Computer Architecture

Size: px
Start display at page:

Download "Computer Architecture"

Transcription

1 Computer Architecture Random Access Memory Technologies április 2. Budapest Gábor Horváth associate professor BUTE Dept. Of Networked Systems and Services

2 2 Storing data Possible types of memories: ROM: read-only Classical ROM: the content is stored during the manufacturing process PROM: one-time programmable EPROM: can be erased using ultraviolet light Etc. SRAM: Static Random Access Memory Can be read and modified any time DRAM: Dynamic Random Access Memory Can be read and modified any time It forgets its content! Needs to be refreshed periodically.

3 Storing data in SRAM Computer Architecture Gábor Horváth, BME-HIT 3

4 4 Storing a single bit in SRAM An SRAM cell consists of a bi-stable flip-flop The bit and its inverse is also available WL = word line: selects the memory cell for operation BL = bit line: reflects the stored bit once the cell is selected BL = the inverse of the stored bit It does not forget the data till power supply is present

5 5 Storing a single bit in SRAM Reading the value of the bit: The BL and BL are precharged A logical high value is given to the WL The switches represented by the transistors get closed Selects the cell The BL will be equal to the bit stored The BL will be equal to the inverse of the bit stored The sense amplifiers detect the difference of BL and BL...providing the bit stored in the cell

6 6 Storing a single bit in SRAM Writing the value of the bit: The BL and BL lines are set according to the bit to store (BL=1, BL=0 if a bit 1 needs to be stored and vice versa) A logical high value is given to the WL The switches represented by the transistors get closed Selects the cell Since the driver transistors of the BL and BL are stronger than the transistors of the cell, the value if the bit is forced to the flip-flop

7 7 Internals of an SRAM cell Each inverter is implemented by two transistors 6 transistors are needed to store a single bit! This makes SRAM very expensive

8 8 Array of SRAM cells SRAM cells are organized to a 2 dimensional grid The address bits are decoded and the appropriate WL line is enabled The entire row gets selected The individual cells of the row represent the bits of the data unit Only data units (rows) can be read and written, individual bits can not Example: SRAM array with 16 bit data units:

9 Storing data in DRAM Computer Architecture Gábor Horváth, BME-HIT 9

10 Storing a single bit in DRAM A DRAM cell consists of a capacitor and a transistor The capacitor stores the data: There is charge: bit 1 No charge: bit 0 WL transistor capacitor BL WL = word line: selects the memory cell for operation BL = bit line: reflects the stored bit once the cell is selected It does forget the data with time! (The charge escapes) Periodical refresh is necessary Computer Architecture Gábor Horváth, BME-HIT 10

11 11 Storing a single bit in DRAM Reading the value of the bit: The BL is precharged exactly to the middle between logical high and low A logical high value is given to the WL The switch represented by the transistor get closed Selects the cell The charge of the capacitor (if any) leaves towards the BL The sense amplifiers detects the level of BL...providing the bit stored in the cell Reading the bit is destructive! The charge representing the bit leaves WL transistor capacitor BL

12 12 Storing a single bit in DRAM Writing the value of the bit: The BL is set according to the bit to store A logical high value is given to the WL The switch represented by the transistor gets closed Selects the cell The charge of BL charges the capacitor WL transistor capacitor BL

13 13 SRAM vs. DRAM Cost: SRAM: 6 transistors vs DRAM: 1 transistor + 1 capacitor The DRAM is much cheaper, and higher capacity can be achieved Speed: SRAM: Reading out the bit means detecting the state of a flip-flop (1-2 ns) DRAM: Reading out the bit means detecting the extremely small charge stored in the capacitor (10-20 ns) Reading out a bit from an SRAM is much faster Integration: SRAM can be integrated with the CPU as they share the same manufacturing process DRAM is produed by a different manufacturing process Applications: SRAM: cache memory DRAM: system memory

14 DRAM based memory systems Computer Architecture Gábor Horváth, BME-HIT 14

15 15 Memory arrays Goal: arrange memory cells on a 2 dimensional grid The position of one bit is given by the row and the column number The row address selects all memory cells belonging to that row, that is called a page The column address selects the proper data unit in a page

16 Basic operation Reading/Writing: The row address is given to the address bus The RAS (Row Address Strobe) line is activated The given row (page) is selected: the page is open The content of the entire page appears at the sense amplifiers The column address is given to the address bus The CAS (Column Address Strobe) line is activated Selects a data unit from the currently open page for reading or writing The WE (Write Enable) signal is active: The data bus is sampled and the selected data unit is modified The OE (Output Enable) signal is active: The selected data unit is put onto the data bus The content of the entire page is written back to the memory cells Even at read operations since the reading is destructive in DRAMs Computer Architecture Gábor Horváth, BME-HIT 16

17 17 Basic operation Refresh: The content needs to be refreshed regularly even if no read/write operations happen The refresh is done page-to-page periodically: from the first page to the last one-by-one, then from the first again Who has to do it? Early solutions: the CPU The CPU had a counter which page is to be refreshed next The CPU had a timer that sent the refresh command to the DRAM with the current page address Later: the memory controller did the same task Now: the DRAM chips have the counter They know which page to refresh next, they just need a signal to do the refresh

18 Evolution of the DRAM based memory systems Computer Architecture Gábor Horváth, BME-HIT 18

19 Asynchronous DRAM systems The classical asynchronous DRAM: Each operation looks like: Row address RAS column address CAS data on the data bus Time consuming! Computer Architecture Gábor Horváth, BME-HIT 19

20 20 Asynchronous DRAM systems FPM DRAM (Fast Page Mode DRAM) Allows to read/write several data units within the same page Without addressing the row and giving the RAS signal every time Looking at the DRAM memory array again: After opening a page the entire content is available at the sense amplifiers, so reading several data units from the same column has no additional cost!

