and 4 or ins 2 and 3. The ground connection should be made directly to the ground lane for best results. DSL Protection tyical DSL rotection circuit is shown in Figure 3. The LCD12C1 (or LCD15C1 for 15 volt drivers) is connected from each line to ground on the IC side of the line. They rovide lightning and ESD rotection for the sensitive line driver IC. Matte Tin Lead Finish Matte tin has become the industry standard leadfree relacement for SnPb lead finishes. matte tin finish is comosed of 0% tin solder with large grains. Since the solder volume on the leads is small comared to the solder aste volume that is laced on the land attern of the PCB, the reflow rofile will be In In Out Out Figure 1 Connection for Differential Protection (to) In Out Figure 2 Connection for Common Mode Protection (toground) determined by the requirements of the solder aste. Therefore, these devices are comatible with both leadfree and SnPb assembly techniques. In addition, unlike other leadfree comositions, matte tin does not have any added alloys that can cause degradation of the solder joint. Figure 3 DSL Protection Circuit 05 Semtech Cor. 4

5 Outline Drawing SOT143 PRELIMINRY D e1 e e/ B E1 bxn bbb E C B SETING PLNE C GUGE PLNE 0.25 H SIDE IEW DETIL L L1 0 c SEE DETIL DIMENSIONS INCHES MILLIMETERS DIM MIN NOM MX MIN NOM MX b b c D E E e BSC e BSC L L1 (.021) (0.54) N aaa bbb ccc X ccc C SETING PLNE b1 aaa C B 1 C NOTES: 1. CONTROLLING DIMENSIONS RE IN MILLIMETERS (NGLES IN DEGREES). 2. DTUMS ND B TO BE DETERMINED T DTUM PLNE H 3. DIMENSIONS "E1" ND "D" DO NOT INCLUDE MOLD FLSH, PROTRUSIONS OR GTE BURRS. 4. REFERENCE JEDEC STD TO253, RITION D. Land Pattern SOT143 Z C G E2 E1 Y Y DIMENSIONS DIM INCHES MILLIMETERS C (.087) (2.) E1 E2 G X Y Z X2 NOTES: 1. THIS LND PTTERN IS FOR REFERENCE PURPOSES ONLY CONSULT YOUR MNUFCTURING GROUP TO ENSURE YOUR COMPNY'S MNUFCTURING GUIDELINES RE MET. 2. REFERENCE IPCSM Semtech Cor. 5

6 Marking Codes Part Number LCD12C1 LCD15C1 Marking Code 12L 15L Ordering Information Part Number Lead Finish Qty er Reel Reel Size LCD12C1.TC LCD15C1.TC LCD12C1.TCT LCD15C1.TCT SnPb SnPb Pb Free Pb Free Contact Information Semtech Cororation Protection Products Division 0 Flynn Road, Camarillo, C Phone: (805) FX (805) Semtech Cor. 6