DDR2 VLP-Registered DIMM Module
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- Myles Barrett
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1 DDR2 VLP-Registered DIMM Module 256MB based on 256Mbit component 512MB, 1GB based on 512Mbit component 1GB, 2GB, 4GB based on 1Gbit component ATCA Compliant 60 Balls FBGA with Pb-Free Revision 1.0 (Mar. 2006) -Initial Release Super Talent Tech., Corporation.
2 1.0 Feature JEDEC standard 1.8V +/- 0.1V Power Supply 240-pin, very low profile mini dual in-line memory module (VLP DIMM) ATCA compliant Fast data transfer rates: PC2-3200, PC2-4200, or PC Supports ECC error detection and correction 256MB (32M x 72), 512MB (64M x 72), 1GB (128M x 72), 2GB(256M x 72), 4GB(512M x 72) VDD = VDDQ = +1.8V VDDSPD = +1.7V to +3.6V Differential data strobe (DQS, DQS#) option Four-bit prefetch architecture DLL to align DQ and DQS transitions with CK Multiple internal device banks for concurrent operation Supports duplicate output strobe (RDQS/RDQS#) Programmable CAS latency (CL) Posted CAS additive latency (AL) WRITE latency (WL) = READ latency (RL) - 1 tck Programmable burst lengths: 4 or 8 Adjustable data-output drive strength 64ms, 8,192-cycle refresh On-die termination (ODT) Serial presence detect (SPD) with EEPROM Gold edge contacts Super Talent Tech., Corporation.
3 2.0 Ordering Information Part number Density Module Component Component Module Organization composition PKG Rank Description S56TV8AMX 256MB 32Mx72 32Mx8*9 FBGA 1 256MB 1Rx8 PC2-5300R-555 S56TV8AJX 256MB 32Mx72 32Mx8*9 FBGA 1 256MB 1Rx8 PC2-4200R-444 S56TV8AHX 256MB 32Mx72 32Mx8*9 FBGA 1 256MB 1Rx8 PC2-3200R-333 S12TV8BMX 512MB 64Mx72 64Mx8*9 FBGA 1 512MB 1Rx8 PC2-5300R-555 S12TV8BJX 512MB 64Mx72 64Mx8*9 FBGA 1 512MB 1Rx8 PC2-4200R-444 S12TV8BHX 512MB 64Mx72 64Mx8*9 FBGA 1 512MB 1Rx8 PC2-3200R-333 S1GTV8CMX 1GB 128Mx72 128Mx8*9 FBGA 1 1GB 1Rx8 PC2-5300R-555 S1GTV8CJX 1GB 128Mx72 128Mx8*9 FBGA 1 1GB 1Rx8 PC2-4200R-444 S1GTV8CHX 1GB 128Mx72 128Mx8*9 FBGA 1 1GB 1Rx8 PC2-3200R-333 S1GTV4AMX 1GB 128Mx72 128Mx4*18 FBGA 1 1GB 1Rx8 PC2-5300R-555 S1GTV4AJX 1GB 128Mx72 128Mx4*18 FBGA 1 1GB 1Rx8 PC2-4200R-444 S1GTV4AHX 1GB 128Mx72 128Mx4*18 FBGA 1 1GB 1Rx8 PC2-3200R-333 S2GTV4DMX 2GB 256Mx72 256Mx4*18 FBGA 1 2GB 1Rx4 PC2-5300R-555 S2GTV4DJX 2GB 256Mx72 256Mx4*18 FBGA 1 2GB 1Rx4 PC2-4200R-444 S2GTV4DHX 2GB 256Mx72 256Mx4*18 FBGA 1 2GB 1Rx4 PC2-3200R-333 S2GTV4BMX 2GB 256Mx72 256Mx4(st)*18 FBGA 2 2GB 2Rx4 PC2-5300R-555 S2GTV4BJX 2GB 256Mx72 256Mx4(st)*18 FBGA 2 2GB 2Rx4 PC2-4200R-444 S2GTV4BHX 2GB 256Mx72 256Mx4(st)*18 FBGA 2 2GB 2Rx4 PC2-3200R-333 S4GTV4CMX 4GB 512Mx72 512Mx4(st)*18 FBGA 2 4GB 2Rx4 PC2-5300R-555 S4GTV4CJX 4GB 512Mx72 512Mx4(st)*18 FBGA 2 4GB 2Rx4 PC2-4200R-444 S4GTV4CHX 4GB 512Mx72 512Mx4(st)*18 FBGA 2 4GB 2Rx4 PC2-3200R-333 Note: Last Character x of the Part Number stand for DRAM vendor S=Samsung; M=Micron; Q=Qimonda; H=Hynix; E=Elpida 