21 21 Asynchronous DRAM systems FPM DRAM (Fast Page Mode DRAM) The row is selected (page is opened) only once Several data units are read/written inside the page The RAS signal indicates how long we are using the same row

22 Asynchronous DRAM systems EDO DRAM (Extended Data Out DRAM) While the data of the previous memory operation is read/written, the column address of the next operation is transmitted in parallel A signifficant overlap speedup Computer Architecture Gábor Horváth, BME-HIT 22

23 23 Asynchronous DRAM systems BEDO DRAM (Burst-Mode EDO DRAM) The column address of the next data is not needed Default: the next column address is incremented At each CAS strobe the next data unit is transmitted Works well is data needs to be transmitted in bursts

24 24 Synchronous DRAM systems SDR SDRAM (Synchronous DRAM) have clock signal Any event can occur at the clock signal only Similar to BEDO: An initial row and column address are provided A burst of data is read/written at consecutive clock signals

25 Synchronous DRAM systems Computer Architecture Gábor Horváth, BME-HIT 25

26 26 Synchronous DRAM systems DDR SDRAM (Double Data Rate SDRAM) Doubles the transfer speed of the burst It transmits data at both the rising and the falling edge of the clock DDR-200 memory operates at 100 MHz only! The 200 means that the burst is transmitted as fast as a 200 MHz single data rate SDRAM can transmit Notation of DDR SDRAMs: Let us have a DDR SDRAM operating at 200 MHz having 64 bit data units It is sold as: DDR-400 PC-3200» As this memory transmits bursts at 400 Mega-data units per second» Data units are 8 bytes speed is 3200 MB/s

27 27 Synchronous DRAM systems DDR2 SDRAM Classical DDR: 2 data units / clock (raising and falling edge) DDR2: 4 data units / clock DDR2-800 memory operates at 200 MHz only! The 800 means that the burst is transmitted as fast as a 800 MHz single data rate SDRAM can transmit Notation of DDR2 SDRAMs: Let us have a DDR2 SDRAM operating at 200 MHz having 64 bit data units It is sold as: DDR2-800 PC2-6400» As this memory transmits bursts at 800 Mega-data units per second» Data units are 8 bytes speed is 6400 MB/s

28 28 Synchronous DRAM systems DDR3 SDRAM Classical DDR: 2 data units / clock (raising and falling edge) DDR2: 4 data units / clock DDR3: 8 data units / clock DDR memory operates at 200 MHz only! The 1600 means that the burst is transmitted as fast as a 1600 MHz single data rate SDRAM can transmit Notation of DDR3 SDRAMs: Let us have a DDR3 SDRAM operating at 200 MHz having 64 bit data units It is sold as: DDR PC » As this memory transmits bursts at 1600 Mega-data units per second» Data units are 8 bytes speed is MB/s

29 Synchronous DRAM systems DDR4 SDRAM Still transfers 8 data units/clock (like DDR3) Internal clock rate is increased to improve throughput Computer Architecture Gábor Horváth, BME-HIT 29

30 30 Comparison SDR DDR DDR2 DDR3 DDR4 Internal clock MHz MHz MHz MHz MHz Data/int. clock Throu. MB/s Burst length Voltage 3.3V 2.5V 1.8V 1.5V V

31 31 Synchronous DRAM systems Conclusion Internal clock rate is almost the same in the last years latency is the same (latency: delay between the address and the corresponding data) Data units transfered / clock cycle increased significantly throughput is improving (Throughput: amount of data transmitted / second)

32 Memory modules Computer Architecture Gábor Horváth, BME-HIT 32

33 33 SIMM SIMM: Single In-line Memory Module Have ICs at one side only Used mainly by asynchronous DRAMs

34 34 DIMM DIMM: Dual In-line Memory Module Have ICs on both sides Used mainly by synchronous DRAMs

35 35 SO-DIMM SO-DIMM: (Small-Outline Dual In-line Memory Module) More compact than DIMM Used mainly by laptops

Memory unit. 2 k words. n bits per word

Memory unit. 2 k words. n bits per word 9- k address lines Read n data input lines Memory unit 2 k words n bits per word n data output lines 24 Pearson Education, Inc M Morris Mano & Charles R Kime 9-2 Memory address Binary Decimal Memory contents

More information

Computer Systems Structure Main Memory Organization

Computer Systems Structure Main Memory Organization Computer Systems Structure Main Memory Organization Peripherals Computer Central Processing Unit Main Memory Computer Systems Interconnection Communication lines Input Output Ward 1 Ward 2 Storage/Memory

More information

1. Memory technology & Hierarchy

1. Memory technology & Hierarchy 1. Memory technology & Hierarchy RAM types Advances in Computer Architecture Andy D. Pimentel Memory wall Memory wall = divergence between CPU and RAM speed We can increase bandwidth by introducing concurrency

More information

A N. O N Output/Input-output connection

A N. O N Output/Input-output connection Memory Types Two basic types: ROM: Read-only memory RAM: Read-Write memory Four commonly used memories: ROM Flash, EEPROM Static RAM (SRAM) Dynamic RAM (DRAM), SDRAM, RAMBUS, DDR RAM Generic pin configuration:

More information

User s Manual HOW TO USE DDR SDRAM

User s Manual HOW TO USE DDR SDRAM User s Manual HOW TO USE DDR SDRAM Document No. E0234E30 (Ver.3.0) Date Published April 2002 (K) Japan URL: http://www.elpida.com Elpida Memory, Inc. 2002 INTRODUCTION This manual is intended for users

More information

Memory Basics. SRAM/DRAM Basics

Memory Basics. SRAM/DRAM Basics Memory Basics RAM: Random Access Memory historically defined as memory array with individual bit access refers to memory with both Read and Write capabilities ROM: Read Only Memory no capabilities for

More information

Chapter 5 :: Memory and Logic Arrays

Chapter 5 :: Memory and Logic Arrays Chapter 5 :: Memory and Logic Arrays Digital Design and Computer Architecture David Money Harris and Sarah L. Harris Copyright 2007 Elsevier 5- ROM Storage Copyright 2007 Elsevier 5- ROM Logic Data

More information

Chapter 7 Memory and Programmable Logic

Chapter 7 Memory and Programmable Logic NCNU_2013_DD_7_1 Chapter 7 Memory and Programmable Logic 71I 7.1 Introduction ti 7.2 Random Access Memory 7.3 Memory Decoding 7.5 Read Only Memory 7.6 Programmable Logic Array 77P 7.7 Programmable Array

More information

Memory ICS 233. Computer Architecture and Assembly Language Prof. Muhamed Mudawar

Memory ICS 233. Computer Architecture and Assembly Language Prof. Muhamed Mudawar Memory ICS 233 Computer Architecture and Assembly Language Prof. Muhamed Mudawar College of Computer Sciences and Engineering King Fahd University of Petroleum and Minerals Presentation Outline Random

