BAS16... Silicon Switching Diode For high-speed switching applications Pb-free (RoHS compliant) package 1) Qualified according AEC Q101 BAS16S BAS16U
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1 BAS6... Silicon Switching Diode For highspeed switching applications Pbfree (RoHS compliant) package ) Qualified according AEC Q BAS6 BAS6W BAS6L BAS6V BAS6W BAS63W BAS6S BAS6U BAS67L4! $ # " "!,,,!,,! Type Package Configuration Marking BAS6 BAS6L* BAS6V BAS6W BAS63W BAS67L4* BAS6S BAS6U BAS6W * Preliminary Data SOT3 TSLP SC79 SCD8 SOD33 TSLP44 SOT363 SC74 SOT33 Pbcontaining package may be available upon special request single single, leadless single single single parallel pair, leadless parallel triple parallel triple single A6s A6 6 A6 white B 6A A6s A6s A6s 998
2 BAS6... Maximum Ratings at T A = 5 C, unless otherwise specified Parameter Symbol Value Unit Diode reverse voltage V R 8 V Peak reverse voltage V RM 85 Forward current BAS6 BAS6L, 7L4 BAS6V, W BAS63W BAS6S BAS6U BAS6W I F ma Nonrepetitive peak surge forward current t = µs, BAS6/ S/ U/ W/ 3W t = µs, BAS6L/ V/ W/ 7L4 t = s Total power dissipation BAS6, T S 54 C BAS6L, 7L4, T S 3 C BAS6V, W, T S C BAS63W, T S 6 C BAS6S, T S 85 C BAS6U, T S 3 C BAS6W, T S 9 C I FSM P tot A mw Junction temperature T j 5 C Storage temperature T stg
3 BAS6... Thermal Resistance Parameter Symbol Value Unit Junction soldering point ) BAS6, BAS6S BAS6L, 7L4 BAS6V, W BAS63W BAS6U BAS6W R thjs K/W Electrical Characteristics at T A = 5 C, unless otherwise specified Parameter Symbol Values Unit min. typ. max. DC Characteristics Breakdown voltage I (BR) = µa V (BR) 85 V Reverse current I R µa V R = 75 V V R = 5 V, T A = 5 C 3 V R = 75 V, T A = 5 C 5 Forward voltage V F mv I F = ma 75 I F = ma 855 I F = 5 ma I F = ma I F = 5 ma 5 Forward recovery voltage I F = ma, t P = ns V fr.75 V For calculation of R thja please refer to Application Note Thermal Resistance 3 998
4 BAS6... Electrical Characteristics at T A = 5 C, unless otherwise specified Parameter Symbol Values Unit min. typ. max. AC Characteristics Diode capacitance V R = V, f = MHz C T pf Reverse recovery time I F = ma, I R = ma, measured at I R = ma, R L = Ω t rr 4 ns Test circuit for reverse recovery time Ι F D.U.T. Oscillograph Pulse generator: = ns, D =.5, t r =.6ns, R i = 5Ω Oscillograph: R = 5Ω, t r =.35ns, C =.5pF EHN
5 BAS6... Reverse current I R = ƒ (T A ) V R = Parameter Forward Voltage V F = ƒ (T A ) I F = Parameter 5 na V F. V BAS 6 Ι F = ma EHB5 4 IR ma 3.5 ma 7 V 5 V. ma C 5 T A 5 C 5 T A Forward current I F = ƒ (V F ) T A = 5 C Forward current I F = ƒ (T S ) BAS6 5 BAS 6 EHB3 3 Ι F ma ma IF typ max V.5 V F C 5 T S 5 998
6 BAS6... Forward current I F = ƒ (T S ) BAS6L, 7L4 Forward current I F = ƒ (T S ) BAS6V, W 5 5 ma ma IF 5 IF C 5 T S C 5 T S Forward current I F = ƒ (T S ) BAS63W Forward current I F = ƒ (T S ) BAS6S 3 5 ma ma IF IF C 5 T S C 5 T S 6 998
7 BAS6... Forward current I F = ƒ (T S ) BAS6U Forward current I F = ƒ (T S ) BAS6W 5 ma 3 ma 75 IF 5 IF C 5 T S C 5 T S Permissible Puls Load R thjs = ƒ ( ) BAS6 3 Permissible Pulse Load I Fmax / I FDC = ƒ ( ) BAS6 K/W RthJS D = IFmax/IFDC D = s s 7 998
8 BAS6... Permissible Puls Load R thjs = ƒ ( ) BAS6L, 7L4 Permissible Pulse Load I Fmax / I FDC = ƒ ( ) BAS6L, 7L4 RthJS K/W D = IFmax/ IFDC D = s s Permissible Puls Load R thjs = ƒ ( ) BAS6V, W 3 Permissible Pulse Load I Fmax / I FDC = ƒ ( ) BAS6V, W K / W RthJS D= IFmax/ IFDC D= s s 8 998
9 BAS6... Permissible Puls Load R thjs = ƒ ( ) BAS63W 3 Permissible Pulse Load I Fmax / I FDC = ƒ ( ) BAS63W K/W RthJS D= IFmax/ IFDC D= s s Permissible Puls Load R thjs = ƒ ( ) BAS6S 3 Permissible Pulse Load I Fmax / I FDC = ƒ ( ) BAS6S K/W RthJS D= IFmax/ IFDC D = s s 9 998