3.0 Operating Frequencies DDR2-667 DDR2-533 DDR-400 Unit CL Mbps CL Mbps CL Mbps CL-tRCD-tRP CK 4.0 Absolute Maximum DC Rating Symbol Parameter Rating Units V in, Vout Voltage on any pin relative to V SS -0.5 ~ 2.3 V V DD Voltage on V DD & V DDQ supply relative to V ss -1.0 ~ 2.3 V V DDQ Short circuit current -0.5 ~ 2.3 V V DDL Power dissipation -0.5 ~ 2.3 V T STG Storage Temperature -55 ~ C Tcase device operating temperature (ambient) 0~85 C TOPR Operating temperature (ambient) 0~55 C II Input leakage current; Any input 0V VIN VDD; VREF Command/Address, RAS#, CAS#, -5~5 µa input 0V VIN 0.95V; (All other pins not under test=0v) WE# S#, CKE, CK, CK#, DM IOZ Output leakage current; 0V VOUT VDDQ; DQs and DQ, DQS, DQS# -5~5 µa ODT are disabled IVREF VREF leakage current; VREF = Valid VREF level -18~18 µa Super Talent Tech., Corporation.
4 5.0 DIMM Pin Configurations (Front side/back side) Pin Front Pin Front Pin Front Pin Front Pin Back Pin Back Pin Back Pin Back 1 V REF 31 DQ19 61 A4 91 VSS 121 VSS 151 VSS 181 VDDQ 211 DM5/DQS14 2 VSS 32 VSS 62 VDDQ 92 DQS5# 122 DQ4 152 DQ A3 212 NC/DQS14# 3 DQ0 33 DQ24 63 A2 93 DQS5 123 DQ5 153 DQ A1 213 VSS 4 DQ1 34 DQ25 64 VDD 94 VSS 124 VSS 154 VSS 184 VDD 214 DQ46 5 VSS 35 VSS 65 VSS 95 DQ DM0/DQS9 155 DM3/DQS CK0 215 DQ47 6 DQS0# 36 DQS3# 66 VSS 96 DQ NC/DQS9# 156 NC/DQS12# 186 CK0# 216 VSS 7 DQS0 37 DQS3 67 VDD 97 VSS 127 VSS 157 VSS 187 VDD 217 DQ52 8 VSS 38 VSS 68 Par_in 98 DQ DQ6 158 DQ A0 218 DQ53 9 DQ2 39 DQ26 69 VDD 99 DQ DQ7 159 DQ VDD 219 VSS 10 DQ3 40 DQ27 70 A10/AP 100 VSS 130 VSS 160 VSS 190 BA1 220 RFU 11 VSS 41 VSS 71 BA0 101 SA2 131 DQ CB4 191 VDDQ 221 RFU 12 DQ8 42 CB0 72 VDDQ 102 NC 132 DQ CB5 192 RAS# 222 VSS 13 DQ9 43 CB1 73 WE# 103 VSS 133 VSS 163 VSS 193 S0# 223 DM6/DQS15 14 VSS 44 VSS 74 CAS# 104 DQS6# 134 DM1/DQS DM8/DQS VDDQ 224 NC/DQS15# 15 DQS1# 45 DQS8# 75 VDDQ 105 DQS6 135 NC/DQS10# 165 NC/DQS17# 195 ODT0 225 VSS 16 DQS1 46 DQS8 76 NC 106 VSS 136 VSS 166 VSS 196 NC/A DQ54 17 VSS 47 VSS 77 NC 107 DQ RFU 167 CB6 197 VDD 227 DQ55 18 Reset# 48 CB2 78 VDDQ 108 DQ RFU 168 CB7 198 VSS 228 VSS 19 NC 49 CB3 79 VSS 109 VSS 139 VSS 169 VSS 199 DQ DQ60 20 VSS 50 VSS 80 DQ DQ DQ VDDQ 200 DQ DQ61 21 DQ10 51 VDDQ 81 DQ DQ DQ NC 201 VSS 231 VSS 22 DQ11 52 CKE0 82 VSS 112 VSS 142 VSS 172 VDD 202 DM4/DQS DM7/DQS16 23 VSS 53 VDD 83 DQS4# 113 DQS7# 143 DQ NC 203 NC/RQS13# 233 NC/DQS16# 24 DQ16 54 NC/BA2 84 DQS4 114 DQS7 144 DQ NC 204 VSS 234 VSS 25 DQ17 55 Err_Out 85 VSS 115 VSS 145 VSS 175 VDDQ 205 DQ DQ62 26 VSS 56 VDDQ 86 DQ DQ DM2/DQS A DQ DQ63 27 DQS2# 57 A11 87 DQ DQ NC/DQS11# 177 A9 207 VSS 237 VSS 28 DQS2 58 A7 88 VSS 118 VSS 148 VSS 178 VDD 208 DQ VDDSPD 29 VSS 59 VDD 89 DQ SDA 149 DQ A8 209 DQ SA0 30 DQ18 60 A5 90 DQ SCL 150 DQ A6 210 VSS 240 SA1 Note: Pin 196 is NC for 256MB or A13 for 512MB and 1GB; pin 54 is NC for 256MB and 512MB, or BA2 for 1GB Super Talent Tech., Corporation.