More information

Module 2. Embedded Processors and Memory. Version 2 EE IIT, Kharagpur 1

Module 2. Embedded Processors and Memory. Version 2 EE IIT, Kharagpur 1 Module 2 Embedded Processors and Memory Version 2 EE IIT, Kharagpur 1 Lesson 5 Memory-I Version 2 EE IIT, Kharagpur 2 Instructional Objectives After going through this lesson the student would Pre-Requisite

More information

Semiconductor Device Technology for Implementing System Solutions: Memory Modules

Semiconductor Device Technology for Implementing System Solutions: Memory Modules Hitachi Review Vol. 47 (1998), No. 4 141 Semiconductor Device Technology for Implementing System Solutions: Memory Modules Toshio Sugano Atsushi Hiraishi Shin ichi Ikenaga ABSTRACT: New technology is producing

More information

Lecture 9: Memory and Storage Technologies

Lecture 9: Memory and Storage Technologies CS61: Systems Programming and Machine Organization Harvard University, Fall 2009 Lecture 9: Memory and Storage Technologies October 1, 2009 Announcements Lab 3 has been released! You are welcome to switch

More information

With respect to the way of data access we can classify memories as:

With respect to the way of data access we can classify memories as: Memory Classification With respect to the way of data access we can classify memories as: - random access memories (RAM), - sequentially accessible memory (SAM), - direct access memory (DAM), - contents

More information

Computer Architecture

Computer Architecture Computer Architecture Slide Sets WS 2013/2014 Prof. Dr. Uwe Brinkschulte M.Sc. Benjamin Betting Part 11 Memory Management Computer Architecture Part 11 page 1 of 44 Prof. Dr. Uwe Brinkschulte, M.Sc. Benjamin

More information

Understanding Memory TYPES OF MEMORY

Understanding Memory TYPES OF MEMORY Understanding Memory TYPES OF MEMORY In this study unit, you ll learn about physical and logical memory. Physical memory comes in two types, random access memory (RAM) and read-only memory (ROM). Typically,

More information

RAM & ROM Based Digital Design. ECE 152A Winter 2012

RAM & ROM Based Digital Design. ECE 152A Winter 2012 RAM & ROM Based Digital Design ECE 152A Winter 212 Reading Assignment Brown and Vranesic 1 Digital System Design 1.1 Building Block Circuits 1.1.3 Static Random Access Memory (SRAM) 1.1.4 SRAM Blocks in

More information

Features. DDR SODIMM Product Datasheet. Rev. 1.0 Oct. 2011

Features. DDR SODIMM Product Datasheet. Rev. 1.0 Oct. 2011 Features 200pin, unbuffered small outline dual in-line memory module (SODIMM) Fast data transfer rates: PC-2100, PC-2700, PC3-3200 Single or Dual rank 256MB(32Megx64), 512MB (64Meg x 64), 1GB(128 Meg x

More information

SDRAM and DRAM Memory Systems Overview

SDRAM and DRAM Memory Systems Overview CHAPTER SDRAM and DRAM Memory Systems Overview Product Numbers: MEM-NPE-32MB=, MEM-NPE-64MB=, MEM-NPE-128MB=, MEM-SD-NPE-32MB=, MEM-SD-NPE-64MB=, MEM-SD-NPE-128MB=, MEM-SD-NSE-256MB=, MEM-NPE-400-128MB=,

More information

Table 1: Address Table

Table 1: Address Table DDR SDRAM DIMM D32PB12C 512MB D32PB1GJ 1GB For the latest data sheet, please visit the Super Talent Electronics web site: www.supertalentmemory.com Features 184-pin, dual in-line memory module (DIMM) Fast

More information

Table 1 SDR to DDR Quick Reference

Table 1 SDR to DDR Quick Reference TECHNICAL NOTE TN-6-05 GENERAL DDR SDRAM FUNCTIONALITY INTRODUCTION The migration from single rate synchronous DRAM (SDR) to double rate synchronous DRAM (DDR) memory is upon us. Although there are many

More information

Memory. The memory types currently in common usage are:

Memory. The memory types currently in common usage are: ory ory is the third key component of a microprocessor-based system (besides the CPU and I/O devices). More specifically, the primary storage directly addressed by the CPU is referred to as main memory

More information

Homework # 2. Solutions. 4.1 What are the differences among sequential access, direct access, and random access?

Homework # 2. Solutions. 4.1 What are the differences among sequential access, direct access, and random access? ECE337 / CS341, Fall 2005 Introduction to Computer Architecture and Organization Instructor: Victor Manuel Murray Herrera Date assigned: 09/19/05, 05:00 PM Due back: 09/30/05, 8:00 AM Homework # 2 Solutions

More information

Features. DDR3 Unbuffered DIMM Spec Sheet

Features. DDR3 Unbuffered DIMM Spec Sheet Features DDR3 functionality and operations supported as defined in the component data sheet 240-pin, unbuffered dual in-line memory module (UDIMM) Fast data transfer rates: PC3-8500, PC3-10600, PC3-12800

More information

Logical Operations. Control Unit. Contents. Arithmetic Operations. Objectives. The Central Processing Unit: Arithmetic / Logic Unit.

Logical Operations. Control Unit. Contents. Arithmetic Operations. Objectives. The Central Processing Unit: Arithmetic / Logic Unit. Objectives The Central Processing Unit: What Goes on Inside the Computer Chapter 4 Identify the components of the central processing unit and how they work together and interact with memory Describe how

More information

Slide Set 8. for ENCM 369 Winter 2015 Lecture Section 01. Steve Norman, PhD, PEng

Slide Set 8. for ENCM 369 Winter 2015 Lecture Section 01. Steve Norman, PhD, PEng Slide Set 8 for ENCM 369 Winter 2015 Lecture Section 01 Steve Norman, PhD, PEng Electrical & Computer Engineering Schulich School of Engineering University of Calgary Winter Term, 2015 ENCM 369 W15 Section

More information

Random-Access Memory (RAM) The Memory Hierarchy. SRAM vs DRAM Summary. Conventional DRAM Organization. Page 1

