BCP4...BCP6... NPN Silicon AF Transistors For AF driver and output stages High collector current Low collectoremitter saturation voltage Complementary types: BCP...BCP (PNP) Pbfree (RoHS compliant) package Qualified according AEC Q Type Marking Pin Configuration Package BCP4 BCP46 BCP BCP6 BCP6 BCP66 Marking is the same as the typename
BCP4...BCP6... Maximum Ratings Parameter Symbol Value Unit Collectoremitter voltage V CEO V BCP4 BCP BCP6 4 6 8 Collectorbase voltage BCP4 BCP BCP6 V CBO 4 6 Emitterbase voltage V EBO Collector current I C A Peak collector current, t p ms I CM. Base current I B ma Peak base current I BM Total power dissipation T S C P tot W Junction temperature T j C Storage temperature T stg 6... Thermal Resistance Parameter Symbol Value Unit Junction soldering point ) R thjs K/W For calculation of R thja please refer to Application Note AN77 (Thermal Resistance Calculation)
BCP4...BCP6... Electrical Characteristics at T A = C, unless otherwise specified Parameter Symbol Values Unit min. typ. max. DC Characteristics Collectoremitter breakdown voltage V (BR)CEO V I C = ma, I B =, BCP4... I C = ma, I B =, BCP... I C = ma, I B =, BCP6, 6 4 6 8 Collectorbase breakdown voltage V (BR)CBO I C = µa, I E =, BCP4... 4 I C = µa, I E =, BCP... 6 I C = µa, I E =, BCP6, 6 Emitterbase breakdown voltage I E = µa, I C = Collectorbase cutoff current V CB = V, I E = V CB = V, I E =, T A = C DC current gain ) I C = ma, V CE = V I C = ma, V CE = V, BCP4/BCP I C = ma, V CE = V, BCP6 I C = ma, V CE = V, BCP46...BCP66 I C = ma, V CE = V V (BR)EBO I CBO h FE. 4 6 6 6 µa Collectoremitter saturation voltage ) I C = ma, I B = ma Baseemitter voltage ) I C = ma, V CE = V AC Characteristics Transition frequency I C = ma, V CE = V, f = MHz V CEsat. V V BE(ON) f T MHz Pulse test: t < µs; D < %
BCP4...BCP6... DC current gain h FE = ƒ(i C ) V CE = V Collectoremitter saturation voltage I C = ƒ(v CEsat ), h FE = BCP 4...6 EHP68 4 BCP 4...6 EHP7 h FE Ι C ma C C C C C C ma Ι C 4..4.6 V.8 V CEsat Baseemitter saturation voltage I C = ƒ(v BEsat ), h FE = Collector cutoff current I CBO = ƒ(t A ) V CBO = V 4 BCP 4...6 EHP7 4 BCP 4...6 EHP69 Ι C ma Ι CBO na max C C C typ..4.6.8 V. C V BEsat T A 4
BCP4...BCP6... Transition frequency f T = ƒ(i C ) V CE = V Total power dissipation P tot = ƒ(t S ) BCP 4...6 EHP67.4 f T MHz W Ptot.6..8.4 ma Permissible Pulse Load R thjs = ƒ(t p ) Ι C 4 6 7 9 C T S Permissible Pulse Load P totmax /P totdc = ƒ(t p ) RthJS D =,,,,,,, Ptotmax/PtotDC D =....... 6 4 s t p 6 4 s t p
Package BCP4...BCP6... Package Outline A 6. ±. ±.. MAX..6±. 4 7±. MAX.. ±. B Foot Print.7 ±.. M A 4.6... MIN.. M.8... B ±.4.4 4.8.4 Marking Layout (Example).. Manufacturer, 4 CW Date code (YYWW) BCP6 Type code Pin Packing Reel ø8 mm =. Pieces/Reel Reel ø mm = 4. Pieces/Reel 8. MAX. 7. Pin 6.8.7 6
BCP4...BCP6... Edition 96 Published by Infineon Technologies AG 876 Munich, Germany 9 Infineon Technologies AG All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of noninfringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (<www.infineon.com>). Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in lifesupport devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that lifesupport device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. 7