10 BAS6... Permissible Puls Load R thjs = ƒ ( ) BAS6U 3 Permissible Pulse Load I Fmax / I FDC = ƒ ( ) BAS6U K/W RthJS D= IFmax/ IFDC D= s s Permissible Puls Load R thjs = ƒ ( ) BAS6W 3 Permissible Pulse Load I Fmax / I FDC = ƒ ( ) BAS6W K/W RthJS D = IFmax/ IFDC D = s s 998
11 Package SC74 BAS6... Package Outline.9 ±. (.5) B (.35) MAX. Pin M B 6x ±. ±..5.5 MAX.. M A MAX.. MAX..6 A ±. Foot Print Marking Layout (Example) Small variations in positioning of Date code, Type code and Manufacture are possible. Manufacturer 5, June Date code (Year/Month) Pin Laser BCW66H Type code Standard Packing Reel ø8 mm = 3. Pieces/Reel Reel ø33 mm =. Pieces/Reel For symmetric types no defined Pin orientation in reel Pin
12 Package SC79 BAS6... Package Outline.8 ±..6 ±. MAX.. M A MAX.. ±. A Cathode.3 ±.5.55 ±.4. ±.5 Foot Print Marking Layout (Example) 5, June Date code BAR63V Type code Cathode Laser Standard Packing Reel ø8 mm = 3. Pieces/Reel Reel ø8 mm = 8. Pieces/Reel ( mm Pitch) Reel ø33 mm =. Pieces/Reel Standard 4 Reel with mm Pitch Cathode.4.93 Cathode
13 Package SCD8 BAS6... Package Outline.8 ±..7 ±. MAX.. M A ± ±. A Cathode.3 ±.5.7±.. ±.5 Foot Print Marking Layout (Example) 5, June Date code BAR63W Type code Cathode Laser Standard Packing Reel ø8 mm = 3. Pieces/Reel Reel ø8 mm = 8. Pieces/Reel ( mm Pitch) Reel ø33 mm =. Pieces/Reel Standard 4 Reel with mm Pitch Cathode.4.9 Cathode
14 BAS6... Date Code for discrete packages with one digit (SCD8, SC79, SC75 ) ) CESCode Month a p A P a p A P a p A P b q B Q b q B Q b q B Q 3 c r C R c r C R c r C R 4 d s D S d s D S d s D S 5 e t E T e t E T e t E T 6 f u F U f u F U f u F U 7 g v G V g v G V g v G V 8 h x H X h x H X h x H X 9 j y J Y j y J Y j y J Y k z K Z k z K Z k z K Z l L 4 l L 4 l L 4 n 3 N 5 n 3 N 5 n 3 N 5 ) New Marking Layout for SC75, implemented at October
15 Package SOD33 BAS
16 Package SOT3 BAS6... Package Outline +. ) ±..9 3 B C.95.4 ±.5.5 MIN. MAX. ±.. MAX....8 MAX ±. A.5 M BC. M A Foot Print ) Lead width can be.6 max. in dambar area Marking Layout (Example) EH s Manufacturer 5, June Date code (YM) Pin BCW66 Type code Standard Packing Reel ø8 mm = 3. Pieces/Reel Reel ø33 mm =. Pieces/Reel Pin
17 Package SOT33 BAS6... Package Outline ± x. M. MAX...9 ±. A ±.. MIN ±.. M A Foot Print.6 Marking Layout (Example) Standard Packing Reel ø8 mm = 3. Pieces/Reel Reel ø33 mm =. Pieces/Reel Manufacturer 5, June Date code (YM) Pin BCR8W Type code Pin
18 Package SOT363 BAS6... Package Outline ± x. M. MAX...9 ±. A Pin ±.. MIN Foot Print Marking Layout (Example) Small variations in positioning of Date code, Type code and Manufacture are possible. Manufacturer 5, June Date code (Year/Month) Pin Laser BCR8S Type code Standard Packing Reel ø8 mm = 3. Pieces/Reel Reel ø33 mm =. Pieces/Reel For symmetric types no defined Pin orientation in reel ±.. M A Pin
19 Package TSLP BAS6... Package Outline Top view +..4 Bottom view.5 MAX..6 ±.5.65±.5 ±.5 Cathode ).5 ±.35 ) Dimension applies to plated terminal Foot Print For board assembly information please refer to Infineon website "Packages" Copper Solder mask Stencil apertures Marking Layout (Example) BAS6L Type code Cathode Laser Standard Packing Reel ø8 mm = 5. Pieces/Reel Reel ø33 mm = 5. Pieces/Reel (optional) ).5 ±.35 Cathode
20 Package TSLP44 BAS
21 BAS6... Edition 6 Published by Infineon Technologies AG 876 München, Germany Infineon Technologies AG 7. All Rights Reserved. Attention please! The information given in this dokument shall in no event be regarded as a guarantee of conditions or characteristics ( Beschaffenheitsgarantie ). With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of noninfringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office ( Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in lifesupport devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that lifesupport device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. 998
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