Random-Access Memory (RAM) The Memory Hierarchy. SRAM vs DRAM Summary. Conventional DRAM Organization. Page 1 Random-ccess Memor (RM) The Memor Hierarch Topics Storage technologies and trends Localit of reference Caching in the hierarch Ke features RM is packaged as a chip. Basic storage unit is a cell (one bit

More information

Memory Systems. Static Random Access Memory (SRAM) Cell

Memory Systems. Static Random Access Memory (SRAM) Cell Memory Systems This chapter begins the discussion of memory systems from the implementation of a single bit. The architecture of memory chips is then constructed using arrays of bit implementations coupled

More information

1 / 25. CS 137: File Systems. Persistent Solid-State Storage

1 / 25. CS 137: File Systems. Persistent Solid-State Storage 1 / 25 CS 137: File Systems Persistent Solid-State Storage Technology Change is Coming Introduction Disks are cheaper than any solid-state memory Likely to be true for many years But SSDs are now cheap

More information

Read-only memory Implementing logic with ROM Programmable logic devices Implementing logic with PLDs Static hazards

Read-only memory Implementing logic with ROM Programmable logic devices Implementing logic with PLDs Static hazards Points ddressed in this Lecture Lecture 8: ROM Programmable Logic Devices Professor Peter Cheung Department of EEE, Imperial College London Read-only memory Implementing logic with ROM Programmable logic

More information

OpenSPARC T1 Processor

OpenSPARC T1 Processor OpenSPARC T1 Processor The OpenSPARC T1 processor is the first chip multiprocessor that fully implements the Sun Throughput Computing Initiative. Each of the eight SPARC processor cores has full hardware

More information

RAM. Overview DRAM. What RAM means? DRAM

RAM. Overview DRAM. What RAM means? DRAM Overview RAM In this chapter, you will learn how to Identify the different types of RAM packaging Explain the varieties of DRAM Install RAM properly Perform basic RAM troubleshooting Program Execution

More information

Memory Hierarchy. Arquitectura de Computadoras. Centro de Investigación n y de Estudios Avanzados del IPN. adiaz@cinvestav.mx. MemoryHierarchy- 1

Memory Hierarchy. Arquitectura de Computadoras. Centro de Investigación n y de Estudios Avanzados del IPN. adiaz@cinvestav.mx. MemoryHierarchy- 1 Hierarchy Arturo Díaz D PérezP Centro de Investigación n y de Estudios Avanzados del IPN adiaz@cinvestav.mx Hierarchy- 1 The Big Picture: Where are We Now? The Five Classic Components of a Computer Processor

More information

What Every Programmer Should Know About Memory

What Every Programmer Should Know About Memory What Every Programmer Should Know About Memory Ulrich Drepper Red Hat, Inc. drepper@redhat.com November 21, 2007 1 Introduction Abstract As CPU cores become both faster and more numerous, the limiting

More information

Technical Note. Micron NAND Flash Controller via Xilinx Spartan -3 FPGA. Overview. TN-29-06: NAND Flash Controller on Spartan-3 Overview

Technical Note. Micron NAND Flash Controller via Xilinx Spartan -3 FPGA. Overview. TN-29-06: NAND Flash Controller on Spartan-3 Overview Technical Note TN-29-06: NAND Flash Controller on Spartan-3 Overview Micron NAND Flash Controller via Xilinx Spartan -3 FPGA Overview As mobile product capabilities continue to expand, so does the demand

More information

DDR subsystem: Enhancing System Reliability and Yield

DDR subsystem: Enhancing System Reliability and Yield DDR subsystem: Enhancing System Reliability and Yield Agenda Evolution of DDR SDRAM standards What is the variation problem? How DRAM standards tackle system variability What problems have been adequately

More information

Features. DDR3 SODIMM Product Specification. Rev. 1.7 Feb. 2016

Features. DDR3 SODIMM Product Specification. Rev. 1.7 Feb. 2016 Features DDR3 functionality and operations supported as defined in the component data sheet 204pin, small-outline dual in-line memory module (SODIMM) Fast data transfer rates: DDR3-1066(PC3-8500) DDR3-1333(PC3-10600)

More information

Random Access Memory (RAM) Types of RAM. RAM Random Access Memory Jamie Tees SDRAM. Micro-DIMM SO-DIMM

Random Access Memory (RAM) Types of RAM. RAM Random Access Memory Jamie Tees SDRAM. Micro-DIMM SO-DIMM Random Access Memory (RAM) Sends/Receives data quickly between CPU This is way quicker than using just the HDD RAM holds temporary data used by any open application or active / running process Multiple

More information

Highlights of the High- Bandwidth Memory (HBM) Standard

Highlights of the High- Bandwidth Memory (HBM) Standard Highlights of the High- Bandwidth Memory (HBM) Standard Mike O Connor Sr. Research Scientist What is High-Bandwidth Memory (HBM)? Memory standard designed for needs of future GPU and HPC systems: Exploit

More information

3.11.5.5 DDR2 Specific SDRAM Functions

3.11.5.5 DDR2 Specific SDRAM Functions JEDEC Standard No. 2-C Page..5.5..5.5 DDR2 Specific SDRAM Functions DDR2 SDRAM EMRS2 and EMRS For DDR2 SDRAMs, both bits BA and BA must be decoded for Mode/Extended Mode Register Set commands. Users must

More information

DDR3 SDRAM UDIMM MT8JTF12864A 1GB MT8JTF25664A 2GB

DDR3 SDRAM UDIMM MT8JTF12864A 1GB MT8JTF25664A 2GB DDR3 SDRAM UDIMM MT8JTF12864A 1GB MT8JTF25664A 2GB 1GB, 2GB (x64, SR) 240-Pin DDR3 SDRAM UDIMM Features For component data sheets, refer to Micron s Web site: www.micron.com Features DDR3 functionality

More information

MICROPROCESSOR. Exclusive for IACE Students www.iace.co.in iacehyd.blogspot.in Ph: 9700077455/422 Page 1

MICROPROCESSOR. Exclusive for IACE Students www.iace.co.in iacehyd.blogspot.in Ph: 9700077455/422 Page 1 MICROPROCESSOR A microprocessor incorporates the functions of a computer s central processing unit (CPU) on a single Integrated (IC), or at most a few integrated circuit. It is a multipurpose, programmable