5 6.0 DIMM Pin Description Pin Name Function Pin Name Function A0 ~ A12 (256MB), A0 ~ A13 (512MB, 1GB) Address input (Multiplexed) ODT0 On Die Termination A10/AP Address Input/Auto precharge CB0~CB7 Data check bits Input/Output BA0, BA1, BA2 (1GB) CK0 ~ CK0# Bank Select DQ0~DQ63 Data Input/Output Clock input DQS0~DQS8 DQS0# ~ DQS17# Data strobes, negative line CKE0 Clock enable input DM (0~8), DQS (9~17) Data Masks/Data strobes (Read) S0# RAS# Chip select input Reset# Register and PLL control pin Row address strobe RFU Reserved for future used CAS# Column address strobe NC No connection WE# Write Enable V DD Core Power SCL SPD Clock Input V DDQ I/O Power SDA SPD Data Input/Output V SS Ground SA0~SA2 SPD Address V REF Input/Output Reference Par_In Parity bit for address & Control bus V DDSPD SPD Err_Out Parity error found in the Address and Control bus 7.0 Address Configuration Organization Row Address Column Address Bank Address Auto Precharge 128Mx8(1Gb) base A0-A13 A0-A9 BA0-BA2 A10 64Mx8(512Mb) base A0-A13 A0-A9 BA0-BA1 A10 32Mx8(256Mb) base A0-A12 A0-A9 BA0-BA1 A Super Talent Tech., Corporation.
6 8.1 Functional Block Diagram: 256MB, 512MB, 1GB Module (Populated as 1 rank of x8 SDRAM Module) Super Talent Tech., Corporation.
7 8.1 Functional Block Diagram: 1GB/2GB Module (Populated as 1 rank of x4 SDRAM Module) Super Talent Tech., Corporation.
8 8.3 Functional Block Diagram: 2GB/4GB Module (Populated as 2 rank of 256Mbx4 stack/512mbx4 stack SDRAM Module) Super Talent Tech., Corporation.
