Features. DDR SODIMM Product Datasheet. Rev. 1.0 Oct. 2011



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Features 200pin, unbuffered small outline dual in-line memory module (SODIMM) Fast data transfer rates: PC-2100, PC-2700, PC3-3200 Single or Dual rank 256MB(32Megx64), 512MB (64Meg x 64), 1GB(128 Meg x 64) JEDEC standard 2.5V I/O (SSTL_2 compatible) V DD = V DDQ = 2.5V ±0.1V V DDSPD = 2.3V to 3.6V Internal, pipelined double data rate (DDR) 2n-prefetch architecture Bidirectional data strobe (DQS) transmitted/received with data that is, source-synchronous data capture Differential clock inputs (CK and CK#) Multiple internal device banks for concurrent operation Single or Dual rank Selectable burst lengths (BL) 2, 4, or 8 Auto precharge option Auto refresh and self refresh modes: 7.8125μs maximum average periodic refresh interval Serial presence-detect (SPD) with EEPROM Selectable CAS latency (CL) for maximum compatibility Gold edge contacts Pb-free 1

Module Specification Module Density & Timing Part Number Bandwidth Data Rate Configuration (tcl-trcd-trp) SP512MBSDU266O01(2) PC-2100 DDR-266 2.5-3-3 512MB (64Mx64) SP512MBSDU333O01(2) PC-2700 DDR-333 2.5-3-3 64Mx8 1Rank SP512MBSDU400O01(2) PC-3200 DDR-400 3-3-3 SP001GBSDU266O01(2) PC-2100 DDR-266 2.5-3-3 1GB (64Mx64) SP001G BSDU333O01(2) PC-2700 DDR-333 2.5-3-3 128Mx8 2Ranks SP001G BSDU400O01(2) PC-3200 DDR-400 3-3-3 Note: 1. This document supports all SDU Series DDR 200Pin SODIMM products. 2. Some item was being EOL in this list, Please contact with our sales Dep. 3. All part numbers end with a double-digit code is for customize use only. Example: SP512MBSDU266O02-XX 2

Pin Assignments 200-Pin SODIMM Front 200-Pin SODIMM Back Pin Symbol Pin Symbol Pin Symbol Pin Symbol Pin Symbol Pin Symbol Pin Symbol Pin Symbol 1 VREF 51 VSS 101 A9 151 DQ42 2 VREF 52 VSS 102 A8 152 DQ46 3 VSS 53 DQ19 103 VSS 153 DQ43 4 VSS 54 DQ23 104 VSS 154 DQ47 5 DQ0 55 DQ24 105 A7 155 VDD 6 DQ4 56 DQ28 106 A6 156 VDD 7 DQ1 57 VDD 107 A5 157 VDD 8 DQ5 58 VDD 108 A4 158 CK1# 9 VDD 59 DQ25 109 A3 159 VSS 10 VDD 60 DQ29 110 A2 160 CK1 11 DQS0 61 DQS3 111 A1 161 VSS 12 DM0 62 DM3 112 A0 162 VSS 13 DQ2 63 VSS 113 VDD 163 DQ48 14 DQ6 64 VSS 114 VDD 164 DQ52 15 VSS 65 DQ26 115 A10 165 DQ49 16 VSS 66 DQ30 116 BA1 166 DQ53 17 DQ3 67 DQ27 117 BA0 167 VDD 18 DQ7 68 DQ31 118 RAS# 168 VDD 19 DQ8 69 VDD 119 WE# 169 DQS6 20 DQ12 70 VDD 120 CAS# 170 DM6 21 VDD 71 NC 121 S0# 171 DQ50 22 VDD 72 NC 122 NC 172 DQ54 23 DQ9 73 NC 123 NC 173 VSS 24 DQ13 74 NC 124 NC 174 VSS 25 DQS1 75 VSS 125 VSS 175 DQ51 26 DM1 76 VSS 126 VSS 176 DQ55 27 VSS 77 NC 127 DQ32 177 DQ56 28 VSS 78 NC 128 DQ36 178 DQ60 29 DQ10 79 NC 129 DQ33 179 VDD 30 DQ14 80 NC 130 DQ37 180 VDD 31 DQ11 81 VDD 131 VDD 181 DQ57 32 DQ15 82 VDD 132 VDD 182 DQ61 33 VDD 83 NC 133 DQS4 183 DQS7 34 VDD 84 NC 134 DM4 184 DM7 35 CK0 85 NC 135 DQ34 185 VSS 36 VDD 86 NC 136 DQ38 186 VSS 37 CK0# 87 VSS 137 VSS 187 DQ58 38 VSS 88 VSS 138 VSS 188 DQ62 39 VSS 89 NC 139 DQ35 189 DQ59 40 VSS 90 VSS 140 DQ39 190 DQ63 41 DQ16 91 NC 141 DQ40 191 VDD 42 DQ20 92 VDD 142 DQ44 192 VDD 43 DQ17 93 VDD 143 VDD 193 SDA 44 DQ21 94 VDD 144 VDD 194 SA0 45 VDD 95 NC 145 DQ41 195 SCL 46 VDD 96 CKE0 146 DQ45 196 SA1 47 DQS2 97 NC 147 DQS5 197 VDDSPD 48 DM2 98 NC 148 DM5 198 SA2 49 DQ18 99 A12 149 VSS 199 NC 50 DQ22 100 A11 150 VSS 200 NC 3