More information

Semiconductor Memories

Semiconductor Memories Semiconductor Memories Semiconductor memories array capable of storing large quantities of digital information are essential to all digital systems Maximum realizable data storage capacity of a single

More information

SOLVING HIGH-SPEED MEMORY INTERFACE CHALLENGES WITH LOW-COST FPGAS

SOLVING HIGH-SPEED MEMORY INTERFACE CHALLENGES WITH LOW-COST FPGAS SOLVING HIGH-SPEED MEMORY INTERFACE CHALLENGES WITH LOW-COST FPGAS A Lattice Semiconductor White Paper May 2005 Lattice Semiconductor 5555 Northeast Moore Ct. Hillsboro, Oregon 97124 USA Telephone: (503)

More information

Byte Ordering of Multibyte Data Items

Byte Ordering of Multibyte Data Items Byte Ordering of Multibyte Data Items Most Significant Byte (MSB) Least Significant Byte (LSB) Big Endian Byte Addresses +0 +1 +2 +3 +4 +5 +6 +7 VALUE (8-byte) Least Significant Byte (LSB) Most Significant

More information

DDR SDRAM SODIMM. MT9VDDT1672H 128MB 1 MT9VDDT3272H 256MB MT9VDDT6472H 512MB For component data sheets, refer to Micron s Web site: www.micron.

DDR SDRAM SODIMM. MT9VDDT1672H 128MB 1 MT9VDDT3272H 256MB MT9VDDT6472H 512MB For component data sheets, refer to Micron s Web site: www.micron. Features DDR SDRAM SODIMM MT9VDDT1672H 128MB 1 MT9VDDT3272H 256MB MT9VDDT6472H 512MB For component data sheets, refer to Micron s Web site: www.micron.com Features 200-pin, small-outline dual in-line memory

More information

Memory Testing. Memory testing.1

Memory Testing. Memory testing.1 Memory Testing Introduction Memory Architecture & Fault Models Test Algorithms DC / AC / Dynamic Tests Built-in Self Testing Schemes Built-in Self Repair Schemes Memory testing.1 Memory Market Share in

More information

Static-Noise-Margin Analysis of Conventional 6T SRAM Cell at 45nm Technology

Static-Noise-Margin Analysis of Conventional 6T SRAM Cell at 45nm Technology Static-Noise-Margin Analysis of Conventional 6T SRAM Cell at 45nm Technology Nahid Rahman Department of electronics and communication FET-MITS (Deemed university), Lakshmangarh, India B. P. Singh Department

More information

Algorithms and Methods for Distributed Storage Networks 3. Solid State Disks Christian Schindelhauer

Algorithms and Methods for Distributed Storage Networks 3. Solid State Disks Christian Schindelhauer Algorithms and Methods for Distributed Storage Networks 3. Solid State Disks Institut für Informatik Wintersemester 2007/08 Solid State Disks Motivation 2 10 5 1980 1985 1990 1995 2000 2005 2010 PRODUCTION

More information

Chapter 9 Semiconductor Memories. Jin-Fu Li Department of Electrical Engineering National Central University Jungli, Taiwan

Chapter 9 Semiconductor Memories. Jin-Fu Li Department of Electrical Engineering National Central University Jungli, Taiwan Chapter 9 Semiconductor Memories Jin-Fu Li Department of Electrical Engineering National Central University Jungli, Taiwan Advanced Reliable Systems (ARES) Lab. Jin-Fu Li, EE, NCU 2 Outline Introduction

More information

Memory technology evolution: an overview of system memory technologies

Memory technology evolution: an overview of system memory technologies Memory technology evolution: an overview of system memory technologies Technology brief, 9 th edition Introduction... 2 Basic DRAM operation... 2 DRAM storage density and power consumption... 4 Memory

More information

ADVANCED PROCESSOR ARCHITECTURES AND MEMORY ORGANISATION Lesson-17: Memory organisation, and types of memory

ADVANCED PROCESSOR ARCHITECTURES AND MEMORY ORGANISATION Lesson-17: Memory organisation, and types of memory ADVANCED PROCESSOR ARCHITECTURES AND MEMORY ORGANISATION Lesson-17: Memory organisation, and types of memory 1 1. Memory Organisation 2 Random access model A memory-, a data byte, or a word, or a double

More information

DDR4 Memory Technology on HP Z Workstations

DDR4 Memory Technology on HP Z Workstations Technical white paper DDR4 Memory Technology on HP Z Workstations DDR4 is the latest memory technology available for main memory on mobile, desktops, workstations, and server computers. DDR stands for

More information

Technical Note DDR2 Offers New Features and Functionality

Technical Note DDR2 Offers New Features and Functionality Technical Note DDR2 Offers New Features and Functionality TN-47-2 DDR2 Offers New Features/Functionality Introduction Introduction DDR2 SDRAM introduces features and functions that go beyond the DDR SDRAM

More information

The Central Processing Unit:

The Central Processing Unit: The Central Processing Unit: What Goes on Inside the Computer Chapter 4 Objectives Identify the components of the central processing unit and how they work together and interact with memory Describe how

More information

DDR SDRAM SODIMM. MT8VDDT3264H 256MB 1 MT8VDDT6464H 512MB For component data sheets, refer to Micron s Web site: www.micron.com

DDR SDRAM SODIMM. MT8VDDT3264H 256MB 1 MT8VDDT6464H 512MB For component data sheets, refer to Micron s Web site: www.micron.com SODIMM MT8VDDT3264H 256MB 1 MT8VDDT6464H 512MB For component data sheets, refer to Micron s Web site: www.micron.com 256MB, 512MB (x64, SR) 200-Pin SODIMM Features Features 200-pin, small-outline dual

More information

are un-buffered 200-Pin Double Data Rate (DDR) Synchronous DRAM Small Outline Dual In-Line Memory Module (SO-DIMM). All devices

are un-buffered 200-Pin Double Data Rate (DDR) Synchronous DRAM Small Outline Dual In-Line Memory Module (SO-DIMM). All devices PC2700 200 pin Unbuffered DDR SO-DIMM Based on DDR333 512Mb bit B Die device Features 200-Pin Small Outline Dual In-Line Memory Module (SO-DIMM) Unbuffered DDR SO-DIMM based on 110nm 512M bit die B device,