9 9.0 AC & DC Operating Conditions Recommended operating conditions (Voltage referenced to Vss=0V, TA=0 to 70 C) Symbol Parameter Min Typ Max Unit V DD Supply Voltage V V DDL Supply Voltage for DLL V V DDQ Supply Voltage for Output V V REF Input Reference Voltage 0.49*V DDQ 0.50*V DDQ 0.51*V DDQ mv V TT Termination Voltage V REF V REF V REF V 10.0 AC Timing Parameters & Specifications (AC operating conditions unless otherwise noted) DDR2-667 DDR2-533 DDR2-400 Parameter Symbol min max min max min max Units DQ output access time from CK/CK tac ps DQS output access time from CK/CK tdqsck ps CK high-level width tch tck CK low-level width tcl tck CK half period thp min(tcl, tch x min(tcl, tch x min(tcl, tch Clock cycle time, CL=x tck ps DQ and DM input hold time tdh(base) 175 x 225 x 275 x ps DQ and DM input setup time tds(base) 100 x 100 x 150 x ps Control & Address input pulse width for each input tipw 0.6 x 0.6 x 0.6 x tck DQ and DM input pulse width for each input tdipw 0.35 x 0.35 x 0.35 x tck Data-out high-impedance time from CK/CK thz x tac max x tac max x tac max ps DQS low-impedance time from CK/CK tlz(dqs) tac min tac max tac min tac max tac min tac max ps DQ low-impedance time from CK/CK DQS-DQ skew for DQS and associated DQ signals tlz(dq) 2*tAC min tac max 2*tAC min tac max 2*tAC min tac max ps tdqsq x 240 x 300 x 350 ps DQ hold skew factor tqhs x 340 x 400 x 450 ps DQ/DQS output hold time from DQS First DQS latching transition to associated clock edge tqh thp - tqhs x thp - tqhs x thp - tqhs x ps tdqss tck DQS input high pulse width tdqsh 0.35 x 0.35 x 0.35 x tck DQS input low pulse width tdqsl 0.35 x 0.35 x 0.35 x tck DQS falling edge to CK setup time tdss 0.2 x 0.2 x 0.2 x tck DQS falling edge hold time from CK tdsh 0.2 x 0.2 x 0.2 x tck Mode register set command cycle timet tmrd 2 x 2 x 2 x tck Write postamble twpst tck Write preamble twpre 0.35 x 0.35 x 0.35 x tck Address and control input hold time tih(base) 275 x 375 x 475 x ps Address and control input setup time tis(base) 200 x 250 x 350 x ps x ps Super Talent Tech., Corporation.
10 Parameter Symbol DDR2-667 DDR2-533 DDR2-400 min max min max min max Units Read preamble trpre tck Read postamble trpst tck Active to active command period for 1KB page size products trrd 7.5 x 7.5 x 7.5 x ns Active to active command period for 2KB page size products trrd 10 x 10 x 10 x ns Four Activate Window for 1KB page size productst tfaw ns Four Activate Window for 2KB page size products tfaw ns CAS to CAS command delay tccd tck Write recovery time twr 15 x 15 x 15 x ns Auto precharge write recovery + precharge time tdal WR+tRP x WR+tRP x WR+tRP x tck Internal write to read command delay twtr 7.5 x 7.5 x 10 x ns Internal read to precharge command delay trtp ns Exit self refresh to a non-read command txsnrt trfc + 10 trfc + 10 trfc + 10 ns Exit self refresh to a read command txsrd tck Exit precharge power down to any nonread command txp 2 x 2 x 2 x tck Exit active power down to read command txard 2 x 2 x 2 x tck Exit active power down to read command(slow exit, lower power) txards 7 - AL 6 - AL 6 - AL tck CKE minimum pulse width(high and low pulse width) tcke tck ODT turn-on delay taond tck ODT turn-on taon tac(min) tac(max)+0.7 tac(min) tac(max)+1t tac(min) tac(max)+1t ns ODT turn-on(power-down mode) taonpd tac(min)+2 2tCK+ tac(max)+1 tac(min)+2 2tCK+ tac(max)+1 tac(min)+2 2tCK+ tac(max)+1 ODT turn-off delay taofd tck ODT turn-off taof tac(min) tac(max)+ 0.6 tac(min) tac(max)+ 0.6 tac(min) tac(max)+ 0.6 ns ODT turn-off (Power-Down mode) taofpd 2.5tCK 2.5tCK 2.5tCK tac(min)+2 +tac(max)+1 tac(min)+2 +tac(max)+1 tac(min)+2 +tac(max)+1 ns ODT to power down entry latency tanpd tck ODT power down exit latency taxpd tck OCD drive mode output delay toit ns Minimum time clocks remains ON after CKE asynchronously drops LOW tdelay tis+tck +tih tis+tck +tih tis+tck +tih ns ns Super Talent Tech., Corporation.
11 11.1 Physical Dimensions: (32Mb/64Mb/128Mbx8 based) 256MB/512MB/1GB Module (1 Rank) Super Talent Tech., Corporation.
12 11.2 Physical Dimensions: (st.256mbx4/ st.512mbx4 based) 2GB/4GB Module (2 Rank) 6.96 (0.275 ) MAX Super Talent Tech., Corporation.
Standard: 64M x 8 (9 components)
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REV 1.2 1 03/2008 NANYA TECHNOLOGY CORPORATION NANYA reserves the right to change products and specifications without notice.
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