Pin Description Symbol Type Description A0 A12 Address inputs: Provide the row address for ACTIVE commands, and the column address and auto precharge bit (A10) for READ/WRITE commands, to select one location out of the memory array in the respective device bank. A10 sampled during a PRECHARGE command determines whether the PRECHARGE applies to one device bank (A10 LOW, device bank selected by BA0, BA1) or all device banks (A10 HIGH). The address inputs also provide the op-code during a MODE REGISTER SET command. BA0 and BA1 define which mode register (mode register or extended mode register) is loaded during the LOAD MODE REGISTER command. BA0 BA1 Bank address: BA0 and BA1 define the device bank to which an ACTIVE, READ, WRITE, or PRECHARGE command is being applied. Clock: CK and CK# are differential clock inputs. All address and control input CK0, CK0#, signals are sampled on the crossing of the positive edge of CK and the negative CK1, CK1#, edge of CK#. Output data (DQ and DQS) is referenced to the crossings of CK and CK2, CK2# CK#. CKE0,CKE1 Clock enable: CKE (registered HIGH) activates and CKE (registered LOW) RAS#, CAS#, WE# S0#, S1# SA0 SA2 SCL SDA DM0 DM7 I/O I/O deactivates the internal clock, input buffers, and output drivers. Command inputs: RAS#, CAS#, and WE# (along with S#) define the command being entered. Chip select: S# enables (registered LOW) and disables (registered HIGH) the command decoder. Presence-detect address inputs: These pins are used to configure the presence-detect devices. Serial clock for presence-detect: SCL is used to synchronize the presence-detect data transfer to and from the module. Serial presence-detect data: SDA is a bidirectional pin used to transfer addresses and data into and out of the presence-detect portion of the module. data mask: DM is an input mask signal for write data. data is masked when DM is sampled HIGH, along with that input data, during a write access. DM is sampled on both edges of DQS. Although DM pins are input-only, the DM loading is designed to match that of DQ and DQS pins. DQ0 DQ63 I/O Data input/output: Bidirectional data bus. DQS0 DQS7, I/O Data strobe: Output with read data, input with write data. DQS is edge aligned with read data, center-aligned with write data. Used to capture data. V DD /V DDQ Supply Power supply: 2.5V ±0.1V. V DDSPD Supply Serial EEPROM positive power supply: +2.3V to +3.6V. V REF Supply SSTL_2 reference voltage. (V DD /2) V SS Supply Ground. NC No connect: These pins are not connected on the module. 4

Simplified Mechanical Drawing(x8 1Rank) X64 DIMM, populated as one physical rank of x8 DDR SDRAMs Note: 1. All dimensions are in millimeters (inches); MAX/MIN or typical (TYP) where noted. Note: 2. The dimensional diagram is for reference only. 5

Simplified Mechanical Drawing(x8 2Ranks) X64 DIMM, populated as two physical ranks of x8 DDR SDRAMs Note: 1. All dimensions are in millimeters (inches); MAX/MIN or typical (TYP) where noted. Note: 2. The dimensional diagram is for reference only. 6