More information

Mobile SDRAM. MT48H16M16LF 4 Meg x 16 x 4 banks MT48H8M32LF 2 Meg x 32 x 4 banks

Mobile SDRAM. MT48H16M16LF 4 Meg x 16 x 4 banks MT48H8M32LF 2 Meg x 32 x 4 banks Features Mobile SDRAM MT48H6M6LF 4 Meg x 6 x 4 banks MT48H8M32LF 2 Meg x 32 x 4 banks Features Fully synchronous; all signals registered on positive edge of system clock V DD /V D =.7.95V Internal, pipelined

More information

Open Flow Controller and Switch Datasheet

Open Flow Controller and Switch Datasheet Open Flow Controller and Switch Datasheet California State University Chico Alan Braithwaite Spring 2013 Block Diagram Figure 1. High Level Block Diagram The project will consist of a network development

More information

FS1140 & FS1141 DDR Protocol Checking & Performance Tool. FuturePlus Systems. Power Tools For Bus Analysis

FS1140 & FS1141 DDR Protocol Checking & Performance Tool. FuturePlus Systems. Power Tools For Bus Analysis FS1140 & FS1141 DDR Protocol Checking & Performance Tool FuturePlus Systems Power Tools For Bus Analysis Overview The FS1140 & FS1141 are new DDR Protocol Checking and Performance Tools that work in conjunction

More information

ADQYF1A08. DDR2-1066G(CL6) 240-Pin O.C. U-DIMM 1GB (128M x 64-bits)

ADQYF1A08. DDR2-1066G(CL6) 240-Pin O.C. U-DIMM 1GB (128M x 64-bits) General Description ADQYF1A08 DDR2-1066G(CL6) 240-Pin O.C. U-DIMM 1GB (128M x 64-bits) The ADATA s ADQYF1A08 is a 128Mx64 bits 1GB DDR2-1066(CL6) SDRAM over clocking memory module, The SPD is programmed

More information

Class 18: Memories-DRAMs

Class 18: Memories-DRAMs Topics: 1. Introduction 2. Advantages and Disadvantages of DRAMs 3. Evolution of DRAMs 4. Evolution of DRAMs 5. Basics of DRAMs 6. Basics of DRAMs 7. Write Operation 8. SA-Normal Operation 9. SA-Read Operation

More information

Dell Reliable Memory Technology

Dell Reliable Memory Technology Dell Reliable Memory Technology Detecting and isolating memory errors THIS WHITE PAPER IS FOR INFORMATIONAL PURPOSES ONLY, AND MAY CONTAIN TYPOGRAPHICAL ERRORS AND TECHNICAL INACCURACIES. THE CONTENT IS

More information

Basic Computer Organization

Basic Computer Organization Chapter 2 Basic Computer Organization Objectives To provide a high-level view of computer organization To describe processor organization details To discuss memory organization and structure To introduce

More information

DDR SDRAM UDIMM MT16VDDT6464A 512MB MT16VDDT12864A 1GB MT16VDDT25664A 2GB

DDR SDRAM UDIMM MT16VDDT6464A 512MB MT16VDDT12864A 1GB MT16VDDT25664A 2GB DDR SDRAM UDIMM MT16VDDT6464A 512MB MT16VDDT12864A 1GB MT16VDDT25664A 2GB For component data sheets, refer to Micron s Web site: www.micron.com 512MB, 1GB, 2GB (x64, DR) 184-Pin DDR SDRAM UDIMM Features

More information

NAND Flash FAQ. Eureka Technology. apn5_87. NAND Flash FAQ

NAND Flash FAQ. Eureka Technology. apn5_87. NAND Flash FAQ What is NAND Flash? What is the major difference between NAND Flash and other Memory? Structural differences between NAND Flash and NOR Flash What does NAND Flash controller do? How to send command to

More information

Chapter 6. Inside the System Unit. What You Will Learn... Computers Are Your Future. What You Will Learn... Describing Hardware Performance

Chapter 6. Inside the System Unit. What You Will Learn... Computers Are Your Future. What You Will Learn... Describing Hardware Performance What You Will Learn... Computers Are Your Future Chapter 6 Understand how computers represent data Understand the measurements used to describe data transfer rates and data storage capacity List the components

More information

DDR2 SDRAM SODIMM MT16HTF12864H 1GB MT16HTF25664H 2GB

DDR2 SDRAM SODIMM MT16HTF12864H 1GB MT16HTF25664H 2GB Features DDR2 SDRAM SODIMM MT16HTF12864H 1GB MT16HTF25664H 2GB For component data sheets, refer to Micron s Web site: www.micron.com Features 200-pin, small outline dual in-line memory module (SODIMM)

More information

DDR2 SDRAM SODIMM MT8HTF3264HD 256MB MT8HTF6464HD 512MB MT8HTF12864HD 1GB For component data sheets, refer to Micron s Web site: www.micron.

DDR2 SDRAM SODIMM MT8HTF3264HD 256MB MT8HTF6464HD 512MB MT8HTF12864HD 1GB For component data sheets, refer to Micron s Web site: www.micron. DDR2 SDRAM SODIMM MT8HTF3264HD 256MB MT8HTF6464HD 512MB MT8HTF12864HD 1GB For component data sheets, refer to Micron s Web site: www.micron.com 256MB, 512MB, 1GB (x64, DR): 200-Pin DDR2 SODIMM Features

More information

Communicating with devices

Communicating with devices Introduction to I/O Where does the data for our CPU and memory come from or go to? Computers communicate with the outside world via I/O devices. Input devices supply computers with data to operate on.

