Trend and Challenges for MEMS Packaging 天水华天科技股份有限公司于大全

Trend and Challenges for MEMS Packaging 天水华天科技股份有限公司于大全 July. 2014 TianShui HuaTian Technology CO., Ltd

Outline of Presentation Development of MEMS MEMS Packaging Trend and Challenges MEMS Packaging of HuaTian Summary 2 HuaTian Technology (XI AN) CO., Ltd

MEMS & Sensors in Smartphones 3 HuaTian Technology (XI AN) CO., Ltd

MEMS & Cellphones 4 HuaTian Technology (XI AN) CO., Ltd

Some of the Things Things and Sensors Inertial Sensors Magnetic Sensors Pressure Sensors Temperature Sensors MEMS Microphone Sensors Smart meters v v v Smart pills v v v Wearables v v v v v v Engine control units v v Anti-lock braking systems Airbag control modules Digital cameras(stills and camcorders) Security cameras Automotive GPSs v v v v v v Printers v v Elderly person monitors/alarms v v Video game consoles Tire pressure monitoring systems Portable media players v v v Toys v v v Video game handheld devices Blood pressure sensors, E-readers v v * This includes sensors such as those for measuring humidity and detecting gas v v v Other Sensors 5 HuaTian Technology (XI AN) CO., Ltd

Market of lot According to Gartner, The IoT will include 26 billion units of "things" installed by 2020. Furthermore, there will be 10 billion units of things shipped in 2020 alone. Mobile phones, tablets and PCs are not considered. With wearables which are examples of the more visible things in the IoT the volumes are currently very small (less than 50 million units) and are expected to reach about 200 million units by 2020. A potential market of nearly $300 million. However, most importantly, the IoT in 2020 will be a very highly fragmented market and there will be no one dominant end application for sensors. But, there will be many different applications using sensors in low volumes, at least not in the volumes we have seen with smartphones. Per Strategy Analytics, the demand for automotive sensors will grow at 6.8% CAGR between 2012 and 2017, rising from $16.9 billion to $23.5 billion. Safety system growth is the largest driver of sensor growth through 2020. 6 HuaTian Technology (XI AN) CO., Ltd

MEMS Packaging Requirements (1) MEMS devices are more demanding on packaging than ICs due to their mechanical function, environmental interaction, and the applications. Specialized interface with the outside world and exposure to corrosive gases or fluids such as pressure sensors, fluidic devices Vacuum packaging, hermeticity Protection from moisture-sensitive capacitive devices will get signal errors High-temperature operation, such in-cylinder pressure sensors operating at 1000C Challenging assembly processes, such as wire bonding to vertical surfaces Sensitivity to vibration and shock during processing steps such as grinding or pick and place 8 HuaTian Technology (XI AN) CO., Ltd

MEMS Packaging Requirements (2) The type of MEMS product dictates the specific packaging requirements; even the same MEMS device could require different packaging for different markets including military, avionics, industrial process control. Automotive, medical, and consumer. Mechanical devices, such as accelerometers, gyroscopes, pressure sensors, microphones, resonators, and valves Optical devices such as mirrors, spectrometers, gas chromatographs, displays Fluidic devices such as reactors, pumps, filters, separators Bio/nano devices (sensors, actuators) 9 HuaTian Technology (XI AN) CO., Ltd

Process Challenges There are a number of process challenges for MEMS packaging Release and stiction Dicing Die handling Wafer level encapsulation Stress Outgasing 10 HuaTian Technology (XI AN) CO., Ltd

Test and Reliability Methods for reliability assessment of MEMS devices are still being developed, and the requirements are more complex than for ICs. Failure modes and mechanisms are more complex Number of potential failure modes and mechanisms is larger Some failures, such as collisions or sticking of movable parts, are transient and thus hard to identify or locate Packages contain multiple components, and MEMS device failure must be differentiated from and ASIC failure Failure criteria are device- and application-specific Standard destructive failure analysis can result in erroneous conclusions due to sample preparation problems, so physical analysis must often be combined with modeling Monitoring instruments may be exposed to the loading conditions, such as temperature excursions, mechanical shock, or vibration, and may need to be checked for degradation themselves 11 HuaTian Technology (XI AN) CO., Ltd

Drivers for MEMS Package Drivers in MEMS packaging: performance, cost, size MEMS average selling price (ASP) erosion from 2006 to 2015 12 HuaTian Technology (XI AN) CO., Ltd

Lower Cost: Standard Platforms Package cost is a significant component; MEMS device cost drops quickly, the package and test become a larger percentage of total production cost. Package standardization is required to reduce cost MEMS companies can take advantages of their package optimization experience and mature production lines. Popular standard platforms: Laminate, Leadframe, and WLCSP 13 HuaTian Technology (XI AN) CO., Ltd

