SMS05C through SMS24C

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From this document you will learn the answers to the following questions:

  • What are voltage induced transient events?

  • What are the SMS series of TS arrays designed to rotect?

  • What is the main cause of the transient rotection of data lines?

Transcription

1 ROTECTION RODUCTS Descrition The SMS series of TS arrays are designed to rotect sensitive electronics from damage or latch-u due to ESD and other voltage-induced transient events. Each device will rotect u to five lines. They are available with oerating voltages of 5, 12, 15 and 24. They are unidirectional devices and may be used on lines where the signal olarities are above ground. TS diodes are solid-state devices designed secifically for transient suression. They feature large crosssectional area junctions for conducting high transient currents. They offer desirable characteristics for board level rotection including fast resonse time, low oerating and claming voltage and no device degradation. The SMS series devices may be used to meet the immunity requirements of IEC , level 4. The low cost SOT23-6L ackage makes them ideal for use in ortable electronics such as cell hones, D s, and notebook comuters. SMS5C through SMS24C TS Diode rray For ESD and Latch-U rotection Features Transient rotection for data lines to IEC (ESD) ±15k (air), ±8k (contact) IEC (EFT) 4 (5/5ns) IEC (Lightning) 24 (8/2µs) Small ackage for use in ortable electronics rotects five I/O lines Working voltages: 5, 12, 15 and 24 Low leakage current Low oerating and claming voltages Solid-state silicon avalanche technology Mechanical Characteristics EIJ SOT23-6L ackage Molding comound flammability rating: UL 94- Marking : Marking Code ackaging : Tae and Reel er EI 481 lications Cell hone Handsets and ccessories Microrocessor ased Equiment ersonal Digital ssistants (D s) Notebooks, Desktos, and Servers ortable Instrumentation Set To ox eriherals M3 layers Cordless hones Circuit Diagram Schematic & IN Configuration SOT23-6L (To iew) Revision 8/11/4 1

2 ROTECTION RODUCTS bsolute Rating Rating alue eak ulse ower (t = 8/2µs) k eak Forward oltage (I = 1, t = 8/2µs) F F. 5 3 Watts 1 Lead Soldering Temerature T L 26 (1 sec. ) C Oerating Temerature T J -55 to +125 C Storage Temerature T STG 55 to C Electrical Characteristics SMS5C arameter Tyical Stand-Off oltage RWM 5 reakdown oltage R = 1m 6 RWM = 5, T=25 C 2 µ Claming oltage C = 5, t = 8/2µ s 9. 8 Claming oltage C = 24, t = 8/2µ s eak ulse Current I t = 8/2µ s 24 Caacitance etween I/O ins and =, f = 1MHz R F SMS12C arameter Tyical Stand-Off oltage WM R 2 1 reakdown oltage = 1m R RWM = 12, T=25 C 1 µ Claming oltage C = 5, t = 8/2µ s 19 Claming oltage C = 15, t = 8/2µ s 23 eak ulse Current t = 8/2µ s 15 I Caacitance etween I/O ins and =, f = 1MHz R F 24 Semtech Cor. 2

3 ROTECTION RODUCTS Electrical Characteristics (Continued) SMS15C arameter Tyical Stand-Off oltage WM R 5 1 reakdown oltage R = 1m RWM = 15, T=25 C 1 µ Claming oltage C = 5, t = 8/2µ s 24 Claming oltage C = 12, t = 8/2µ s 29 eak ulse Current t = 8/2µ s 12 I Caacitance etween I/O ins and =, f = 1MHz R F SMS24C arameter Tyical Stand-Off oltage WM R 4 2 reakdown oltage R = 1m RWM = 24, T=25 C 1 µ Claming oltage C = 5, t = 8/2µ s 4 Claming oltage C = 8, t = 8/2µ s 44 eak ulse Current I t = 8/2µ s 8 Caacitance etween I/O ins and =, f = 1MHz R 6 75 F 24 Semtech Cor. 3