More information

路 論 Chapter 15 System-Level Physical Design

路 論 Chapter 15 System-Level Physical Design Introduction to VLSI Circuits and Systems 路 論 Chapter 15 System-Level Physical Design Dept. of Electronic Engineering National Chin-Yi University of Technology Fall 2007 Outline Clocked Flip-flops CMOS

More information

The Leader in Memory Technology

The Leader in Memory Technology DDR SDRAM s 2 ; Basic DDR SDRAM operations 1. DDR SDRAM application notes available from Samsung - App. note 1 : Key features and points for memory controller designers ; Explains key features of DDR SDRAM

More information

Switch Fabric Implementation Using Shared Memory

Switch Fabric Implementation Using Shared Memory Order this document by /D Switch Fabric Implementation Using Shared Memory Prepared by: Lakshmi Mandyam and B. Kinney INTRODUCTION Whether it be for the World Wide Web or for an intra office network, today

More information

GR2DR4B-EXXX/YYY/LP 1GB & 2GB DDR2 REGISTERED DIMMs (LOW PROFILE)

GR2DR4B-EXXX/YYY/LP 1GB & 2GB DDR2 REGISTERED DIMMs (LOW PROFILE) GENERAL DESCRIPTION The Gigaram is a 128M/256M bit x 72 DDDR2 SDRAM high density JEDEC standard ECC Registered memory module. The Gigaram consists of eighteen CMOS 128MX4 DDR2 for 1GB and thirty-six CMOS

More information

DDR2 SDRAM SODIMM MT4HTF6464HZ 512MB. Features. 512MB (x64, SR) 200-Pin DDR2 SODIMM. Features. Figure 1: 200-Pin SODIMM (MO-224 R/C C)

DDR2 SDRAM SODIMM MT4HTF6464HZ 512MB. Features. 512MB (x64, SR) 200-Pin DDR2 SODIMM. Features. Figure 1: 200-Pin SODIMM (MO-224 R/C C) DDR2 SDRAM SODIMM MT4HTF6464HZ 512MB 512MB (x64, SR) 200-Pin DDR2 SODIMM Features Features 200-pin, small-outline dual in-line memory module (SODIMM) Fast data transfer rates: PC2-3200, PC2-4200, PC2-5300,

More information

CHAPTER 16 MEMORY CIRCUITS

CHAPTER 16 MEMORY CIRCUITS CHPTER 6 MEMORY CIRCUITS Chapter Outline 6. atches and Flip-Flops 6. Semiconductor Memories: Types and rchitectures 6.3 Random-ccess Memory RM Cells 6.4 Sense-mplifier and ddress Decoders 6.5 Read-Only

More information

Atmel Norway 2005. XMEGA Introduction

Atmel Norway 2005. XMEGA Introduction Atmel Norway 005 XMEGA Introduction XMEGA XMEGA targets Leadership on Peripheral Performance Leadership in Low Power Consumption Extending AVR market reach XMEGA AVR family 44-100 pin packages 16K 51K

More information

Modeling Sequential Elements with Verilog. Prof. Chien-Nan Liu TEL: 03-4227151 ext:34534 Email: jimmy@ee.ncu.edu.tw. Sequential Circuit

Modeling Sequential Elements with Verilog. Prof. Chien-Nan Liu TEL: 03-4227151 ext:34534 Email: jimmy@ee.ncu.edu.tw. Sequential Circuit Modeling Sequential Elements with Verilog Prof. Chien-Nan Liu TEL: 03-4227151 ext:34534 Email: jimmy@ee.ncu.edu.tw 4-1 Sequential Circuit Outputs are functions of inputs and present states of storage elements

More information

V58C2512(804/404/164)SB HIGH PERFORMANCE 512 Mbit DDR SDRAM 4 BANKS X 16Mbit X 8 (804) 4 BANKS X 32Mbit X 4 (404) 4 BANKS X 8Mbit X 16 (164)

V58C2512(804/404/164)SB HIGH PERFORMANCE 512 Mbit DDR SDRAM 4 BANKS X 16Mbit X 8 (804) 4 BANKS X 32Mbit X 4 (404) 4 BANKS X 8Mbit X 16 (164) V58C2512804/404/164SB HIGH PERFORMAE 512 Mbit DDR SDRAM 4 BANKS X 16Mbit X 8 804 4 BANKS X 32Mbit X 4 404 4 BANKS X 8Mbit X 16 164 5 6 75 DDR400 DDR333 DDR266 Clock Cycle Time t CK2.5 6ns 6ns 7.5ns Clock

More information

Handout 17. by Dr Sheikh Sharif Iqbal. Memory Unit and Read Only Memories

Handout 17. by Dr Sheikh Sharif Iqbal. Memory Unit and Read Only Memories Handout 17 by Dr Sheikh Sharif Iqbal Memory Unit and Read Only Memories Objective: - To discuss different types of memories used in 80x86 systems for storing digital information. - To learn the electronic

More information

DDR3 DIMM Slot Interposer

DDR3 DIMM Slot Interposer DDR3 DIMM Slot Interposer DDR3-1867 Digital Validation High Speed DDR3 Digital Validation Passive 240-pin DIMM Slot Interposer Custom Designed for Agilent Logic Analyzers Compatible with Agilent Software

More information

DDR SDRAM SODIMM MT16VDDF6464H 512MB MT16VDDF12864H 1GB

DDR SDRAM SODIMM MT16VDDF6464H 512MB MT16VDDF12864H 1GB SODIMM MT16VDDF6464H 512MB MT16VDDF12864H 1GB 512MB, 1GB (x64, DR) 200-Pin DDR SODIMM Features For component data sheets, refer to Micron s Web site: www.micron.com Features 200-pin, small-outline dual

More information

Configuring Memory on the HP Business Desktop dx5150

Configuring Memory on the HP Business Desktop dx5150 Configuring Memory on the HP Business Desktop dx5150 Abstract... 2 Glossary of Terms... 2 Introduction... 2 Main Memory Configuration... 3 Single-channel vs. Dual-channel... 3 Memory Type and Speed...

More information

Intel 965 Express Chipset Family Memory Technology and Configuration Guide

Intel 965 Express Chipset Family Memory Technology and Configuration Guide Intel 965 Express Chipset Family Memory Technology and Configuration Guide White Paper - For the Intel 82Q965, 82Q963, 82G965 Graphics and Memory Controller Hub (GMCH) and Intel 82P965 Memory Controller

More information

The Bus (PCI and PCI-Express)

The Bus (PCI and PCI-Express) 4 Jan, 2008 The Bus (PCI and PCI-Express) The CPU, memory, disks, and all the other devices in a computer have to be able to communicate and exchange data. The technology that connects them is called the

More information

Building Blocks for PRU Development

Building Blocks for PRU Development Building Blocks for PRU Development Module 1 PRU Hardware Overview This session covers a hardware overview of the PRU-ICSS Subsystem. Author: Texas Instruments, Sitara ARM Processors Oct 2014 2 ARM SoC

More information

DDR2 SDRAM SODIMM MT8HTF6464HDZ 512MB MT8HTF12864HDZ 1GB. Features. 512MB, 1GB (x64, DR) 200-Pin DDR2 SODIMM. Features