MEMS Packages and Laminate/PCB A lamination-based manufacturing process allows for a broader selection of materials and fabrication processes than silicon-based manufacturing, and therefore provides greater design freedom for producing functional microdevices. Laminate microphones RF micro-switch on PCB Flexible integrated microfluidics From Prof. Mark Bachman, University of California Irvine 14 HuaTian Technology (XI AN) CO., Ltd

Miniaturization Source: Robert Bosch and Gartner MEMS technology has also allowed a shrinkage in size The figure shows the accelerometer footprint sizes for the automotive and consumer segments. 15 HuaTian Technology (XI AN) CO., Ltd

New Enabling Technology More advanced 3D technologies, are generally reserved for high-i/o communication ICs and could be applied to higher-i/o combo sensor MEMS. These include: flip chip, through silicon via (TSV) through-mold via copper pillar ASIC as a capping wafer wafer bonding 16 HuaTian Technology (XI AN) CO., Ltd

BMA355 Bosch Sensortec BMA355, 3-Axis MEMS Accelerometer, the first MEMS device using TSV in ASIC and WLCSP to reach the smallest. With a size of 1.4mm3 (1.2x1.5x0.8mm) the BMA335 is the smallest MEMS accelerometer on the market and feauture 60% volume reduction. 17 HuaTian Technology (XI AN) CO., Ltd

CMOS Image Sensor 18 HuaTian Technology (XI AN) CO., Ltd

TGV Application Diameter 5-30μm, pitch 10-80μm, thickness 20-250μm Vertical feedthrough, Hermeticity, low cost. reliability May need microlense/ micro mirror 19 HuaTian Technology (XI AN) CO., Ltd

MEMS Packaging Technology Packaging Technology Laminate Leadframe SiP Wafer level Packaging Simulation Mechanical and stress Thermal Electrical 21 HuaTian Technology (XI AN) CO., Ltd

HTXA QFN Technology Roadmap 22 HuaTian Technology (XI AN) CO., Ltd

HTXA Laminated Technology Roadmap Items 2009-2011 2012-2013 2014 2015 Package LGA TFBGA VFBGA WFBGA BGA-H Options SiP LFBGA Stack die CSP PiP Au Wire HVM Pd-Cu Wire HVM Technology Pd-Cu Wire Qual run Max I/O Counts: 408 Min Pitch: 0.65mm Min Ball size: 0.3mm Alloy Wire HVM Max I/O Counts: 800 Min Pitch: 0.4mm Min Ball size: 0.25mm Coreless Substrate 1Layer Substrate Min. Sub Thk 0.13mm Package size: Min. Sub Thk 0.18mm 5G SerDes 1.5x1.0~21.0x21.0mm Package size: ~35x35mm CODEC AP FPGA G-Sensor Key Market Trends Set-Top Box(STB) GPS-LNA SIM Card RF Transceiver Base Bond HDTV DSP Si-Microphone RF-PA Gyroscope Touch-Sensor Si Node =50nm 40nm 28nm 23 HuaTian Technology (XI AN) CO., Ltd

HTKS TSV Technology TSV WLCSP WLO WLC Application Application Application Application WLCSP WLO TSV WLC CIS MEMS Interposer CIS PMU RFIC AP BP DSP CIS lens LED lens Laser Lens Stacked Lens Normal CIS Module Array CIS Module 24 HuaTian Technology (XI AN) CO., Ltd

HTKS WLCSP Technology Process Wafer size Line & Space Metal Layer num 200mm 20um/20um Al/Ni/Au or Cu/Ni/Au 2 RDL Wafer size Method Bump diameter Bump height Bump pitch Bump Metal Solder bump 200mm Mount 100~150 um 100um 150~300 um 200mm Print 200um 100um 400um As customer request (MP SAC305) Wafer size Bump Diameter Bump height Bump pitch Bump Metal 200/300mm 15um 20um 40um Cu/Ni/Sn Cu/Ni/SnAg ECD bumping (developing) 25 HuaTian Technology (XI AN) CO., Ltd

Summary (1) With the proliferation of sensors due to IoT and smartphones, MEMS market is exploding. It give a great push for MEMS packaging and provide a good business chance for OSAT. (2) There are a number of packaging challenges for MEMS packaging. New technology, TSV, TGV, Cu pillar are developing to achieve low cost, miniaturization and high performance. (3) Standard packaging technology based on laminate, leadframe and WLCSP will be the main technologies for OSAT (4) Huatian group has put great effort for MEMS packaging and are ready for MEMS packaging. 27 HuaTian Technology (XI AN) CO., Ltd

Thank you for your attention! 28 HuaTian Technology (XI AN) CO., Ltd

Trend and Challenges for MEMS Packaging 天水华天科技股份有限公司 于大全

Trend and Challenges for MEMS Packaging 天水华天科技股份有限公司于大全