4 ROTECTION RODUCTS Tyical Characteristics Non-Reetitive eak ulse ower vs. ulse Time ower Derating Curve eak ulse ower - k (kw) 1.1 % of Rated ower or ulse Duration - t (µs) mbient Temerature - T ( o C) ulse Waveform Claming oltage vs. eak ulse Current ercent of I e -t td = /2 Waveform arameters: tr = 8µs td = 2µs Time (µs) Claming oltage - C () SMS24C SMS15C SMS12C SMS5C Waveform arameters: tr = 8µs td = 2µs eak ulse Current - () Forward oltage vs. Forward Current Forward oltage - F () Waveform arameters: tr = 8µs td = 2µs Forward Current - I F () 24 Semtech Cor. 4

5 ROTECTION RODUCTS lications Information Device Connection for rotection of Five Data Lines The SMSxxC is designed to rotect u to five unidirectional data lines. The device is connected as follows: SMSxxC Circuit Diagram 1. Unidirectional rotection of five I/O lines is achieved by connecting ins 1, 3, 4, 5 and 6 to the data lines. in 2 is connected to ground. The ground connection should be made directly to the ground lane for best results. The ath length is ket as short as ossible to reduce the effects of arasitic inductance in the board traces. Circuit oard Layout Recommendations for Suression of ESD. Good circuit board layout is critical for the suression of ESD induced transients. The following guidelines are recommended: rotection of Five Unidirectional Lines lace the SMSxxC near the inut terminals or connectors to restrict transient couling. Minimize the ath length between the SMSxxC and the rotected line. Minimize all conductive loos including ower and ground loos. The ESD transient return ath to ground should be ket as short as ossible. Never run critical signals near board edges. Use ground lanes whenever ossible. Matte Tin Lead Finish Matte tin has become the industry standard lead-free relacement for Snb lead finishes. matte tin finish is comosed of 1% tin solder with large grains. Since the solder volume on the leads is small comared to the solder aste volume that is laced on the land attern of the C, the reflow rofile will be determined by the requirements of the solder aste. Therefore, these devices are comatible with both lead-free and Snb assembly techniques. In addition, unlike other lead-free comositions, matte tin does not have any added alloys that can cause degradation of the solder joint. 24 Semtech Cor. 5

6 ROTECTION RODUCTS Outline Drawing -SOT23 - SO-8 6L 2X E/2 ccc C 2X N/2 TIS aaa C SETING LNE C N 1 2 D e1 D EI E e 2 1 bxn bbb C - D H GGE LNE.25 H SIDE IEW DETIL L (L1) c 1 SEE DETIL DIMENSIONS INCHES MILLIMETERS DIM MIN NOM MX MIN NOM MX b c D E E e.11 SC.37 SC 2.8 SC.95 SC e1.75 SC 1.9 SC L L1 (.24) (.6) N aaa.4.1 bbb.8.2 ccc.8.2 NOTES: 1. CONTROLLING DIMENSIONS RE IN MILLIMETERS (NGLES IN DEGREES). 2. DTUMS -- ND -- TO E DETERMINED T DTUM LNE -H- 3. DIMENSIONS "E1" ND "D" DO NOT INCLUDE MOLD FLSH, ROTRUSIONS OR GTE URRS. Land attern -SOT23 6L X (C) G Y Z DIM C G X Y Z DIMENSIONS INCHES MILLIMETERS (.98) (2.5) NOTES: 1. THIS LND TTERN IS FOR REFERENCE UROSES ONLY. CONSULT YOUR MNUFCTURING GROU TO ENSURE YOUR COMNY'S MNUFCTURING GUIDELINES RE MET. 24 Semtech Cor. 6

7 ROTECTION RODUCTS Marking Codes art Number Marking Code SMS5C C5 SMS12C C12 SMS15C C15 SMS24C C24 Note: in 1 Identified with a dot. Ordering Information art Number Lead Finish Qty er Reel Reel Size SMS5C.TC SMS12C.TC SMS15C.TC SMS24C.TC SMS5C.TCT SMS12C.TCT SMS15C.TCT SMS24C.TCT Snb Snb Snb Snb b b b b Note: (1) No suffix indicates tube ack. 24 Semtech Cor. 7

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