SMF05C. TVS Diode Array For ESD and Latch-Up Protection PRELIMINARY. PROTECTION PRODUCTS Description. Features. Mechanical Characteristics

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1 Description The SMF series TVS arrays are designed to protect sensitive electronics from damage or latchup due to ESD and other voltageinduced transient events. They are designed for use in applications where board space is at a premium. Each device will protect up to five lines. They are unidirectional devices and may be used on lines where the signal polarities are above ground. TVS diodes are solidstate devices designed specifically for transient suppression. They feature large crosssectional area junctions for conducting high transient currents. They offer desirable characteristics for board level protection including fast response time, low operating and clamping voltage, and no device degradation. The SMF series devices may be used to meet the immunity requirements of IE 14, level 4. The small S7 package makes them ideal for use in portable electronics such as cell phones, PDA s, notebook computers, and digital cameras. SMF5 TVS Diode Array For ESD and LatchUp Protection Features ESD protection for data lines to IE 14 (ESD) ±15kV (air), ±8kV (contact) IE 144 (EFT) 4A (5/5ns) Small package for use in portable electronics Protects five I/O lines Working voltage: 5V Low leakage current Low operating and clamping voltages Solidstate siliconavalanche technology Mechanical haracteristics EIAJ S7L package Molding compound flammability rating: UL 94V Marking : Marking ode Packaging : Tape and Reel per EIA 481 Applications ellular Handsets and Accessories ordless Phones Personal Digital Assistants (PDA s) Notebooks and Handhelds Portable Instrumentation Digital ameras Peripherals MP3 Players ircuit Diagram Schematic & PIN onfiguration S7L (Top View) Revision 8/4/4 1

2 Absolute Maximum Rating Rating Symbol Value Units P eak Pulse Power (tp = 8/µ s) P eak Pulse urrent (tp = 8/µ s) P pk 1 Watts I PP 8 A ESD per IE 14 (Air) ESD per IE 14 (ontact) V ESD 15 kv Lead Soldering Temperature T L (1 seconds) o Operating Temperature T J 55 to +15 o Storage Temperature T STG 55 to +15 o Electrical haracteristics SMF5 Parameter Symbol onditions Minimum Typical Maximum Units Reverse StandOff Voltage V RWM 5 V Reverse Breakdown Voltage V R B I t = 1mA V Reverse Leakage urrent I R V RWM = 5V, T=5 5 µ A lamping Voltage V I PP = 5A, t = 8/µ s p 9. 8 V lamping Voltage V I PP = 8A, t = 8/µ s p 1. 5 V Junction apacitance j V R = V, f = 1MHz 13 pf 4 Semtech orp.

3 Typical haracteristics NonRepetitive Peak Pulse Power vs. Pulse Time Power Derating urve Peak Pulse Power Ppk (kw) Pulse Duration t p (µs) % of Rated Power or I PP Ambient Temperature T A ( o ) Pulse Waveform lamping Voltage vs. Peak Pulse urrent Percent of IPP e t td = IPP/ Waveform Parameters: tr = 8µs td = µs Time (µs) lamping Voltage V (V) Waveform Parameters: tr = 8µs td = µs Peak Pulse urrent I PP (A) 14 apacitance vs. Reverse Voltage ESD lamping haracteristics (8kV ontact Discharge per IE 14) 1 apacitance j (pf) f = 1MHz Reverse Voltage V R (V) 4 Semtech orp. 3

4 Applications Information Device onnection for Protection of Five Data Lines The SMF5 is designed to protect up to five unidirectional data lines. The device is connected as follows: SMF5 ircuit Diagram Unidirectional protection of five I/O lines is achieved by connecting pins 1, 3, 4, 5 and to the data lines. Pin is connected to ground. The ground connection should be made directly to the ground plane for best results. The path length is kept as short as possible to reduce the effects of parasitic inductance in the board traces. ircuit Board Layout Recommendations for Suppression of ESD. Good circuit board layout is critical for the suppression of ESD induced transients. The following guidelines are recommended: Place the SMF5 near the input terminals or connectors to restrict transient coupling. Minimize the path length between the SMF5 and the protected line. Minimize all conductive loops including power and ground loops. The ESD transient return path to ground should be kept as short as possible. Never run critical signals near board edges. Use ground planes whenever possible. Protection of Five Unidirectional Lines Matte Tin Lead Finish Matte tin has become the industry standard leadfree replacement for SnPb lead finishes. A matte tin finish is composed of 1% tin solder with large grains. Since the solder volume on the leads is small compared to the solder paste volume that is placed on the land pattern of the PB, the reflow profile will be determined by the requirements of the solder paste. Therefore, these devices are compatible with both leadfree and SnPb assembly techniques. In addition, unlike other leadfree compositions, matte tin does not have any added alloys that can cause degradation of the solder joint. 4 Semtech orp. 4

5 Typical Applications 4 Semtech orp. 5

6 Outline Drawing S7 L X E/ ccc X N/ TIPS aaa SEATING PLANE A N 1 B D e1 D EI E e A A A1 bxn bbb AB D GAGE PLANE.15 SIDE VIEW H DETAIL L (L1) A SEE DETAIL A c 1 DIMENSIONS INHES MILLIMETERS DIM MIN NOM MAX MIN NOM MAX A A A b c D E E e e1.83 BS. BS.51.1 BS.5 BS 1.3 BS L L1 N 1 (.17) 8 (.4) 8 aaa bbb ccc NOTES: 1. ONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).. DATUMS A AND B TO BE DETERMINED AT DATUM PLANE H 3. DIMENSIONS "E1" AND "D" DO NOT INLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. 4. REFERENE JEDE STD MO3, VARIATION AB. Land Pattern S7 L X Y G Z DIM G P X Y Z DIMENSIONS INHES MILLIMETERS (.73) (1.85) P NOTES: 1. THIS LAND PATTERN IS FOR REFERENE PURPOSES ONLY. ONSULT YOUR MANUFATURING GROUP TO ENSURE YOUR OMPANY'S MANUFATURING GUIDELINES ARE MET. 4 Semtech orp.

7 Marking odes Part Number SMF5 Marking ode 5 Note: (1) Pin 1 Identified with a dot Ordering Information Part Number Lead Finish Qty per Reel Reel Size SMF5.T SMF5.TT SnPb 3, 7 Inch Matte Sn 3, 7 Inch ontact Information Semtech orporation Protection Products Division Flynn Road, amarillo, A 931 Phone: (85) FAX (85) Semtech orp. 7

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