DDR2 SDRAM SODIMM MT8HTF6464HDZ 512MB MT8HTF12864HDZ 1GB. Features. 512MB, 1GB (x64, DR) 200-Pin DDR2 SODIMM. Features DDR SDRAM SODIMM MT8HTF6464HDZ 5MB MT8HTF864HDZ GB 5MB, GB (x64, DR) 00-Pin DDR SODIMM Features Features 00-pin, small-outline dual in-line memory module (SODIMM) Fast data transfer rates: PC-300, PC-400,

More information

Computers. Hardware. The Central Processing Unit (CPU) CMPT 125: Lecture 1: Understanding the Computer

Computers. Hardware. The Central Processing Unit (CPU) CMPT 125: Lecture 1: Understanding the Computer Computers CMPT 125: Lecture 1: Understanding the Computer Tamara Smyth, tamaras@cs.sfu.ca School of Computing Science, Simon Fraser University January 3, 2009 A computer performs 2 basic functions: 1.

More information

Chapter 13. PIC Family Microcontroller

Chapter 13. PIC Family Microcontroller Chapter 13 PIC Family Microcontroller Lesson 01 PIC Characteristics and Examples PIC microcontroller characteristics Power-on reset Brown out reset Simplified instruction set High speed execution Up to

More information

Objectives. Units of Memory Capacity. CMPE328 Microprocessors (Spring 2007-08) Memory and I/O address Decoders. By Dr.

Objectives. Units of Memory Capacity. CMPE328 Microprocessors (Spring 2007-08) Memory and I/O address Decoders. By Dr. CMPE328 Microprocessors (Spring 27-8) Memory and I/O address ecoders By r. Mehmet Bodur You will be able to: Objectives efine the capacity, organization and types of the semiconductor memory devices Calculate

More information

Price/performance Modern Memory Hierarchy

Price/performance Modern Memory Hierarchy Lecture 21: Storage Administration Take QUIZ 15 over P&H 6.1-4, 6.8-9 before 11:59pm today Project: Cache Simulator, Due April 29, 2010 NEW OFFICE HOUR TIME: Tuesday 1-2, McKinley Last Time Exam discussion

More information

Management Challenge. Managing Hardware Assets. Central Processing Unit. What is a Computer System?

Management Challenge. Managing Hardware Assets. Central Processing Unit. What is a Computer System? Management Challenge Managing Hardware Assets What computer processing and storage capability does our organization need to handle its information and business transactions? What arrangement of computers

More information

Tuning DDR4 for Power and Performance. Mike Micheletti Product Manager Teledyne LeCroy

Tuning DDR4 for Power and Performance. Mike Micheletti Product Manager Teledyne LeCroy Tuning DDR4 for Power and Performance Mike Micheletti Product Manager Teledyne LeCroy Agenda Introduction DDR4 Technology Expanded role of MRS Power Features Examined Reliability Features Examined Performance

More information

CHAPTER 7: The CPU and Memory

CHAPTER 7: The CPU and Memory CHAPTER 7: The CPU and Memory The Architecture of Computer Hardware, Systems Software & Networking: An Information Technology Approach 4th Edition, Irv Englander John Wiley and Sons 2010 PowerPoint slides

More information

Technical Note. Initialization Sequence for DDR SDRAM. Introduction. Initializing DDR SDRAM

Technical Note. Initialization Sequence for DDR SDRAM. Introduction. Initializing DDR SDRAM TN-46-8: Initialization Sequence for DDR SDRAM Introduction Technical Note Initialization Sequence for DDR SDRAM Introduction The double data rate DDR synchronous dynamic random access memory SDRAM device

More information

A Mixed Time-Criticality SDRAM Controller

A Mixed Time-Criticality SDRAM Controller NEST COBRA CA4 A Mixed Time-Criticality SDRAM Controller MeAOW 3-9-23 Sven Goossens, Benny Akesson, Kees Goossens Mixed Time-Criticality 2/5 Embedded multi-core systems are getting more complex: Integrating

More information

COMBINATIONAL and SEQUENTIAL LOGIC CIRCUITS Hardware implementation and software design

COMBINATIONAL and SEQUENTIAL LOGIC CIRCUITS Hardware implementation and software design PH-315 COMINATIONAL and SEUENTIAL LOGIC CIRCUITS Hardware implementation and software design A La Rosa I PURPOSE: To familiarize with combinational and sequential logic circuits Combinational circuits

More information

Tuning DDR4 for Power and Performance. Mike Micheletti Product Manager Teledyne LeCroy

Tuning DDR4 for Power and Performance. Mike Micheletti Product Manager Teledyne LeCroy Tuning DDR4 for Power and Performance Mike Micheletti Product Manager Teledyne LeCroy Agenda Introduction DDR4 Technology Expanded role of MRS Power Features Examined Reliability Features Examined Performance

More information

GETTING STARTED WITH PROGRAMMABLE LOGIC DEVICES, THE 16V8 AND 20V8

GETTING STARTED WITH PROGRAMMABLE LOGIC DEVICES, THE 16V8 AND 20V8 GETTING STARTED WITH PROGRAMMABLE LOGIC DEVICES, THE 16V8 AND 20V8 Robert G. Brown All Rights Reserved August 25, 2000 Alta Engineering 58 Cedar Lane New Hartford, CT 06057-2905 (860) 489-8003 www.alta-engineering.com

More information

All Programmable Logic. Hans-Joachim Gelke Institute of Embedded Systems. Zürcher Fachhochschule

All Programmable Logic. Hans-Joachim Gelke Institute of Embedded Systems. Zürcher Fachhochschule All Programmable Logic Hans-Joachim Gelke Institute of Embedded Systems Institute of Embedded Systems 31 Assistants 10 Professors 7 Technical Employees 2 Secretaries www.ines.zhaw.ch Research: Education:

More information

Why Latency Lags Bandwidth, and What it Means to Computing

Why Latency Lags Bandwidth, and What it Means to Computing Why Latency Lags Bandwidth, and What it Means to Computing David Patterson U.C. Berkeley patterson@cs.berkeley.edu October 2004 Bandwidth Rocks (1) Preview: Latency Lags Bandwidth Over last 20 to 25 years,

More information